The document describes a failure mode and effects analysis (FMEA) for a printed circuit board (PCB) assembly process. It lists 11 potential failure modes at different steps, their causes and effects. For each failure mode it provides a risk priority number based on occurrence, severity and detection ratings.
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Design Fmea Example
The document describes a failure mode and effects analysis (FMEA) for a printed circuit board (PCB) assembly process. It lists 11 potential failure modes at different steps, their causes and effects. For each failure mode it provides a risk priority number based on occurrence, severity and detection ratings.
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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Copyright MAIL-Soft Consulting AB, 2001 MAIL-Soft Consulting AB
Webb: http:// Stora Bergsgatan 11D
Produced and designed: MAIL-Soft Treboda S - 545 33 Treboda Design Failure Mode and Effect Analysis E-mail: [email protected] V01-09 Description / Beskrivning Part no. / Artikelnummer Status - Hardware / Status - Hrdvara Customer / Kund Function / Funktion Part name / Artikelbenmning Issued by / Utfrdad av Doc.no. / Dok.nr. Date / Datum No. Step Failure mode Causes of failure Effects of failure on part/system Testmethod Recommendations Decisions taken Respons. Po S Pd RPN Po S Pd RPN 1 Incoming inspection Material change not notified to Samhall Deficient information Goods not released, production delay None 1 2 1 2 2 FIFO not followed Traceability not followed Incurant material due to age or specifiction None 2 2 1 4 3 Interchange of PCB Erroneous marking Wrong PCB to production None 6 8 10 480 4 ESD damage to PCB Wrong handeling PCB will be destroyed None 4 7 5 140 5 Spotwelding fuse to precut Ni-strip Mounted other way round Lack of information Further assembly fuse not in use None 1 4 4 16 6 Position natt acc to tolerances Machinery tolerances Fuse does not fit None 3 4 5 60 7 Spotwelding pos 1 to battery can on cell Mix of tapes Lack of information Not as close as possible to cell None 1 5 1 5 8 Wrong positioning in height Machinery tolermaces Fues not in use (in combination with other errors above) None 5 10 3 150 9 Spotwelding precut Ni-strip to battery head Fuse mounted upside down or other way around Wrong marking Not as close as possible to cell None 4 4 3 48 10 Bad welding quality Spotwelding machine not well adjusted Open C or bad mech strength None 3 3 4 36 11 Assembly tape cell lid Bad welding quality Spotwelding machine not well adjusted Open C or bad mech strength None 3 4 4 48 PCB Laila SXK107110 Rev. A Samhall Operation Characteristics of failure Rating Action - Status 990521 Assembly PCB Klaus Mailer DFMEA:99-001 03-05-2014 Side 1 of 2 design_fmea_example.xls Copyright MAIL-Soft Consulting AB, 2001 MAIL-Soft Consulting AB Webb: http:// Stora Bergsgatan 11D Produced and designed: MAIL-Soft Treboda S - 545 33 Treboda Design Failure Mode and Effect Analysis E-mail: [email protected] V01-09 Description / Beskrivning Part no. / Artikelnummer Status - Hardware / Status - Hrdvara Customer / Kund Function / Funktion Part name / Artikelbenmning Issued by / Utfrdad av Doc.no. / Dok.nr. Date / Datum No. Step Failure mode Causes of failure Effects of failure on part/system Testmethod Recommendations Decisions taken Respons. Po S Pd RPN Po S Pd RPN PCB Laila SXK107110 Rev. A Samhall Operation Characteristics of failure Rating Action - Status 990521 Assembly PCB Klaus Mailer DFMEA:99-001 03-05-2014 Side 2 of 2 design_fmea_example.xls