1

ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Introduction to MEMS
Olivier FRANCAIS / ESIEE Group
[email protected]
http://www.esiee.fr/~francaio
(350 m)
(200 m)
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Content of the tutorials
What is a MEMS ? Tentative of definition
For what purpose ? The main application fields
Why micro ? Some Motivations for miniaturisation
How ? Technological (and design) tools
When ? History and trends
Try to answer to some basic questions
MEMS : Micro Electro Mechanical Systems
One example
Sandia National Laboratories
2
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Top D
ow
n
MEMS : Order of magnitude
power of 10
mm m nm m km
MEMS
Microtechnology
[cm ; 0.1um]
NEMS
Nanotechnology
<100nm
To compare MEMS Scale :
MEMS are from virus (80 nm) to anuts (2 cm)
Like from nuts (2 cm) to top of himalaya (8km)
(A)
Cell 5m
Hair 75 m
Atom 0.1 nm Man 1.8 m
Himalaya 8 km
Ant 3mm
Virus 80nm
Molecule 5 nm
B
ottom
U
p
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
MEMS : a progressive evolution of IC
microtehnology
Sensors
Actuators
Airbag ADXL (Analog Devices 2000)
Microsystems
MEMS
Micro Electro Mechanical Systems
Signal Treatment
ESIEE 1984
Berkeley 1988
! US name : MEMS
! European name : Microsystems Technology
! Japanese name : Micromachines or Micromechatronics
The Brain
The muscle
The sense
3
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
First example : a simple MEMS Sensor
Silicon accelerometre with capacitive detection
obtained by bulk micro-machining
(Sensor from ESIEE, 1995)
2mthick Silicon suspension :
Area 1mm
Suspended mass
"Acceleration
"Displacement
"Capacitance variation
"Voltage, current or frequency
C(x)=C(x(a))
Movable structure
Detection scheme
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Second example :
Advanced MEMS Sensors & Actuators
Fixed com
Movable part
Fixed comb
Main applications of comb-drive structures :
Sensors
Actuators
MEMS resonators, filters
Electronics
Electro-Mechanical Structure :
silicon combs for actuation and sensing purposes
Microsystem
4
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
So what is a MEMS practically ?
Bio-MEMS, RF MEMS, Optical MEMS
#It is a small device obtained using microtechnologies (MEMS technologies)
which are derived from conventional microelectronics(IC processing).
Silicon Micromachining
#Its dimensions are in the micrometer centimeter range !
#It can be either a complete system (Microsystem) or it can be just a
component to be included in a system (MEMS)
#Scientific and/or application fields involved in MEMS are much wider than
electronics and mechanics :
fluidic - thermal acoustic electromagnetics chemistry Biology Optics
..MULTIPHYSICS..
MEMS : Micro Electro Mechanical Systems
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Content
What is a MEMS ? Tentative of definition
For what purpose ? The main application fields
Why micro ? Some Motivations for miniaturisation
How ? Technological (and design) tools
When ? History and trends
Try to answer to some basic questions
5
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
The First MEMS : in 1967 !
[H.C. Nathanson, et al., The Resonant Gate Transistor, IEEE
Trans. Electron Devices, March 1967, vol. 14, no. 3, pp 117-133.]
- The gate is a movable Gold cantilever
- Photoresist sacrificial layer
- Drain current modulation by the cantilever motion
The resonant gate MOS Transistor
Frequency response :
fo ! 30khz
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
MEMS history (1/2)
1824 : Discovery of silicon (Berzelius)
1910 : First patent on the MOS transistor concept
1939 : First PN junction (Schottky)
1947 : Fabrication of the first bipolar transistor (Shockley)
1955 : Evidence of piezoresistive effect in Si and Ge (Smith)
1958 : First integrated circuit (Oscillator)
1559 : R. Feynman Famous Talk : There is plenty of room at the bottom
1960 : Fabrication of the first piezoresistive sensor pressure- (Kulite) accel. in 1970
1967 : First Surface Micro-machining process (H. Nathanson) : resonant gate transistor
1970 : Silicon-glass bonding
1972 : National Semiconductor : Commercialize a Pressure Sensor
1977 : IBM HP : Micro-machined Ink Jet Nozzle
1978 : Silicon Bulk Micromachining : K. Bean
1978 : Structure obtained by Micromoulding (LIGA)
Heavy link with IC technology
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ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
MEMS history (2/2)
1982 : Famous Review paper Silicon as a Mechanical material (K. Petersen)
1985 : Assembly of silicon wafers (Si/Si fusion bonding) : Lasky, et al.
1985 : IC-compatible surface micromachining -> Polysilicon comb structures
1988 : Electrostatic micromotor (UC -Berkeley BSAC)
1988 : 1st MEMS conference (1st Transducers conference was held in 1987)
1992 : First MUMPS process (MCNC) (with support of DARPA). Now owned by Memscap
1992 : SCREAM Process (Cornell)
1993 : Analog Devices : Commercialize Multi-axis Accelerometer integrating electronics
1993 : Texas Instrument : Commercialize the Digital Mirror Display (DMD)
1996 : DRIE (Bosch Process)
1998 : Technologie standard :
2000 : MEMS becomes a growing market: A huge number of MEMS Start-up
2002 : The telecom recession puts many things in stand-by
What is next ?
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Microsystems history
1960 1980 2000
Microelectronics
2010
Micro-sensors
Microfluidics
Micro-actuators
1970 1990
MOEMS
RF-MEMS
Bio-MEMS
NEMS ?
Nanoelectronics
Microtechnologies
era
Nanotechnologies
era???
Micro-mechanics
DNA chip (CEA)
Pentium 3
10M Transistors
8086
30k Transistors
First IC
5 Transistors
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ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Industrial MEMS Activity
New Start-Ups. In France only :
Memscap - Tronics - Apibio - PhS MEMS - Opsitech
Big companies as well:
Analog Devices, Corning, Atmel, Bosch, Lucent, Alcatel, Thales, Schlumberger...
Computer peripherals - Sensors - MOEMS
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Segmentation of MEMS Market
Automotive 31% 17%
Computers 26% 26%
Industrial 25% 22%
Medical 16% 11%
Telecom 1% 21%
Others 1% 3%
2002 2006
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ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Scientific Activity on MEMS
Conferences :
IEEE/MEMS - Transducers -Eurosensors
Journals :
IEEE/Journal of MEMS - Sensors & Actuators
- J. Micromechanics & Microengineering -
MEMS Design Tools for MEMS :
Coventor, Intellisense, Memscap, Ansys,
Minatec Project (in Grenoble France) : 150 Million Euros invested on the
creation of a scientific pole on Micro & NanoTechnologies
http://www.minatec.com
Number of patents around MEMS
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Content
What is a MEMS ? Tentative definition
For what purpose ? The main application fields
Why micro ? Some Motivations for miniaturisation
How ? Technological (and design) tools
When ? History and trends
Try to answer to some basic questions
9
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Some Motivations for Miniaturisation
Reduction of size [d] and weight [d]
3
Reduction of power consumption
Improvement of performance (speed, sensitivity) : f
o
" [d]
-2
Improvement of reliability
Reduction of cost : Mass Production of identical components
New properties and functionalities
Scientific motivations : explore smaller things
Make money!!!
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
One goal is miniaturisation ...
ADXL-50
ADXL-202 (2D)
(3 mm)
1995 : IC 16mm (1D)
2002 : IC 3mm
1980 : Printed board 50cm
Example : accelerometer (Airbag)
Integration
IC Technology compatible
Cost reduction
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ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
To keep in mind when reducing size
Scaling laws:
Surface/Volume [d]
-1
Mass = #V [d]
3
Resonnant = (k/M)
1/2
[d]
-2
Contact force > Mass
Friction > Inertia
Electrostatic Force > Magnetic Force
Thermal dissipation > Stocking
Greater shock resistance
Faster time response
Surface effect > volume effects
MEMS :
a multi-disciplinary field
very close to microtechnology
$% Analog Electronics
$% Digital Electronics
$% Physics of transducers
$% Physique of semiconductors.
$% IC Technology and MEMS Technology.
$% Application environments: Biology, chemistry,
acoustics,...
Not like macroscopic world ! ! ! !
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Content
What is a MEMS ? Tentative definition
For what purpose ? The main application fields
Why micro ? Some Motivations for miniaturisation
How ? Technological (and design) tools
When ? History and trends
Try to answer to some basic questions
11
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Renault
Dassault
MEMS: What are they for ?
MEMS found a huge number of applications in many fields
Automotive
Aerospace
Tlcom
Instrumentation
Military
Medecine
Pharmacology
Environment
Food
Domotic
Toys
Computers
Consumer electronics
Microsensors
Microactuators
MOEMS
RF MEMS
Bio-MEMS
JVC
Omron
ALCATEL
esa
SONY
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Typical applications
Pressure sensor
Inertial sensor

BioMEMS
Micro-mirror
Optical switch
Optic cavity
Switch RF
Tunable passive component
Resonator
Filters, antennas
Sensors/actuators MOEMS
Bio-chip
Micro-chemical reactor
Micro-fluidic
MEMS
RF-MEMS
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ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Sensor applications : a way to secure
automotive environment
* ESP Programm (Electronic Stability Programm)
* Vehicle Dynamic Control (VDC):
gyroscope, low g accelerometer, 4 wheel speed sensors
Airbag : Accelerometers
Car control : gyroscope
Tire: Pressure Control
Anti-collision : Scanner
Fuel Injection : Valve

Gyroscope Bosch
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
How does MEMS sense (1/2) ?
Air gap h
Surface (S)
$ Measure displacement
$ C ~= &
0
S/h
$ Capacitance bridge or switched Capacitors
$ Sensitivity to the Parasitic capacitive
certainly among the easiest to fabricate
But among the most difficult to use
Case of Capacitive Sensors :
13
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
ADXL Capacitive Accelerometer
Analog device (3um)
2002
100um
Moving mass
Return springs
(X and Y)
Comb fingers
measure X et Y
Surface micromachining
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
MEMS Capacitive sensor
Images courtesy of Kionix Inc.
The Comb Drives
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ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Integrated Capacitive Pressure sensor
(Infineon KP100)
Mixed electronics
Capacitive measurement by
Sigma-Delta converter
Digital filter
Alim 5V ; 4Mhz
500-1500 mbar 0.6mbar
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Flow sensor of by pressure loss
Differential capacitive measurement
Bulk micromachining and wafer bonding
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ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Effective, Easy to integrate and Mature
Way of Mechanical Sensing
Accelerometer
Seismic mass + Gauge(s)
Pressure sensor
Membrane + jauge(s) 1969
l
l
G
R
R
t
t
'
( )
*
+
,
-
. '
How does MEMS sense (2/2) ?
Case of piezoresistive sensors :
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Integrated pressure sensor Motorola
(2000)
X-ducer sensor
2.7mm
Sensor 100kPa Amplification and
compensation integrated Adjustment of
resistances by laser
O/p 0.2 into 4.7V with a alim. 5V
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ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Fingertip Biometric sensor
Courtesy of TIMA / CMP
http://tima.imag.fr
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Just have a look at two
Micro-actuators
Electrostatic
attraction of charged surfaces, plates extansion of solids (or fluids)
Thermal
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ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Electrostatic Actuator : comb drive
Comb drive for micro-resonator
Linear actuator with transmission
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Synchronous Electrostatic Motors
With Lateral Actuation
Surface Micro-machining Si-poly
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ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Electrostatic motor
rotating motor
Surface micromachining Si-poly SUMMIT V
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Thermal actuators
Thermal expansion
Asymetric Thermal Actuators
Heatuators
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ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Tweezer with thermal actuation
Possibility to catch cells and manipulate it
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Typical applications
Pressure sensor
Inertial sensor

BioMEMS
Micro-mirror
Optical switch
Optic cavity
Switch RF
Tunable passive component
Resonator
Filters, antennas
Sensors/actuators MOEMS
Bio-chip
Micro-chemical reactor
Micro-fluidic
MEMS
RF-MEMS
20
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Telecommunications environment
Insertion of MEMS technology
No more passive components on a printed board
(SAW Quartz R,L,C RF Filter)
Raytheon / TI
Transceivers / Receivers :
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
+V
d
x
Principle :
) x d ( 2
SV
) x ( F
/
&
(
Tunable capacitor
Young & Boser, 1996, Univ. Berkeley
(1 to 5 pF @ 1GHz, tension de commande<5 V)
x d
S
C
/
& (
Use of electrostatic force :
Top view
Surface micromachining
Possibility to obtain :
Tunable filter
MEMS Voltage Control Oscillatoir

Anchor
Movable top plate
Suspension
21
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Mechanical Switch RF
- Cantilever Micro-switch : Ohmic ON/OFF contact
Cantilever : L / l / e : 60 / 30 / 2 m
Voltage used V 0 30 V
R
DC
< 1 1
Ni
Au
Less insertion losses (<0.1 dB)
Less consumption
Good linearity
Majumder S., McGruyer N.E., Measurement and modeling of
surface micromachined electrostatically actuated microswitchs ,
Tech. Digest, Transducers 1997, Chicago, June 1997, pp 1145-1148
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Micro-resonator / Micro-mixer
Resonant comb-structure (Filter - Oscillator)
Frequency tunable with DC bias
Can be used as a mixer by DC bias modulation
Frequency response :
Q > 1000 @ 100-500khz
Excitation
Detection
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ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Example of micro-resonator
Electrostatic
Comb Drive
Fixed structure
Anchor
Novasensor
Resonant Structure
Spring K, mass M
Polysilicon material
M
k
f
2 2
1
0
(
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Typical applications
Pressure sensor
Inertial sensor

BioMEMS
Micro-mirror
Optical switch
Optic cavity
Switch RF
Tunable passive component
Resonator
Filters, antennas
Sensors/actuators MOEMS
Bio-chip
Micro-chemical reactor
Micro-fluidic
MEMS
RF-MEMS
23
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
MOEMS : Micro-mirror
Plate in torsion around one axis or two.
Use for laser reflexion angle control
1D 2D
Torsion axis
Inclinable mirror
Sweeping 1D
Sweeping 2D
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
http://www.dlp.com
Texas-Instruments Video Projector
(1995)
DMD : Digital Mirror Devices
(MOEMS)
! 1 DMD = Matrix of 1280 x 1024
micro-mirrors (15 m * 15 m)
24
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Optical Switch
Comb drive
Electrostatic actuation
Sercalo (1999)
Mirror (ON / OFF)
Actuator
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Out of plane!!!
Micro Optical Bench
U.C.L.A.
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ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Photonics cristals in Silicon
Optical filters Tunable with MEMS technology
Photonic Band Gap (0 m) : Networks (DBR Bragg mirror)
Resonant cavity, waveguides
2D 3D
Control transmission of electromagnetic waves
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Typical applications
Pressure sensor
Inertial sensor

BioMEMS
Micro-mirror
Optical switch
Optic cavity
Switch RF
Tunable passive component
Resonator
Filters, antennas
Sensors/actuators MOEMS
Bio-chip
Micro-chemical reactor
Micro-fluidic
MEMS
RF-MEMS
26
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Bio-MEMS
MicroTechnologies BIOLOGIST
Biologic element
Biological application
MEMS Engineering
_components development
New experiments
Greater performances
Size of a cell : 10
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Microfluidics Building Blocks :
Micro-channels / Micro-valves
(Bio-compatible) Materials:
- Glass
- Polymers (PDMS, SU8...)
Moulding techniques
- Silicon
Typical Dimensions :
Height Width : 5->200um
Length up to cm
27
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Input A
Input B
Output
Micro-reactor
mixing - separation - .
New functionnalits using arrays of electrodes :
- Heating, Displacement, Trapping, Electroporation of biological species
Some advantages of miniaturization :
- Saving the sample quantity and reaction product (nl; pl)
- Faster reactions (Hr sec ; Day Minute)
- Parallel treatments in high numbers, reduced costs
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
More Complex Sytems
Lab - On - Chip
Systmes intgrs : Micronics
Integration
Autonomy
Tranportability
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ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Illustration of MEMS Technologies
Output in Microfluidic
Micro-filter
Structure in Silicon
5um-width Pilars
Spacing is 2um
Volume of the cavity 3nl
Micro-diffuser
Structure in Silicon
Hollow Tip of 100um in height
Opening is 8um in diameter
Micro-needles
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Some other Applications
Andreas Manz, Imperial College (London) and Harvard University (US)
Find the closest way between 2 points
in a complex network
Such as London streets
500ms using a microfluidic system !!
Manipulation of cells for
gene therapy
Studies on Neural Networks
Neural Growth in A microchannel network
29
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Content
What is a MEMS ? Tentative of definition
For what purpose ? The main application fields
Why micro ? Some Motivations for miniaturisation
How ? Technological tools
When ? History and trends
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
From IC Technology to
MEMS technology
Silicon as mechanical component Silicon as electrical component
IC + MEMS : Microsystems
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ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Bulk, Surface, DRIE
Bulk micromachining involves removing material from the
silicon wafer itself
Typically wet etched
Traditional MEMS industry
Artistic design, inexpensive equipment
Issues with IC compatibility
Surface micromachining leaves the wafer untouched, but
adds/removes additional layers above the wafer surface,
First widely used in 1990s
Typically plasma etched
IC-like design philosophy, relatively expensive equipment
Different issues with IC compatibility
Deep Reactive Ion Etch (DRIE) removes substrate but
looks like surface micromachining!
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Bulk Micromachining
(100)
liquid etchants : etch rate differences in different crystal directions
<111> etch rate is slowest, <100> and <110> fastest
Fastest:slowest can be more than 400:1
Isotropic silicon etchants
HNA
HF, nitric, and acetic acids
Lots of neat features, tough to work with
XeF
2
, BrF
3
gas phase, gentle
Xactix, STS selling research & production equipment
Commonly used anisotropic etches in silicon include Potasium
Hydroxide (KOH), Tetramethyl Ammonium Hydroxide (TMAH), and
Ethylene Diamine Pyrochatecol (EDP)
31
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Etch rate of plane <111> : slow
plane <100> and <110> : fast
Angle of 54.7 betwenn 100 and 111 orientation
Selectivity > 400
Protective
layer
111 111
100
<111>
<100>
Silicon Substrate
54.7
Anisotropic Etching of Silicon
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Some basic shapes on (100) wafers
% Regulated Temperature (between 70 and 90C)
% Etching speed between 0.5 et 2m/min
% Etching masks :
- for TMAH : Si
3
N
4
, SiO
2
, Boron-doped Si (10
20
at/cm3)
- for KOH : Si
3
N
4
, Boron-doped Si (10
20
at/cm3)
Silicon
membranes
32
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Orders of magnitude of etching
speeds
Alkaline
solution
Temperature
(C)
Etching speeds in m/h for
Si <100> Si <110> Si <111> SiO
2
KOH : H
2
O 80 66 132 0.33 3 0.008
EDP 110 51 57 1.25 0.004
Case of EDP at 100 :
<100> 50m/h
<110> 30m/h
<111> 3m/h
SiO2 200A/h
p+ doped Si : slowly etched
EDP 100C : 1 l ethylenediamine, 133 ml water,
160 g pyroctechol, 6 gr pyrazine
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Wet etching : CMP/TIMA
process
http://imag.cmp.fr (CMOS Process)
Each layer of the CMOS process can be used to achieve
the MEMS : Nitrude, Oxyde, Poly, Alu
Use of the polysilicon to obtain
piezoresistance
33
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Surface micromachining :
Sacrificial layer
1) Deposit sacrificial layer (.1~3um)
2) Pattern contacts (Photo + UV + Dev
+ etch)
3) Deposit/pattern structural layer (.1~3um)
4) Etch sacrificial layer (wet chemical or
dry plasma etching)
Polysilicon cantilever :
Residual stress gradients
Planar Technology : weak thickness (2m)
Tensile Compressive
Top view
Sous-gravure!
Just right! The bottom line: anneal poly between
oxides with similar phosphorous content. ~1000C for
~60 seconds is enough.
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Surface micromachining :
Exemples
Pictures from(IEF orsay)
Microdispositif Al
Cantilever beams
Buckled bridge
Guckels ring
Sacrificial layer :
Oxide
Structure :
Polysilicon

Under-cut
34
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
MUMPS process
Multi Users MEMS processes
7 layers during the process
3 loyers of Poly (2 are used for the MEMS)
2 layer of PSG
1 layer of metallisation
1 isolant layer (Nitrude)
Design rules : 2m
Cost : 3000 Euros / cm
Poly0
Poly1
Poly2
http://www.memsrus.com http://www.sfu.ca/adm
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
ExtensionSUMMIT proces
S
A
N
D
I
A

N
a
t
i
o
n
a
l
L
a
b
o
r
a
t
o
r
i
e
s
(
U
S
A
)
SUMMIT :
4 niveaux de poly dont 3 actifs
SUMMIT V:
5 niveau de poly dont 4 actifs
Design rules 1m
(10000 Euros / 5*5mm)
http://www.sandia.gov/mstc/technologies/micromachines/summit5.html
35
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Optical switch
Deep Reactive Ion Etching
(DRIE)
Anisotropic etching
Tunable capacitor : HF modulator
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Deep Reactive Ion Etch (DRIE)
DRIE Machines: Alcatel, STS, PlasmaTerm
Trion, Oxford Instruments
Unconstrained geometry
90 side walls
High aspect ratio 1:50
Easily masked (PR, SiO2)
Process recipe depends on
geometry
&
'
ALCATEL 601 E DRIE Machine
Selectivity: SiO
2
(>300) et Al (>1000)
Speed : up to 12m/min
Profiles: 90 (aspect ratio of ~50)
36
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
DRIE Basics
Bosch Process 1996 (Ambiant temperature) : Alternated steps of
SF
6
etching and passivation with C
4
F
8
Alernative: Crygenic process : SF
6
etching and O
2
oxidation
octofluorocyclobutane
Uses high density plasma to alternatively
etch silicon and deposit a etch-resistant
polymer on side walls
Polymer deposition Silicon etch using
SF
6
chemistry
Polymer
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
SOI Process
SOI
Si
1) Begin with a bonded
SOI wafer. Grow and etch
a thin thermal oxide layer
to act as a mask for the
silicon etch.
Si
SiO
2
2) Etch the silicon device
layer to expose the buried
oxide layer (DRIE)
3) Etch the buried oxide layer in
buffered HF to release free-
standing structures.
(Silicon On Insulator)
SiO2
37
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
SURFACE MICROMACHINING
ON EPI-SOI
SOI wafer - Etching of superficial Si and SiO2 layers
Epitaxy - Implant - Passivation - Metallisation
Freeing of the microstructures
Etching of the microstructures
Sealing of a micromachined silicon cap
Tronics technology
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Comparaison :
DRIE vs. (Wet) Bulk Micromachining
High aspect ratio (up to 50)
vertical structures
38
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
From IC Technology to
MEMS technology
Silicon as mechanical component Silicon as electrical component
IC + MEMS : Microsystems
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Micro-moulding and LIGA
LIGA
(LIthografie, Galvanic, Abformung)
Karlsruhe Germany
!Mould in Poly-Methyl-Methacrylate (PMMA)
!X-Ray Lithography (LIGA) :
Aspect ratios higher than 100, thickness up to a few mm
! UV Lithography on (thick) photoresist like SU8 (Micro-moulding)
lithography, electrodeposition, injection moulding
39
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Moulding using X-Ray LIGA
Micro-moulding
Electrodeposition
Resolution 1/20
Requires a Synchrotron
Thick resist PMMA
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Moulding using UV Lithography
100 4m-thick features
obtained from thick
photoresist (IEF)
40 4m-thick line
realized on
photoresist (IEF)
UV
Photoresist
coating
Deposition of a
seed layer
UV Insolation
Development
Electrodeposition
Photoresist
stripping
40
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Thick photoresists : SU8 EPON
(IBM)
* Advantages for UV micromoulding:
- Cheaper than LIGA
- Possibility to superimpose several
levels
- High photoresist thickness. Ex:
- Simple coating > 0.5 mm
- Double coating > 1.2 mm
SU-8: A negative photoresist
Thickness up to 3mm
Aspect ratio 1/20
Resistant to acids, bases, solvants..
Good Mechanical stiffness.
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Micro moulding by Embossing
A simple technique to create 3-dimensional structures
by stamping a stiff mould in a softer material.
PDMS is extensively used for fabrication
of bio-compatible microfluidic devices, BioMEMS
41
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Bonding
Need Need of of closing closing ( (fluidic devices fluidic devices) )
Under Under- -vacuum vacuum sensors sensors ( ( high high Q) Q)
Anodic bonding : Silicon Glass
Silicon fusion bonding : Silicon - Silicon (Van Der Wall Bonding and
thermal treatment (T>800C) (chemical bonding)
SiO2/SiO2 Si/Si Si3N4/Si3N4 Si3N4/Si SiO2/Glass
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Anodic Bonding :
Glass/Silicon
Use of an electrostatic field :
Voltage applied : 400-700V
T : 350-450C
+ H. T.
Wafer handler
Heater
vacuum
silicon
Glass
Advantages :
Easy alignment (Glass)
Low temperature ( Can use Aluminum, no impurity
diffusion in silicon)
Defects :
Bimorph effect : constraints
Not so easy to cut due to thickness of the 2 wafer
Pull silicon and glass close together
Silicon positive, glass negative
Positive ions in glass drift toward silicon causing high field at interface
Use glass with similar thermal expansion coefficient
Cleanliness critical to prevent voids
Thin metal lines can pass through bond
42
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Silicon Fusion Bonding
High temperature (1000C)
Matriaux : Si/Si - SiO2/SiO2 - Si3N4/Si3N4
Main characteristics :
Require hydroxyl groups on surface
Organic cleaning and native Oxyde elimination
Surface activation : hydrophilic or hydrophobic
Alignment and contact (between 300C and 500C )
annealing ( >800C)
Si (HF ou BHF)
SiO
2
(re-oxydation HNO
3
)
Plasma activation can be used
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Sometimes Problems may happen
during MEMS Fabrication
43
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Stress and stress-gradient is an issue
A need to have a good control of thin film deposition conditions
Usually, annealing helps a lot in flatening the structures
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Sticking of Structures to the Substarte
Release process
etching of the sacrificial layer is done using wet chemicals
During the drying process, sticking occurs sue to capillary forces, Van
der Waals interaction (surface tension effect)
Sticking of electrostatic nature may also occur
44
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Illustration
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Solution : CO2 Supercritical Point Drying
Drying by CO
2
in supercritical phase
In such liquid-gas phase
no problem of capillarity forces (surface
tension is nil)
Remark : before drying, wafers are rinced
and diluted in isopropanol (IPA) which has
low surface tension
45
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Other problems: Mechanical Fracture
Fracture due water pressure
during dicing
Zoom on the broken area
Special care Si wafers handling starting from a given fabrication step
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Conclusion
MEMS are real :
Cover a huge domain of applications :
Pluri - disciplinarity
High industrialisations for sensors
Microsystems
Improve performances in optical and RF applications
MOEMS - RFMEMS
Heavy innovation for chemistry, biologist : the key market!!
Bio-MEMS
Step before the next miniaturisation : Nanotechnology.
NEMS.
46
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Some Useful References
Web sites :
http://www.sensorsmag.com
http://www.elecdesign.com
http://www.nexus-emsto.com
http://mems.isi.edu
http://www.trimmer.net
http://www.vdivde-it.de/mstnews
Books :
Fundamentals of Microfabrication, Madou, CRC
Microsystem Design, Senturia, Kluwer
Microactuators, Massood Tabib-Azar, Kluwer
Silicon Sensors ; Middelhoek S., Audet S.A. (Academic Press, 1989)
Microsensors : Principles and Applications ; Gardner J.W. (Wiley, 1994)
Semiconductor Sensors ; Sze S.M. (Wiley, 1994)
Sensor Technology and Devices ; Riscti L. (Artech House, 1994)
Microsensorss MEMS and Smart devices ; J.W Gardner, (Wiley, 2001)
The MEMS Handbook ; Mohamed Gad-el-Hak, (CRC Press, 2001)
MEMS and MOEMS : Technology and Applications ; P. Rai-Choudhury (SPIE Press 2001)
ESIEE GROUP
O. Franais - SAME 2003 Tutorials MEMS October 8
th
2003
Thank you for
your attention