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ENGR 498A System Requirements Memo 9/26/2014 Project 1436

This document provides an overview of a project to design a lightweight sensor payload and test bed for use in amateur rockets. The payload will contain modular circuit boards with different sensors to measure variables like temperature, altitude, and orientation. A test bed will simulate sensor inputs to verify payload functionality. Requirements include withstanding rocket acceleration, collecting and storing sensor data, and triggering parachute deployment. Three operational scenarios are described: normal flight, failed parachute, and poor weather conditions. Requirements, a test plan, schedule, and next steps are also outlined.

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0% found this document useful (0 votes)
109 views14 pages

ENGR 498A System Requirements Memo 9/26/2014 Project 1436

This document provides an overview of a project to design a lightweight sensor payload and test bed for use in amateur rockets. The payload will contain modular circuit boards with different sensors to measure variables like temperature, altitude, and orientation. A test bed will simulate sensor inputs to verify payload functionality. Requirements include withstanding rocket acceleration, collecting and storing sensor data, and triggering parachute deployment. Three operational scenarios are described: normal flight, failed parachute, and poor weather conditions. Requirements, a test plan, schedule, and next steps are also outlined.

Uploaded by

MarkBedoya
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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ENGR 498A

System Requirements Memo


9/26/2014
Project 1436
Turki Alturki, Mark Bedoya, Matthew Cichon, Tyler Gabb, Ryan Hoefferle, Eric Moser

Table of Contents
Contents
Abstract..................................................................................................................................... 3
Concept of Operations................................................................................................................... 3
Purpose............................................................................................................................... 3
Scope of the Project................................................................................................................ 3
Background.......................................................................................................................... 4
Concept for the Proposed System................................................................................................ 4
System Overview................................................................................................................... 6
Operational Scenarios.............................................................................................................. 8
System Requirements.................................................................................................................... 9
Test Matrix............................................................................................................................... 10
Schedule of Activities.................................................................................................................. 11
Next Steps................................................................................................................................ 12

Abstract
The Lightweight Rocket Sensor Payload and Test Bed project is sponsored by Texas
Instruments. The project is to be completed over the fall and spring semesters of the 2014-2015
academic year. The first semester is consist mainly of the system design. The second semester
will consist of the system build and test. The goal of the project as given by the sponsor is to
design a durable, lightweight sensor payload to be used in common amateur rockets along with
a test bed capable of simulating real sensor data to allow characterization of the payload without
the costly overhead of field testing. The payload size and weight is constrained by the capacity of
a common off-the-shelf rocket. The payload should be able to measure and log various sensors
inputs and control a few output functions that can be triggered by certain sensor conditions (i.e.
parachute deployment based on altitude). The test bed must be able to force or simulate sensor
inputs to verify the accuracy and functionality of the payload.
The concept of the system is given in the Concept of Operations section. The purpose of
the system is to deliver a research payload into the atmosphere to collect data and to protect the
payload during flight and to accomplish this on an amateur rocket. The idea is that this payload
could be dropped in to any amateur rocket to collect data. The ideal method for capturing data is
by using sensor modularized printed circuit boards (PCB). Each PCB would contain one sensor
and any signal processing and controls circuits needed for that sensor (Figure 1). A block
diagram of the proposed payload is given in Figure 2. Three operational scenarios are explored;
ideal operating conditions, failed parachute deployment, and poor weather conditions. A detailed
list of the system requirements is given in Table 1. Table 1 covers functional requirements,
technology requirements, Illities requirements, constraints, and tradeoffs. A test matrix was
developed to explore what method would be used to verify the success of each requirement. Each
requirement may be tested, analyzed, inspected, or a combination of the three may be performed.
A Gantt chart is shown in Figure 4 detailing the proposed schedule for the first semester. Finally,
the foreseeable tasks to be completed after the System Requirements Review are laid out in
detail in the Next Steps section.

Concept of Operations
Purpose
The concept of operations serves as a comprehensive overview of the system. It explains
the reasons behind project development, what is being developed, and the functionality of the
system being developed. Stakeholders will find this document to be central to their
understanding of the system and the reasons behind decisions that have been made.
Scope of the Project
The system will include two major components, the rocket payload and the test bed. The
payload will be built as a self-contained system allowing it to be a drop-in component to a hobby

rocket. Any outputs that the payload controls will be simple true or false states that will turn
something outside of the payload on or off. Electronics and controls included in the payload will
not extend outside of the payload case. Thus, the scope of the payload will be the physical
container that houses the electronics.
The test bed will be contained to any electrical, electro-mechanical, and mechanical
systems that are used to force inputs into the payload, as well as any external computers used to
control the testing.
Background
The system being developed encompasses an electronic payload and the containing shell.
It will be built as a drop-in unit to a commercial-off-the-shelf (COTS) amateur rocket. Amateur
rockets are usually bought as kits and do not contain payloads. Many hobbyists also build their
own rockets, and desired payloads are custom built by the user. Searches of online hobbyist
stores reveal no existing product such as the one being developed here although there are drop-in
payload shells that allow the user to install their own payload.
The COTS payload we are developing will enable a broader set of users to engage in
amateur science experiments and will produce more interest in the fields of engineering and
science.
Concept for the Proposed System
The purpose of the system is to deliver a research payload into the atmosphere to collect
data and to protect the payload during flight and to accomplish this on an amateur rocket. To do
this, the payload must be contained in an enclosure that can easily be placed onto a rocket with
little modification. The simplest way to do this is by replacing the nose cone included with an
amateur rocket with a self-contained nose that houses the payload and easily mounts to the
rocket frame.
Alternatives to the design differ in the form factor of the internal electronics payload. The
first option would be to include multiple sensors on a single PCB that would be housed vertically
inside of the nose cone. The ease of this design is based on the fact that there are less separate
components that are placed in the payload. Mounting is simpler, there are less pieces to account
for, and overall design is easier. Disadvantages include a design that is not modular, possible
issues with accelerometer orientation, and difficulty with maintenance.
The second option includes building small, circular breakout boards, each containing
one sensor and stacked above one another in the shell. This allows for better modularity, is
accelerometer orientation-friendly, and ease of maintenance. Disadvantages include more
complex electronics interfacing, more complex mounting, and a more costly payload. This
design is shown in Figure 1.

Figure 1 Modular PCB Design

System Overview
The overview of the system is illustrated in Figures 1 and 2. Figure 1 shows how the
system components are interconnected. The payload is contained within its container/nosecone.
The red box indicates the physical container of the payload. Notice that the temperature sensor is
embedded into the outer shell of the nosecone so that it may measure the surrounding airs
ambient temperature.

Figure 2 Component Connections


Figure 2 shows data flow and algorithms calculated in the MCU. The blue box represents
the MCU. Data flows from the external sensors and it used to calculate altitude, distance
traveled, velocity, and orientation.

Figure 3 Data Flow

Operational Scenarios
Scenario 1 Ideal Operating Conditions
The user begins by powering on the payload before launch. This will be done either by
plugging in the battery or turning a power switch on. The system will power on and begin
collecting data before launch. The payload is then launched. The acceleration experienced by the
payload will be much greater than gravity. The system must be able to withstand this without
components coming loose inside of the shell.
The flight will be very short since apogee is reached within seconds. The parachute will
be set to deploy seconds after apogee. Once the parachute is deployed the payload will make it
safely back to the ground so that the payload may be recovered.

Scenario 2 Failed Parachute Deployment


After the user has powered on and launched the payload, the possibility of a failed
parachute deployment exists. If the rocket reaches apogee and the mechanism used to release the
parachute fails, the payload is at risk of being destroyed upon returning to the ground. This is
highly problematic as long as the data is being stored on board and not transmitted to the ground
during flight. Solutions to this include designing a payload shell that can withstand an impact, or
including a backup mechanism to attempt to deploy the parachute again. Adding a second
parachute may not be practical.

Scenario 3 Poor Weather Conditions


Poor weather is a likely possibility during launch. Normally, a rocket would avoid being
launched during obviously poor weather, but the weather could also be clear skies and very
windy. If this is the case, the rocket could easily be blown off course making it more difficult to
find. It may also cause various other problems such as failed parachute deployment and unstable
flight. Any secondary parachute deployment system would reduce the chances of the payload
being destroyed. If a payload is blown off course, it may be impossible to find unless it has a
GPS transmitter sending information to the user. Instability is also impossible to avoid. The only
solution is to avoid launching in bad weather situations.

System Requirements
Table 1 System Requirements

Test Matrix

Table 2 Test Matrix

Schedule of Activities
Figure 4 Gantt Chart

Next Steps
This section outlines the upcoming tasks to be completed in the foreseeable future.
I.

Design preliminary prototype payload and test bed.


i.
Determine the dimensions of the rocket.
ii.
Determine the type of sensor payload to use: modular or fixed/vertically mounted.
iii.
Consult the system requirements to begin developing pseudo-code for the
microprocessors.
iv. Consult the system requirements to determine what sensors to use, and determine
a high level circuit design.
v. Consult the system requirements to begin the payload housing design.
vi.
Consult the system requirements to begin preliminary design of the test bed, and
determine the desired objectives of testing.
vii.
Create a working list of components to be used.
a)
Manufacturer
b)
Part Number
c)
Functionality
viii.
Create working list of required parts and materials.
a)
Plastic vs. Metal
b)
3D print vs. CNC machine
II.
Develop a budget plan.
i.
Determine the cost per unit (Modular and Macro scales).
ii.
Determine the risk assessment and reduction.
a)
Housing durability with respect to expected stressed of
launch/apogee
b)
Mounting methods to secure PCB and circuit components
c)
Feasibility of test bed to be able to expose flaws and help refine the
following solutions
iii.
Redesign and reassess the plan until cost, risk, and development ratios are
optimized.
III.
Determine the manufacture and assembly methods.
i.
Consult working lists for components and materials.
ii.
Develop a plan for mechanical and electrical synergy.
a)
Mechanical design vs. viable space/surface for circuitry
b)
Housing design vs. PCB mounting/securing
IV.
Begin Manufacture and Assembly.
i.
Consult the predetermined circuit anatomy to begin the manufacture of the PCBs.
ii.
Consult the predetermined mechanical housing design to begin the manufacture of
the housing and modular PCB mounts.
iii.
Develop a test plan for the payload and test bed.
iv. Begin the cyclic process of build, test, fix until the project is finished.
Periodically, these next steps will be revisited in an effort to refine the feasibility of both
the test bed and payload, the ability to use both components to demonstrate the durability and

functionality of the payload, and the ability of the test bed to demonstrate said durability and
functionality of the payload.

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