cd4051b Datasheet

Download as pdf or txt
Download as pdf or txt
You are on page 1of 28

CD4051B, CD4052B, CD4053B

August 1998 - Revised October 2003

Data sheet acquired from Harris Semiconductor


SCHS047G

Features
Wide Range of Digital and Analog Signal Levels
- Digital . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3V to 20V
- Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20VP-P

[ /Title Low ON Resistance, 125 (Typ) Over 15VP-P Signal Input


Range for VDD -VEE = 18V
(CD405
High OFF Resistance, Channel Leakage of 100pA (Typ)
1B,
CD4052 at VDD -VEE = 18V
Logic-Level Conversion for Digital Addressing Signals of
B,
to 20V (VDD -VSS = 3V to 20V) to Switch Analog
CD4053 3V
Signals to 20VP-P (VDD -VEE = 20V)
B)
Matched Switch Characteristics, rON = 5 (Typ) for
/SubVDD -VEE = 15V
ject
Low Quiescent Power Dissipation Under All Digital(CMOS Very
Control Input and Supply Conditions, 0.2W (Typ) at
Analog
VDD -VSS = VDD -VEE = 10V
Multi Binary Address Decoding on Chip
plexers/Dem 5V, 10V, and 15V Parametric Ratings
ultiplex- 100% Tested for Quiescent Current at 20V
ers with Maximum Input Current of 1A at 18V Over Full Package
Temperature Range, 100nA at 18V and 25oC
Logic
Level
Break-Before-Make Switching Eliminates Channel
Overlap
Conversion)
/Author Applications
Analog and Digital Multiplexing and Demultiplexing
()
/Key A/D and D/A Conversion
words
Signal Gating
(Harris
CMOS Analog Multiplexers/Demultiplexers
Semiconduc- with Logic Level Conversion
tor,
The CD4051B, CD4052B, and CD4053B analog multiplexers
CD4000 are digitally-controlled analog switches having low ON

The CD4051B is a single 8-Channel multiplexer having three


binary control inputs, A, B, and C, and an inhibit input. The
three binary signals select 1 of 8 channels to be turned on,
and connect one of the 8 inputs to the output.
The CD4052B is a differential 4-Channel multiplexer having
two binary control inputs, A and B, and an inhibit input. The
two binary input signals select 1 of 4 pairs of channels to be
turned on and connect the analog inputs to the outputs.
The CD4053B is a triple 2-Channel multiplexer having three
separate digital control inputs, A, B, and C, and an inhibit
input. Each control input selects one of a pair of channels
which are connected in a single-pole, double-throw
configuration.
When these devices are used as demultiplexers, the
CHANNEL IN/OUT terminals are the outputs and the
COMMON OUT/IN terminals are the inputs.

Ordering Information
PART NUMBER

TEMP. RANGE
(oC)

PACKAGE

CD4051BF3A, CD4052BF3A,
CD4053BF3A

-55 to 125

16 Ld CERAMIC
DIP

CD4051BE, CD4052BE,
CD4053BE

-55 to 125

16 Ld PDIP

CD4051BM, CD4051BMT,
CD4051BM96
CD4052BM, CD4052BMT,
CD4052BM96
CD4053BM, CD4053BMT,
CD4053BM96

-55 to 125

16 Ld SOIC

CD4051BNSR, CD4052BNSR,
CD4053BNSR

-55 to 125

16 Ld SOP

CD4051BPW, CD4051BPWR,
CD4052BPW, CD4052BPWR
CD4053BPW, CD4053BPWR

-55 to 125

16 Ld TSSOP

NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.

impedance and very low OFF leakage current. Control of


analog signals up to 20VP-P can be achieved by digital
signal amplitudes of 4.5V to 20V (if VDD -VSS = 3V, a
VDD -VEE of up to 13V can be controlled; for VDD -VEE level
differences above 13V, a VDD -VSS of at least 4.5V is
required). For example, if VDD = +4.5V, VSS = 0V, and
VEE = -13.5V, analog signals from -13.5V to +4.5V can be
controlled by digital inputs of 0V to 5V. These multiplexer
circuits dissipate extremely low quiescent power over the
full VDD -VSS and VDD -VEE supply-voltage ranges,
independent of the logic state of the control signals. When
a logic 1 is present at the inhibit input terminal, all
channels are off.
1

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
Copyright 2003, Texas Instruments Incorporated

CD4051B, CD4052B, CD4053B


Pinouts
CD4051B (PDIP, CDIP, SOIC, SOP, TSSOP)
TOP VIEW
4 1

16 VDD

6 2

15 2

COM OUT/IN 3

14 1

7 4

13 0

CHANNELS
IN/OUT

CD4052B (PDIP, CDIP, SOP, TSSOP)


TOP VIEW
0 1

16 VDD

2 2

15 2

COMMON Y OUT/IN 3

14 1

Y CHANNELS
IN/OUT

X CHANNELS
IN/OUT

CHANNELS IN/OUT
CHANNELS
IN/OUT

Y CHANNELS
IN/OUT

3 4

13 COMMON X OUT/IN

5 5

12 3

1 5

12 0

INH 6

11 A

INH 6

11 3

VEE 7

10 B

VEE 7

10 A

VSS 8

9 C

VSS 8

9 B

X CHANNELS
IN/OUT

CD4053B (PDIP, CDIP, SOP, TSSOP)


TOP VIEW

IN/OUT

by 1

16 VDD

bx 2

15 OUT/IN bx OR by

cy 3

14 OUT/IN ax OR ay

OUT/IN CX OR CY 4

13 ay

IN/OUT CX 5

12 ax

INH 6

11 A

VEE 7

10 B

VSS 8

9 C

IN/OUT

Functional Block Diagrams


CD4051B
CHANNEL IN/OUT

16 VDD

12

15

14

13
TG

TG
A

11
TG

10
LOGIC
LEVEL
CONVERSION

INH

BINARY
TO
1 OF 8
DECODER
WITH
INHIBIT

TG

3
TG

TG

TG

TG

8 VSS

7 VEE

All inputs are protected by standard CMOS protection network.

COMMON
OUT/IN

CD4051B, CD4052B, CD4053B


Functional Block Diagrams

(Continued)
CD4052B
X CHANNELS IN/OUT
3

11

15

14

12

TG
16 VDD

10

INH

TG

BINARY
TO
1 OF 4
DECODER
WITH
INHIBIT

LOGIC
LEVEL
CONVERSION

TG

COMMON X
OUT/IN

TG

13

TG
TG

3
COMMON Y
OUT/IN

TG
TG

8 VSS

VEE

Y CHANNELS IN/OUT

CD4053B

LOGIC
LEVEL
CONVERSION

16 VDD

BINARY TO
1 OF 2
DECODERS
WITH
INHIBIT

IN/OUT
cy

cx

by

bx

ay

ax

13

12
TG

COMMON
OUT/IN
ax OR ay
14

11

TG

TG

COMMON
OUT/IN
bx OR by
15

10

TG

TG

4
TG

INH

COMMON
OUT/IN
cx OR cy

VDD

VSS

VEE

All inputs are protected by standard CMOS protection network.

CD4051B, CD4052B, CD4053B


TRUTH TABLES
INPUT STATES
INHIBIT

ON CHANNEL(S)

None

CD4051B

CD4052B
INHIBIT

0x, 0y

1x, 1y

2x, 2y

3x, 3y

None

CD4053B
INHIBIT

A OR B OR C

ax or bx or cx

ay or by or cy

None

X = Dont Care

CD4051B, CD4052B, CD4053B


Absolute Maximum Ratings

Thermal Information

Supply Voltage (V+ to V-)


Voltages Referenced to VSS Terminal . . . . . . . . . . . -0.5V to 20V
DC Input Voltage Range . . . . . . . . . . . . . . . . . . -0.5V to VDD +0.5V
DC Input Current, Any One Input. . . . . . . . . . . . . . . . . . . . . . 10mA

Package Thermal Impedance, JA (see Note 1):


E (PDIP) package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W
M (SOIC) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W
NS (SOP) package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W
PW (TSSOP) package . . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W
Maximum Junction Temperature (Ceramic Package) . . . . . . . . .175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .265oC
(SOIC - Lead Tips Only)

Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC

CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
Common Conditions Here: If Whole Table is For the Full Temp. Range, VSUPPLY = 5V, AV = +1,
RL = 100, Unless Otherwise Specified (Note 3)

Electrical Specifications

LIMITS AT INDICATED TEMPERATURES (oC)

CONDITIONS

25
PARAMETER

VIS (V)

VEE (V)

VSS (V)

VDD (V)

-55

-40

85

125

MIN

TYP

MAX

UNITS

SIGNAL INPUTS (VIS) AND OUTPUTS (VOS)


-

150

150

0.04

10

10

10

300

300

0.04

10

15

20

20

600

600

0.04

20

20

100

100

3000

3000

0.08

100

800

850

1200

1300

470

1050

10

310

330

520

550

180

400

15

200

210

300

320

125

240

Change in ON
Resistance (Between
Any Two Channels),
rON

15

10

10

15

OFF Channel Leakage


Current: Any Channel
OFF (Max) or ALL
Channels OFF (Common
OUT/IN) (Max)

18

0.01

100
(Note 2)

nA

Capacitance:

-5

5-

Quiescent Device
Current, IDD Max

Drain to Source ON
Resistance rON Max
0 VIS VDD

Input, CIS

100 (Note 2)

1000 (Note 2)

pF

CD4051

30

pF

CD4052

18

pF

CD4053

pF

0.2

pF

30

60

ns

10

15

30

ns

15

10

20

ns

Output, COS

Feedthrough
CIOS
Propagation Delay Time
(Signal Input to Output

VDD

RL = 200k,
CL = 50pF,
tr , tf = 20ns

CD4051B, CD4052B, CD4053B


Common Conditions Here: If Whole Table is For the Full Temp. Range, VSUPPLY = 5V, AV = +1,
RL = 100, Unless Otherwise Specified (Continued) (Note 3)

Electrical Specifications

LIMITS AT INDICATED TEMPERATURES (oC)

CONDITIONS

25
PARAMETER

VIS (V)

VEE (V)

VSS (V)

VDD (V)

-55

-40

85

125

MIN

TYP

MAX

UNITS

1.5

1.5

1.5

1.5

1.5

10

15

3.5

3.5

3.5

3.5

3.5

10

15

11

11

11

11

11

0.1

CONTROL (ADDRESS OR INHIBIT), VC


Input Low Voltage, VIL ,
Max

VIL = VDD
through
1k;
VIH = VDD
through
Input High Voltage, VIH , 1k
Min

Input Current, IIN (Max)

VEE = VSS ,
RL = 1k to VSS ,
IIS < 2A on All
OFF Channels

VIN = 0, 18

18

0.1

0.1

10-5

Propagation Delay Time:


Address-to-Signal
tr , tf = 20ns,
OUT (Channels ON or CL = 50pF,
OFF) See Figures 10, RL = 10k
11, 14

450

720

ns

10

160

320

ns

15

120

240

ns

-5

225

450

ns

400

720

ns

10

160

320

ns

15

120

240

ns

-10

200

400

ns

200

450

ns

10

90

210

ns

15

70

160

ns

-10

130

300

ns

7.5

pF

Propagation Delay Time:


Inhibit-to-Signal OUT tr , tf = 20ns,
(Channel Turning ON) CL = 50pF,
See Figure 11
RL = 1k

Propagation Delay Time:


Inhibit-to-Signal OUT
(Channel Turning
OFF) See Figure 15

tr , tf = 20ns,
CL = 50pF,
RL = 10k

Input Capacitance, CIN


(Any Address or Inhibit
Input)
NOTE:

2. Determined by minimum feasible leakage measurement for automatic testing.

Electrical Specifications
TEST CONDITIONS
PARAMETER

VIS (V)

VDD (V)

RL (k)

Cutoff (-3dB) Frequency Channel ON (Sine Wave Input)

5 (Note 3)

10

VOS at Common OUT/IN

VEE = VSS ,
V OS
20Log ------------ = 3dB
V IS

VOS at Any Channel

LIMITS
TYP

UNITS

CD4053

30

MHz

CD4052

25

MHz

CD4051

20

MHz

60

MHz

CD4051B, CD4052B, CD4053B


Electrical Specifications
TEST CONDITIONS

LIMITS

PARAMETER

VIS (V)

VDD (V)

RL (k)

TYP

UNITS

Total Harmonic Distortion, THD

2 (Note 3)

10

0.3

3 (Note 3)

10

0.2

5 (Note 3)

15

0.12

VEE = VSS, fIS = 1kHz Sine Wave


-40dB Feedthrough Frequency
(All Channels OFF)

5 (Note 3)

10

VOS at Common OUT/IN

CD4053

MHz

CD4052

10

MHz

CD4051

12

MHz

VOS at Any Channel

MHz

Between Any 2 Channels

MHz

Between Sections,
CD4052 Only

Measured on Common

MHz

Measured on Any Channel

10

MHz

Between Any Two


Sections, CD4053
Only

In Pin 2, Out Pin 14

2.5

MHz

In Pin 15, Out Pin 14

MHz

10
(Note 4)

65

mVPEAK

VEE = 0, VSS = 0, tr , tf = 20ns, VCC


= VDD - VSS (Square Wave)

65

mVPEAK

VEE = VSS ,
V OS
20Log ------------ = 40dB
V IS

-40dB Signal Crosstalk


Frequency

5 (Note 3)

10

VEE = VSS ,
V OS
20Log ------------ = 40dB
V IS

Address-or-Inhibit-to-Signal
Crosstalk

10

NOTES:
V DD V EE
----------------------------2

3. Peak-to-Peak voltage symmetrical about


4. Both ends of channel.

Typical Performance Curves


300
VDD - VEE = 10V

VDD - VEE = 5V

rON , CHANNEL ON RESISTANCE ()

rON , CHANNEL ON RESISTANCE ()

600

500

400
TA = 125oC

300

TA = 25oC

200

TA = -55oC
100

0
-4

-3

-2

-1

VIS , INPUT SIGNAL VOLTAGE (V)

FIGURE 1. CHANNEL ON RESISTANCE vs INPUT SIGNAL


VOLTAGE (ALL TYPES)

250
TA = 125oC

200

150
TA = 25oC
100
TA = -55oC
50

0
-10

-7.5

-5
-2.5
0
2.5
5
VIS , INPUT SIGNAL VOLTAGE (V)

7.5

FIGURE 2. CHANNEL ON RESISTANCE vs INPUT SIGNAL


VOLTAGE (ALL TYPES)

10

CD4051B, CD4052B, CD4053B


Typical Performance Curves

(Continued)

600

250
rON , CHANNEL ON RESISTANCE ()

rON , CHANNEL ON RESISTANCE ()

TA = 25oC
VDD - VEE = 5V

500
400
300
200

10V
15V

100
0
-10

-7.5

-5

-2.5

2.5

7.5

VDD - VEE = 15V


200

TA = 125oC

150
TA = 25oC

100

TA = -55oC
50

0
-10

10

-7.5

-5

FIGURE 3. CHANNEL ON RESISTANCE vs INPUT SIGNAL


VOLTAGE (ALL TYPES)

PD , POWER DISSIPATION PACKAGE (W)

100

-2

-4

-2
0
2
4
VIS , INPUT SIGNAL VOLTAGE (V)

TA = 25oC
ALTERNATING O
AND I PATTERN
CL = 50pF

VDD = 15V
103
VDD = 10V
102

VDD = 5V
CL = 15pF

10
1

10

TEST CIRCUIT
VDD

CD4029
VDD B/D
A B
100
10 9
1
3 CL
13
5
12
2
4 CD4052 14
15
6
11
7
8

102
103
104
SWITCHING FREQUENCY (kHz)

105

FIGURE 7. DYNAMIC POWER DISSIPATION vs SWITCHING


FREQUENCY (CD4052B)

VDD = 5V

10

B/D
CD4029
A B C

VDD
100 11 10 9
13
14
15
12 CD4051
1
5
3
2
48 7 6 C
L
100

CL = 15pF
1

100

PD , POWER DISSIPATION PACKAGE (W)

VDD = 10V

10

FIGURE 5. ON CHARACTERISTICS FOR 1 OF 8 CHANNELS


(CD4051B)

104

7.5

VDD = 15V

102

-4

10

102
103
104
SWITCHING FREQUENCY (kHz)

105

FIGURE 6. DYNAMIC POWER DISSIPATION vs SWITCHING


FREQUENCY (CD4051B)

PD , POWER DISSIPATION PACKAGE (W)

VOS , OUTPUT SIGNAL VOLTAGE (V)

1k
500

103

-6

TEST CIRCUIT
VDD

TA = 25oC
ALTERNATING O
AND I PATTERN
CL = 50pF
104

RL = 100k, RL = 10k

105

2.5

105

VDD = 5V
VSS = 0V
VEE = -5V
TA = 25oC

-6

FIGURE 4. CHANNEL ON RESISTANCE vs INPUT SIGNAL


VOLTAGE (ALL TYPES)

-2.5

VIS , INPUT SIGNAL VOLTAGE (V)

VIS , INPUT SIGNAL VOLTAGE (V)

105

TA = 25oC
ALTERNATING O
AND I PATTERN
CL = 50pF

104

103

VDD = 5V

102

CL = 15pF

VDD = 15V
VDD = 10V
TEST CIRCUIT
VDD f
9
4
CL
100
3
12
5
13
100
CD4053 2
10
1
15
11
14
6
7
8

10
1

10

102
103
104
SWITCHING FREQUENCY (kHz)

105

FIGURE 8. DYNAMIC POWER DISSIPATION vs SWITCHING


FREQUENCY (CD4053B)

CD4051B, CD4052B, CD4053B


Test Circuits and Waveforms
VDD = 15V

VDD = 7.5V

VDD = 5V

VDD = 5V

5V

7.5V
16

5V

16

16

16

VSS = 0V

VSS = 0V

VSS = 0V
VEE = 0V

7
8

VEE = -7.5V

7
8

VEE = -10V

7
8

7
8

VEE = -5V

VSS = 0V
(D)

(C)

(B)

(A)

NOTE: The ADDRESS (digital-control inputs) and INHIBIT logic levels


are: 0 = VSS and 1 = VDD. The analog signal (through the TG) may
swing from VEE to VDD.
FIGURE 9. TYPICAL BIAS VOLTAGES

tr = 20ns

tr = 20ns

tf = 20ns

90%
50%

90%
50%

10%

tf = 20ns

90%
50%

90%
50%
10%

10%

10%
TURN-ON TIME
90%
50%

90%
10%

10%

10%
TURN-OFF TIME

TURN-OFF TIME

FIGURE 10. WAVEFORMS, CHANNEL BEING TURNED ON


(RL = 1k)

FIGURE 11. WAVEFORMS, CHANNEL BEING TURNED OFF


(RL = 1k)

VDD

VDD

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10
9
CD4051

IDD

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10
9
CD4052

VDD

IDD

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10
9
CD4053

FIGURE 12. OFF CHANNEL LEAKAGE CURRENT - ANY CHANNEL OFF

TURN-ON
TIME

tPHZ

IDD

CD4051B, CD4052B, CD4053B


Test Circuits and Waveforms (Continued)
VDD

1
2
3
4
5
6
7
8

IDD

VDD

16
15
14
13
12
11
10
9

1
2
3
4
5
6
7
8

IDD

VDD

16
15
14
13
12
11
10
9

1
2
3
4
5
6
7
8

CD4052

CD4051

16
15
14
13
12
11
10
9

IDD

CD4053

FIGURE 13. OFF CHANNEL LEAKAGE CURRENT - ALL CHANNELS OFF

VDD
1
2
3
4
5
6
7
8

VDD

VEE
VSS

16
15
14
13
12
11
10
9

OUTPUT

VDD

OUTPUT

OUTPUT

1
RL
CL
2
RL
CL
3
VDD
VEE
4
VDD
5
VEE
6
VEE
VSS CLOCK
7
IN
8
VSS

VSS

CD4051

16
15
14
13
12
11
10
9

VDD

VEE

VDD

VSS CLOCK
VSS
IN
VSS

CD4052

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10
9
CD4053

RL

CL
VEE

VDD

VSS CLOCK
IN
VSS

FIGURE 14. PROPAGATION DELAY - ADDRESS INPUT TO SIGNAL OUTPUT

VDD

OUTPUT
RL

1
2
3
4
5
6
7
8

50pF
VEE

VDD
VSS

VDD
CLOCK VEE
IN
VSS

16
15
14
13
12
11
10
9

VDD

OUTPUT
50pF

RL

VEE
VDD
VSS

VDD
CLOCK VEE
IN VSS

tPHL AND tPLH VSS


CD4051

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10
9

OUTPUT
RL

50pF
VEE
VDD

VDD
VSS CLOCK VEE
IN VSS

V
tPHL AND tPLH SS
CD4052

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10
9

VDD

V
tPHL AND tPLH SS
CD4053

FIGURE 15. PROPAGATION DELAY - INHIBIT INPUT TO SIGNAL OUTPUT


VDD

VIH

1K

VIH
VIL

VDD

VDD

1K

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10
9

VIH
VIL

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10
9

1K

1K

A
VIH

1K

VIL
VIH

VIL

MEASURE < 2A ON ALL


OFF CHANNELS (e.g., CHANNEL 6)

1K

VIH
VIL

VIL
MEASURE < 2A ON ALL
OFF CHANNELS (e.g., CHANNEL 2x)

MEASURE < 2A ON ALL


OFF CHANNELS (e.g., CHANNEL by)

FIGURE 16. INPUT VOLTAGE TEST CIRCUITS (NOISE IMMUNITY)

10

16
15
14
13
12
11
10
9

CD4053B

CD4052B

CD4051B

1
2
3
4
5
6
7
8

CD4051B, CD4052B, CD4053B


Test Circuits and Waveforms (Continued)
VDD

VDD
1
2
3
4
5
6
7
8

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10
9

CD4051
CD4053

VDD

16
15
14
13
12
11
10
9

KEITHLEY
160 DIGITAL
MULTIMETER
TG
ON

10k

X-Y
PLOTTER

FIGURE 18. CHANNEL ON RESISTANCE MEASUREMENT


CIRCUIT

VDD
1
2
3
4
5
6
7
8

VDD

VSS

CD4051
CD4053

VSS

H.P.
MOSELEY
7030A

CD4052

VDD
16
15
14
13
12
11
10
9

VSS

FIGURE 17. QUIESCENT DEVICE CURRENT

1
2
3
4
5
6
7
8

1k
RANGE

VSS

16
15
14
13
12
11
10
9

VDD

VSS

CD4052

NOTE: Measure inputs sequentially,


to both VDD and VSS connect all
unused inputs to either VDD or VSS .

NOTE: Measure inputs sequentially,


to both VDD and VSS connect all
unused inputs to either VDD or VSS .

FIGURE 19. INPUT CURRENT

5VP-P

CHANNEL
ON
5VP-P

OFF
CHANNEL
VDD

RF
VM

RL

1K

RL

RL

RL

FIGURE 20. FEEDTHROUGH (ALL TYPES)

FIGURE 21. CROSSTALK BETWEEN ANY TWO CHANNELS


(ALL TYPES)

CHANNEL IN Y
ON OR OFF

CHANNEL IN X
ON OR OFF
RL

RF
VM
RL

FIGURE 22. CROSSTALK BETWEEN DUALS OR TRIPLETS (CD4052B, CD4053B)

11

RF
VM

CHANNEL
ON

RF
VM

CHANNEL
OFF

6
7
8

5VP-P

COMMON

CHANNEL
OFF

CD4051B, CD4052B, CD4053B


Test Circuits and Waveforms (Continued)
DIFFERENTIAL
SIGNALS

CD4052

CD4052

COMMUNICATIONS
LINK

DIFF.
AMPLIFIER/
LINE DRIVER

DIFF.
MULTIPLEXING

DIFF.
RECEIVER

DEMULTIPLEXING

FIGURE 23. TYPICAL TIME-DIVISION APPLICATION OF THE CD4052B

Special Considerations
In applications where separate power sources are used to
drive VDD and the signal inputs, the VDD current capability
should exceed VDD/RL (RL = effective external load). This
provision avoids permanent current flow or clamp action on
the VDD supply when power is applied or removed from the
CD4051B, CD4052B or CD4053B.

A
B
CD4051B
C
INH

A
B
C

D
E

Q0

A
B
E

1/2
CD4556

A
B
CD4051B
C
INH

Q1
Q2

A
B
CD4051B
C
INH

FIGURE 24. 24-TO-1 MUX ADDRESSING

12

COMMON
OUTPUT

PACKAGE OPTION ADDENDUM

www.ti.com

4-Dec-2014

PACKAGING INFORMATION
Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (C)

Device Marking
(4/5)

7901502EA

ACTIVE

CDIP

16

TBD

A42

N / A for Pkg Type

-55 to 125

7901502EA
CD4052BF3A

8101801EA

ACTIVE

CDIP

16

TBD

A42

N / A for Pkg Type

-55 to 125

8101801EA
CD4053BF3A

CD4051BE

ACTIVE

PDIP

16

25

Pb-Free
(RoHS)

CU NIPDAU | CU SN

N / A for Pkg Type

-55 to 125

CD4051BE

CD4051BEE3

PREVIEW

PDIP

16

25

TBD

Call TI

Call TI

-55 to 125

CD4051BE

CD4051BEE4

ACTIVE

PDIP

16

25

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-55 to 125

CD4051BE

CD4051BF

ACTIVE

CDIP

16

TBD

A42

N / A for Pkg Type

-55 to 125

CD4051BF

CD4051BF3A

ACTIVE

CDIP

16

TBD

A42

N / A for Pkg Type

-55 to 125

CD4051BF3A

CD4051BF3AS2283

OBSOLETE

CDIP

16

TBD

Call TI

Call TI

CD4051BM

ACTIVE

SOIC

16

40

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4051BM

CD4051BM96

ACTIVE

SOIC

16

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU | CU SN

Level-1-260C-UNLIM

-55 to 125

CD4051BM

CD4051BM96G3

ACTIVE

SOIC

16

2500

Green (RoHS
& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-55 to 125

CD4051BM

CD4051BM96G4

ACTIVE

SOIC

16

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4051BM

CD4051BMG4

ACTIVE

SOIC

16

40

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4051BM

CD4051BMT

ACTIVE

SOIC

16

250

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4051BM

CD4051BNSR

ACTIVE

SO

NS

16

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4051B

CD4051BNSRE4

ACTIVE

SO

NS

16

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4051B

CD4051BPW

ACTIVE

TSSOP

PW

16

90

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CM051B

CD4051BPWE4

ACTIVE

TSSOP

PW

16

90

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CM051B

Addendum-Page 1

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

4-Dec-2014

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (C)

Device Marking
(4/5)

CD4051BPWG4

ACTIVE

TSSOP

PW

16

90

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CM051B

CD4051BPWR

ACTIVE

TSSOP

PW

16

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU | CU SN

Level-1-260C-UNLIM

-55 to 125

CM051B

CD4051BPWRG4

ACTIVE

TSSOP

PW

16

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CM051B

CD4052BE

ACTIVE

PDIP

16

25

Pb-Free
(RoHS)

CU NIPDAU | CU SN

N / A for Pkg Type

-55 to 125

CD4052BE

CD4052BEE4

ACTIVE

PDIP

16

25

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-55 to 125

CD4052BE

CD4052BF

ACTIVE

CDIP

16

TBD

A42

N / A for Pkg Type

-55 to 125

CD4052BF

CD4052BF3A

ACTIVE

CDIP

16

TBD

A42

N / A for Pkg Type

-55 to 125

7901502EA
CD4052BF3A

CD4052BM

ACTIVE

SOIC

16

40

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4052BM

CD4052BM96

ACTIVE

SOIC

16

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU | CU SN

Level-1-260C-UNLIM

-55 to 125

CD4052BM

CD4052BM96E4

ACTIVE

SOIC

16

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4052BM

CD4052BM96G3

ACTIVE

SOIC

16

2500

Green (RoHS
& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-55 to 125

CD4052BM

CD4052BM96G4

ACTIVE

SOIC

16

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4052BM

CD4052BMG4

ACTIVE

SOIC

16

40

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4052BM

CD4052BMT

ACTIVE

SOIC

16

250

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4052BM

CD4052BNSR

ACTIVE

SO

NS

16

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4052B

CD4052BNSRG4

ACTIVE

SO

NS

16

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4052B

CD4052BPW

ACTIVE

TSSOP

PW

16

90

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CM052B

CD4052BPWE4

ACTIVE

TSSOP

PW

16

90

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CM052B

Addendum-Page 2

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

4-Dec-2014

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (C)

Device Marking
(4/5)

CD4052BPWR

ACTIVE

TSSOP

PW

16

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU | CU SN

Level-1-260C-UNLIM

-55 to 125

CM052B

CD4052BPWRG3

ACTIVE

TSSOP

PW

16

2000

Green (RoHS
& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-55 to 125

CM052B

CD4052BPWRG4

ACTIVE

TSSOP

PW

16

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CM052B

CD4053BE

ACTIVE

PDIP

16

25

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-55 to 125

CD4053BE

CD4053BEE4

ACTIVE

PDIP

16

25

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-55 to 125

CD4053BE

CD4053BF

ACTIVE

CDIP

16

TBD

A42

N / A for Pkg Type

-55 to 125

CD4053BF

CD4053BF3A

ACTIVE

CDIP

16

TBD

A42

N / A for Pkg Type

-55 to 125

8101801EA
CD4053BF3A

CD4053BF3AS2283

OBSOLETE

CDIP

16

TBD

Call TI

Call TI

CD4053BM

ACTIVE

SOIC

16

40

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4053M

CD4053BM96

ACTIVE

SOIC

16

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU | CU SN

Level-1-260C-UNLIM

-55 to 125

CD4053M

CD4053BM96E4

ACTIVE

SOIC

16

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4053M

CD4053BM96G3

ACTIVE

SOIC

16

2500

Green (RoHS
& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-55 to 125

CD4053M

CD4053BM96G4

ACTIVE

SOIC

16

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4053M

CD4053BMG4

ACTIVE

SOIC

16

40

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4053M

CD4053BMT

ACTIVE

SOIC

16

250

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4053M

CD4053BNSR

ACTIVE

SO

NS

16

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4053B

CD4053BPW

ACTIVE

TSSOP

PW

16

90

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CM053B

CD4053BPWG4

ACTIVE

TSSOP

PW

16

90

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CM053B

Addendum-Page 3

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device

4-Dec-2014

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (C)

Device Marking
(4/5)

CD4053BPWR

ACTIVE

TSSOP

PW

16

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU | CU SN

Level-1-260C-UNLIM

-55 to 125

CM053B

CD4053BPWRG3

ACTIVE

TSSOP

PW

16

2000

Green (RoHS
& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-55 to 125

CM053B

CD4053BPWRG4

ACTIVE

TSSOP

PW

16

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-55 to 125

CM053B

(1)

The marketing status values are defined as follows:


ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 4

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

4-Dec-2014

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4051B, CD4051B-MIL, CD4052B, CD4052B-MIL, CD4053B, CD4053B-MIL :

Catalog: CD4051B, CD4052B, CD4053B


Automotive: CD4051B-Q1, CD4051B-Q1, CD4053B-Q1, CD4053B-Q1
Military: CD4051B-MIL, CD4052B-MIL, CD4053B-MIL
NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product


Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Military - QML certified for Military and Defense Applications

Addendum-Page 5

PACKAGE MATERIALS INFORMATION


www.ti.com

29-Apr-2014

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins


Type Drawing

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

CD4051BM96

SOIC

16

2500

330.0

16.4

6.5

10.3

2.1

8.0

16.0

Q1

CD4051BM96

SOIC

16

2500

330.0

16.8

6.5

10.3

2.1

8.0

16.0

Q1

CD4051BM96

SOIC

16

2500

330.0

16.4

6.5

10.3

2.1

8.0

16.0

Q1

CD4051BM96G3

SOIC

16

2500

330.0

16.8

6.5

10.3

2.1

8.0

16.0

Q1

CD4051BM96G4

SOIC

16

2500

330.0

16.4

6.5

10.3

2.1

8.0

16.0

Q1

CD4051BM96G4

SOIC

16

2500

330.0

16.4

6.5

10.3

2.1

8.0

16.0

Q1

CD4051BPWR

TSSOP

PW

16

2000

330.0

12.4

6.9

5.6

1.6

8.0

12.0

Q1

CD4051BPWRG4

TSSOP

PW

16

2000

330.0

12.4

6.9

5.6

1.6

8.0

12.0

Q1

CD4052BM96

SOIC

16

2500

330.0

16.4

6.5

10.3

2.1

8.0

16.0

Q1

CD4052BM96

SOIC

16

2500

330.0

16.8

6.5

10.3

2.1

8.0

16.0

Q1

CD4052BM96G3

SOIC

16

2500

330.0

16.8

6.5

10.3

2.1

8.0

16.0

Q1

CD4052BM96G4

SOIC

16

2500

330.0

16.4

6.5

10.3

2.1

8.0

16.0

Q1

CD4052BPWR

TSSOP

PW

16

2000

330.0

12.4

6.9

5.6

1.6

8.0

12.0

Q1

CD4052BPWR

TSSOP

PW

16

2000

330.0

12.4

6.9

5.6

1.6

8.0

12.0

Q1

CD4052BPWRG3

TSSOP

PW

16

2000

330.0

12.4

6.9

5.6

1.6

8.0

12.0

Q1

CD4052BPWRG4

TSSOP

PW

16

2000

330.0

12.4

6.9

5.6

1.6

8.0

12.0

Q1

CD4053BM96

SOIC

16

2500

330.0

16.4

6.5

10.3

2.1

8.0

16.0

Q1

CD4053BM96

SOIC

16

2500

330.0

16.8

6.5

10.3

2.1

8.0

16.0

Q1

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION


www.ti.com

29-Apr-2014

Device

Package Package Pins


Type Drawing

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

CD4053BM96G3

SOIC

16

2500

330.0

16.8

6.5

10.3

2.1

8.0

16.0

Q1

CD4053BM96G4

SOIC

16

2500

330.0

16.4

6.5

10.3

2.1

8.0

16.0

Q1

CD4053BPWR

TSSOP

PW

16

2000

330.0

12.4

6.9

5.6

1.6

8.0

12.0

Q1

CD4053BPWR

TSSOP

PW

16

2000

330.0

12.4

6.9

5.6

1.6

8.0

12.0

Q1

CD4053BPWRG3

TSSOP

PW

16

2000

330.0

12.4

6.9

5.6

1.6

8.0

12.0

Q1

CD4053BPWRG4

TSSOP

PW

16

2000

330.0

12.4

6.9

5.6

1.6

8.0

12.0

Q1

*All dimensions are nominal

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

CD4051BM96

SOIC

16

2500

333.2

345.9

28.6

CD4051BM96

SOIC

16

2500

364.0

364.0

27.0

CD4051BM96

SOIC

16

2500

367.0

367.0

38.0

CD4051BM96G3

SOIC

16

2500

364.0

364.0

27.0

CD4051BM96G4

SOIC

16

2500

367.0

367.0

38.0

CD4051BM96G4

SOIC

16

2500

333.2

345.9

28.6

CD4051BPWR

TSSOP

PW

16

2000

364.0

364.0

27.0

CD4051BPWRG4

TSSOP

PW

16

2000

367.0

367.0

35.0

CD4052BM96

SOIC

16

2500

333.2

345.9

28.6

CD4052BM96

SOIC

16

2500

364.0

364.0

27.0

CD4052BM96G3

SOIC

16

2500

364.0

364.0

27.0

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION


www.ti.com

29-Apr-2014

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

CD4052BM96G4

SOIC

16

2500

333.2

345.9

28.6

CD4052BPWR

TSSOP

PW

16

2000

364.0

364.0

27.0

CD4052BPWR

TSSOP

PW

16

2000

367.0

367.0

35.0

CD4052BPWRG3

TSSOP

PW

16

2000

364.0

364.0

27.0

CD4052BPWRG4

TSSOP

PW

16

2000

367.0

367.0

35.0

CD4053BM96

SOIC

16

2500

333.2

345.9

28.6

CD4053BM96

SOIC

16

2500

364.0

364.0

27.0

CD4053BM96G3

SOIC

16

2500

364.0

364.0

27.0

CD4053BM96G4

SOIC

16

2500

333.2

345.9

28.6

CD4053BPWR

TSSOP

PW

16

2000

364.0

364.0

27.0

CD4053BPWR

TSSOP

PW

16

2000

367.0

367.0

35.0

CD4053BPWRG3

TSSOP

PW

16

2000

364.0

364.0

27.0

CD4053BPWRG4

TSSOP

PW

16

2000

367.0

367.0

35.0

Pack Materials-Page 3

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products

Applications

Audio

www.ti.com/audio

Automotive and Transportation

www.ti.com/automotive

Amplifiers

amplifier.ti.com

Communications and Telecom

www.ti.com/communications

Data Converters

dataconverter.ti.com

Computers and Peripherals

www.ti.com/computers

DLP Products

www.dlp.com

Consumer Electronics

www.ti.com/consumer-apps

DSP

dsp.ti.com

Energy and Lighting

www.ti.com/energy

Clocks and Timers

www.ti.com/clocks

Industrial

www.ti.com/industrial

Interface

interface.ti.com

Medical

www.ti.com/medical

Logic

logic.ti.com

Security

www.ti.com/security

Power Mgmt

power.ti.com

Space, Avionics and Defense

www.ti.com/space-avionics-defense

Microcontrollers

microcontroller.ti.com

Video and Imaging

www.ti.com/video

RFID

www.ti-rfid.com

OMAP Applications Processors

www.ti.com/omap

TI E2E Community

e2e.ti.com

Wireless Connectivity

www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2014, Texas Instruments Incorporated

You might also like