MODULE 4questions No 2
MODULE 4questions No 2
1]a
ELECTRONIC FUNDAMENTALS
SEMICONDUCTORS
Module 4.1.1-B1.1
1.what is the characteristic of a diodes connected in series ?
a. The current must be the same of each diodes.
b.the current must be divided between diodes.
c.the voltage drop at each diodes is equal to supply voltage.
2.What are the 2 materials commonly used as semiconductors?
a.rubber and tin
b.copper and alliminium
c.germanium and silicon.
3.what are the majority carrier in the p-type semiconductor?
a.electrons
b.holes
c.nucleus.
4.The terms flow of electron from negative supply to positive and holes moving in
opposite direction is known as..
a.Reverse Bias
b.depletion layer
c.Forward Bias.
5..Due to intrinsic conduction that produce minority carriers causes tiny current to
flow across the P-N junction and is known as
a.barrier potential
b.depletion layer
c.leakage current.
6.what is the average output voltage of a Single Phase Full Wave Rectifier ?
a.0.318 x peak
b.0.637 x peak
c.1.717 x peak
7.what are the advantages having Bridge rectifier compare to Single phase full wave
rectifier?
a.cheap and last longer
b.required centre tap which is good as voltage doubler.
a.proton
b.neutron.
c.electrons.
14 .to test a transistor using analogue multimeter.
a.the red cables is connected to +ve terminal
b. the black cables is connected to =+ve terminal
c.both cables connected together
15.what is the function of a coupling capacitor in the amplifier unit.
a.acts as anoise filter
b.gain amplifier
c.allows ac current only and blocd dc curren
t.
16.2 types of FIELD EFFECT TRANSISTOR[FET]
a.JUGFET and FLIP-FLOP
b.MOSFET and JUGFET
c.FLIP FLOP AND PUSH PULL
Module 41..3-b.1.1
17. .Printed Circuit Boards are manufactured in 3 basic config
Which of the following is true.
a.Single layer contain printed conducting path on
one side with component mounted on opposite side.
b.multilayer boardslaminated together with compon
ent mounted one one side only.
c.multilayer sandwich- printed conducting path and
component mounted on both side.
18.In an integrated circuits the components are mounted.
a.by wires
b.by metal screw.
c.by metal oxide film.
Module4.2. b1.1
19.which of the following is correct properties of ops amp.
a.low open loop gain /high input impedence /low output
b.high open loop gain /low input impedence /high output
impedence
c.high open loop gain /high input impedence /low output.
impedence
20.How is PCB protected after manufacture ?
a.by conformal coating.
b.with wax.
c.with non conductive varnished.
Module 4.3.b.1.1.
21.what is the purpose of having negative feedback in op-a.
Amp circuit.
a.feed some output back to inverting input.
b.feed some output back to non-inverting input.
c.gives both input and output a non inverted signal.