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ECE 431 Digital Circuit Design Chapter 6 MOS Inverters: Switching Characteristics and Interconnect Effects

This document summarizes key concepts from Chapter 6 of the textbook ECE 431 Digital Circuit Design. It discusses MOS inverter switching characteristics and interconnect effects. It defines propagation delay and outlines methods for calculating delay times using transistor models and load capacitance. Interconnect resistance and capacitance modeling is presented for estimating interconnect delay. Power dissipation of CMOS inverters is also summarized. The document provides equations, examples, and diagrams to illustrate these digital circuit design concepts.

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Sneha S Revankar
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0% found this document useful (0 votes)
74 views44 pages

ECE 431 Digital Circuit Design Chapter 6 MOS Inverters: Switching Characteristics and Interconnect Effects

This document summarizes key concepts from Chapter 6 of the textbook ECE 431 Digital Circuit Design. It discusses MOS inverter switching characteristics and interconnect effects. It defines propagation delay and outlines methods for calculating delay times using transistor models and load capacitance. Interconnect resistance and capacitance modeling is presented for estimating interconnect delay. Power dissipation of CMOS inverters is also summarized. The document provides equations, examples, and diagrams to illustrate these digital circuit design concepts.

Uploaded by

Sneha S Revankar
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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ECE 431 Digital Circuit Design

Chapter 6 MOS Inverters: Switching


Characteristics and Interconnect
Effects
Lecture given by Qiliang Li

6.1 Introduction

Cload =C gd ,n +C gd , p +C db,n +C db, p +C int +C g

Simplified first-stage CMOS inverter

6.2 Delay-Time Definitions


Input-to-output signal delay times

V50%

1
= (VOL + VOH )
2

PHL = t1 t0
PLH = t3 t2
Average propagation delay

P =

PHL + PLH
2

Output signal fall and rise times

fall = tB t A

rise = tD tC

V10% = VOL + 0.1 (VOH VOL )


V90% = VOL + 0.9 (VOH VOL )

6.3 Calculation of Delay Times


Using current X time = Charges = capacitance X voltage

PHL

Cload VHL Cload (VOH V50% )


=
=
I avg ,HL
I avg ,HL

PLH

Cload VLH Cload (V50% VOL )


=
=
I avg ,LH
I avg ,LH

I avg ,HL

1
= [iC (Vin = VOH ,Vout = VOH ) + iC (Vin = VOH ,Vout = V50% )]
2

I avg ,HL

1
= [iC (Vin = VOL ,Vout = V50% ) + iC (Vin = VOL ,Vout = VOL )]
2

For rising-input case


i.e., falling output -> tPHL

dVout
Cload
= iC = iD , p iD ,n
dt
dVout
For Vin = VOH
Cload
= iD , n
dt
iD , n

kn
2
= (VOH VT ,n )
2

Time between t0 and t1

t =t1'

t = t0

Vout =VOH VT , n

dt = Cload

Vout =VOH

2Cload
=
kn (VOH VT ,n ) 2

Vout =VOH VT , n

Vout =VOH

2CloadVT ,n
t t0 =
2
kn (VOH VT ,n )
'
1

1
dVout

i
D ,n
dVout

(6.17)

nMOS is in saturation

Time between t1 and t1

iD , n

kn
2
2(VOH VT ,n )Vout Vout
=
2

nMOS is in linear region

1
t =t1' dt = Cload Vout =VOH VT ,n iD,n dVout

t =t1

Vout =V50%

= 2Cload
2
Vout =VOH VT , n k 2(V
V
V
V
)

OH
T ,n
out
out
n
Vout =V50%

dVout

2(VOH VT ,n ) V50%
Cload
ln(
)
t1 t =
kn (VOH VT ,n )
V50%
'
1

(6.21)

(6.3 Calculation of Delay Times continue )

In summary:
PHL

2VT ,n
4(VOH VT ,n )
Cload
=
+ ln(
1)]
[
kn (VOH VT ,n ) VOH VT ,n
VOH + VT ,n

PHL

2VT ,n
4(VDD VT ,n )
Cload
=
+ ln(
1)]
[
kn (VDD VT ,n ) VDD VT ,n
VDD

(6.3 Calculation of Delay Times continue )

Example 6.1 in page 225

Example 6.2 fall time in page 226


(use VT,n = 1 V)

(6.3 Calculation of Delay Times continue )

Similarly for Charging-up: Vin from VOH -> VOL


nMOS is cut off and pMOS is turned on.

PLH

2 | VT , p |
4(VDD | VT , p |)
Cload
=
+ ln(
1)]
[
k p (VDD | VT , p |) VDD | VT , p |
VDD

To achieve balanced propagation delays:


VT,n = VT,p

What about the delays in other type


inverter, e.g., depletion load inverter?
If the input is not ideal: tr and tf are not
zero

PHL ( actual ) =

2
PHL ( step _ input )

PLH ( actual ) =

2
PLH ( step _ input )

+( )
2

+(

f
2

6.4 Inverter Design with Delay Constraints


Constraints: Delay, noise margins, logic threshold, area and power dissipation

2VT ,n
4(V V )
W
Cload
)n = *
[
+ ln( DD T ,n 1)]
L
PHL nCox (VDD VT ,n ) VDD VT ,n
VDD

2 | VT , p |
4(V | VT , p |)
W
Cload
)p = *
[
+ ln( DD
1)]
PLH pCox (VDD | VT , p |) VDD | VT , p |
L
VDD

Example 6.3 in page 232

Limit of delay

Cload = Cgd ,n (Wn ) + C gd , p (W p ) + Cdb,n (Wn ) + Cdb, p (W p ) + Cint + C g


Cload = 0 + nWn + pW p
0 = 2 Ddrain (C jsw,n K eq ,n + C jsw, p K eq , p ) + Cint + Cg

n = K eq ,n (C j 0,n Ddrain + 2C jsw,n )


p = K eq , p (C j 0, p Ddrain + 2C jsw, p )

PHL

PLH

2VT ,n
4(VDD VT ,n )
0 + nWn + pW p
Ln
[


ln(
+
1)]
=
C (V V ) V V
W
V
n
DD
T ,n
DD
n ox DD T ,n

0 + nWn + pW p

2 | VT , p |
4(VDD | VT , p |)
Lp

[
+ ln(
1)]

C (V | V |) V | V |
W
V
p
T ,p
DD
T ,p
DD

p ox DD

+ ( n + R p )Wn
0 + nWn + pW p

= n 0
W
W
n
n

PHL = n

PHL

Limits of delay: as W and W are


increasing (while R is kept unchanged)

0 + ( n + p )W p
R

= n
Wp

, where

Wp

R =
Wn

lim it
PHL
= n ( n + R p )
n
lim it
PLH = p ( + p )

Example 6.4 in page 237 effect of channel width

Limit of delay

CMOS Ring Oscillator Circuit


Identical CMOS inverters

T = 6 P
1
1
f = =
T 2 n P
1
P =
2n f

6.5 Estimation of Interconnect Parasitics


Different models to estimate
depending on the length of
interconnection lines

rise ( fall ) < 2.5 ( )

Transmission-line modeling

either Transmission-line
2.5 ( ) < rise ( fall ) < 5 ( ) modeling or lumped

modeling
l
rise ( fall ) > 5 ( )
lumped modeling

L: length of interconnect, v: propagation speed

Capacitive or RC modeling

Variation of the fringing field factor with the interconnect geometry

Interconnect Capacitance Estimation

w t
2

2
C =
+

2h
2h 2h

ln1 +
2
+
+

t
t
t

1 0.0543

w
2h

C = +
+ 1.47
h

2h
2
2
h
h

ln1 +
+
+ 2

t
t
t

For w>= t/2

For w< t/2

where p: material resistivity, l, w and t: length, width and thickness

Capacitance of an interconnect
line with is coupled with two
other parallel lines on both sides.

Cross-sectional view of a double-metal CMOS structure,


showing capacitances between various layers

Interconnect Resistance Estimation

total resistance

Sheet resistivity

Rwire

l
l
=
= Rsheet ( )
wt
w

Rsheet =

where p: material resistivity, l, w and t: length, width and thickness

6.6 Calculation of Interconnect Delay


RC Delay Models

Vout (t ) = VDD (1 exp(

t
))
RC

V50% = VDD (1 exp(

PLH 0.69 RC

PLH
RC

))

The Elmore Delay

Di = C j
j =1

for _ all
kPij

Example 6.5
Poly-Si interconnect with length 1000 m, width 4 m, what is the delay due to this interconnect?
R
C

10: R/10, C/10


R=7.5 k ohm, C = 356 fF
Use Lumped RC model: tPLH = tPHL = 0.69 * RC = 1.9 ns
Use Distrubuted RC model:
j
10

DN = C j Rk = RC (
j =1

k =1

N +1
) RC / 2
2N

500 um
500 um
2 um

6 um

6.7 Switching Power Dissipation of CMOS Inverters

Pavg

1
=
T

2
v (t ) i (t )dt = Cload VDD
f

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