DISCRETE SEMICONDUCTORS

DATA SHEET
handbook, halfpage

M3D283

KMI15/4
Rotational speed sensor
Product specification
Supersedes data of 2000 Jun 26

2000 Sep 05

Philips Semiconductors

Product specification

Rotational speed sensor

KMI15/4

FEATURES

PINNING

Digital current output signal

PIN

DESCRIPTION

Zero speed capability

Wide air gap

VCC

Wide temperature range

Vibration insensitive
EMC resistant.
DESCRIPTION
handbook, halfpage

The KMI15/4 sensor detects rotational speed of ferrous

gear wheels and reference marks(1).
The sensor consists of a magnetoresistive sensor
element, a signal conditioning integrated circuit in bipolar
technology and a ferrite magnet. The frequency of the
digital current output signal is proportional to the rotational
speed of a gear wheel.
CAUTION
Do not press two or more products together against their
magnetic forces.

2
MBH782

(1) The sensor contains a customized integrated circuit. Usage in

hydraulic brake systems and in systems with active brake
control is forbidden. For all other applications, higher
temperature versions of up to 150 C are available on
request.

Fig.1 Simplified outline (SOT453C).

QUICK REFERENCE DATA

SYMBOL

PARAMETER

MIN.

TYP.

MAX.

UNIT

VCC

DC supply voltage

12

Tamb

ambient operating temperature

40

+85

ICC (low)

current output signal low

mA

ICC (high)

current output signal high

14

mA

ft

operating tooth frequency

25000

Hz

sensing distance

0 to 2.0

0 to 2.3

mm

2000 Sep 05

Philips Semiconductors

Product specification

Rotational speed sensor

KMI15/4

LIMITING VALUES
In accordance with Absolute Maximum Rating System (IEC 60134).
SYMBOL

PARAMETER

CONDITIONS

MIN.

Tamb = 40 to +85 C; RL = 115

VCC

DC supply voltage

Tstg

storage temperature

Tamb

operating ambient temperature

Tsld

soldering temperature

t 10 s

output short-circuit duration to GND

MAX.

UNIT

0.5

+16

40

+150

40

+85

260

continuous

CHARACTERISTICS
Tamb = 25 C; VCC = 12 V; d = 1.5 mm; ft = 2 kHz; test circuit: see Fig.7; RL = 115 ; sensor positioning: see Fig.15;
gear wheel: module 2 mm; material 1.0715; unless otherwise specified.
SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

ICC (low)

current output signal low

ICC (high)

current output signal high

see Figs 6 and 8

11.2

14

16.8

mA

tr

output signal rise time

CL = 100 pF; see Fig.9;

10 to 90% value

0.5

tf

output signal fall time

CL = 100 pF; see Fig.9;

10 to 90% value

0.7

td

switching delay time

between stimulation pulse (generated by

a coil) and output signal

ft

operating tooth frequency for both rotation directions

25000

Hz

sensing distance

see Fig.15 and note 1

0 to 2.0 0 to 2.3

mm

duty cycle

see Fig.6

20

see Figs 6 and 8

5.6

50

8.4

80

Note
1. High rotational speeds of wheels reduce the sensing distance due to eddy current effects (see Fig.17).

2000 Sep 05

mA

Philips Semiconductors

Product specification

Rotational speed sensor

KMI15/4

FUNCTIONAL DESCRIPTION
The KMI15/4 sensor is sensitive to the motion of ferrous
gear wheels or reference marks. The functional principle is
shown in Fig.3. Due to the effect of flux bending, the
different directions of magnetic field lines in the
magnetoresistive sensor element will cause an electrical
signal. Because of the chosen sensor orientation and the
direction of ferrite magnetization, the KMI15/4 is sensitive
to movement in the y direction in front of the sensor only
(see Fig.2).

handbook, halfpage

x
magnet with
direction of
magnetization

The magnetoresistive sensor element signal is amplified,

temperature compensated and passed to a Schmitt-trigger
in the conditioning integrated circuit (Figs 4 and 5).
The digital output signal level (see Fig.6) is at a fixed level
independent of the sensing distance. A (2-wire) output
current enables safe sensor signal transport to the
detecting circuit (see Fig.7). The integrated circuit housing
is separated from the sensor element housing to optimize
the sensor behaviour at high temperatures.

sensor

IC

The strength of the magnetic field caused by the

Ferroxdure 100 magnet in the different sensor directions,
measured at the centre of the magnetoresistive bridge, is
typically: Hx = 7 kA/m (auxiliary field) and Hz = 17 kA/m
(perpendicular to the sensor surface). Hy is zero due to the
trimming process.

MBH779

Fig.2 Component detail of the KMI15/4.

gear wheel
handbook, full pagewidth
magnet

direction
of
motion

magnetic
field lines

sensor

MRA957

(a)

(b)

(c)

Fig.3 Functional principle.

2000 Sep 05

(d)

Philips Semiconductors

Product specification

Rotational speed sensor

KMI15/4

handbook, full pagewidth

CONSTANT
CURRENT
SOURCE

VOLTAGE CONTROL

SENSOR

SCHMITT
TRIGGER

AMPLIFIER

V CC

SWITCHABLE
CURRENT
SOURCE

MRA958

Fig.4 Block diagram.

VCC

handbook, full pagewidth

constant
current source

switchable
current source

power supply

sensor

Vref

EMC
FILTER
preamplifier

GAP

Schmitttrigger

V
MRA959

Fig.5 Simplified circuit diagram.

2000 Sep 05

Philips Semiconductors

Product specification

Rotational speed sensor

KMI15/4

MRA960

handbook, halfpage

I CC
T
14 mA
V
CC
SENSOR
V

7 mA
I CC

tp

CL

RL

GND

MRA961

tp
= ---- 100%
T

Fig.6 Output signal as a function of time.

Fig.7 Test and application circuit.

APPLICATION INFORMATION

MRA967

16

MRA968

handbook,
halfpage
I

handbook, halfpage

CC
(mA)
14

VCC = 20 V

t
( s)

VCC = 12 V

0.8
I CC(high)

tf

VCC = 8 V

12
0.6
tr

10
0.4
VCC = 20 V

0.2

I CC(low)

ICC

VCC = 12 V
VCC = 8 V

tr

tf
t

50

Fig.8

50

100

150

200
Tamb (oC)

Output current levels as functions of

ambient temperature; typical values.

2000 Sep 05

Fig.9

50

50

100

150
200
Tamb ( oC)

Output current switching times as functions

of ambient temperature; typical values.

Philips Semiconductors

Product specification

Rotational speed sensor

KMI15/4

Mounting conditions

Gear Wheel Dimensions

The recommended sensor position in front of a gear wheel

is shown in Fig.15. Distance d is measured between the
sensor front and the tip of a gear wheel tooth. The KMI15/4
senses ferrous indicators like gear wheels in the y
direction only (no rotational symmetry of the sensor); see
Fig.2. The effect of incorrect mounting positions on
sensing distance is shown in Figs 11, 12 and 13.
The symmetrical reference axis of the sensor corresponds
to the axis of the ferrite magnet.

SYMBOL

DESCRIPTION

UNIT

German DIN
z

number of teeth

diameter

mm

module m = d/z

mm

pitch p = m

mm

PD

pitch diameter (d in inch)

inch

DP

diametric pitch DP = z/PD

inch1

CP

circular pitch CP = /DP

inch

ASA; note1

Environmental conditions
Due to eddy current effects the sensing distance depends
on the tooth frequency (see Fig.17). The influence of gear
wheel module on the sensing distance is shown in Fig.16.

Note
1. For conversion from ASA to DIN: m = 25.4 mm/DP;
p = 25.4 mm CP.

MBD840

handbook, halfpage

d
(mm)
pitch

ft

handbook, halfpage

pitch
diameter

MRA964

0
0

pitch diameter
module = -----------------------------------------number of teeth

y (mm)

VCC = 12 V; ft = 2 kHz; module = 2 mm; pitch diameter = 100 mm.

pitch = module

Fig.11 Sensing distance as a function of positional

tolerance in the y-axis; typical values.

Fig.10 Gear wheel dimensions.

2000 Sep 05

Philips Semiconductors

Product specification

Rotational speed sensor

KMI15/4

MBD841

handbook, halfpage

d
(mm)

MBD842

handbook, halfpage

d
(mm)

ft

d
1

10 mm
0

0
0

(deg)

6
x (mm)

VCC = 12 V; ft = 2 kHz; module = 2 mm.

VCC = 12 V; ft = 2 kHz; module = 2 mm.

Fig.12 Sensing distance as a function of positional

tolerance; typical values.

Fig.13 Sensing distance as a function of positional

tolerance in the x-axis; typical values.

MBD839

handbook, halfpage

d
(mm)

handbook, halfpage

sensor
d

2
d
1

gear wheel

MRA963

0
-50

50

100

150

200
Tamb ( o C)

Fig.14 Typical sensing distance as a function of

ambient temperature; typical values.

2000 Sep 05

Fig.15 Sensor positioning.

Philips Semiconductors

Product specification

Rotational speed sensor

KMI15/4

MRA966

1.5

MBD843

handbook, halfpage

handbook, halfpage

d
d0

d
(mm)
3

2
d

0.5

ft
1

0
0

4
5
module m (mm)

f t (kHz)

d0 = sensing distance for gear wheel with module = 2 mm.

VCC = 12 V; module = 2 mm.

Fig.16 Normalized maximum sensing distance as

a function of a gear wheel module; typical
values.

2000 Sep 05

Fig.17 Sensing distance as a function of tooth

frequency; typical values.

Philips Semiconductors

Product specification

Rotational speed sensor

KMI15/4

EMC

The board net often contains a central load dump

protection that makes such a device in the protection
circuit of the sensor module unnecessary.

Figure 18 shows a recommended application circuit for

automotive applications (wheel sensing ft < 5 kHz).
It provides a protection interface to meet Electromagnetic
Compatibility (EMC) standards and safeguard against
voltage spikes Table 1 lists the tests which are applicable
to this circuit and the achieved class of functional status.
Protection against load dump (test pulse 5 according to
DIN 40839) means a very high demand on the protection
circuit and requires a suitable suppressor diode with
sufficient energy absorption capability.
Table 1

Tests for electrostatic discharge (ESD) were conducted in

line with IEC 801-2 to demonstrate the KMI15/4s
handling capabilities. The IEC 801-2 test conditions
were: C = 150 pF, R = 150 , V = 2 kV.
Electromagnetic disturbances with fields up to 150 V/m
and f = 1 GHz (ref. DIN 40839) have no influence on
performance.

EMC test results

EMC REF. DIN 40839

SYMBOL

MIN. (V)

MAX. (V)

REMARKS

CLASS

Test pulse 1

VLD

100

td = 2 ms

Test pulse 2

VLD

100

td = 0.2 ms

Test pulse 3a

VLD

150

td = 0.1 s

Test pulse 3b

VLD

100

td = 0.1 s

Test pulse 4

VLD

td = 130 ms

Test pulse 5

VLD

120

td = 400 ms

D1

handbook, halfpage

+V

VCC
1N4001/3
BZTO3G36

V
D2

C1
100
nF

RL
115

SENSOR

CL
100
nF
MGD805

GND

Fig.18 Test/application circuit for the KMI15/4.

2000 Sep 05

10

Philips Semiconductors

Product specification

Rotational speed sensor

KMI15/4

PACKAGE OUTLINE
Plastic single-ended multi-chip package;
magnetized ferrite magnet (5.5 x 5.5 x 3 mm); 4 interconnections; 2 in-line leads

M1

SOT453C

v M A B

HE1

A
Q

A
L1
M2
bp1

D
D2
L
L3

v M A B

M3

E1

HE

SENSOR DIE POSITION

centre of reading point

D1

L2
1

2
bp

c
0

2.5

5 mm

scale
DIMENSIONS (mm are the original dimensions)
UNIT A(1)

bp

bp1

1.7
1.4

0.8
0.7

1.57
1.47

0.3
0.24

mm

D(2) D1(2) D2(2) E(2) E1(2)

4.1
3.9

5.7
5.5

3.15
2.95

4.5
4.3

5.7
5.5

HE

HE1

K
max.

L1

L2

L3

4.6
4.4

18.2
17.8

5.6
5.5

3.87

7.55
7.25

1.2
0.9

3.9
3.5

6.55
6.35

M1

M2

M3(1)

5.65 5.65 3.15 0.75

0.25
5.35 5.35 2.85 0.65

Notes
1. Glue thickness not included.
2. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION

REFERENCES
IEC

JEDEC

EIAJ

2000 Sep 05

EUROPEAN
PROJECTION

ISSUE DATE
99-09-23
00-08-31

SOT453C

11

Philips Semiconductors

Product specification

Rotational speed sensor

KMI15/4

DATA SHEET STATUS

DATA SHEET STATUS

PRODUCT
STATUS

DEFINITIONS (1)

Objective specification

Development

This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.

Preliminary specification

Qualification

This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.

Product specification

Production

This data sheet contains final specifications. Philips Semiconductors

reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.

Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS

DISCLAIMERS

Short-form specification The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Life support applications These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Right to make changes Philips Semiconductors

reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

Application information Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

2000 Sep 05

12

Philips Semiconductors

Product specification

Rotational speed sensor

KMI15/4
NOTES

2000 Sep 05

13

Philips Semiconductors

Product specification

Rotational speed sensor

KMI15/4
NOTES

2000 Sep 05

14

Philips Semiconductors

Product specification

Rotational speed sensor

KMI15/4
NOTES

2000 Sep 05

15

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SCA 70

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613520/04/pp16

Date of release: 2000

Sep 05

Document order number:

9397 750 07471