Microstip Vs Stripline
Microstip Vs Stripline
Microstip Vs Stripline
com
STRIPLINE OR MICROSTRIP:
Which is better for EMC?
Karthik Raj Guruchandran
www.basebandhub.com
Abstract:
This article talks about the two most commonly used routing configurations on PCBs Microstrip and Stripline
configurations.Thearticlecoversthebasicstructuraldifferences,impedancecalculationformulasandanalysisof
emissionperformanceina3Dsimulationenvironmentforboththeconfigurations.
Background:
Ifeltprovidingabitofbackgroundonthemicrostripandthestriplineconfigurationswoulddefinitelyhelpafew
readers.Ifyouarealreadyfamiliarwiththeseconfigurations,thenfeelfreetomoveontothenextsection.
In simple terms, the Microstrip is a layout configuration where a signal trace is routed on top of a ground
reference.Thetraceisgenerallypresentonthetoporthebottomlayersonamultilayeredboard.Anexampleof
amicrostripconfigurationisshownbelow.
Figure:MicrostripConfiguration
SointhisconfigurationwehavetypicallyaFR4dielectricsurroundingthetraceononesidewhileairsurrounding
itontheother.
Ontheotherhand,inastriplineconfiguration,thetraceissandwichedbetweentwogroundlayersprovidingthe
trace an excellent reference and shielding on both sides. The downside being that it generally requires more
layersanditisnotpossibletoachievethisconfigurationwitha2layerboard.
Anexampleofstriplineconfigurationcanbeseenbelow.
www.basebandhub.com
Figure:StriplineConfiguration
There are afew more configurations that are commonly used which tend tobe derivatives ofeither microstrip
called the embedded microstrip or the stripline called the dual stripline. Please note that we will not be
discussingabouttheseconfigurationsinthisarticle.
Introduction:
ModelConstruction:
www.basebandhub.com
Microstrip
(1)
:
+
+
=
T W
H
Ln
r
Z
8 .
98 . 5
41 . 1
87
0
Where,
WTracewidth
HDielectricthickness
TTraceThickness
rRelativedielectricconstant
Stripline
(1)
:
( )
+
+
=
T W
T H
Ln
r
Z
8 .
2 9 . 1 60
0
Where,
WTracewidth
HDielectricthickness
TTraceThickness
rRelativedielectricconstant
Ididthistomakesurethesourceimpedance(input
port in the model) the transmission line and the
termination impedance (output port in the model)
are of the same value in order to have maximum
energytransfer.
Now,withthetracedimensions,copperthicknesses
andtheFR4thicknessinhand,allIhadtodowasto
construct a board model in CST. It is fairly straight
forward job and if you know CST, then you would
probablyknowhoweasyitistoconstructaboardof
thissort.
Simulationsetup:
OnceIhadthetracesconstructed,Ithenterminated
the two ends of both the microstrip trace and the
striplinetracewitha50ohmporttomatchwiththe
calculated trace impedance. I added a few field
monitors to monitor the 3D field, which I later used
to calculate near field that would contribute to
crosstalk. I then used a transient solver to compute
the S11 and S21 of the traces over 05GHzfrequency
range.
SimulationResults:
Themicrostriptraceat1GHzhadanearfieldcontent
of was around +10.36dBm which was about 18dB
morethanthestriplinetracewhileat200MHzithad
a Hfield of +9.66dBm, which means that the
stripline has definitely better emission performance
when compared with the microstrip. In general
terms, we could say that the microstrip trace is
around1520dBworsethanitsstriplinecounterpart.
Conclusion:
Figure:StriplineEmissionsat200MHz Figure:MicrostripEmissionsat200MHz
References:
1)http://www.ultracad.com/articles/formula.pdf