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Practice Problems

The document summarizes the television circuit board assembly line process at Jantar-Mantar Corporation's Akurdi facility in India. The 10-station process includes soldering, parts placement, assembly, testing, inspection, and packaging. Station 3, the through-hole part assembly, has the longest activity time of 9 minutes per board and is likely the bottleneck. The daily capacity of the line is 50 boards per day and the direct labor content per board is 49 minutes.

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Amandeep Dahiya
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547 views2 pages

Practice Problems

The document summarizes the television circuit board assembly line process at Jantar-Mantar Corporation's Akurdi facility in India. The 10-station process includes soldering, parts placement, assembly, testing, inspection, and packaging. Station 3, the through-hole part assembly, has the longest activity time of 9 minutes per board and is likely the bottleneck. The daily capacity of the line is 50 boards per day and the direct labor content per board is 49 minutes.

Uploaded by

Amandeep Dahiya
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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JANTAR-MANTAR Corporation Circuit Board Line

The Jantar-Mantar Corporation assembles circuit boards at its Akurdi facility for its line of
consumer electronics products. The Akurdi facility produces boards for televisions, VCRs
and stereo systems, which are then assembled at different plants throughout Maharashtra.
Each line at the Akurdi board plant is dedicated to a particular product line.

The television circuit board assembly line consists of ten stations connected by a conveyor
belt and automated material handling equipment. The line operates for 8 hours per day. See
Table 1 on the next page for a summary of the process.

1. Solder Screen: Raw boards are fed into the screen machine. The machine then
applies paste prior to placement of all surface mount parts. A single operator tends the
machine and makes sure that it always fed with the appropriate amounts of input
materials.
2. Position Parts: A fully automated pick & place robot positions each surface mount
component at the appropriate site on the board. The machines are fed by reels of
components and are programmed automatically to synchronize placements with the
design of each board being processed.
3. Through Hole Part Assembly: This is an entirely manual process. Workers place
larger and more delicate through hole components (each CPU chips) on the board.
4. Convection Ovens: Each oven heats a board to re-flow solder that has been applied
to the surface mount parts. Operators position thermal sensors on each board to ensure
that the correct amount of heat is applied to different sectors of the board. The
operators also load and unload boards from the ovens.
5. Wave Solder: The operator attaches each board to rack and then loads & unloads
racks that are fed into the machine on a conveyor belt. The machine is used to connect
through hole components to each board by passing the board over a pool of molten
solder.
6. Board Cleaning: Boards are cleaned in automated washing machines that rinse off
all debris and residues associated with the placement and soldering steps. Workers
load and unload boards into the machines. Each machine runs one board at a time on
a pre-set wash/rinse cycle.
7. Inspect: This is a manual process. Each board is examined to ensure that all
components are properly placed and soldered.
8. Burn-In Test: Each board is connected to an automated testing machine. The boards
are powered up and their output is monitored over the test period. Operators load and
unload boards and remove defective boards for re-work.
9. Functionality & Performance Test: This is another manual operation. Testers test
the functionality of each board against a pre-programmed protocol.
10. Package & Ship: Boards are shipped with electrostatic protective materials.



Station Task Activity
Time (per
board)
Labor
Content
(per board)
Number of
Resources
Inventory
(boards)
1 Solder Screen 2 minutes 2 minutes 1 worker 1
2 Position Parts 5 minutes 0 minutes 3 machines 3
3 Through Hole Part
Assembly
9 minutes 9 minutes 4 workers 4
4 Convection Ovens 15 minutes 2 minutes 7 ovens
2 workers
7
5 Wave Solder 1.5 minutes 0.5 minutes 1 worker 1
6 Board Cleaning 12 minutes 2 minutes 6 machines
2 workers
6
7 Inspect 8 minutes 8 minutes 5 inspection
workers
5
8 Burn-In Test 20 minutes 3 minutes 9 machines
2 workers
9
9 Functionality &
Performance Test
10 minutes 10 minutes 5 testers 5
10 Package & Ship 6 minutes 6 minutes 3 workers 3

Figure 1 Jantar-Mantar Process Flow and Data for the Television Circuit Board Line

1. What is the bottleneck activity? (3 marks)
2. What is the Process Capacity of the line? (1 marks)
3. What is the Direct Labor Content of a board? (2 marks)
4. Assume, for this question only, that the daily demand is 200 boards per day. What is
the utilization of Station 1, the Solder Screen operation? (2 marks)
5. What is the Manufacturing Lead Time of the process, (i.e. the average time to get one
board through the line), assuming that the process is capacity constrained? (2 marks)
6. Approximately how long would it take Jantar-Mantar to complete an order for 500
boards? For this question only, assume that the time for the first unit to pass through
the system is 50 minutes and that the Process Capacity is (your question 2 answer)
boards/day. You may assume that the factory is empty when the order arrives. (2
marks)
7. Jantar-Mantar is interested in increasing the capacity of the line without investing in
any additional equipment. They think they can do so by re-assigning workers on the
line. What would be the impact on line capacity of decreasing the number of
inspectors in activity 7 (i.e. Inspect), from 5 to 4 people and re-assigning that inspector
optimally, i.e. to the activity that would provide the greatest increment in capacity? (3
marks)

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