cd4051b Datasheet
cd4051b Datasheet
cd4051b Datasheet
Features
Wide Range of Digital and Analog Signal Levels
- Digital . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3V to 20V
- Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20VP-P
Ordering Information
PART NUMBER
TEMP. RANGE
(oC)
PACKAGE
CD4051BF3A, CD4052BF3A,
CD4053BF3A
-55 to 125
16 Ld CERAMIC
DIP
CD4051BE, CD4052BE,
CD4053BE
-55 to 125
16 Ld PDIP
CD4051BM, CD4051BMT,
CD4051BM96
CD4052BM, CD4052BMT,
CD4052BM96
CD4053BM, CD4053BMT,
CD4053BM96
-55 to 125
16 Ld SOIC
CD4051BNSR, CD4052BNSR,
CD4053BNSR
-55 to 125
16 Ld SOP
CD4051BPW, CD4051BPWR,
CD4052BPW, CD4052BPWR
CD4053BPW, CD4053BPWR
-55 to 125
16 Ld TSSOP
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
Copyright 2003, Texas Instruments Incorporated
16 VDD
6 2
15 2
COM OUT/IN 3
14 1
7 4
13 0
CHANNELS
IN/OUT
16 VDD
2 2
15 2
COMMON Y OUT/IN 3
14 1
Y CHANNELS
IN/OUT
X CHANNELS
IN/OUT
CHANNELS IN/OUT
CHANNELS
IN/OUT
Y CHANNELS
IN/OUT
3 4
13 COMMON X OUT/IN
5 5
12 3
1 5
12 0
INH 6
11 A
INH 6
11 3
VEE 7
10 B
VEE 7
10 A
VSS 8
9 C
VSS 8
9 B
X CHANNELS
IN/OUT
IN/OUT
by 1
16 VDD
bx 2
15 OUT/IN bx OR by
cy 3
14 OUT/IN ax OR ay
OUT/IN CX OR CY 4
13 ay
IN/OUT CX 5
12 ax
INH 6
11 A
VEE 7
10 B
VSS 8
9 C
IN/OUT
16 VDD
12
15
14
13
TG
TG
A
11
TG
10
LOGIC
LEVEL
CONVERSION
INH
BINARY
TO
1 OF 8
DECODER
WITH
INHIBIT
TG
3
TG
TG
TG
TG
8 VSS
7 VEE
COMMON
OUT/IN
(Continued)
CD4052B
X CHANNELS IN/OUT
3
11
15
14
12
TG
16 VDD
10
INH
TG
BINARY
TO
1 OF 4
DECODER
WITH
INHIBIT
LOGIC
LEVEL
CONVERSION
TG
COMMON X
OUT/IN
TG
13
TG
TG
3
COMMON Y
OUT/IN
TG
TG
8 VSS
VEE
Y CHANNELS IN/OUT
CD4053B
LOGIC
LEVEL
CONVERSION
16 VDD
BINARY TO
1 OF 2
DECODERS
WITH
INHIBIT
IN/OUT
cy
cx
by
bx
ay
ax
13
12
TG
COMMON
OUT/IN
ax OR ay
14
11
TG
TG
COMMON
OUT/IN
bx OR by
15
10
TG
TG
4
TG
INH
COMMON
OUT/IN
cx OR cy
VDD
VSS
VEE
ON CHANNEL(S)
None
CD4051B
CD4052B
INHIBIT
0x, 0y
1x, 1y
2x, 2y
3x, 3y
None
CD4053B
INHIBIT
A OR B OR C
ax or bx or cx
ay or by or cy
None
X = Dont Care
Thermal Information
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
Common Conditions Here: If Whole Table is For the Full Temp. Range, VSUPPLY = 5V, AV = +1,
RL = 100, Unless Otherwise Specified (Note 3)
Electrical Specifications
CONDITIONS
25
PARAMETER
VIS (V)
VEE (V)
VSS (V)
VDD (V)
-55
-40
85
125
MIN
TYP
MAX
UNITS
150
150
0.04
10
10
10
300
300
0.04
10
15
20
20
600
600
0.04
20
20
100
100
3000
3000
0.08
100
800
850
1200
1300
470
1050
10
310
330
520
550
180
400
15
200
210
300
320
125
240
Change in ON
Resistance (Between
Any Two Channels),
rON
15
10
10
15
18
0.01
100
(Note 2)
nA
Capacitance:
-5
5-
Quiescent Device
Current, IDD Max
Drain to Source ON
Resistance rON Max
0 VIS VDD
Input, CIS
100 (Note 2)
1000 (Note 2)
pF
CD4051
30
pF
CD4052
18
pF
CD4053
pF
0.2
pF
30
60
ns
10
15
30
ns
15
10
20
ns
Output, COS
Feedthrough
CIOS
Propagation Delay Time
(Signal Input to Output
VDD
RL = 200k,
CL = 50pF,
tr , tf = 20ns
Electrical Specifications
CONDITIONS
25
PARAMETER
VIS (V)
VEE (V)
VSS (V)
VDD (V)
-55
-40
85
125
MIN
TYP
MAX
UNITS
1.5
1.5
1.5
1.5
1.5
10
15
3.5
3.5
3.5
3.5
3.5
10
15
11
11
11
11
11
0.1
VIL = VDD
through
1k;
VIH = VDD
through
Input High Voltage, VIH , 1k
Min
VEE = VSS ,
RL = 1k to VSS ,
IIS < 2A on All
OFF Channels
VIN = 0, 18
18
0.1
0.1
10-5
450
720
ns
10
160
320
ns
15
120
240
ns
-5
225
450
ns
400
720
ns
10
160
320
ns
15
120
240
ns
-10
200
400
ns
200
450
ns
10
90
210
ns
15
70
160
ns
-10
130
300
ns
7.5
pF
tr , tf = 20ns,
CL = 50pF,
RL = 10k
Electrical Specifications
TEST CONDITIONS
PARAMETER
VIS (V)
VDD (V)
RL (k)
5 (Note 3)
10
VEE = VSS ,
V OS
20Log ------------ = 3dB
V IS
LIMITS
TYP
UNITS
CD4053
30
MHz
CD4052
25
MHz
CD4051
20
MHz
60
MHz
LIMITS
PARAMETER
VIS (V)
VDD (V)
RL (k)
TYP
UNITS
2 (Note 3)
10
0.3
3 (Note 3)
10
0.2
5 (Note 3)
15
0.12
5 (Note 3)
10
CD4053
MHz
CD4052
10
MHz
CD4051
12
MHz
MHz
MHz
Between Sections,
CD4052 Only
Measured on Common
MHz
10
MHz
2.5
MHz
MHz
10
(Note 4)
65
mVPEAK
65
mVPEAK
VEE = VSS ,
V OS
20Log ------------ = 40dB
V IS
5 (Note 3)
10
VEE = VSS ,
V OS
20Log ------------ = 40dB
V IS
Address-or-Inhibit-to-Signal
Crosstalk
10
NOTES:
V DD V EE
----------------------------2
VDD - VEE = 5V
600
500
400
TA = 125oC
300
TA = 25oC
200
TA = -55oC
100
0
-4
-3
-2
-1
250
TA = 125oC
200
150
TA = 25oC
100
TA = -55oC
50
0
-10
-7.5
-5
-2.5
0
2.5
5
VIS , INPUT SIGNAL VOLTAGE (V)
7.5
10
(Continued)
600
250
rON , CHANNEL ON RESISTANCE ()
TA = 25oC
VDD - VEE = 5V
500
400
300
200
10V
15V
100
0
-10
-7.5
-5
-2.5
2.5
7.5
TA = 125oC
150
TA = 25oC
100
TA = -55oC
50
0
-10
10
-7.5
-5
100
-2
-4
-2
0
2
4
VIS , INPUT SIGNAL VOLTAGE (V)
TA = 25oC
ALTERNATING O
AND I PATTERN
CL = 50pF
VDD = 15V
103
VDD = 10V
102
VDD = 5V
CL = 15pF
10
1
10
TEST CIRCUIT
VDD
CD4029
VDD B/D
A B
100
10 9
1
3 CL
13
5
12
2
4 CD4052 14
15
6
11
7
8
102
103
104
SWITCHING FREQUENCY (kHz)
105
VDD = 5V
10
B/D
CD4029
A B C
VDD
100 11 10 9
13
14
15
12 CD4051
1
5
3
2
48 7 6 C
L
100
CL = 15pF
1
100
VDD = 10V
10
104
7.5
VDD = 15V
102
-4
10
102
103
104
SWITCHING FREQUENCY (kHz)
105
1k
500
103
-6
TEST CIRCUIT
VDD
TA = 25oC
ALTERNATING O
AND I PATTERN
CL = 50pF
104
RL = 100k, RL = 10k
105
2.5
105
VDD = 5V
VSS = 0V
VEE = -5V
TA = 25oC
-6
-2.5
105
TA = 25oC
ALTERNATING O
AND I PATTERN
CL = 50pF
104
103
VDD = 5V
102
CL = 15pF
VDD = 15V
VDD = 10V
TEST CIRCUIT
VDD f
9
4
CL
100
3
12
5
13
100
CD4053 2
10
1
15
11
14
6
7
8
10
1
10
102
103
104
SWITCHING FREQUENCY (kHz)
105
VDD = 7.5V
VDD = 5V
VDD = 5V
5V
7.5V
16
5V
16
16
16
VSS = 0V
VSS = 0V
VSS = 0V
VEE = 0V
7
8
VEE = -7.5V
7
8
VEE = -10V
7
8
7
8
VEE = -5V
VSS = 0V
(D)
(C)
(B)
(A)
tr = 20ns
tr = 20ns
tf = 20ns
90%
50%
90%
50%
10%
tf = 20ns
90%
50%
90%
50%
10%
10%
10%
TURN-ON TIME
90%
50%
90%
10%
10%
10%
TURN-OFF TIME
TURN-OFF TIME
VDD
VDD
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CD4051
IDD
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CD4052
VDD
IDD
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CD4053
TURN-ON
TIME
tPHZ
IDD
1
2
3
4
5
6
7
8
IDD
VDD
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
IDD
VDD
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
CD4052
CD4051
16
15
14
13
12
11
10
9
IDD
CD4053
VDD
1
2
3
4
5
6
7
8
VDD
VEE
VSS
16
15
14
13
12
11
10
9
OUTPUT
VDD
OUTPUT
OUTPUT
1
RL
CL
2
RL
CL
3
VDD
VEE
4
VDD
5
VEE
6
VEE
VSS CLOCK
7
IN
8
VSS
VSS
CD4051
16
15
14
13
12
11
10
9
VDD
VEE
VDD
VSS CLOCK
VSS
IN
VSS
CD4052
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CD4053
RL
CL
VEE
VDD
VSS CLOCK
IN
VSS
VDD
OUTPUT
RL
1
2
3
4
5
6
7
8
50pF
VEE
VDD
VSS
VDD
CLOCK VEE
IN
VSS
16
15
14
13
12
11
10
9
VDD
OUTPUT
50pF
RL
VEE
VDD
VSS
VDD
CLOCK VEE
IN VSS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
OUTPUT
RL
50pF
VEE
VDD
VDD
VSS CLOCK VEE
IN VSS
V
tPHL AND tPLH SS
CD4052
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VDD
V
tPHL AND tPLH SS
CD4053
VIH
1K
VIH
VIL
VDD
VDD
1K
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VIH
VIL
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1K
1K
A
VIH
1K
VIL
VIH
VIL
1K
VIH
VIL
VIL
MEASURE < 2A ON ALL
OFF CHANNELS (e.g., CHANNEL 2x)
10
16
15
14
13
12
11
10
9
CD4053B
CD4052B
CD4051B
1
2
3
4
5
6
7
8
VDD
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CD4051
CD4053
VDD
16
15
14
13
12
11
10
9
KEITHLEY
160 DIGITAL
MULTIMETER
TG
ON
10k
X-Y
PLOTTER
VDD
1
2
3
4
5
6
7
8
VDD
VSS
CD4051
CD4053
VSS
H.P.
MOSELEY
7030A
CD4052
VDD
16
15
14
13
12
11
10
9
VSS
1
2
3
4
5
6
7
8
1k
RANGE
VSS
16
15
14
13
12
11
10
9
VDD
VSS
CD4052
5VP-P
CHANNEL
ON
5VP-P
OFF
CHANNEL
VDD
RF
VM
RL
1K
RL
RL
RL
CHANNEL IN Y
ON OR OFF
CHANNEL IN X
ON OR OFF
RL
RF
VM
RL
11
RF
VM
CHANNEL
ON
RF
VM
CHANNEL
OFF
6
7
8
5VP-P
COMMON
CHANNEL
OFF
CD4052
CD4052
COMMUNICATIONS
LINK
DIFF.
AMPLIFIER/
LINE DRIVER
DIFF.
MULTIPLEXING
DIFF.
RECEIVER
DEMULTIPLEXING
Special Considerations
In applications where separate power sources are used to
drive VDD and the signal inputs, the VDD current capability
should exceed VDD/RL (RL = effective external load). This
provision avoids permanent current flow or clamp action on
the VDD supply when power is applied or removed from the
CD4051B, CD4052B or CD4053B.
A
B
CD4051B
C
INH
A
B
C
D
E
Q0
A
B
E
1/2
CD4556
A
B
CD4051B
C
INH
Q1
Q2
A
B
CD4051B
C
INH
12
COMMON
OUTPUT
www.ti.com
4-Dec-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
7901502EA
ACTIVE
CDIP
16
TBD
A42
-55 to 125
7901502EA
CD4052BF3A
8101801EA
ACTIVE
CDIP
16
TBD
A42
-55 to 125
8101801EA
CD4053BF3A
CD4051BE
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU | CU SN
-55 to 125
CD4051BE
CD4051BEE3
PREVIEW
PDIP
16
25
TBD
Call TI
Call TI
-55 to 125
CD4051BE
CD4051BEE4
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU
-55 to 125
CD4051BE
CD4051BF
ACTIVE
CDIP
16
TBD
A42
-55 to 125
CD4051BF
CD4051BF3A
ACTIVE
CDIP
16
TBD
A42
-55 to 125
CD4051BF3A
CD4051BF3AS2283
OBSOLETE
CDIP
16
TBD
Call TI
Call TI
CD4051BM
ACTIVE
SOIC
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4051BM
CD4051BM96
ACTIVE
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-55 to 125
CD4051BM
CD4051BM96G3
ACTIVE
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-55 to 125
CD4051BM
CD4051BM96G4
ACTIVE
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4051BM
CD4051BMG4
ACTIVE
SOIC
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4051BM
CD4051BMT
ACTIVE
SOIC
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4051BM
CD4051BNSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4051B
CD4051BNSRE4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4051B
CD4051BPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM051B
CD4051BPWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM051B
Addendum-Page 1
Samples
www.ti.com
4-Dec-2014
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
CD4051BPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM051B
CD4051BPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-55 to 125
CM051B
CD4051BPWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM051B
CD4052BE
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU | CU SN
-55 to 125
CD4052BE
CD4052BEE4
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU
-55 to 125
CD4052BE
CD4052BF
ACTIVE
CDIP
16
TBD
A42
-55 to 125
CD4052BF
CD4052BF3A
ACTIVE
CDIP
16
TBD
A42
-55 to 125
7901502EA
CD4052BF3A
CD4052BM
ACTIVE
SOIC
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4052BM
CD4052BM96
ACTIVE
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-55 to 125
CD4052BM
CD4052BM96E4
ACTIVE
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4052BM
CD4052BM96G3
ACTIVE
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-55 to 125
CD4052BM
CD4052BM96G4
ACTIVE
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4052BM
CD4052BMG4
ACTIVE
SOIC
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4052BM
CD4052BMT
ACTIVE
SOIC
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4052BM
CD4052BNSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4052B
CD4052BNSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4052B
CD4052BPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM052B
CD4052BPWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM052B
Addendum-Page 2
Samples
www.ti.com
4-Dec-2014
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
CD4052BPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-55 to 125
CM052B
CD4052BPWRG3
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-55 to 125
CM052B
CD4052BPWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM052B
CD4053BE
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU
-55 to 125
CD4053BE
CD4053BEE4
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU
-55 to 125
CD4053BE
CD4053BF
ACTIVE
CDIP
16
TBD
A42
-55 to 125
CD4053BF
CD4053BF3A
ACTIVE
CDIP
16
TBD
A42
-55 to 125
8101801EA
CD4053BF3A
CD4053BF3AS2283
OBSOLETE
CDIP
16
TBD
Call TI
Call TI
CD4053BM
ACTIVE
SOIC
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4053M
CD4053BM96
ACTIVE
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-55 to 125
CD4053M
CD4053BM96E4
ACTIVE
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4053M
CD4053BM96G3
ACTIVE
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-55 to 125
CD4053M
CD4053BM96G4
ACTIVE
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4053M
CD4053BMG4
ACTIVE
SOIC
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4053M
CD4053BMT
ACTIVE
SOIC
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4053M
CD4053BNSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4053B
CD4053BPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM053B
CD4053BPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM053B
Addendum-Page 3
Samples
www.ti.com
Orderable Device
4-Dec-2014
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
CD4053BPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-55 to 125
CM053B
CD4053BPWRG3
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-55 to 125
CM053B
CD4053BPWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM053B
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 4
Samples
www.ti.com
4-Dec-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4051B, CD4051B-MIL, CD4052B, CD4052B-MIL, CD4053B, CD4053B-MIL :
Addendum-Page 5
29-Apr-2014
Device
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CD4051BM96
SOIC
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD4051BM96
SOIC
16
2500
330.0
16.8
6.5
10.3
2.1
8.0
16.0
Q1
CD4051BM96
SOIC
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD4051BM96G3
SOIC
16
2500
330.0
16.8
6.5
10.3
2.1
8.0
16.0
Q1
CD4051BM96G4
SOIC
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD4051BM96G4
SOIC
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD4051BPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD4051BPWRG4
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD4052BM96
SOIC
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD4052BM96
SOIC
16
2500
330.0
16.8
6.5
10.3
2.1
8.0
16.0
Q1
CD4052BM96G3
SOIC
16
2500
330.0
16.8
6.5
10.3
2.1
8.0
16.0
Q1
CD4052BM96G4
SOIC
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD4052BPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD4052BPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD4052BPWRG3
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD4052BPWRG4
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD4053BM96
SOIC
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD4053BM96
SOIC
16
2500
330.0
16.8
6.5
10.3
2.1
8.0
16.0
Q1
Pack Materials-Page 1
29-Apr-2014
Device
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CD4053BM96G3
SOIC
16
2500
330.0
16.8
6.5
10.3
2.1
8.0
16.0
Q1
CD4053BM96G4
SOIC
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD4053BPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD4053BPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD4053BPWRG3
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD4053BPWRG4
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD4051BM96
SOIC
16
2500
333.2
345.9
28.6
CD4051BM96
SOIC
16
2500
364.0
364.0
27.0
CD4051BM96
SOIC
16
2500
367.0
367.0
38.0
CD4051BM96G3
SOIC
16
2500
364.0
364.0
27.0
CD4051BM96G4
SOIC
16
2500
367.0
367.0
38.0
CD4051BM96G4
SOIC
16
2500
333.2
345.9
28.6
CD4051BPWR
TSSOP
PW
16
2000
364.0
364.0
27.0
CD4051BPWRG4
TSSOP
PW
16
2000
367.0
367.0
35.0
CD4052BM96
SOIC
16
2500
333.2
345.9
28.6
CD4052BM96
SOIC
16
2500
364.0
364.0
27.0
CD4052BM96G3
SOIC
16
2500
364.0
364.0
27.0
Pack Materials-Page 2
29-Apr-2014
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD4052BM96G4
SOIC
16
2500
333.2
345.9
28.6
CD4052BPWR
TSSOP
PW
16
2000
364.0
364.0
27.0
CD4052BPWR
TSSOP
PW
16
2000
367.0
367.0
35.0
CD4052BPWRG3
TSSOP
PW
16
2000
364.0
364.0
27.0
CD4052BPWRG4
TSSOP
PW
16
2000
367.0
367.0
35.0
CD4053BM96
SOIC
16
2500
333.2
345.9
28.6
CD4053BM96
SOIC
16
2500
364.0
364.0
27.0
CD4053BM96G3
SOIC
16
2500
364.0
364.0
27.0
CD4053BM96G4
SOIC
16
2500
333.2
345.9
28.6
CD4053BPWR
TSSOP
PW
16
2000
364.0
364.0
27.0
CD4053BPWR
TSSOP
PW
16
2000
367.0
367.0
35.0
CD4053BPWRG3
TSSOP
PW
16
2000
364.0
364.0
27.0
CD4053BPWRG4
TSSOP
PW
16
2000
367.0
367.0
35.0
Pack Materials-Page 3
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
www.ti.com/automotive
Amplifiers
amplifier.ti.com
www.ti.com/communications
Data Converters
dataconverter.ti.com
www.ti.com/computers
DLP Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
www.ti.com/energy
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
www.ti.com/video
RFID
www.ti-rfid.com
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2014, Texas Instruments Incorporated