IIT Kanpur PCB Design Guide Sheet

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TheDepartmentofElectricalEngineeringatIITKanpurhasavarietyofdevicesand
machinestoproducesinglelayer,doublelayerplatedthroughprintedcircuitboards
(PCBs), multi layer (max 8 layers) plated through PCBs, for through pin and surface
mounteddevices.

Printed circuit boards are electronic circuits boards created for mounting electronic
components on a nonconductive board, and for creating conductive connections
between them. The creation of circuit patterns is accomplished using both additive
and subtractive methods. The conductive circuit is generally copper, although
aluminum, nickel, chrome, and other metals are sometimes used. There are three
basic varieties of printed circuit boards: singlesided, doublesided, and multi
layered.
1.SinglesidedPCB:conductorsononlyonesurfaceofadielectricbase.
2. Doublesided PCB: conductors on both sides of adielectric base, usually the two
layersareinterconnectedbyplatedthroughholes(PTHs).
3.Multilayer:conductorson3ormorelayersseparatedbydielectricmaterialand
thelayersareinterconnectedbyPTHorpads
4 layer PCB is a sandwich of 2 double layered PCBs. Likewise 6 layer PCB is a
sandwich of 3 double layered PCB. This sandwiching is done by placing oxidizing
materialbetweendoublelayeredPCBs.
Thespatialanddensityrequirement,andthecircuitrycomplexitydeterminethetype
ofboardtobeproduced.

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CADSystem
Recommended software for the CAD system is Altium. This software has enhanced
features like improved interactive routing, user selectable track width, internal
routing loops, PCB routing completion detector, preserving track angles while
dragging,designingbottomlayerlayout(mirrorhastodone)justbyflipandediting
theboardetc.

Note: Minimum track width requirement is 0.2 mm and minimum spacing

betweentracksis0.2mm

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CNCdrilling/millingmachine

A computer automated, single spindle CNC machine is used which allows direct
processing of Excellon/Sieb & Meyer drill data or HP/GL data for PCB production
(drilling,milling,isolationrouting)andmilling/drillingofholes.Selectionofdrillbitis
also automated and the drill bit moves to the corresponding coordinate to make a
drill.Likewisedrillsofdifferentdiacanbemade.

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Photoplotter

With the photoplotter, films are developed for various layers and for the solder
masks. Moreover, both positive and negative type films can be developed. This is
also a computer automated equipment. It plots images from a CAD database by
usingGerberdatafileonaphotographicfilm.

Here, the film is rolled over the inner drum in the plotter. On running the
softwareincomputer,thelaserdiodemovesstepbystepalongtherotatingdrumby
meansofsteppermotordrivenleadscrew.Thelaserdiodemovingspeed,resolution
canalsobeadjustedasperrequirement.

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FilmDeveloper

After photoplotting, the individual PCB layers film is produced by a developer

machine. Then, under a light table, the film is manually inspected for any track
breaks,lineshortagesormissingofanytrack.

Here,thefilmsaredevelopedmanuallyinatray.

BrushingMachine

Aftercompletionofdrilling,theboardsaretobebrushedthoroughlytoensurethat
no stray particles remain on the board. Boards are brushed thoroughly, rinsed and
driedbythiswetbrushingmachine.

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Laminator

Thisisusedtolaminatetheentireboardareawithphotoresistmaterial.Hereeither
positive or negative photoresist material can be used for laminating the board. We
generally use negative photo resist. Lamination is performed by rolling the
photoresistcoilunderpressureonbothsidesofthemovingboardbyheatablefeed
rollers. Howeverrotationalspeedisadjustableasperrequirement.

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Platingunit

This unit is used for making printed through hole (PTH) circuit boards, where
connectivity from top to bottom layer can be made through holes. Here top and
bottom layers are connected by depositing copper in holes of the board. This unit
comprisesallthetanksandequipmentfordegreasing,rinsing,catalyzing,activating,
pickling and plating the drilled and cleaned boards. These process of degreasing,
rinsing, catalyzing, activating, pickling are used for removing grease, oil, dirt, soot
and other contaminants from surfaces. After thorough cleaning only copper is
deposited.

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Exposuresystem

After fixing layoutfilms exactly on both sides of the laminated board the light
sensitivecoverisexposedbyaultravioletlightindoublesideddrawerexposureunit
with a vacuum system. After the exposure that part of the laminate, which is not
protected by the layout film becomes etchresistent (if we use negative film &
negativephotoresist).

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SprayDeveloper

AfterexposingtheboardtoUVlight,thePCBisbroughtintoaspraydevelopingunit
where the board is treated with aqueous alkaline solution (like TCl alcohol)so that
thenonexposedpartmaygetsoftened.Arotarysystempresentinsidethechamber
allowsthesimultaneoustreatmentoftheentireboardsurface.

FoamEtchingCenter

Aftertreatingtheboardwithaqueousalkalinesolution,thePCBissubjectedinfoam
etching center by hanging it into a foaming fluid (usually acids) to etch out the
copper from the part of the PCB not exposed to UV. The copper part of the PCB
which is not exposed to UV gets softensand it is etched by acids. Now the board is
readywithprintedlayouttracks,padswhicharecoveredbyphotoresist.

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MaskingandLegendprinting

The bare copper PCB is silkscreened with a solder mask (usually green)
(Sometimes the solder mask is applied by photo imaging or dry film) which is
designed to insulate and protect the copper tracks and keep them from shorting
together during the soldering process. The solder mask covers the whole board
exceptsolderablesurfacessuchasthruholeandsurfacemountpads.
Thesoldermaskisthendriedorcured.ThePCBistinnedorplated,i.e.,solder,silver
or gold is applied to exposed pads. The PCB is silkscreened with component
identification lettering (usually white). The silkscreen legend is dried or cured . Any
finaldrillingofholesthatarenottobeplatedthroughandanyextraroutingarenow
performed,andthelaminateiscutintoindividualprintedcircuitboards.

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MultilayeredPCB

For fabricating multilayer PCB, we have to first fabricate corresponding number of

doublesidedPCBs.
For a 4 layered PCB, we have to first fabricate two double layered PCBs, and for 6
layered,3doublelayeredPCBs.
These double layered PCBs are sandwiched one over another exactly with oxidizing
agent between them. Then the sandwiched board inserted in the multilayer press
machine. It has a control unit for all pressure supply, press plates and heaters. The
largeloadingdoorthatallowsquickandeasyaccesstothepressurepart issecurity
switch protected. The unit is controlled by two digital and adjustable thermostats,
one digital timer as well as a pressure valve with pressure meter. Two strong air
ventilatorsareactivatedautomaticallyduringcoolingcycle.
Aftercompletecuringandcooling,thesandwitchedmultilayedPCBistakenoutfrom
thepressmachineissubjectedtomasking,legendprintingasperrequirement.

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The PCB lab. has a variety of chemicals in the store for PCB fabrication process.
The lab. has facility for producing deionized water which is used in plating
purpose.

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It has got the facility of inspection of photo films and PCBs under a table lamp
withamicroscope.

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PCBManufacturingsteps

FollowingarethestepsinvolvedinfabricationofPCB.
Basematerialcutting
Drilling
Throughholeplating
Layerfilmgeneration
Solderresistfilmgeneration
Legendprintingfilm(optional)
Laminating
Exposing
Spraydeveloping
Etchingprocess
Solderresistmasking
Legendprinting(optional)

Basematerialcutting

Base material which is selected based on application, may be epoxy resin (FR4),
duroid(ofrequireddielectricconstant),iscutintotherequiredsize

Drilling

Holes are drilled through the board using an automated drilling machine. A cnc
drilling/millingmachine,whichiscontrolledbyanExcellonfilewiththeholeposition
data and alis of the labels of the required drill bits, is used to drill the holes, to mill
certainboardcontoursandtoproducemultipleprintedpanel.Theholesareusedto
mountelectroniccomponentsontheboardandtoprovideaconductivecircuitfrom
onelayeroftheboardtoanother.

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Throughholeplating

Following drilling, the board is scrubbed to remove fine copper particles left by the
drill. After being scrubbed, the board is cleaned and etched to promote good
adhesion and then is plated with an additional layer of copper. Since the holes are
notconductive,electrolysiscopperplatingisemployedtoprovideathincontinuous
conductivelayeroverthesurfaceoftheboardandthroughtheholes.

Layerfilm

For multilayer boards films must be produced according to the number of layers.
Powerfulsoftwaretoolsgenerateaplotfile,whosedatacontrolaphotoplotter.After
developing the films, they have to be inspected under table lamp for any track
breaks,lineshortagesormissingofanytrack.

Solderresistfilm

In order to ensure no shortings in the PCB due to formation of moisture, or due to

spreading of solder leads, the complete board except the pads are to be soldered
masked. This is done in CAD design tools and the photofilm is generated in the
photoplotter.Thenthephotofilmisdeveloped.

Legendprintingfilm(optional)

This is developed in order to ensure ease and fastness during soldering of
components. This is also designed in CAD system and the film is generated in the
photoplotter.

Laminating

Bythisprocessthedrilledandplatedthroughboardsarelaminatedbyrollingunder
pressureaphotoresistlaminateonbothsidesoftheboard.
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Exposing

After properly aligning films on the photoresist laminated board, the board is
exposedbyaUVlightonbothsidesintheUVexposureunit.

Spraydeveloping

Theexposedboardisdevelopedinaspraydeveloperunit.Thedevelopersolutionis
sprayedonbothsidesoftheboardbyasprayrotatingsystem.Afterwardstherestof
the nonexposed laminate is removed by a rinsing process, whereas the exposed
laminateisetchresistantandthusprotectsthecircuitpatternagainstetching

Etchingprocess

In that process the UV nonexposed copper is etched. Afterwards the etch resistant
materialoverthetracks,padsofPCBisrinsedbymeansofasolventattack.

Solderresistmasking/Legendprinting(optional)

Inourlabthisisdonemanuallybyscreenprintingprocess.

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A.OVERALLGUIDELINES(SUMMARY)

MaximumPCBsizewhichcanbefabricated:10inchesx12inches
MinimumPCBsizewhichcanbefabricated:3inchesx2inches
Maximumtrackwidthpossible:100mil
Minimumtrackwidthpossible:8mil
Minimumclearancerequiredforperfectplot:8mil
B.DETAILEDGUIDELINESFORPCBJOBORDER

B.1Paddimensionrequirements

Inner diameter is 33 mil minimum. Higher values will automatically be mapped to

nearest hole drill bit available. Must be at least 4 mil greater than component lead
diametertoallowconsiderationsforminimumcopperplatingthicknessinthehole.
Outer diameter is 55 mil minimum and an integer values thereafter.
Differencebetween inner diameter and outer diameter must be 20 mil minimum to
ensure good copper area for soldering. This also applies to those footprints which
havebeenspeciallycreatedforthepurposebythedesigner.ForSMDs,thestandard
padsizespecifiedbythecomponentmanufacturermaybeused.

B.2Viarequirements

Innerdiameteris24milminimumtoensurecorrectfeedthrough.Outerdiameteris
40milminimum.

B.3Fillrequirements

Copperfillsforpowerplanesneedtobecreatedwithbasicblocksofsquaresofthe
following dimensions: blocks of sizes 10 mil to 100 mil in steps of 5 mil; blocks of
sizes100milto200milinstepsof10mil.Considerableoverlappingbetweenthese
buildingblocksisnecessarytoensurenovisiblegapsinthephotoplot.

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B.4Maximumprimitivedimension

ThephotoplotteratPCBfabfacility,IITKanpurcanacceptandplotaperturesizesup
to 100 mil. So the designer might take this into consideration before designing the
PCB. If any dimension higher than this is needed, he/she might have to use some
basicprimitives.Forexample,ifatrackof150milisrequired,a100miltrackanda
55miltrackcanbeplacedsidebysidewitha5miloverlaptogeta150
miltrack.

B.5Holedrillbitsavailableatthefacility

Manual Drill
78.70 mil (2.0 mm), 62.99 mil (1.6 mm), 51.18 mil (1.3 mm), 39.37 mil (1.0 mm), 35.43 mil
(0.9 mm), 31.49 mil (0.8 mm), 27.56 mil (0.7 mm), 23.62 mil (0.6 mm), 19.69 mil (0.5 mm)

CNC Mill/Drill
118.11 mil (3.0 mm), 59.06 mil (1.5 mm), 51.18 mil (1.3 mm), 43.31 mil (1.1 mm), 39.37 mil
(1.0 mm), 35.43 mil (0.9 mm), 31.49 mil (0.8 mm), 27.56 mil (0.7 mm), 23.62 mil (0.6 mm)

RF Cutters
78.70 mil (2.0 mm), 39.37 mil (1.0 mm), 15.75 mil (0.4 mm),7.87 mil (0.2 mm), 5.91 mil
(0.15 mm)

B.6SolderMasking/LegendPrintingFacility: Availableonrequest

B.7Copperthicknessonboard

Singlelayer:Optionsof1.38mil(35microns)withaboardthicknessof62.99mil(1.6
mm) and 2.76 mil (70 microns) with a board thickness of 94.49 mil (2.4 mm) are
available.BoardmaterialisGlassEpoxyorPaperPhenolic.
Doublelayer:Optionsof1.38mil(35microns)and0.67mil(17microns)bothwitha
board thickness of 62.99 mil (1.6 mm) are available. Board material is Glass Epoxy
(FR4).

C.BasicPCBDesignIssues

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The designer can use autoroute tools of the PCB design software he/she is using.
Butcaremustbetakenthatalldimensionsareofintegervalues.Usuallythedesigner
canrestricttheautoroutetooltouseonlyintegerdimensionsbysettingdesignrules
for the PCB. It must also be ensured to keep outer most layer, a little larger in
dimension than the actual board. A mechanical layer called Mechanical Layer 4
showing the actual dimensions of the board must be incorporated. This helps the
fabricatortocorrectlyusetheCNCmachinefordrillingholesintothePCB.Theorigin
of the PCB dimensions must also be set a little far, diagonally from the left bottom
corner of the board. Please refer to the documentation of the PCB design software
usedforfurtherinformation.
ThePCBdesignnamemustalsobementionedeitheronthetoplayerorthebottom
layer for a dual layered PCB. The text placement tool of the concerned PCB design
software can be used. It is a good practice to make sure that the name of the file
whichcontainsthePCBdesignrepresentsthePCBdesignveryclosely.

D.RecommendedCADSoftware

Altium Protel DXP Suite 2004

Note: If DXP 2004 is being used, please ensure that the .PCBDOC file is exported to
PCB Version 4 Binary format (.PCB file) before ordering the PCB. The file which
results due to the export must be directly sent to PCB fab for processing. Opening
thisfileinDXPagaincouldresultinproblemswiththeexistingprocedure.

Note:PleasesendonlythefinalPCBfilewhileordering.

E.Ordering,FabricationandDelivery

ThefinalfilerequiredforfabricationmustbesubmittedinthePCBLabafterfillingup
thePCBjoborderformTheprocessmightresultindeliveryperiodsof23weeksfor
normalPCBsand34weeksforPCBswithgreenmaskingandlegendprinting.

Thesetimesmayvaryabitdependingonthequeuependingatthefacilityand
the process conditions of the PCB. Single layer PCBs will be delivered in less than 2
weekstime.PCBfabricationisatimeandresource consumingprocessandhenceis
done with utmost care. Any complaints regarding the PCB fabrication and quality
maydirectlybeaddressedtothePCBfabricationfacilityincharge.





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F.Glossaryofterms

Footprint: Thepatternandspaceonaboardtakenupbyacomponent.

Clearance:ThespacingrequiredbetweentwoentitiesonaPCBtoensuresafe
operation.

Photoplotter: (also"vectorplotter",or"Gerberphotoplotter"afterGerberScientific
Co., which built the first vector photoplotters for commercial use). It plots images
fromaCADdatabaseonphotographicfilminadarkroombydrawingeachlinewitha
continuous lamp shined through an annularring aperture, and creating each shape
(orpad)byflashingthelampthroughaspeciallysizedandshapedaperture.

Gerber File: Data file used to control a photoplotter. Named after Gerber Scientific
Co.,whomadetheoriginalvectorphotoplotter.

Aperture: An indexed shape with a specified x and y dimension, or linetype with a
specified width, used as a basic element or object by a photoplotter in plotting
geometric patterns on film. The "apertures" are thin trapezoidal pieces of plastic
which are mostly opaque, but with a transparent portion that controls the size and
shapeofthelightpatternpassingthroughit.

Track: Besides its usual definition ofa strand of conductor, wire on a printed board
alsomeansarouteortrack.





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Pad: ThePCBComponentfootprintshavecopperlandingareaswherethe
componentsarefixedbymeansofsolder.

ThroughHole: (Ofacomponent,alsospelled"thruhole").Havingpinsdesignedto
beinsertedintoholesandsolderedtopadsonaprintedboard.


PlatedThroughHole: AholeinaPCBwithmetalplatingaddedafteritisdrilled.Its
purposeistoserveeitherasacontactpointforathroughholecomponentoravia.


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Via:AplatedthroughholeinaPCBusedtorouteatraceverticallyintheboard,that
is,fromonelayertoanother.

SMD: SurfaceMountDevice,wherethecomponentsleadsarenotfixedintoPTHs
butaresolderedtopadsdirectly.