L M 7 2 3 , L M 7 2 3 C

www.ti.com SNVS765CJUNE 1999REVISED APRIL 2013

L M 7 2 3 / L M 7 2 3 C V ol ta g e R e g u l a tor
C he ck for Sa mpl e s: L M 7 2 3, L M 7 2 3 C
1FEATUR ES DESC R IPTION
The LM723/LM723C is a voltage regulator designed
2 150 mA Ou tpu t C u r r e nt Withou t Exte r na l Pa ss
primarily for series regulator applications. By itself, it
Tr a nsistor
will supply output currents up to 150 mA; but external
Ou tpu t C u r r e nts in Exce ss of 10A Possibl e by
transistors can be added to provide any desired load
Adding Exte r na l Tr a nsistor s
current. The circuit features extremely low standby
current drain, and provision is made for either linear Inpu t V ol ta g e 40V M a x
or foldback current limiting.
Ou tpu t V ol ta g e Adju sta bl e fr om 2 V to 3 7 V
The LM723/LM723C is also useful in a wide range of
C a n be Use d a s Eithe r a L ine a r or a Switching
other applications such as a shunt regulator, a
R e g u l a tor
current regulator or a temperature controller.
The LM723C is identical to the LM723 except that the
LM723C has its performance ensured over a 0C to
+70C temperature range, instead of 55C to
+125C.
C onne ction Dia g r a m
Note : Pin 5 connected to case.
Fig u r e 1. Top V ie w Fig u r e 2 . Top V ie w
C DIP Pa cka g e or PDIP Pa cka g e TO-100
Se e Pa cka g e J or NFF0014A Se e Pa cka g e L M E
Fig u r e 3 . Top V ie w
Se e Pa cka g e NAJ002 0A
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright 19992013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
L M 7 2 3 , L M 7 2 3 C
SNVS765CJUNE 1999REVISED APRIL 2013 www.ti.com
Equ iva l e nt C ir cu it*
*Pin numbers refer to metal can package.
Typica l Appl ica tion
for minimum temperature drift.
Typica l Pe r for ma nce
Regulated Output Voltage 5V
Line Regulation (V
IN
= 3V) 0.5mV
Load Regulation (I
L
= 50 mA) 1.5mV
Fig u r e 4. Ba sic L ow V ol ta g e R e g u l a tor (V
OUT
= 2 to 7 V ol ts)
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOL UTE M AXIM UM R ATINGS
(1) (2 )
Pulse Voltage from V
+
to V

(50 ms) 50V

Continuous Voltage from V
+
to V

40V
Input-Output Voltage Differential 40V
Maximum Amplifier Input Voltage
(Either Input) 8.5V
Maximum Amplifier Input Voltage
(Differential) 5V
Current from V
Z
25 mA
Current from V
REF
15 mA
Internal Power Dissipation
Metal Can
(3)
800 mW
CDIP
(3)
900 mW
PDIP
(3)
660 mW
Operating Temperature Range
LM723 55C to +150C
LM723C 0C to +70C
Storage Temperature Range
Metal Can 65C to +150C
PDIP 55C to +150C
Lead Temperature (Soldering, 4 sec. max.)
Hermetic Package 300C
Plastic Package 260C
ESD Tolerance 1200V
(Human body model, 1.5 k in series with 100 pF)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
(2) A military RETS specification is available on request. At the time of printing, the LM723 RETS specification complied with the Min and
Max limits in this table. The LM723E, H, and J may also be procured as a Standard Military Drawing.
(3) See derating curves for maximum power rating above 25C.
EL EC TR IC AL C HAR AC TER ISTIC S
(1) (2 ) (3 ) (4)
Pa r a me te r C onditions L M 7 2 3 L M 7 2 3 C Units
M in Typ M a x M in Typ M a x
Line Regulation V
IN
= 12V to V
IN
= 15V 0.01 0.1 0.01 0.1 % V
OUT
55C T
A
+125C 0.3 % V
OUT
0C T
A
+70C 0.3 % V
OUT
V
IN
= 12V to V
IN
= 40V 0.02 0.2 0.1 0.5 % V
OUT
Load Regulation I
L
= 1 mA to I
L
= 50 mA 0.03 0.15 0.03 0.2 % V
OUT
55C T
A
+125C 0.6 % V
OUT
0C T
A
+70C 0.6 % V
OUT
Ripple Rejection f = 50 Hz to 10 kHz, C
REF
= 0 74 74 dB
f = 50 Hz to 10 kHz, C
REF
= 5 F 86 86 dB
(1) Unless otherwise specified, T
A
= 25C, V
IN
= V
+
= V
C
= 12V, V

= 0, V
OUT
= 5V, I
L
= 1 mA, R
SC
= 0, C
1
= 100 pF, C
REF
= 0 and divider
impedance as seen by error amplifier 10 k connected as shown in Figure 4. Line and load regulation specifications are given for the
condition of constant chip temperature. Temperature drifts must be taken into account separately for high dissipation conditions.
(2) A military RETS specification is available on request. At the time of printing, the LM723 RETS specification complied with the Min and
Max limits in this table. The LM723E, H, and J may also be procured as a Standard Military Drawing.
(3) Specified by correlation to other tests.
(4) L
1
is 40 turns of No. 20 enameled copper wire wound on Ferroxcube P36/22-3B7 pot core or equivalent with 0.009 in. air gap.
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EL EC TR IC AL C HAR AC TER ISTIC S
(1)(2 )(3 )(4)
(continu e d)
Pa r a me te r C onditions L M 7 2 3 L M 7 2 3 C Units
M in Typ M a x M in Typ M a x
Average Temperature Coefficient of 55C T
A
+125C 0.002 0.015 %/C
Output Voltage (
(5)
)
0C T
A
+70C 0.003 0.015 %/C
Short Circuit Current Limit R
SC
= 10, V
OUT
= 0 65 65 mA
Reference Voltage 6.95 7.15 7.35 6.80 7.15 7.50 V
Output Noise Voltage BW = 100 Hz to 10 kHz, C
REF
= 0 86 86 Vrms
BW = 100 Hz to 10 kHz, C
REF
= 5 F 2.5 2.5 Vrms
Long Term Stability 0.05 0.05 %/1000
hrs
Standby Current Drain I
L
= 0, V
IN
= 30V 1.7 3.5 1.7 4.0 mA
Input Voltage Range 9.5 40 9.5 40 V
Output Voltage Range 2.0 37 2.0 37 V
Input-Output Voltage Differential 3.0 38 3.0 38 V

JA
PDIP 105 C/W

JA
CDIP 150 C/W

JA
H10C Board Mount in Still Air 165 165 C/W

JA
H10C Board Mount in 400 LF/Min Air Flow 66 66 C/W

JC
22 22 C/W
(5) For metal can applications where V
Z
is required, an external 6.2V zener diode should be connected in series with V
OUT
.
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TYPIC AL PER FOR M ANC E C HAR AC TER ISTIC S
L oa d R e g u l a tion L oa d R e g u l a tion
C ha r a cte r istics with C ha r a cte r istics with
C u r r e nt L imiting C u r r e nt L imiting
Fig u r e 5. Fig u r e 6.
L oa d & L ine R e g u l a tion vs
Inpu t-Ou tpu t V ol ta g e C u r r e nt L imiting
Diffe r e ntia l C ha r a cte r istics
Fig u r e 7 . Fig u r e 8.
C u r r e nt L imiting
C ha r a cte r istics vs Sta ndby C u r r e nt Dr a in vs
Ju nction Te mpe r a tu r e Inpu t V ol ta g e
Fig u r e 9. Fig u r e 10.
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TYPIC AL PER FOR M ANC E C HAR AC TER ISTIC S (continu e d)
L ine Tr a nsie nt R e sponse L oa d Tr a nsie nt R e sponse
Fig u r e 11. Fig u r e 12 .
Ou tpu t Impe de nce vs
Fr e qu e ncy
Fig u r e 13 .
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M AXIM UM POWER R ATINGS
Noise
vs
Fil te r C a pa citor L M 7 2 3
(C
R EF
in C ir cu it of Fig u r e 4) Powe r Dissipa tion vs
(Ba ndwidth 100 Hz to 10 kHz) Ambie nt Te mpe r a tu r e
Fig u r e 14. Fig u r e 15.
L M 7 2 3 C
Powe r Dissipa tion vs
Ambie nt Te mpe r a tu r e
Fig u r e 16.
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Ta bl e 1. R e sistor V a l u e s (k) for Sta nda r d Ou tpu t V ol ta g e
Ou tpu t 5% Ou tpu t
Fixe d Fixe d
Positive Ne g a tive
Appl ica bl e Fig u r e s Adju sta bl e Adju sta bl e
Appl ica bl e
Ou tpu t 5% Ou tpu t 5%
Ou tpu t Ou tpu t
10%
(1)
10%
Fig u r e s
V ol ta g e V ol ta g e
Se e
(2 )
R 1 R 2 R 1 P1 R 2 R 1 R 2 R 1 P1 R 2
Figure 4, Figure 19,
+3.0 Figure 21, Figure 24, 4.12 3.01 1.8 0.5 1.2 +100 Figure 22 3.57 102 2.2 10 91
Figure 27 (Figure 19)
Figure 4, Figure 19,
+3.6 Figure 21, Figure 24, 3.57 3.65 1.5 0.5 1.5 +250 Figure 22 3.57 255 2.2 10 240
Figure 27 (Figure 19)
Figure 4, Figure 19,
Figure 18,
+5.0 Figure 21, Figure 24, 2.15 4.99 0.75 0.5 2.2 6
(3)
3.57 2.43 1.2 0.5 0.75
(Figure 25)
Figure 27 (Figure 19)
Figure 4, Figure 19,
Figure 18,
+6.0 Figure 21, Figure 24, 1.15 6.04 0.5 0.5 2.7 9 3.48 5.36 1.2 0.5 2.0
Figure 25
Figure 27 (Figure 19)
Figure 17, Figure 19,
Figure 18,
+9.0 (Figure 19, Figure 21, 1.87 7.15 0.75 1.0 2.7 12 3.57 8.45 1.2 0.5 3.3
Figure 25
Figure 24, Figure 27)
Figure 17, Figure 19,
Figure 18,
+12 (Figure 19, Figure 21, 4.87 7.15 2.0 1.0 3.0 15 3.65 11.5 1.2 0.5 4.3
Figure 25
Figure 24, Figure 27)
Figure 17, Figure 19,
Figure 18,
+15 (Figure 19, Figure 21, 7.87 7.15 3.3 1.0 3.0 28 3.57 24.3 1.2 0.5 10
Figure 25
Figure 24, Figure 27)
Figure 17, Figure 19,
+28 (Figure 19, Figure 21, 21.0 7.15 5.6 1.0 2.0 45 Figure 23 3.57 41.2 2.2 10 33
Figure 24, Figure 27)
+45 Figure 22 3.57 48.7 2.2 10 39 100 Figure 23 3.57 97.6 2.2 10 91
+75 Figure 22 3.57 78.7 2.2 10 68 250 Figure 23 3.57 249 2.2 10 240
(1) Replace R1/R2 in figures with divider shown in Figure 28.
(2) Figures in parentheses may be used if R1/R2 divider is placed on opposite input of error amp.
(3) V
+
and V
CC
must be connected to a +3V or greater supply.
Ta bl e 2 . For mu l a e for Inte r me dia te Ou tpu t V ol ta g e s
Ou tpu ts fr om +2 to +7 vol ts Ou tpu ts fr om +4 to +2 50 vol ts C u r r e nt L imiting
(Figure 4 Figure 19 Figure 20 (Figure 22)
Figure 21 Figure 24 Figure 27
Ou tpu ts fr om +7 to +3 7 vol ts Ou tpu ts fr om6 to 2 50 vol ts Fol dba ck C u r r e nt L imiting
(Figure 17 Figure 19 Figure 20 (Figure 18 Figure 23 Figure 25)
Figure 21 Figure 24 Figure 27)
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TYPIC AL APPL IC ATIONS
for minimum temperature drift.
R3 may be eliminated for minimum component count.
Typica l Pe r for ma nce
Regulated Output Voltage 15V
Line Regulation (V
IN
= 3V) 1.5 mV
Load Regulation (I
L
= 50 mA) 4.5 mV
Fig u r e 17 . Ba sic Hig h V ol ta g e R e g u l a tor (V
OUT
= 7 to 3 7 V ol ts)
Typica l Pe r for ma nce
Regulated Output Voltage 15V
Line Regulation (V
IN
= 3V) 1 mV
Load Regulation (I
L
= 100 mA) 2 mV
Fig u r e 18. Ne g a tive V ol ta g e R e g u l a tor
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Typica l Pe r for ma nce
Regulated Output Voltage +15V
Line Regulation (V
IN
= 3V) 1.5 mV
Load Regulation (I
L
= 1A) 15 mV
Fig u r e 19. Positive V ol ta g e R e g u l a tor (Exte r na l NPN Pa ss Tr a nsistor )
Typica l Pe r for ma nce
Regulated Output Voltage +5V
Line Regulation (V
IN
= 3V) 0.5 mV
Load Regulation (I
L
= 1A) 5 mV
Fig u r e 2 0. Positive V ol ta g e R e g u l a tor (Exte r na l PNP Pa ss Tr a nsistor )
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Typica l Pe r for ma nce
Regulated Output Voltage +5V
Line Regulation (V
IN
= 3V) 0.5 mV
Load Regulation (I
L
= 10 mA) 1 mV
Short Circuit Current 20 mA
Fig u r e 2 1. Fol dba ck C u r r e nt L imiting
Typica l Pe r for ma nce
Regulated Output Voltage +50V
Line Regulation (V
IN
= 20V) 15 mV
Load Regulation (I
L
= 50 mA) 20 mV
Fig u r e 2 2 . Positive Fl oa ting R e g u l a tor
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Typica l Pe r for ma nce
Regulated Output Voltage 100V
Line Regulation (V
IN
= 20V) 30 mV
Load Regulation (I
L
= 100 mA) 20 mV
Fig u r e 2 3 . Ne g a tive Fl oa ting R e g u l a tor
Typica l Pe r for ma nce
Regulated Output Voltage +5V
Line Regulation (V
IN
= 30V) 10 mV
Load Regulation (I
L
= 2A) 80 mV
Fig u r e 2 4. Positive Switching R e g u l a tor
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Typica l Pe r for ma nce
Regulated Output Voltage 15V
Line Regulation (V
IN
= 20V) 8 mV
Load Regulation (I
L
= 2A) 6 mV
Fig u r e 2 5. Ne g a tive Switching R e g u l a tor
Note : Current limit transistor may be used for shutdown if current limiting is not required.
Typica l Pe r for ma nce
Regulated Output Voltage +5V
Line Regulation (V
IN
= 3V) 0.5 mV
Load Regulation (I
L
= 50 mA) 1.5 mV
Fig u r e 2 6. R e mote Shu tdown R e g u l a tor with C u r r e nt L imiting
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Regulated Output Voltage +5V
Line Regulation (V
IN
= 10V) 0.5 mV
Load Regulation (I
L
= 100 mA) 1.5 mV
Fig u r e 2 7 . Shu nt R e g u l a tor
Fig u r e 2 8. Ou tpu t V ol ta g e Adju st
(1)
(1) Replace R1/R2 in figures with divider shown in Figure 28.
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Sche ma tic Dia g r a m
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R EV ISION HISTOR Y
C ha ng e s fr om R e vision B (Apr il 2 013 ) to R e vision C Pa g e
Changed layout of National Data Sheet to TI format .......................................................................................................... 15
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PACKAGE OPTION ADDENDUM
www.ti.com 1-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (C) Device Marking
(4/5)
Samples
LM723CH ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 LM723CH
LM723CH/NOPB ACTIVE TO-100 LME 10 500 Green (RoHS
& no Sb/Br)
POST-PLATE Level-1-NA-UNLIM 0 to 70 LM723CH
LM723CN NRND PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 LM723CN
LM723CN/NOPB ACTIVE PDIP NFF 14 25 Green (RoHS
& no Sb/Br)
CU SN Level-1-NA-UNLIM 0 to 70 LM723CN
LM723H ACTIVE TO-100 LME 10 500 TBD Call TI Call TI -55 to 150 LM723H
LM723H/NOPB ACTIVE TO-100 LME 10 500 Green (RoHS
& no Sb/Br)
POST-PLATE Level-1-NA-UNLIM -55 to 150 LM723H
U5R7723312 ACTIVE TO-100 LME 10 500 TBD Call TI Call TI -55 to 150 LM723H
U5R7723393 ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 LM723CH

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

PACKAGE OPTION ADDENDUM
www.ti.com 1-Nov-2013
Addendum-Page 2
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

MECHANICAL DATA
MMBC006 MARCH 2001
1 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
LME (OMBCYW10) METAL CYLINDRICAL PACKAGE
7
8
4202488/A 03/01
0.335 (8,51)
0.370 (9,40)
0.335 (8,51)
0.305 (7,75)
0.185 (4,70)
0.165 (4,19)
0.500 (12,70) MIN
0.010 (0,25)
0.040 (1,02)
0.040 (1,02)
0.010 (0,25)
0.016 (0,41)
0.021 (0,53)
0.045 (1,14)
0.029 (0,74)
0.028 (0,71)
0.034 (0,86)
0.120 (3,05)
0.160 (4,06) 0.120 (3,05)
0.110 (2,79)

Seating
Plane
36

3
1
10
9
4
5
6
2
0.230 (5,84)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Leads in true position within 0.010 (0,25) R @ MMC at seating plane.
D. Pin numbers shown for reference only. Numbers may not be marked on package.
E. Falls within JEDEC MO006/TO-100.
MECHANICAL DATA
N0014A
www.ti.com
N14A (Rev G)
NFF0014A
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that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
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