SN54HC04, SN74HC04

www.ti.com

SCLS078F DECEMBER 1982 REVISED AUGUST 2013

HEX INVERTERS
Check for Samples: SN54HC04, SN74HC04

FEATURES

DESCRIPTION

The HC04 devices contain six independent inverters.

They perform the Boolean function Y = A in positive
logic.

12

11

10

VCC
6A
6Y
5A
5Y
4A
4Y

2A
NC
2Y
NC
3A

20 19
18

17

6A

VCC

13

16

15
14

6Y
NC
5A
NC
5Y

9 10 11 12 13

4Y

14

4A

3Y

1A
1Y
2A
2Y
3A
3Y
GND

1Y

SN54HC04...FK PACKAGE
(TOP VIEW)

SN54HC04...J OR W PACKAGE
SN74HC04...D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)

1A
NC

Wide Operating Voltage Range of 2 V to 6 V

Outputs Can Drive Up To 10 LSTTL Loads
Low Power Consumption, 20-A Max ICC
Typical tpd = 8 ns
4-mA Output Drive at 5 V
Low Input Current of 1 A Max

GND
NC

NC No internal connection

FUNCTION TABLE
(EACH INVERTER)
INPUT
A

OUTPUT
Y

LOGIC DIAGRAM (POSITIVE LOGIC)

A

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Copyright 19822013, Texas Instruments Incorporated

SN54HC04, SN74HC04
SCLS078F DECEMBER 1982 REVISED AUGUST 2013

www.ti.com

Absolute Maximum Ratings (1)

over operating free-air temperature range (unless otherwise noted)
MIN

MAX

0.5

UNIT

VCC

Supply voltage range

IIK

Input clamp current (2)

VI < 0 or VI > VCC

20

mA

IOK

Output clamp current (2)

VO < 0

20

mA

IO

Continuous output current

VO = 0 to VCC

25

mA

50

mA

Continuous current through VCCor GND

JA

Package thermal impedance (3)

Tstg

Storage temperature range

D package

86

N package

80

NS package

76

PW package

(1)
(2)
(3)

C/W

113
60

150

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.

Recommended Operating Conditions (1)

SN54HC04
VCC

Supply voltage
VCC = 2 V

VIH

High-level input voltage

VCC = 4.5 V
VCC = 6 V

SN74HC04

MIN

NOM

MAX

Low-level input voltage

NOM

MAX

1.5

1.5

3.15

3.15

4.2

4.2

VCC = 2 V
VIL

MIN

VCC = 4.5 V
VCC = 6 V

UNIT
V
V

0.5

0.5

1.35

1.35

1.8

1.8

VI

Input voltage

VCC

VCC

VO

Output voltage

VCC

VCC

VCC = 2 V
t/v Input transition rise or fall rate
TA
(1)

Operating free-air temperature

1000

1000

VCC = 4.5 V

500

500

VCC = 6 V

400

400

55

125

40

85

ns
C

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

Submit Documentation Feedback

Copyright 19822013, Texas Instruments Incorporated

Product Folder Links: SN54HC04, SN74HC04

SN54HC04, SN74HC04
www.ti.com

SCLS078F DECEMBER 1982 REVISED AUGUST 2013

Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER

TEST CONDITIONS

VCC

IOH = 20 A
VI = VIH or
VIL

VOH

IOH = 4 mA
IOH = 5.2 mA
IOL = 20 A
VI = VIH or
VIL

VOL

IOL = 4 mA
IOL = 5.2 mA
II
ICC

TA = 25C
MIN

TYP

SN54HC04
MAX

MIN

SN74HC04

MAX

MIN

2V

1.9

1.998

1.9

1.9

4.5 V

4.4

4.499

4.4

4.4

6V

5.9

5.999

5.9

5.9

4.5 V

3.98

4.3

3.7

3.84

6V

5.48

5.8

5.2

UNIT

MAX

5.34

2V

0.002

0.1

0.1

0.1

4.5 V

0.001

0.1

0.1

0.1

6V

0.001

0.1

0.1

0.1

4.5 V

0.17

0.26

0.4

0.33

6V

0.15

0.26

0.4

0.33

VI = VCC or 0

6V

0.1

100

1000

1000

nA

VI = VCC or 0, IO = 0

6V

40

20

10

10

10

pF

Ci

2 V to 6 V

Switching Characteristics
over operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)
PARAMETER

FROM
(INPUT)

TO
(OUTPUT)

VCC

tpd

tt

TA = 25C
MIN

SN54HC04
MIN

SN74HC04

TYP

MAX

MAX

MIN

2V

45

95

125

120

4.5 V

19

29

24

6V

16

25

20

UNIT

MAX

2V

38

75

110

95

4.5 V

15

22

19

6V

13

19

16

ns

ns

Operating Characteristics
TA = 25C
Cpd

PARAMETER

TEST CONDITIONS

Power dissipation capacitance per inverter

No load

Copyright 19822013, Texas Instruments Incorporated

Product Folder Links: SN54HC04, SN74HC04

TYP
20

UNIT
pF

Submit Documentation Feedback

SN54HC04, SN74HC04
SCLS078F DECEMBER 1982 REVISED AUGUST 2013

www.ti.com

PARAMETER MEASUREMENT INFORMATION

From Output
Under Test

Test
Point

Input

0V

CL = 50 pF
(see Note A)

50%
10%

90%

In-Phase
Output

90%

tr

tPHL

tPLH

LOAD CIRCUIT

Input

VCC
50%

50%

0V

90%

tPHL

VOH
50%
10%

Out-of-Phase
Output

VOL

tf
tPLH

90%

50%
10%

tf

VOLTAGE WAVEFORMS
INPUT RISE AND FALL TIMES

90%

tr

VCC
50%
10%

50%
10%

50%
10%

90%

tf

VOH
VOL

tr

VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES

NOTES: A. CL includes probe and test-fixture capacitance.

B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.

Figure 1. Load Circuit and Voltage Waveforms

Submit Documentation Feedback

Copyright 19822013, Texas Instruments Incorporated

Product Folder Links: SN54HC04, SN74HC04

SN54HC04, SN74HC04
www.ti.com

SCLS078F DECEMBER 1982 REVISED AUGUST 2013

REVISION HISTORY
Changes from Revision E (October 2010) to Revision F

Page

Removed Ordering Information table. ................................................................................................................................... 1

Copyright 19822013, Texas Instruments Incorporated

Product Folder Links: SN54HC04, SN74HC04

Submit Documentation Feedback

PACKAGE OPTION ADDENDUM

www.ti.com

10-Jun-2014

PACKAGING INFORMATION
Orderable Device

Status
(1)

Package Type Package Pins Package

Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (C)

Device Marking
(4/5)

5962-8409801VCA

ACTIVE

CDIP

14

TBD

A42

N / A for Pkg Type

-55 to 125

5962-8409801VC
A
SNV54HC04J

5962-8409801VDA

ACTIVE

CFP

14

TBD

A42

N / A for Pkg Type

-55 to 125

5962-8409801VD
A
SNV54HC04W

84098012A

ACTIVE

LCCC

FK

20

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

84098012A
SNJ54HC
04FK

8409801CA

ACTIVE

CDIP

14

TBD

A42

N / A for Pkg Type

-55 to 125

8409801CA
SNJ54HC04J

8409801DA

ACTIVE

CFP

14

TBD

A42

N / A for Pkg Type

-55 to 125

8409801DA
SNJ54HC04W

JM38510/65701B2A

ACTIVE

LCCC

FK

20

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

JM38510/
65701B2A

JM38510/65701BCA

ACTIVE

CDIP

14

TBD

A42

N / A for Pkg Type

-55 to 125

JM38510/
65701BCA

JM38510/65701BDA

NRND

CFP

14

TBD

A42

N / A for Pkg Type

-55 to 125

JM38510/
65701BDA

M38510/65701B2A

ACTIVE

LCCC

FK

20

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

JM38510/
65701B2A

M38510/65701BCA

ACTIVE

CDIP

14

TBD

A42

N / A for Pkg Type

-55 to 125

JM38510/
65701BCA

M38510/65701BDA

NRND

CFP

14

TBD

A42

N / A for Pkg Type

-55 to 125

JM38510/
65701BDA

SN54HC04J

ACTIVE

CDIP

14

TBD

A42

N / A for Pkg Type

-55 to 125

SN54HC04J

SN74HC04D

ACTIVE

SOIC

14

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04DBR

ACTIVE

SSOP

DB

14

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04DBRE4

ACTIVE

SSOP

DB

14

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04DBRG4

ACTIVE

SSOP

DB

14

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

Addendum-Page 1

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

10-Jun-2014

Orderable Device

Status
(1)

Package Type Package Pins Package

Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (C)

Device Marking
(4/5)

SN74HC04DE4

ACTIVE

SOIC

14

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04DR

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU | CU SN

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04DRE4

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04DRG3

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04DRG4

ACTIVE

SOIC

14

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04DT

ACTIVE

SOIC

14

250

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04DTG4

ACTIVE

SOIC

14

250

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04N

ACTIVE

PDIP

14

25

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

SN74HC04N

SN74HC04N3

OBSOLETE

PDIP

14

TBD

Call TI

Call TI

-40 to 85

SN74HC04NE4

ACTIVE

PDIP

14

25

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

SN74HC04N

SN74HC04NSR

ACTIVE

SO

NS

14

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04NSRG4

ACTIVE

SO

NS

14

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04PW

ACTIVE

TSSOP

PW

14

90

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04PWG4

ACTIVE

TSSOP

PW

14

90

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04PWLE

OBSOLETE

TSSOP

PW

14

TBD

Call TI

Call TI

-40 to 85

SN74HC04PWR

ACTIVE

TSSOP

PW

14

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04PWRE4

ACTIVE

TSSOP

PW

14

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04PWRG4

ACTIVE

TSSOP

PW

14

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

SN74HC04PWT

ACTIVE

TSSOP

PW

14

250

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

HC04

Addendum-Page 2

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

10-Jun-2014

Orderable Device

Status
(1)

Package Type Package Pins Package

Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (C)

Device Marking
(4/5)

SNJ54HC04FK

ACTIVE

LCCC

FK

20

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

84098012A
SNJ54HC
04FK

SNJ54HC04J

ACTIVE

CDIP

14

TBD

A42

N / A for Pkg Type

-55 to 125

8409801CA
SNJ54HC04J

SNJ54HC04W

ACTIVE

CFP

14

TBD

A42

N / A for Pkg Type

-55 to 125

8409801DA
SNJ54HC04W

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 3

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

10-Jun-2014

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC04, SN54HC04-SP, SN74HC04 :

Catalog: SN74HC04, SN54HC04

Automotive: SN74HC04-Q1, SN74HC04-Q1
Military: SN54HC04
Space: SN54HC04-SP
NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Military - QML certified for Military and Defense Applications
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

Addendum-Page 4

PACKAGE MATERIALS INFORMATION

www.ti.com

11-Oct-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

SN74HC04DBR

SSOP

DB

14

2000

330.0

16.4

8.2

6.6

2.5

12.0

16.0

Q1

SN74HC04DR

SOIC

14

2500

330.0

16.8

6.5

9.5

2.3

8.0

16.0

Q1

SN74HC04DR

SOIC

14

2500

330.0

16.4

6.5

9.0

2.1

8.0

16.0

Q1

SN74HC04DRG3

SOIC

14

2500

330.0

16.8

6.5

9.5

2.3

8.0

16.0

Q1

SN74HC04DRG4

SOIC

14

2500

330.0

16.4

6.5

9.0

2.1

8.0

16.0

Q1

SN74HC04DRG4

SOIC

14

2500

330.0

16.4

6.5

9.0

2.1

8.0

16.0

Q1

SN74HC04DT

SOIC

14

250

330.0

16.4

6.5

9.0

2.1

8.0

16.0

Q1

SN74HC04PWR

TSSOP

PW

14

2000

330.0

12.4

6.9

5.6

1.6

8.0

12.0

Q1

SN74HC04PWT

TSSOP

PW

14

250

330.0

12.4

6.9

5.6

1.6

8.0

12.0

Q1

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

11-Oct-2013

*All dimensions are nominal

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

SN74HC04DBR

SSOP

DB

14

2000

367.0

367.0

38.0

SN74HC04DR

SOIC

14

2500

364.0

364.0

27.0

SN74HC04DR

SOIC

14

2500

333.2

345.9

28.6

SN74HC04DRG3

SOIC

14

2500

364.0

364.0

27.0

SN74HC04DRG4

SOIC

14

2500

367.0

367.0

38.0

SN74HC04DRG4

SOIC

14

2500

333.2

345.9

28.6

SN74HC04DT

SOIC

14

250

367.0

367.0

38.0

SN74HC04PWR

TSSOP

PW

14

2000

367.0

367.0

35.0

SN74HC04PWT

TSSOP

PW

14

250

367.0

367.0

35.0

Pack Materials-Page 2

MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001

DB (R-PDSO-G**)

PLASTIC SMALL-OUTLINE

28 PINS SHOWN
0,38
0,22

0,65
28

0,15 M

15

0,25
0,09
8,20
7,40

5,60
5,00

Gage Plane
1

14

0,25

08

0,95
0,55

Seating Plane
2,00 MAX

0,10

0,05 MIN

PINS **

14

16

20

24

28

30

38

A MAX

6,50

6,50

7,50

8,50

10,50

10,50

12,90

A MIN

5,90

5,90

6,90

7,90

9,90

9,90

12,30

DIM

4040065 /E 12/01
NOTES: A.
B.
C.
D.

All linear dimensions are in millimeters.

This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products

Applications

Audio

www.ti.com/audio

Automotive and Transportation

www.ti.com/automotive

Amplifiers

amplifier.ti.com

Communications and Telecom

www.ti.com/communications

Data Converters

dataconverter.ti.com

Computers and Peripherals

www.ti.com/computers

DLP Products

www.dlp.com

Consumer Electronics

www.ti.com/consumer-apps

DSP

dsp.ti.com

Energy and Lighting

www.ti.com/energy

Clocks and Timers

www.ti.com/clocks

Industrial

www.ti.com/industrial

Interface

interface.ti.com

Medical

www.ti.com/medical

Logic

logic.ti.com

Security

www.ti.com/security

Power Mgmt

power.ti.com

Space, Avionics and Defense

www.ti.com/space-avionics-defense

Microcontrollers

microcontroller.ti.com

Video and Imaging

www.ti.com/video

RFID

www.ti-rfid.com

OMAP Applications Processors

www.ti.com/omap

TI E2E Community

e2e.ti.com

Wireless Connectivity

www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2014, Texas Instruments Incorporated