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CC1120
SWRS112H JUNE 2011 REVISED JULY 2015
CC1120 High-Performance RF Transceiver for Narrowband Systems

1 Device Overview
1.1
Features
High-Performance, Single-Chip Transceiver

Adjacent Channel Selectivity:
64 dB at 12.5-kHz Offset
Blocking Performance: 91 dB at 10 MHz
Excellent Receiver Sensitivity:
123 dBm at 1.2 kbps
110 dBm at 50 kbps
127 dBm Using Built-in Coding Gain
Very Low Phase Noise:
111 dBc/Hz at 10-kHz Offset
Suitable for Systems Targeting ETSI Category 1
Compliance in 169-MHz and 433-MHz Bands
High Spectral Efficiency (9.6 kbps in 12.5-kHz
Channel in Compliance With FCC Narrowbanding
Mandate)
Separate 128-Byte RX and TX FIFOs
Support for Seamless Integration With the CC1190
Device for Increased Range Giving up to 3-dB
Improvement in Sensitivity and up to +27-dBm
Output Power
Power Supply
Wide Supply Voltage Range (2.0 V to 3.6 V)
Low Current Consumption:
RX: 2 mA in RX Sniff Mode
RX: 17 mA Peak Current in Low-Power
Mode
RX: 22 mA Peak Current in
High-Performance Mode
TX: 45 mA at +14 dBm
Power Down: 0.12 A
(0.5 A With eWOR Timer Running)
Programmable Output Power up to +16 dBm With
0.4-dB Step Size
1.2
Automatic Output Power Ramping

Configurable Data Rates: 0 to 200 kbps
Supported Modulation Formats: 2-FSK,
2-GFSK, 4-FSK, 4-GFSK, MSK, OOK
WaveMatch: Advanced Digital Signal Processing
for Improved Sync Detect Performance
RoHS-Compliant 5-mm 5-mm No-Lead QFN
32-Pin Package (RHB)
Regulations Suitable for Systems Targeting
Compliance With
Europe: ETSI EN 300 220, ETSI EN 54-25
US: FCC CFR47 Part 15, FCC CFR47 Part 90,
24, and 101
Japan: ARIB RCR STD-T30, ARIB STD-T67,
ARIB STD-T108
Peripherals and Support Functions
Enhanced Wake-On-Radio (eWOR)
Functionality for Automatic Low-Power Receive
Polling
Includes Functions for Antenna Diversity
Support
Support for Retransmissions
Support for Automatic Acknowledge of Received
Packets
TCXO Support and Control, Also in Power
Modes
Automatic Clear Channel Assessment (CCA) for
Listen-Before-Talk (LBT) Systems
Built-in Coding Gain Support for Increased
Range and Robustness
Digital RSSI Measurement
Temperature Sensor
Applications
Narrowband Ultra-Low-Power Wireless Systems

With Channel Spacing Down to
12.5 kHz
169-, 315-, 433-, 868-, 915-, 920-, 950-MHz
ISM/SRD Band
Wireless Metering and Wireless Smart Grid
(AMR and AMI)
IEEE 802.15.4g Systems

Home and Building Automation
Wireless Alarm and Security Systems
Industrial Monitoring and Control
Wireless Healthcare Applications
Wireless Sensor Networks and Active RFID
Private Mobile Radios
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CC1120
1.3
www.ti.com
Description
The CC1120 device is a fully integrated single-chip radio transceiver designed for high performance at
very low-power and low-voltage operation in cost-effective wireless systems. All filters are integrated, thus
removing the need for costly external SAW and IF filters. The device is mainly intended for Industrial,
Scientific, and Medical (ISM) applications and Short Range Device (SRD) frequency bands at
164 to 192 MHz, 274 to 320 MHz, 410 to 480 MHz, and 820 to 960 MHz.
The CC1120 device provides extensive hardware support for packet handling, data buffering, burst
transmissions, clear channel assessment, link quality indication, and wake-on-radio. The main operating
parameters of the CC1120 device can be controlled through an SPI interface. In a typical system, the
CC1120 device is used with a microcontroller and only a few external passive components.
Device Information (1)
PART NUMBER
CC1120
(1)
1.4
PACKAGE
BODY SIZE (NOM)
VQFN (32)
5.00 mm 5.00 mm
For more information, see Section 8, Mechanical Packaging and Orderable Information
Functional Block Diagram

Figure 1-1 shows the system block diagram of the CC1120 device.
CC112X
(optional 32kHz
clock intput)
Ultra low power 32kHz

auto-calibrated RC oscillator
4k byte
ROM
Power on reset
MARC
Main Radio Control Unit
Ultra low power 16 bit
MCU
CSn (chip select)
SPI
Serial configuration
and data interface
SI (serial input)
Interrupt and
IO handler
System bus
SO (serial output)
SCLK (serial clock)

eWOR
Enhanced ultra low power
Wake On Radio timer
Configuration and
status registers
Battery sensor /
temp sensor
256 byte
FIFO RAM
buffer
Packet handler
and FIFO control
(optional GPIO0-3)
RF and DSP frontend

Output power ramping and OOK / ASK modulation
I
Fully integrated Fractional-N
Frequency Synthesizer
Q
High linearity
LNA
LNA_N
(optional GPIO for

antenna diversity)
ifamp
XOSC
XOSC_Q2
90dB dynamic
range ADC
(optional bit clock)

Channel
filter
ifamp
LNA_P
XOSC_Q1
Data interface with
signal chain access
Cordic
14dBm high
efficiency PA
Modulator
PA
(optional autodetected
external XOSC / TCXO)
Highly flexible FSK / OOK

demodulator
(optional low jitter serial
data output for legacy
protocols)
90dB dynamic
range ADC
AGC
Automatic Gain Control, 60dB VGA range
RSSI measurements and carrier sense detection
Figure 1-1. Functional Block Diagram
Device Overview
Copyright 20112015, Texas Instruments Incorporated
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Product Folder Links: CC1120
CC1120
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Table of Contents
1
2
3
Device Overview ......................................... 1
Thermal Resistance Characteristics for RHB

Package ............................................. 15
1.1
Features .............................................. 1
1.2
Applications ........................................... 1
4.15
Timing Requirements
1.3
Description ............................................ 2
4.16
Regulatory Standards ............................... 16
1.4
Functional Block Diagram ............................ 2
4.17
Typical Characteristics .............................. 17
Revision History ......................................... 4

Terminal Configuration and Functions .............. 5
...............................
16
Detailed Description ................................... 20

5.1
Block Diagram....................................... 20
5.2
Frequency Synthesizer .............................. 20
5.3
Receiver ............................................. 21
5.4
Transmitter .......................................... 21
5.5
Radio Control and User Interface ................... 21
7
Recommended Operating Conditions (General
Characteristics) ....................................... 7
5.6
Enhanced Wake-On-Radio (eWOR) ................ 21
5.7
Sniff Mode ........................................... 22
5.8
Antenna Diversity
4.3
RF Characteristics .................................... 7
5.9
WaveMatch .......................................... 23
4.4
Power Consumption Summary ....................... 8
4.5
Receive Parameters .................................. 9
4.6
Transmit Parameters ................................ 12
4.7
PLL Parameters ..................................... 13
4.8
32-MHz Clock Input (TCXO)
4.9
4.10
4.11
32-kHz RC Oscillator
..........................................
3.2
Pin Configuration .....................................
Specifications ............................................
Absolute Maximum Ratings .................................
4.1
ESD Ratings ..........................................
3.1
4.14
4.2
4.12
4.13
Pin Diagram
...................................
22
Application, Implementation, and Layout ......... 24
Device and Documentation Support ............... 26
6.1
Application Information .............................. 24
7.1
Device Support ...................................... 26
14
7.2
Documentation Support ............................. 27
32-MHz Crystal Oscillator ........................... 14
7.3
Trademarks.......................................... 27
32-kHz Clock Input .................................. 14
7.4
Electrostatic Discharge Caution ..................... 27
...............................
I/O and Reset .......................................
Temperature Sensor ................................
7.5
Glossary ............................................. 27
.......................
15
15
15
Mechanical Packaging and Orderable

Information .............................................. 28
Table of Contents

CC1120
www.ti.com
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision G (September 2014) to Revision H
Moved storage temperature range back to Absolute Maximum Ratings table ............................................... 7
Updated the formatting of the Specifications section ........................................................................... 7
Changed clock frequency minimum value FROM: 32 MHz TO: 31.25 MHz in 32-MHz Clock Input (TCXO) .......... 14
Added clock frequency typical value of 32 MHz to 32-MHz Clock Input (TCXO) .......................................... 14
Changed crystal frequency minimum value FROM: 32 MHz TO: 31.25 MHz in the 32-MHz Crystal Oscillator table . 14
Added crystal frequency typical value of 32 MHz in the 32-MHz Crystal Oscillator table ................................. 14
Changed table title FROM: Wakeup and Timing TO: Timing Requirements ............................................... 16
Changes from Revision F (July 2014) to Revision G
Page
Page
Added "Ambient" to the temperature range condition and removed Tj from Temperature range ......................... 7
Added data to TCXO table ......................................................................................................... 14
Revision History

CC1120
www.ti.com
3 Terminal Configuration and Functions

3.1
Pin Diagram
25 AVDD_PFD_CHP
26 DCPL_PFD_CHP
27 AVDD_SYNTH2
28 AVDD_XOSC
DCPL_XOSC
29
30 XOSC_Q1
XOSC_Q2
31
32 EXT_XOSC
Figure 3-1 shows pin names and locations for the CC1120 device.
VDD_GUARD
24
LPF1
RESET_N
23
LPF0
GPIO3
22
AVDD_SYNTH1
GPIO2
21
DCPL_VCO
DVDD
20
LNA_N
DCPL
SI
SCLK
CC1120
19 LNA_P
GND
GROUND PAD
18
TRX_SW
17
PA
11
12
13
14
15
16
GPIO0
CSn
DVDD
AVDD_IF
RBIAS
AVDD_RF
N.C.
SO (GPIO1)
10
Figure 3-1. Package 5-mm 5-mm QFN
Terminal Configuration and Functions

CC1120
3.2
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Pin Configuration
The following table lists the pinout configuration for the CC1120 device.
PIN
NO.
NAME
TYPE
VDD_GUARD
RESET_N
GPIO3
Digital I/O
General-purpose I/O
GPIO2
Digital I/O
General-purpose I/O
DVDD
Power
2.03.6 VDD to internal digital regulator
DCPL
Power
Digital regulator output to external decoupling capacitor
SI
Digital input
Serial data in
SCLK
Digital input
Serial data clock
SO(GPIO1)
Digital I/O
Serial data out (general-purpose I/O)
10
GPIO0
Digital I/O
General-purpose I/O
11
CSn
Digital input
Active-low chip select
12
DVDD
Power
2.03.6 V VDD
13
AVDD_IF
Power
2.03.6 V VDD
14
RBIAS
Analog
External high-precision resistor
15
AVDD_RF
Power
2.03.6 V VDD
16
N.C.
Not connected
17
PA
Analog
Single-ended TX output (requires DC path to VDD)
18
TRX_SW
Analog
TX and RX switch. Connected internally to GND in TX and floating

(high-impedance) in RX.
19
LNA_P
Analog
Differential RX input (requires DC path to ground)
20
LNA_N
Analog
Differential RX input (requires DC path to ground)
21
DCPL_VCO
Power
Pin for external decoupling of VCO supply regulator
22
AVDD_SYNTH1
Power
2.03.6 V VDD
23
LPF0
Analog
External loop filter components
24
LPF1
Analog
External loop filter components
25
AVDD_PFD_CHP
Power
2.03.6 V VDD
26
DCPL_PFD_CHP
Power
Pin for external decoupling of PFD and CHP regulator
27
AVDD_SYNTH2
Power
2.03.6 V VDD
28
AVDD_XOSC
Power
2.03.6 V VDD
29
DCPL_XOSC
Power
Pin for external decoupling of XOSC supply regulator
30
XOSC_Q1
Analog
Crystal oscillator pin 1 (must be grounded if a TCXO or other external

clock connected to EXT_XOSC is used)
31
XOSC_Q2
Analog
Crystal oscillator pin 2 (must be left floating if a TCXO or other

external clock connected to EXT_XOSC is used)
32
EXT_XOSC
Digital input
Pin for external clock input (must be grounded if a regular crystal

connected to XOSC_Q1 and XOSC_Q2 is used)
GND
Ground pad
The ground pad must be connected to a solid ground plane.
Power
DESCRIPTION
Digital input
2.03.6 V VDD
Asynchronous, active-low digital reset
Terminal Configuration and Functions

CC1120
www.ti.com
4 Specifications
All measurements performed on CC1120EM_868_915
CC1120EM_420_470 rev.1.0.1, or CC1120EM_169 rev.1.2.
rev.1.0.1,
CC1120EM_955
rev.1.2.1,
Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN
Supply voltage (VDD, AVDD_x)
All supply pins must have the same voltage
MAX
0.3
3.9
+10
dBm
VDD + 0.3
Input RF level
Voltage on any digital pin
Max 3.9 V
0.3
UNIT
Voltage on analog pins (including DCPL pins)
0.3
2.0
Storage temperature, Tstg
40
125
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under general characteristics is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Stresses beyond those listed
under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS unless otherwise noted.
4.1
ESD Ratings
VESD
(1)
(2)
4.2
Human body model (HBM), per ANSI/ESDA/JEDEC JS001 (1)
Electrostatic
discharge (ESD)
performance
Charged device model (CDM), per JESD22-C101
(2)
All pins
VALUE
UNIT
kV
500
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V HBM allows safe manufacturing with a standard ESD control process.
Recommended Operating Conditions (General Characteristics)
over operating free-air temperature range (unless otherwise noted)

MIN
Voltage supply range
All supply pins must have the same voltage
Voltage on digital inputs

Ambient temperature range
4.3
NOM
MAX
UNIT
2.0
3.6
VDD
40
85
RF Characteristics
over operating free-air temperature range (unless otherwise noted)

PARAMETER
Frequency bands
TEST CONDITIONS
See SWRA398, Using the CC112x/CC1175 at 274 to

320 MHz, for more information
Contact TI for more information about the use of these

frequency bands
Frequency resolution
MIN
MAX
960
410
480
(273.3)
(320)
164
192
(205)
(240)
(136.7)
30
In 410480 MHz band
15
6
0
200
Transparent mode
100
1e-4

kbps
bps
Specifications
MHz
Hz
Packet mode
Data rate step size
UNIT
(160)
In 820950 MHz band

In 164192 MHz band
Data rate
TYP
820
CC1120
4.4
www.ti.com
Power Consumption Summary
TA = 25C, VDD = 3.0 V if nothing else stated

PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
0.12
UNIT
CURRENT CONSUMPTION: STATIC MODES

Power down with retention
Low-power RC oscillator running
0.5
XOFF mode
Crystal oscillator / TCXO disabled
170
IDLE mode
Clock running, system waiting with no radio

activity
1.3
mA
37
mA
26
mA
45
mA
34
mA
50
mA
45
mA
34
mA
54
mA
49
mA
41
mA
32
mA
CURRENT CONSUMPTION, TRANSMIT MODES

TX current consumption +10 dBm
TX current consumption 0 dBm
950-MHz band (high-performance mode)

868-, 915-, and 920-MHz bands (highperformance mode)



LOW-POWER MODE
(1)

CURRENT CONSUMPTION, RECEIVE MODE (HIGH-PERFORMANCE MODE) (1)
1.2 kbps, 4-byte preamble
RX wait for sync
RX peak current
38.4 kbps, 4-byte preamble

433-, 868-, 915-, 920-, and
950MHz bands
169-MHz band
Average current consumption

Check for data packet every 1 second using Wake
on Radio
Using RX sniff mode, where the receiver

wakes up at regular intervals to look for an
incoming packet (2)
Peak current consumption during packet
reception at the sensitivity threshold
50 kbps, 5-byte preamble, 40-kHz RC
oscillator used as sleep timer
2
13.4
22
mA
mA
23
15
17
mA
CURRENT CONSUMPTION, RECEIVE MODE (LOW-POWER MODE) (1)

RX peak current
Low-power RX
mode
(1)
(2)
1.2 kbps
Peak current consumption during packet

reception at the sensitivity level
TA = 25C, VDD = 3.0 V, fc = 869.5 MHz if nothing else stated.

See the sniff mode design note for more information (SWRA428).
Specifications

CC1120
www.ti.com
4.5
Receive Parameters
All RX measurements made at the antenna connector, to a bit error rate (BER) limit of 1%.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
GENERAL RECEIVE PARAMETERS (HIGH-PERFORMANCE MODE) (1)

Saturation
+10
Digital channel filter programmable bandwidth
IIP3, normal mode
At maximum gain
IIP3, high linearity mode
Using 6-dB gain reduction in front end
Data rate offset tolerance
With carrier sense detection enabled and assuming

4-byte preamble
12%
With carrier sense detection disabled
0.2%
Radiated emissions measured according to

ETSI EN 300 220, fc = 869.5 MHz
< 57
Spurious
emissions
113 GHz (VCO leakage at 3.5 GHz)

30 MHz to 1 GHz
433-MHz band
kHz
14
dBm
dBm
56
dBm
60 + j60 /
30 + j30
868-, 915-, and 920-MHz bands

Optimum
source
impedance
dBm
200
(Differential or single-ended RX configurations)
100 + j60 /
50 + j30
140 + j40 /
70 + j20
169-MHz band
RX PERFORMANCE IN 950-MHZ BAND (HIGH-PERFORMANCE MODE) (2)
Sensitivity (3)
1.2 kbps 2FSK, 12.5-kHz channel

separation, 4-kHz deviation,
10-kHz channel filter
1.2 kbps 2FSK, 50-kHz channel

Blocking
and
Selectivity
50 kbps 2GFSK, 200-kHz channel
100-kHz channel filter (Same modulation
format as 802.15.4g Mandatory Mode)
200 kbps 4GFSK, 83-kHz deviation (outer

symbols), 200-kHz channel filter, zero IF
(1)
(2)
(3)
(4)
(5)
1.2 kbps, DEV = 4 kHz CHF = 10 kHz (4)
120
114
50 kbps 2GFSK, DEV = 25 kHz,

CHF = 100 kHz (4)
107
200 kbps, DEV = 83 kHz (outer symbols),

CHF = 200 kHz (4), 4GFSK (5)
100
12.5 kHz (adjacent channel)
51
25 kHz (alternate channel)
52
1 MHz
73
2 MHz
76
10 MHz
81
50 kHz (adjacent channel)
47
+ 100 kHz (alternate channel)
48
1 MHz
69
2 MHz
71
10 MHz
78
43
51
1 MHz
62
2 MHz
65
10 MHz
71
37
44
1 MHz
55
2 MHz
58
10 MHz
64
dBm
dB

TA = 25C, VDD = 3.0 V if nothing else stated.
Sensitivity can be improved if the TX and RX matching networks are separated.
DEV is short for deviation, CHF is short for Channel Filter Bandwidth
BT = 0.5 is used in all GFSK measurements
Specifications

CC1120
www.ti.com
Receive Parameters (continued)

PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RX PERFORMANCE IN 868-, 915-, AND 920-MHZ BANDS (HIGH-PERFORMANCE MODE) (2)
Sensitivity
1.2-kbps 2-FSK, 12.5-kHz channel

1.2-kbps 2-FSK, 12.5-kHz channel

separation, using settings optimized for
blocking performance
(3-kHz deviation, 7.8-kHz channel filter,
minimum loop bandwidth)
1.2-kbps 2-FSK, 50-kHz channel

Blocking
and
Selectivity
38.4-kbps 2-GFSK, 100-kHz channel
separation, 20-kHz deviation, 100-kHz
channel filter
50-kbps 2-GFSK, 200-kHz channel

channel filter
(Same modulation format as 802.15.4g
Mandatory Mode)
200-kbps 4-GFSK, 83-kHz deviation (outer

symbols), 200-kHz channel filter, zero IF
Image rejection (image compensation enabled)
10
300 bps with coding gain (using a PN spreading

sequence with 4 chips per data bit) DEV = 4 kHz
CHF = 10 kHz (4)
127
123
120
117
4.8 kbps OOK
114
110

CHF = 100 kHz (4)
110
200 kbps, DEV = 83 kHz (outer symbols),

CHF = 200 kHz (4), 4GFSK
103
54
54
1 MHz
75
2 MHz
79
10 MHz
87
1 kHz
78
2 kHz
82
8 MHz
88
10 MHz
88
48
48
1 MHz
69
2 MHz
74
10 MHz
81
+ 100 kHz (adjacent channel)
42
43
1 MHz
62
2 MHz
66
10 MHz
74
43
50
1 MHz
61
2 MHz
65
10 MHz
74
36
44
1 MHz
55
2 MHz
59
10 MHz
67
1.2 kbps, DEV = 4 kHz CHF = 10 kHz (4), image at

125 kHz
54
Specifications
dBm
dB
dB

CC1120
www.ti.com

PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RX PERFORMANCE IN 434-MHZ BAND (HIGH-PERFORMANCE MODE) (2)
Sensitivity
123

CHF = 100 kHz
109
1.2 kbps, DEV = 20 kHz CHF = 50 kHz

Blocking
and
Selectivity

38.4 kbps 2GFSK, 100-kHz channel

(4)
60
60
1 MHz
79
2 MHz
82
10 MHz
91
54
54
1 MHz
74
2 MHz
78
10 MHz
86
47
50
1 MHz
67
2 MHz
71
RX PERFORMANCE IN 169-MHZ BAND (HIGH-PERFORMANCE MODE)

Sensitivity

Blocking
and
Selectivity
Spurious
response
rejection
dB
78
(2)
123
117
64
66
1 MHz
82
2 MHz
83
10 MHz
89
60
60
1 MHz
76
2 MHz
77
10 MHz
83

Image rejection (image compensation enabled)
116
10 MHz
dBm
1.2 kbps, DEV = 4 kHz CHF = 10 kHz (4), image at

125 kHz

dB
70
dB
66
dB
Specifications
dbm
11
CC1120
www.ti.com

PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RX PERFORMANCE IN LOW-POWER MODE (1)

Sensitivity


Blocking
and
Selectivity
38.4 kbps 2GFSK, 100-kHz channel
channel filter
50 kbps 2GFSK, 200-kHz channel

channel filter
(Same modulation format as 802.15.4g
Mandatory Mode)
111
99

CHF = 100 kHz (4)
99
46
46
1 MHz
73
2 MHz
78
10 MHz
79
43
45
1 MHz
71
2 MHz
74
10 MHz
75
37
43
1 MHz
58
2 MHz
62
+ 10 MHz
64
43
52
1 MHz
60
2 MHz
64
10 MHz
dB
65
Saturation
4.6
dBm
+10
dBm
Transmit Parameters
TA = 25C, VDD = 3.0 V, fc = 869.5 MHz if nothing else stated

PARAMETER
Maximum output power
Minimum output power

Output power step size
Adjacent channel power
TEST CONDITIONS
TYP
At 950 MHz
+12
At 915- and 920-MHz
+14
At 915- and 920-MHz with VDD = 3.6 V
+15
At 868 MHz
+15
At 868 MHz with VDD = 3.6 V
+16
At 433 MHz
+15
+16
At 169 MHz
+15
+16
Within fine step size range
11
Within coarse step size range
40
Within fine step size range
0.4
4-GFSK 9.6 kbps in 12.5-kHz channel, measured in

100-Hz bandwidth at 434 MHz (FCC Part 90 Mask D
compliant)
75
4-GFSK 9.6 kbps in 12.5-kHz channel, measured in

8.75-kHz bandwidth (ETSI EN 300 220 compliant)
58
2-GFSK 2.4 kbps in 12.5-kHz channel, 1.2-kHz deviation
61
Spurious emissions
(not including harmonics)
12
MIN
UNIT
dBm
dBm
dB
dBc
<60
Specifications
MAX
dBm

CC1120
www.ti.com
Transmit Parameters (continued)

PARAMETER
TEST CONDITIONS
MIN
39
3rd Harm, 169 MHz
58
2nd Harm, 433 MHz
56
3rd Harm, 433 MHz

2nd Harm, 450 MHz
3rd Harm, 450 MHz
Harmonics 2nd Harm, 868 MHz
3rd Harm, 868 MHz
2nd Harm, 915 MHz
3rd Harm, 915 MHz
MAX
UNIT
51
Transmission at +14 dBm (or maximum allowed in

applicable band where this is less than +14 dBm) using TI
reference design Emissions measured according to ARIB
T-96 in 950-MHz band, ETSI EN 300-220 in 170-, 433-,
and 868-MHz bands and FCC part 15.247 in 450- and
915-MHz band Fourth harmonic in 915-MHz band will
require extra filtering to meet FCC requirements if
transmitting for long intervals
(>50-ms periods)
dBm
60
45
40
42
56
52
4th Harm, 915 MHz
60
2nd Harm, 950 MHz
58
3rd Harm, 950 MHz
42
868-, 915-, and 920-MHz

Optimum
bands
load
433 MHz band
impedance
169 MHz band
4.7
TYP
2nd Harm, 169 MHz
dBV/m
dBm
35 + j35
55 + j25
80 + j0
PLL Parameters

PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
HIGH-PERFORMANCE MODE
Phase noise in 950-MHz band
10 kHz offset
99
100 kHz offset
99
1 MHz offset
Phase noise in 868-, 915-, 920-MHz bands
dBc/Hz
123
10 kHz offset
99
100 kHz offset
100
1 MHz offset
122
10 kHz offset
106
100 kHz offset
107
1 MHz offset
127
10 kHz offset
111
100 kHz offset
116
1 MHz offset
135
dBc/Hz
dBc/Hz
dBc/Hz
Specifications

13
CC1120
www.ti.com
PLL Parameters (continued)

PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
LOW-POWER MODE (1)

10 kHz offset
90
100 kHz offset
Phase noise in 868-, 915-, 920-MHz bands
92
1 MHz offset
124
10 kHz offset
95
100 kHz offset
95
1 MHz offset
(1)
dBc/Hz
dBc/Hz
124
10 kHz offset
98
100 kHz offset
102
1 MHz offset
129
10 kHz offset
106
100 kHz offset
110
1 MHz offset
136
dBc/Hz
dBc/Hz
4.8
32-MHz Clock Input (TCXO)

PARAMETER
TEST CONDITIONS
Clock frequency
TCXO with CMOS output (1)
Clipped sine output

(1)
High input voltage
TCXO with CMOS output

directly coupled to pin
EXT_OSC
Low input voltage

Clock input amplitude
(peak-to-peak)
TCXO clipped sine output

connected to pin EXT_OSC
through series capacitor
MIN
TYP
MAX
UNIT
31.25
32
33.6
MHz
1.4
VDD
0.6
0.8
1.5
For TCXO with CMOS output rise and fall time, see Section 4.15.
4.9
32-MHz Crystal Oscillator

PARAMETER
TEST CONDITIONS
MIN
It is expected that there be will degraded

sensitivity at multiples of XOSC/2 in RX, and
an increase in spurious emissions when the
RF channel is close to multiples of XOSC in
TX. We recommend that the RF channel is
kept RX_BW/2 away from XOSC/2 in RX,
and that the level of spurious emissions be
evaluated if the RF channel is closer than 1
MHz to multiples of XOSC in TX.
Crystal frequency
31.25
Load capacitance (CL)
TYP
MAX
UNIT
32
33.6
MHz
10
ESR
Simulated over operating conditions
pF
60
4.10 32-kHz Clock Input

PARAMETER
MIN
Clock frequency
MAX
32
32-kHz clock input pin input high voltage
V
0.2 VDD
Specifications
UNIT
kHz
0.8 VDD
32-kHz clock input pin input high voltage
14
TYP

CC1120
www.ti.com
4.11 32-kHz RC Oscillator

PARAMETER
TEST CONDITIONS
Frequency
After calibration
Frequency accuracy after calibration
Relative to frequency reference

(32-MHz crystal or TCXO)
MIN
TYP
MAX
32
UNIT
kHz
0.1%
Initial calibration time (1)

(1)
For Initial calibration time of the 32-kHz RC Oscillator, see Section 4.15.
4.12 I/O and Reset

PARAMETER
TEST CONDITIONS
Logic input high voltage
MIN
TYP
MAX
UNIT
0.8 VDD
Logic input low voltage
0.2 VDD
Logic output high voltage
At 4-mA output load or less
Logic output low voltage

Power-on reset threshold
0.8 VDD
V
0.2 VDD
Voltage on DVDD pin
1.3
4.13 Temperature Sensor

TA = 25C, VDD = 3.0 V if nothing else stated (1)
PARAMETER
TEST CONDITIONS
Temperature sensor range
MIN
TYP
40
MAX
UNIT
85
Temperature coefficient
Change in sensor output voltage versus change in

temperature
2.66
mV/C
Typical output voltage
Typical sensor output voltage at TA = 25C,

VDD = 3.0 V
794
mV
VDD coefficient
Change in sensor output voltage versus change in

VDD
1.17
mV/V
(1)
The CC1120 device can be configured to provide a voltage proportional to temperature on GPIO1. The temperature can be estimated
by measuring this voltage (see Section 4.13, Temperature Sensor). For more information, refer to CC112X/CC120X On-Chip
Temperature Sensor (SWRA415).
4.14 Thermal Resistance Characteristics for RHB Package

C/W (1)
NAME
DESCRIPTION
RJC(top)
Junction-to-case (top)
RJB
Junction-to-board
5.3
RJA
Junction-to-free air
31.3
PsiJT
Junction-to-package top
0.2
PsiJB
Junction-to-board
5.3
RJC(bot)
Junction-to-case (bottom)
0.8
(1)
21.1
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 40 mW and an ambient temperature of 25C is assumed.
Specifications

15
CC1120
www.ti.com
4.15 Timing Requirements

PARAMETER
TEST CONDITIONS
Power down to IDLE

IDLE to RX/TX
MIN NOM MAX
UNIT
Depends on crystal
0.4
ms
Calibration disabled
166
Calibration enabled
461
RX/TX turnaround
50
RX/TX to IDLE time
Calibrate when leaving RX/TX

enabled
296
Calibrate when leaving RX/TX

disabled
Frequency synthesizer calibration
When using SCAL strobe
391
Time from start RX until valid RSSI

Including gain settling (function of channel bandwidth. Programmable for
trade-off between speed and accuracy)
12.5-kHz channels
4.6
200-kHz channels
0.3
s
ms
32-MHz CLOCK INPUT (TCXO) (1)

TCXO with CMOS output
32-kHz RC OSCILLATOR
Rise and fall time
Initial calibration time

(1)
(2)
ns
(2)
1.6
ns
See Section 4.8 for more information about the 32-MHz Clock Input (TCXO).
See Section 4.11 for more information about the 32-kHz RC Oscillator.
4.16 Regulatory Standards

PERFORMANCE MODE
FREQUENCY BAND
SUITABLE FOR COMPLIANCE WITH
820960 MHz (1)
ARIB T-96
ARIB T-108
ETSI EN 300 220 category 2
ETSI EN 54-25
FCC PART 101
FCC PART 24 SUBMASK D
FCC PART 15.247
FCC PART 15.249
FCC PART 90 MASK G
FCC PART 90 MASK J
410480 MHz (2)
ARIB T-67
ARIB RCR STD-30
FCC PART 90 MASK D
FCC PART 90 MASK G
164192 MHz (2)

FCC PART 90 MASK D
820960 MHz

FCC PART 15.247
FCC PART 15.249
410480 MHz
164192 MHz
High-performance mode
Low-power mode
(1)
(2)
16
Performance also suitable for systems targeting maximum allowed output power in the respective bands, using a range extender such
as the CC1190 device
Performance also suitable for systems targeting maximum allowed output power in the respective bands, using a range extender
Specifications

CC1120
www.ti.com
4.17 Typical Characteristics

All
measurements
performed
on
CC1120EM_868_915
CC1120EM_420_470 rev.1.0.1, or CC1120EM_169 rev.1.2.
rev.1.0.1,
CC1120EM_955
rev.1.2.1,
Figure 4-17 was measured at the 50- antenna connector.

-120
-121
Sensitivity (dBm)
Sensitivity (dBm)
-120
-122
-123
-124
-125
-121
-122
-123
-124
-40
40
80
2.5
Temperature (C)
1.2 kbps,
10-kHz Channel
Filter Bandwidth
4-kHz Deviation,
1.2 kbps,
Figure 4-1. Sensitivity vs Temperature

23.2
-116
22.8
-118
RX Current (mA)
Sensitivity (dBm)
10-kHz Channel
Filter Bandwidth
4-kHz Deviation,
Figure 4-2. Sensitivity vs Voltage
-114
-120
-122
-124
-126
22.4
22
21.6
21.2
-128
-130
3
11
13
15
20.8
-130
17
-80
Sync Word Detect Threshold
1.2 kbps,
10-kHz Channel
Filter Bandwidth
4-kHz Deviation,
1.2 kbps,
4-kHz Deviation,
10-kHz Channel
Filter Bandwidth
70
60
50
40
30
20
10
0
169.95
170
170.05
170.1
-10
859.9
4-kHz Deviation,
859.95
860
860.05
860.1
Frequency (MHz)
Frequency (MHz)
1.2 kbps,
20
Figure 4-4. RX Current vs Input Level
Selectivity (dB)
70
60
50
40
30
20
10
0
-10
-20
169.9
-30
Input Level (dBm)
Figure 4-3. Sync Word Sensitivity vs Voltage
Selectivity (dB)
3.5
Supply Voltage (V)
10-kHz Channel
Filter Bandwidth
Figure 4-5. Selectivity vs Offset Frequency (12.5-kHz Channels)
1.2 kbps,
4-kHz Deviation,
10-kHz Channel
Filter Bandwidth
Figure 4-6. Selectivity vs Offset Frequency (12.5-kHz Channels)
Specifications

17
CC1120
www.ti.com
Typical Characteristics (continued)

17
100
Output Power (dBm)
80
40
20
0
-20
16.5
16
15.5
15
-40
-150
-100
-50
-40
Input Level (dBm)

1.2 kbps,
10-kHz Channel Filter

Bandwidth
4-kHz Deviation,
Max Setting,
Figure 4-7. RSSI vs Input Level
80
170 MHz,
3.6 V
Figure 4-8. Output Power vs Temperature
18
20
16
10
Output Power (dBm)
14
12
10
8
0
-10
-20
-30
-40
Max Setting,
43
47
4B
53
4F
57
5B
3.5
67
3
Supply Voltage (V)
6B
2.5
73
6F
77
-50
7F
7B
Output Power (dBm)
40
Temperature (C)
63
5F
RSSI
60
PA power setting
170 MHz,
Figure 4-9. Output Power vs Voltage
Figure 4-10. Output Power at 868 MHz vs PA Power Setting
60
TX Current (mA)
50
40
30
20
10
43
47
4F
4B
53
57
5B
63
5F
67
6B
73
6F
77
7F
7B
PA power setting
Figure 4-11. TX Current at 868 MHz
vs PA Power Setting
18
Figure 4-12. Phase Noise in 868-MHz Band
Specifications

CC1120
www.ti.com
Typical Characteristics (continued)
9.6 kbps in 12.5-kHz Channel
1.2 kbps 2-FSK,
3.1
2.9
2.7
2.5
2.3
2.1
1.9
1.7
1.5
0
10
15
20
25
DEV = 4 kHz
Figure 4-14. Eye Diagram

GPIO Output Low Voltage (mV)
GPIO Output High Voltage (V)
Figure 4-13. FCC Part 90 Mask D
30
35
1400
1200
1000
800
600
400
200
0
0
10
15
20
25
30
35
Current (mA)
Current (mA)
Figure 4-15. GPIO Output High Voltage vs Current Being Sourced Figure 4-16. GPIO Output Low Voltage vs Current Being Sinked
Figure 4-17. Output Power vs Load Impedance (+14-dBm Setting)
Specifications

19
CC1120
www.ti.com
5 Detailed Description
5.1
Block Diagram
Figure 5-1 shows the system block diagram of the CC1120 devices.
CC112X
(optional 32kHz
clock intput)
Ultra low power 32kHz

auto-calibrated RC oscillator
4k byte
ROM
Power on reset
MARC
Main Radio Control Unit
Ultra low power 16 bit
MCU
CSn (chip select)
SPI
Serial configuration
and data interface
SI (serial input)
Interrupt and
IO handler
System bus
SO (serial output)
SCLK (serial clock)

eWOR
Enhanced ultra low power
Wake On Radio timer
Configuration and
status registers
Battery sensor /
temp sensor
256 byte
FIFO RAM
buffer
Packet handler
and FIFO control
(optional GPIO0-3)
RF and DSP frontend

Output power ramping and OOK / ASK modulation
I
Fully integrated Fractional-N
Q
(optional GPIO for

antenna diversity)
ifamp
XOSC
XOSC_Q2
90dB dynamic
range ADC
(optional bit clock)

Cordic
High linearity
LNA
LNA_N
Data interface with

signal chain access
Channel
filter
ifamp
LNA_P
XOSC_Q1
Modulator
14dBm high
efficiency PA
PA
(optional autodetected
external XOSC / TCXO)
Highly flexible FSK / OOK

demodulator
(optional low jitter serial
data output for legacy
protocols)
90dB dynamic
range ADC
AGC
Automatic Gain Control, 60dB VGA range
RSSI measurements and carrier sense detection
Figure 5-1. System Block Diagram
5.2
At the center of the CC1120 device there is a fully integrated, fractional-N, ultra-high-performance
frequency synthesizer. The frequency synthesizer is designed for excellent phase noise performance,
providing very high selectivity and blocking performance. The system is designed to comply with the most
stringent regulatory spectral masks at maximum transmit power.
Either a crystal can be connected to XOSC_Q1 and XOSC_Q2, or a TCXO can be connected to the
EXT_XOSC input. The oscillator generates the reference frequency for the synthesizer, as well as clocks
for the analog-to-digital converter (ADC) and the digital part. To reduce system cost, CC1120 device has
high-accuracy frequency estimation and compensation registers to measure and compensate for crystal
inaccuracies. This compensation enables the use of lower cost crystals. If a TCXO is used, the CC1120
device automatically turns on and off the TCXO when needed to support low-power modes and Wake-OnRadio operation.
20
Detailed Description

CC1120
www.ti.com
5.3
Receiver
The CC1120 device features a highly flexible receiver. The received RF signal is amplified by the lownoise amplifier (LNA) and is down-converted in quadrature (I/Q) to the intermediate frequency (IF). At IF,
the I/Q signals are digitized by the high dynamic-range ADCs.
An advanced automatic gain control (AGC) unit adjusts the front-end gain, and enables the CC1120
device to receive strong and weak signals, even in the presence of strong interferers. High-attenuation
channels and data filtering enable reception with strong neighbor channel interferers. The I/Q signal is
converted to a phase and magnitude signal to support the FSK and OOK modulation schemes.
NOTE
A unique I/Q compensation algorithm removes any problem of I/Q mismatch, thus avoiding
time-consuming and costly I/Q image calibration steps.
The CC1120 device only requires preamble to settle the AGC. The minimum number of preamble required
is 0.5 byte.
5.4
Transmitter
The CC1120 transmitter is based on direct synthesis of the RF frequency (in-loop modulation). To use the
spectrum effectively, the CC1120 device has extensive data filtering and shaping in TX mode to support
high throughput data communication in narrowband channels. The modulator also controls power ramping
to remove issues such as spectral splattering when driving external high-power RF amplifiers.
5.5
Radio Control and User Interface

The CC1120 digital control system is built around the main radio control (MARC), which is implemented
using an internal high-performance, 16-bit ultra-low-power processor. MARC handles power modes, radio
sequencing, and protocol timing.
A 4-wire SPI serial interface is used for configuration and data buffer access. The digital baseband
includes support for channel configuration, packet handling, and data buffering. The host MCU can stay in
power-down mode until a valid RF packet is received. This greatly reduces power consumption. When the
host MCU receives a valid RF packet, it burst-reads the data. This reduces the required computing power.
The CC1120 radio control and user interface are based on the widely used CC1101 transceiver. This
relationship enables an easy transition between the two platforms. The command strobes and the main
radio states are the same for the two platforms.
For legacy formats, the CC1120 device also supports two serial modes.
Synchronous serial mode: The CC1120 device performs bit synchronization and provides the MCU
with a bit clock with associated data.
Transparent mode: The CC1120 device outputs the digital baseband signal using a digital interpolation
filter to eliminate jitter introduced by digital filtering and demodulation.
5.6
Enhanced Wake-On-Radio (eWOR)

eWOR, using a flexible integrated sleep timer, enables automatic receiver polling with no intervention from
the MCU. When the CC1120 device enters RX mode, it listens and then returns to sleep if a valid RF
packet is not received. The sleep interval and duty cycle can be configured to make a trade-off between
network latency and power consumption. Incoming messages are time-stamped to simplify timer resynchronization.
The eWOR timer runs off an ultra-low-power 32-kHz RC oscillator. To improve timing accuracy, the RC
oscillator can be automatically calibrated to the RF crystal in configurable intervals.

21
CC1120
5.7
www.ti.com
Sniff Mode
The CC1120 device supports quick start up times, and requires few preamble bits. Sniff mode uses these
conditions to dramatically reduce the current consumption while the receiver is waiting for data.
Because the CC1120 device can wake up and settle much faster than the duration of most preambles, it
is not required to be in RX mode continuously while waiting for a packet to arrive. Instead, the enhanced
Wake-On-Radio feature can be used to put the device into sleep mode periodically. By setting an
appropriate sleep time, the CC1120 device can wake up and receive the packet when it arrives with no
performance loss. This sequence removes the need for accurate timing synchronization between
transmitter and receiver, and lets the user trade off current consumption between the transmitter and
receiver.
For more information, see the sniff mode design note (SWRA428).
5.8
Antenna Diversity
Antenna diversity can increase performance in a multipath environment. An external antenna switch is
required. The CC1201 device uses one of the GPIO pins to automatically control the switch. This device
also supports differential output control signals typically used in RF switches.
If antenna diversity is enabled, the GPIO alternates between high and low states until a valid RF input
signal is detected. An optional acknowledge packet can be transmitted without changing the state of the
GPIO.
An incoming RF signal can be validated by received signal strength or by using the automatic preamble
detector. Using the automatic preamble detector ensures a more robust system and avoids the need to
set a defined signal strength threshold (such a threshold sets the sensitivity limit of the system).
22

CC1120
www.ti.com
5.9
WaveMatch
Advanced capture logic locks onto the synchronization word and does not require preamble settling bytes.
Therefore, receiver settling time is reduced to the settling time of the AGC, typically 4 bits.
The WaveMatch feature also greatly reduces false sync triggering on noise, further reducing the power
consumption and improving sensitivity and reliability. The same logic can also be used as a highperformance preamble detector to reliably detect a valid preamble in the channel.
See SWRC046 for more information.
Figure 5-2. Receiver Configurator in SmartRF Studio

23
CC1120
www.ti.com
6 Application, Implementation, and Layout

NOTE
Information in the following Applications section is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TIs customers are responsible for
determining suitability of components for their purposes. Customers should validate and test
their design implementation to confirm system functionality.
6.1
6.1.1
Application Information
Typical Application Circuit
NOTE
This section is intended only as an introduction. The reference designs listed in Section 6.1.2
show everything required.
Very few external components are required for the operation of the CC1120 device. Figure 6-1 shows a
typical application circuit. The board layout will greatly influence the RF performance of the CC1120
device. Figure 6-1 does not show decoupling capacitors for power pins.
Optional
vdd
25
AVDD_PFD_CHP
vdd
VDD_GUARD
DCPL_PFD_CHP 26
vdd
AVDD_SYNTH2 27
AVDD_XOSC 28
2 RESET_N
vdd
LPF1 24
LPF0 23
3 GPIO3
AVDD_SYNTH1 22
4 GPIO2
DCPL_VCO 21
CC1120
5 DVDD
vdd
LNA_N 20
6 DCPL
LNA_P 19
7 SI
TRX_SW 18
8 SCLK
N.C.
16
AVDD_RF
15
vdd
13 AVDD_IF
vdd
14 RBIAS
12 DVDD
vdd
CSn
11
10 GPIO0
9 SO (GPIO1)
PA 17
vdd
vdd
DCPL_XOSC 29
(optional control pin

from CC1120)
XOSC_Q1 30
EXT_XOSC 32
XOSC/
TCXO
XOSC_Q2 31
32 MHz
crystal
MCU connection
SPI interface and
optional gpio pins
Figure 6-1. Typical Application Circuit
24
Application, Implementation, and Layout

CC1120
www.ti.com
6.1.2
TI Reference Designs
The following reference designs are available for the CC1120 device:
CC1120EM-868-915-RD CC1120EM 868- to 915-MHz Reference Design
This RF Layout Reference Design demonstrates good decoupling and layout techniques for a low power
RF device operating in the 868-MHz and 915-MHz frequency bands.
CC1120EM 868/915 MHz Reference Design (SWRC222)
CC112x IPC 868- and 915-MHz 2-layer Reference Design (SWRR106)
CC112x IPC 868- and 915-MHz 4-layer Reference Design (SWRR107)
CC1120EM-169-RD CC1120EM 169-MHz Reference Design
RF device operating in the 169-MHz frequency band. (SWRC220)
CC1120EM-420-470-RD CC1120EM 420- to 470-MHz Reference Design
RF device operating in the 420-470 MHz frequency band. (SWRC221)
Application, Implementation, and Layout

25
CC1120
www.ti.com
7 Device and Documentation Support

7.1
Device Support
7.1.1
Development Support
7.1.1.1
Configuration Software
The CC1120 device can be configured using the SmartRF Studio software (SWRC046). The SmartRF
Studio software is highly recommended for obtaining optimum register settings, and for evaluating
performance and functionality.
7.1.2
Device and Development-Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix)
(for example, CC1120). Texas Instruments recommends two of three possible prefix designators for its
support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development
from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).
Device development evolutionary flow:
X
Experimental device that is not necessarily representative of the final device's electrical
specifications and may not use production assembly flow.
Prototype device that is not necessarily the final silicon die and may not necessarily meet
final electrical specifications.
null
Production version of the silicon die that is fully qualified.
Support tool development evolutionary flow:

TMDX
Development-support product that has not yet completed Texas Instruments internal
qualification testing.
TMDS
Fully qualified development-support product.
X and P devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
Production devices and TMDS development-support tools have been characterized fully, and the quality
and reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be
used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, RHB) and the temperature range (for example, blank is the default commercial
temperature range) provides a legend for reading the complete device name for any CC1120 device.
For orderable part numbers of CC1120 devices in the QFN package types, see the Package Option
Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.
26
Device and Documentation Support

CC1120
www.ti.com
7.2
Documentation Support
The following documents supplement the CC1120 transceiver. Copies of these documents are available
on the Internet at www.ti.com. Tip: Enter the literature number in the search box provided at www.ti.com.
7.2.1
SWRU295
CC112X/CC1175 Low-Power High Performance Sub-1 GHz RF Transceivers/Transmitter

User's Guide
SWRA398
Using the CC112x/CC1175 at 274 to 320 MHz
SWRC046
SmartRF Studio Software
SWRA428
CC112x/CC120x Sniff Mode Application Note
SWRZ039
CC112x, CC1175 Silicon Errata
SWRR106
CC112x IPC 868- and 915-MHz 2-layer Reference Design
SWRR107
CC112x IPC 868- and 915-MHz 4-layer Reference Design
SWRC220
CC1120EM 169-MHz Reference Design
SWRC221
CC1120EM 420- to 470-MHz Reference Design
SWRC222
CC1120EM 868- to 915-MHz Reference Design
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools
and contact information for technical support.
7.3
Trademarks
SmartRF, E2E are trademarks of Texas Instruments.
7.4
Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
7.5
Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
Device and Documentation Support

27
CC1120
www.ti.com
8 Mechanical Packaging and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
28
Mechanical Packaging and Orderable Information

PACKAGE OPTION ADDENDUM
www.ti.com
23-Jun-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package

Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
CC1120RHBR
ACTIVE
VQFN
RHB
32
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CC1120
CC1120RHBT
ACTIVE
VQFN
RHB
32
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CC1120
CC1120RHMR
OBSOLETE
VQFN
RHM
32
TBD
Call TI
Call TI
-40 to 85
CC1120
CC1120RHMT
OBSOLETE
VQFN
RHM
32
TBD
Call TI
Call TI
-40 to 85
CC1120
(1)
The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jun-2015
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION

www.ti.com
23-Jun-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins

Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CC1120RHBR
VQFN
RHB
32
3000
330.0
12.4
5.3
5.3
1.5
8.0
12.0
Q2
CC1120RHBT
VQFN
RHB
32
250
180.0
12.4
5.3
5.3
1.5
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION

www.ti.com
23-Jun-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CC1120RHBR
VQFN
RHB
32
3000
338.1
338.1
20.6
CC1120RHBT
VQFN
RHB
32
250
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
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anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
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dsp.ti.com
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www.ti.com/energy
Clocks and Timers
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Industrial
www.ti.com/industrial
Interface
interface.ti.com
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Logic
logic.ti.com
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power.ti.com
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Microcontrollers
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Wireless Connectivity
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

cc1120 Radio Transciever Datasheet

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Product

CC1120 High-Performance RF Transceiver for Narrowband Systems

High-Performance, Single-Chip Transceiver

Automatic Output Power Ramping

Narrowband Ultra-Low-Power Wireless Systems

IEEE 802.15.4g Systems

BODY SIZE (NOM)

Functional Block Diagram

Ultra low power 32kHz

CSn (chip select)

SCLK (serial clock)

RF and DSP frontend

(optional GPIO for

(optional bit clock)

Highly flexible FSK / OOK

Figure 1-1. Functional Block Diagram

Copyright 20112015, Texas Instruments Incorporated

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SWRS112H JUNE 2011 REVISED JULY 2015

Device Overview ......................................... 1

Thermal Resistance Characteristics for RHB

Regulatory Standards ............................... 16

Functional Block Diagram ............................ 2

Typical Characteristics .............................. 17

Revision History ......................................... 4

Detailed Description ................................... 20

Frequency Synthesizer .............................. 20

Radio Control and User Interface ................... 21

Enhanced Wake-On-Radio (eWOR) ................ 21

Sniff Mode ........................................... 22

Power Consumption Summary ....................... 8

Receive Parameters .................................. 9

Transmit Parameters ................................ 12

PLL Parameters ..................................... 13

32-MHz Clock Input (TCXO)

Application, Implementation, and Layout ......... 24

Device and Documentation Support ............... 26

Application Information .............................. 24

Device Support ...................................... 26

Documentation Support ............................. 27

32-MHz Crystal Oscillator ........................... 14

32-kHz Clock Input .................................. 14

Electrostatic Discharge Caution ..................... 27

Mechanical Packaging and Orderable

Copyright 20112015, Texas Instruments Incorporated

Submit Documentation Feedback

Changes from Revision F (July 2014) to Revision G

Copyright 20112015, Texas Instruments Incorporated

Submit Documentation Feedback

SWRS112H JUNE 2011 REVISED JULY 2015

3 Terminal Configuration and Functions

Figure 3-1. Package 5-mm 5-mm QFN

Terminal Configuration and Functions

Copyright 20112015, Texas Instruments Incorporated

Submit Documentation Feedback

2.03.6 VDD to internal digital regulator

Digital regulator output to external decoupling capacitor

Serial data clock

Serial data out (general-purpose I/O)