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SEMICONDUCTOR TECHNICAL DATA


 


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INTEGRATED
PRESSURE SENSOR
0 to 10 kPa (0 to 1.45 psi)
0.2 to 4.7 V OUTPUT

  "

The MPX5010 series piezoresistive transducer is a stateoftheart monolithic silicon
pressure sensor designed for a wide range of applications, but particularly those
employing a microcontroller or microprocessor with A/D inputs. This patented, single
element transducer combines advanced micromachining techniques, thinfilm metallization, and bipolar processing to provide an accurate, high level analog output signal that
is proportional to the applied pressure.
Features
5.0% Maximum Error over 0 to 85C
Ideally Suited for Microprocessor or MicrocontrollerBased Systems

BASIC CHIP
CARRIER ELEMENT
CASE 86708, STYLE 1

Patented Silicon Shear Stress Strain Gauge

Durable Epoxy Unibody Element
Temperature Compensated over

*40 to +125C
VS
3

THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1

Xducer
SENSING
ELEMENT

GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY

Vout

DIFFERENTIAL
PORT OPTION
CASE 867C05, STYLE 1

PINS 4, 5 AND 6 ARE NO CONNECTS

PIN NUMBER

GND

Figure 1. Fully Integrated Pressure Sensor Schematic

MAXIMUM RATINGS(1)
Parametrics

Symbol

Value

Unit

Overpressure(2) (P1 > P2)

Pmax

75

kPa

Burst Pressure(2) (P1 > P2)

Pburst

100

kPa

Tstg

40 to +125

TA

40 to +125

Storage Temperature
Operating Temperature

Vout

N/C

Gnd

N/C

VS

N/C

NOTE: Pins 4, 5, and 6 are internal

device connections. Do not connect
to external circuitry or ground. Pin 1
is noted by the notch in the Lead.

1. TC = 25C unless otherwise noted.

2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Senseon and Xducer are trademarks of Motorola, Inc.

REV 2

Motorola Sensor Device Data

Motorola, Inc. 1997


 

OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2)
Characteristic

Symbol

Min

Pressure Range(1)

POP

Supply Voltage(2)

VS

4.75

Supply Current

Io

Typ

Max

Unit

10

kPa

5.0

5.25

Vdc

7.0

10

mAdc

Minimum Pressure Offset(3)

@ VS = 5.0 Volts

(0 to 85C)

Voff

0.2

0.425

Vdc

Full Scale Output(4)

@ VS = 5.0 Volts

(0 to 85C)

VFSO

4.475

4.7

4.925

Vdc

Full Scale Span(5)

@ VS = 5.0 Volts

(0 to 85C)

VFSS

4.5

Vdc

Accuracy(6)

(0 to 85C)

Sensitivity
Response Time(7)
Output Source Current at Full Scale Output

5.0

%VFSS

V/P

450

mV/kPa

tR

1.0

ms

IO+

0.1

mAdc

WarmUp Time(8)

20

ms

Offset Stability(9)

0.5

%VFSS

Symbol

Min

Typ

Max

Unit

Weight, Basic Element (Case 867)

4.0

Grams

Common Mode Line Pressure(10)

690

kPa

MECHANICAL CHARACTERISTICS
Characteristic

NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25C.
TcSpan:
Output deviation over the temperature range of 0 to 85C, relative to 25C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative
to 25C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warmup is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset stability is the products output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
10. Common mode pressures beyond what is specified may result in leakage at the casetolead interface.

Motorola Sensor Device Data


 

ONCHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING

Figure 2 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPX5010 series pressure sensor operating characteristics, and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media, other than dry
air, may have adverse effects on sensor performance and
longterm reliability. Contact the factory for information

SILICONE
DIE COAT
WIRE BOND

regarding media compatibility in your application.

Figure 3 shows a typical decoupling circuit for interfacing
the integrated sensor to the A/D input of a microprocessor.
Proper decoupling of the power supply is recommended.
Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves
are shown for operation over a temperature range of 0 to
85C using the decoupling circuit below. (The output will saturate outside of the specified pressure range.)

STAINLESS STEEL
METAL COVER

DIE

MPX5010
OUTPUT
(PIN 1)

P1

A/D

50 pF

51 k

PROCESSOR

RTV DIE
BOND

LEAD FRAME

P2

EPOXY CASE

Figure 3. Typical Decoupling Filter for Sensor to

Microprocessor Interface

Figure 2. CrossSectional Diagram

(Not to Scale)

OUTPUT (V)

5.0
TRANSFER FUNCTION:
4.5 V = V *(0.09*P+0.04) ERROR
out S
4.0 VS = 5.0 Vdc
TEMP = 0 to 85C
3.5
3.0
2.5
2.0
1.5

TYPICAL

MAX

1.0

MIN

0.5
0
0

4
5
6
8
3
7
DIFFERENTIAL PRESSURE (kPa)

10

11

Figure 4. Output versus Pressure Differential

Motorola Sensor Device Data


 

Transfer Function (MPX5010D)

Nominal Transfer Value: Vout = VS x (0.09 x P + 0.04)
Nominal Transfer Value: (Pressure Error x Temp. Factor x 0.09 x VS)
Nominal Transfer Value: VS = 5.0 V 0.25 Vdc

Temperature Error Band

MPX5010D Series

4.0
3.0
Temperature
Error
Factor

2.0

Temp

Multiplier

40
0 to 85
+125

3
1
3

1.0
0.0
40

20

20

40

80

60

100

120

140

Temperature in C
NOTE: The Temperature Multiplier is a linear response from 0 to 40C and from 85 to 125C.

Pressure Error Band

0.5
0.4
Pressure Error (kPa)

0.3
0.2
0.1
0
0.1
0.2

10

Pressure (kPa)

0.3
0.4
0.5

Pressure

Error (Max)

0 to 10 kPa

0.5 kPa

Motorola Sensor Device Data


 

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The Motorola MPX

Part Number

pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the table
below:
Pressure (P1)
Side Identifier

Case Type

MPX5010D

86708C

Stainless Steel Cap

MPX5010DP

867C05

Side with Part Marking

MPX5010GP

867B04

Side with Port Attached

MPX5010GVP

867D04

Stainless Steel Cap

MPX5010GS

867E03

Side with Port Attached

MPX5010GVS

867A04

Stainless Steel Cap

MPX5010GSX

867F03

Side with Port Attached

MPX5010GVSX

867G03

Stainless Steel Cap

ORDERING INFORMATION
The MPX5010 pressure sensor is available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure connections.
MPX Series
D i T
Device
Type

O i
Options

C
Case
Type
T

Order Number

Device Marking

Basic Element

Differential

86708

MPX5010D

MPX5010D

Ported Elements

Differential Dual Ports

867C05

MPX5010DP

MPX5010DP

Gauge

867B04

MPX5010GP

MPX5010GP

Gauge Vacuum Port

867D04

MPX5010GVP

MPX5010GVP

Gauge, Axial

867E03

MPX5010GS

MPX5010D

Gauge Vacuum Axial

867A04

MPX5010GVS

MPX5010D

Gauge, Axial PC Mount

867F03

MPX5010GSX

MPX5010D

Gauge Vacuum Axial PC Mount

867G03

MPX5010GVSX

MPX5010D

Motorola Sensor Device Data


 

PACKAGE DIMENSIONS

C
R
M
B

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).

POSITIVE PRESSURE
(P1)

A
N
PIN 1
SEATING
PLANE

DIM
A
B
C
D
F
G
J
L
M
N
R
S

T
G

J
S

F
D 6 PL
0.136 (0.005)

T A

INCHES
MIN
MAX
0.595
0.630
0.514
0.534
0.200
0.220
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
30 _NOM
0.475
0.495
0.430
0.450
0.090
0.105

STYLE 1:
PIN 1.
2.
3.
4.
5.
6.

CASE 86708
ISSUE N

MILLIMETERS
MIN
MAX
15.11
16.00
13.06
13.56
5.08
5.59
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.40
17.65
18.42
30 _NOM
12.07
12.57
10.92
11.43
2.29
2.66

VOUT
GROUND
VCC
V1
V2
VEX

BASIC ELEMENT (D)

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.

POSITIVE
PRESSURE
(P1)

DIM
A
B
C
D
E
F
G
J
K
N
S
V

PIN 1
PORT #2
VACUUM
(P2)

J
N

E
T

S
G
F

D 6 PL
0.13 (0.005)

T B

INCHES
MIN
MAX
0.690
0.720
0.245
0.255
0.780
0.820
0.027
0.033
0.178
0.186
0.048
0.064
0.100 BSC
0.014
0.016
0.345
0.375
0.300
0.310
0.220
0.240
0.182
0.194

STYLE 1:
PIN 1.
2.
3.
4.
5.
6.

MILLIMETERS
MIN
MAX
17.53
18.28
6.22
6.48
19.81
20.82
0.69
0.84
4.52
4.72
1.22
1.63
2.54 BSC
0.36
0.41
8.76
9.53
7.62
7.87
5.59
6.10
4.62
4.93

VOUT
GROUND
VCC
V1
V2
VEX

CASE 867A04
ISSUE E
VACUUM SIDE PORTED (GVS)

Motorola Sensor Device Data


 

PACKAGE DIMENSIONSCONTINUED

A
U
L

SEATING
PLANE

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.

PORT #1
POSITIVE
PRESSURE (P1)

V
Q

B
K
1

PIN 1

0.25 (0.010)

T Q

S
G

D 6 PL
0.13 (0.005)

INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.305
0.325
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.230
0.250
0.220
0.240
0.910 BSC
0.182
0.194

DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V

T P

STYLE 1:
PIN 1.
2.
3.
4.
5.
6.

CASE 867B04
ISSUE E

MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
7.75
8.26
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
5.84
6.35
5.59
6.10
23.11 BSC
4.62
4.93

VOUT
GROUND
VCC
V1
V2
VEX

PRESSURE SIDE PORTED (GP)

P
0.25 (0.010)

T Q

U
W

X
R
PORT #1
POSITIVE
PRESSURE
(P1)

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.

A
L
V

PORT #2 VACUUM (P2)

PORT #1 POSITIVE
PRESSURE (P1)

PORT #2
VACUUM
(P2)

B
PIN 1

C
SEATING
PLANE

S
SEATING
PLANE

D 6 PL

G
F

0.13 (0.005)

CASE 867C05
ISSUE F

DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
W
X

INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.405
0.435
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.063
0.083
0.220
0.240
0.910 BSC
0.182
0.194
0.310
0.330
0.248
0.278

STYLE 1:
PIN 1.
2.
3.
4.
5.
6.

MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
10.29
11.05
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
1.60
2.11
5.59
6.10
23.11 BSC
4.62
4.93
7.87
8.38
6.30
7.06

VOUT
GROUND
VCC
V1
V2
VEX

PRESSURE AND VACUUM SIDES PORTED (DP)

Motorola Sensor Device Data


 

PACKAGE DIMENSIONSCONTINUED

0.25 (0.010)

P
T Q M

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.

A
U

SEATING
PLANE

PORT #2
VACUUM (P2)

L
V

DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V

POSITIVE PRESSURE (P1)

PIN 1

S
C

D 6 PL

0.13 (0.005)

T P

INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.305
0.325
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.230
0.250
0.220
0.240
0.910 BSC
0.182
0.194

STYLE 1:
PIN 1.
2.
3.
4.
5.
6.

CASE 867D04
ISSUE F

MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
7.75
8.26
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
5.84
6.35
5.59
6.10
23.11 BSC
4.62
4.93

VOUT
GROUND
VCC
V1
V2
VEX

VACUUM SIDE PORTED (GVP)

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.

DIM
A
B
C
D
E
F
G
J
K
N
S
V

V
PIN 1

PORT #1
POSITIVE
PRESSURE
(P1)

J
N

S
G
F

6 PL

0.13 (0.005)

T B

INCHES
MIN
MAX
0.690
0.720
0.245
0.255
0.780
0.820
0.027
0.033
0.178
0.186
0.048
0.064
0.100 BSC
0.014
0.016
0.345
0.375
0.300
0.310
0.220
0.240
0.182
0.194
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.

MILLIMETERS
MIN
MAX
17.53
18.28
6.22
6.48
19.81
20.82
0.69
0.84
4.52
4.72
1.22
1.63
2.54 BSC
0.36
0.41
8.76
9.53
7.62
7.87
5.59
6.10
4.62
4.93

VOUT
GROUND
VCC
V1
V2
VEX

CASE 867E03
ISSUE D
PRESSURE SIDE PORTED (AS, GS)

Motorola Sensor Device Data


 

PACKAGE DIMENSIONSCONTINUED

T
C

A
U

B
R
PIN 1

PORT #1
POSITIVE
PRESSURE
(P1)

P
0.25 (0.010)

T Q

S
K
J
0.13 (0.005)

T P

D 6 PL
Q S

NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
U
V

INCHES
MIN
MAX
1.080
1.120
0.740
0.760
0.630
0.650
0.027
0.033
0.160
0.180
0.048
0.064
0.100 BSC
0.014
0.016
0.220
0.240
0.070
0.080
0.150
0.160
0.150
0.160
0.440
0.460
0.695
0.725
0.840
0.860
0.182
0.194

STYLE 1:
PIN 1.
2.
3.
4.
5.
6.

MILLIMETERS
MIN
MAX
27.43
28.45
18.80
19.30
16.00
16.51
0.68
0.84
4.06
4.57
1.22
1.63
2.54 BSC
0.36
0.41
5.59
6.10
1.78
2.03
3.81
4.06
3.81
4.06
11.18
11.68
17.65
18.42
21.34
21.84
4.62
4.93

VOUT
GROUND
VCC
V1
V2
VEX

CASE 867F03
ISSUE D
PRESSURE SIDE PORTED (GSX)

T
C

A
U

POSITIVE
PRESSURE
(P1)

B
R

PORT #2
VACUUM
(P2)

PIN 1

P
0.25 (0.010)

T Q

S
K
J
0.13 (0.005)

T P

D 6 PL
Q S

G
F

NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
U
V

INCHES
MIN
MAX
1.080
1.120
0.740
0.760
0.630
0.650
0.027
0.033
0.160
0.180
0.048
0.064
0.100 BSC
0.014
0.016
0.220
0.240
0.070
0.080
0.150
0.160
0.150
0.160
0.440
0.460
0.695
0.725
0.840
0.860
0.182
0.194

STYLE 1:
PIN 1.
2.
3.
4.
5.
6.

MILLIMETERS
MIN
MAX
27.43
28.45
18.80
19.30
16.00
16.51
0.68
0.84
4.06
4.57
1.22
1.63
2.54 BSC
0.36
0.41
5.59
6.10
1.78
2.03
3.81
4.06
3.81
4.06
11.18
11.68
17.65
18.42
21.34
21.84
4.62
4.93

VOUT
GROUND
VCC
V1
V2
VEX

CASE 867G03
ISSUE D
VACUUM SIDE PORTED (GVSX)

Motorola Sensor Device Data


 

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals
must be validated for each customer application by customers technical experts. Motorola does not convey any license under its patent rights nor the rights of
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or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
Mfax is a trademark of Motorola, Inc.
How to reach us:
USA / EUROPE / Locations Not Listed: Motorola Literature Distribution;
P.O. Box 5405, Denver, Colorado 80217. 3036752140 or 18004412447

JAPAN: Nippon Motorola Ltd.; TatsumiSPDJLDC, 6F SeibuButsuryuCenter,

3142 Tatsumi KotoKu, Tokyo 135, Japan. 81335218315

Mfax: [email protected] TOUCHTONE 6022446609

ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
US & Canada ONLY 18007741848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 85226629298
INTERNET: http://motorola.com/sps

10

Motorola Sensor DeviceMPX5010/D

Data

This datasheet has been download from:

www.datasheetcatalog.com
Datasheets for electronics components.