MSP 430 G 2955

MSP430G2955 MSP430G2855 MSP430G2755
www.ti.com SLAS800 MARCH 2013
MIXED SIGNAL MICROCONTROLLER

Check for Samples: MSP430G2955, MSP430G2855, MSP430G2755
1
FEATURES
Low Supply-Voltage Range: 1.8 V to 3.6 V Ultra-Low Power Consumption Active Mode: 250 A at 1 MHz, 2.2 V Standby Mode: 0.7 A Off Mode (RAM Retention): 0.1 A Five Power-Saving Modes Ultra-Fast Wake-Up From Standby Mode in Less Than 1 s 16-Bit RISC Architecture, 62.5-ns Instruction Cycle Time Basic Clock Module Configurations Internal Frequencies up to 16 MHz With Four Calibrated Frequency Internal Very-Low-Power Low-Frequency (LF) Oscillator 32-kHz Crystal High-Frequency (HF) Crystal up to 16 MHz External Digital Clock Source External Resistor Two 16-Bit Timer_A With Three Capture/Compare Registers One 16-Bit Timer_B With Three Capture/Compare Registers Up to 32 Touch-Sense-Enabled I/O Pins Universal Serial Communication Interface (USCI) Enhanced UART Supporting Auto Baudrate Detection (LIN) IrDA Encoder and Decoder Synchronous SPI I2C On-Chip Comparator for Analog Signal Compare Function or Slope Analog-to-Digital (A/D) Conversion 10-Bit 200-ksps Analog-to-Digital (A/D) Converter With Internal Reference, Sampleand-Hold, and Autoscan Brownout Detector Serial Onboard Programming, No External Programming Voltage Needed, Programmable Code Protection by Security Fuse Bootstrap Loader On-Chip Emulation Logic Family Members are Summarized in Table 1 Package Options TSSOP: 38 Pin (DA) QFN: 40 Pin (RHA) For Complete Module Descriptions, See the MSP430x2xx Family Users Guide (SLAU144)
DESCRIPTION
The Texas Instruments MSP430 family of ultra-low-power microcontrollers consists of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with five low-power modes, is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 1 s. The MSP430G2x55 series are ultra-low-power mixed signal microcontrollers with built-in 16-bit timers, up to 32 I/O touch-sense-enabled pins, a versatile analog comparator, and built-in communication capability using the universal serial communication interface. For configuration details, see Table 1. Typical applications include low-cost sensor systems that capture analog signals, convert them to digital values, and then process the data for display or for transmission to a host system.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright 2013, Texas Instruments Incorporated
MSP430G2955 MSP430G2855 MSP430G2755

SLAS800 MARCH 2013 www.ti.com
Table 1. Available Options (1) (2)

Device MSP430G2955IDA38 MSP430G2955IRHA40 MSP430G2855IDA38 MSP430G2855IRHA40 MSP430G2755IDA38 MSP430G2755IRHA40 1 1 32 4096 1 1 48 4096 1 1 56 4096 BSL EEM Flash (KB) RAM (B) Timer_A Timer_B 2x TA3 1x TB3 2x TA3 1x TB3 2x TA3 1x TB3 COMP_A+ Channels 8 ADC10 Channels 12 USCI_A0 USCI_B0 1 Clock HF, LF, DCO, VLO HF, LF, DCO, VLO HF, LF, DCO, VLO I/O 32 32 32 32 32 32 Package Type 38-TSSOP 40-QFN 38-TSSOP 40-QFN 38-TSSOP 40-QFN
12
12
(1) (2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Device Pinout, 38-Pin TSSOP (DA Package)

TEST/SBWTCK DVCC P2.5/TA1.0/ROSC DVSS XOUT/P2.7 XIN/P2.6 RST/NMI/SBWTDIO P2.0/TA1CLK/ACLK/A0 P2.1/TA0INCLK/SMCLK/A1 P2.2/TA0.0/A2 P3.0/UCB0STE/UCA0CLK/A5 P3.1/UCB0SIMO/UCB0SDA P3.2/UCB0SOMI/UCB0SCL P3.3/UCB0CLK/UCA0STE AVSS AVCC P4.0/TB0.0/CA0 P4.1/TB0.1/CA1 P4.2/TB0.2/CA2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 P1.7/TA0.2/TDO/TDI P1.6/TA0.1/TDI P1.5/TA0.0/TMS P1.4/SMCLK/TCK P1.3/TA0.2 P1.2/TA0.1 P1.1/TA0.0 P1.0/TA0CLK/ADC10CLK P2.4/TA0.2/A4/VREF+/VEREF+ P2.3/TA0.1/A3/VREF/VEREF P3.7/TA1.2/A7 P3.6/TA1.1/A6 P3.5/UCA0RXD/UCA0SOMI P3.4/UCA0TXD/UCA0SIMO P4.7/TB0CLK/CA7 P4.6/TB0OUTH/A15/CA6 P4.5/TB0.2/A14/CA5 P4.4/TB0.1/A13/CA4 P4.3/TB0.0/A12/CA3
Submit Documentation Feedback
Product Folder Links: MSP430G2955 MSP430G2855 MSP430G2755
MSP430G2955 MSP430G2855 MSP430G2755

Device Pinout, 40-Pin QFN (RHA Package)

P1.6/TA0.1/TDI/TCLK P1.7/TA0.2/TDO/TDI P2.5/TA1.0/ROSC P1.4/SMCLK/TCK
TEST/SBWTCK
P1.5/TA0.0/TMS
P1.3/TA0.2
39 38 37 36 35 34 33 32 DVSS XOUT/P2.7 XIN/P2.6 DVSS RST/NMI/SBWTDIO P2.0/TA1CLK/ACLK/A0 P2.1/TA0INCLK/SMCLK/A1 P2.2/TA0.0/A2 P3.0/UCB0STE/UCA0CLK/A5 P3.1/UCB0SIMO/UCB0SDA 1 2 3 4 5 6 7 8 9 10 12 13 14 15 16 17 18 19 P3.3/UCB0CLK/UCA0STE P4.1/TB0.1/CA1 P4.0/TB0.0/CA0 P4.2/TB0.2/CA2 AVSS P4.3/TB0.0/A12/CA3 P3.2/UCB0SOMI/UCB0SCL P4.4/TB0.1/A13/CA4 P4.5/TB0.2/A14/CA5 AVCC 30 29 28 27 26 25 24 23 22 21 P1.1/TA0.0 P1.0/TA0CLK/ADC10CLK P2.4/TA0.2/A4/VREF+/VEREF+ P2.3/TA0.1/A3/VREF/VEREF P3.7/TA1.2/A7 P3.6/TA1.1/A6 P3.5/UCA0RXD/UCA0SOMI P3.4/UCA0TXD/UCA0SIMO P4.7/TB0CLK/CA7 P4.6/TB0OUTH/A15/CA6
Functional Block Diagram

VCC VSS P1.x, P2.x 2x8 P3.x, P4.x 2x8
XIN
XOUT ACLK SMCLK Flash 56 kB 48 kB 32 kB RAM 4 kB ADC 10-Bit 12 Channels, Autoscan, DTC
Ports P1, P2 Ports P3, P4 2x8 I/O, Pullup or pulldown resistors
Basic Clock System+
COMP_A+ 8 Channels
P1.2/TA0.1
DVCC
DVCC
MCLK
2x8 I/O, Interrupt capability, Pullup or pulldown resistors
16MHz CPU incl. 16 Registers
MAB
MDB
Emulation (2BP) JTAG Interface Spy-Bi-Wire Brownout Protection Watchdog WDT+ 15 or 16 Bit Timer1_A3 3 CC Registers Timer0_A3 3 CC Registers
Timer0_B3 3 CC Registers, Shadow Register
USCI_A0: UART, LIN, IrDA,SPI USCI_B0: SPI,I2C
RST/NMI
MSP430G2955 MSP430G2855 MSP430G2755

Table 2. Terminal Functions

TERMINAL NAME P1.0/ TACLK/ ADC10CLK P1.1/ TA0.0 P1.2/ TA0.1 P1.3/ TA0.2 P1.4/ SMCLK/ TCK P1.5/ TA0.0/ TMS P1.6/ TA0.1/ TDI/ TCLK P1.7/ TA0.2/ TDO/ TDI (1) P2.0/ TA1CLK/ ACLK/ A0 P2.1/ TAINCLK/ SMCLK/ A1 P2.2/ TA0.0/ A2 P2.3/ TA0.1/ A3/ VREF-/ VEREFP2.4/ TA0.2/ A4/ VREF+/ VEREF+ (1) 4 TDO or TDI is selected via JTAG instruction. Submit Documentation Feedback
NO. DA 31 RHA
I/O General-purpose digital I/O pin 29 I/O
DESCRIPTION
Timer_A, clock signal TACLK input ADC10, conversion clock General-purpose digital I/O pin Timer_A, capture: CCI0A input, compare: OUT0 output or BSL transmit General-purpose digital I/O pin Timer_A, capture: CCI1A input, compare: OUT1 output General-purpose digital I/O pin Timer_A, capture: CCI2A input, compare: OUT2 output General-purpose digital I/O pin SMCLK signal output JTAG test clock, input terminal for device programming and test General-purpose digital I/O pin
32 33 34
30 31 32
I/O I/O I/O
35
33
I/O
36
34
I/O
Timer_A, compare: OUT0 output JTAG test mode select, input terminal for device programming and test General-purpose digital I/O pin / Timer_A, compare: OUT1 output JTAG test data input terminal during programming and test JTAG test clock input terminal during programming and test General-purpose digital I/O pin Timer_A, compare: OUT2 output JTAG test data output terminal during programming and test JTAG test data input terminal during programming and test General-purpose digital I/O pin Timer1_A3.TACLK ACLK output ADC10, analog input A0 General-purpose digital I/O pin Timer_A, clock signal at INCLK SMCLK signal output ADC10, analog input A1 General-purpose digital I/O pin
37
35
I/O
38
36
I/O
I/O
I/O
10
I/O
Timer_A, capture: CCI0B input or BSL receive, compare: OUT0 output ADC10, analog input A2 General-purpose digital I/O pin Timer_A, capture CCI1B input, compare: OUT1 output
29
27
I/O
ADC10, analog input A3 Negative reference voltage output Negative reference voltage input General-purpose digital I/O pin Timer_A, compare: OUT2 output
30
28
I/O
ADC10, analog input A4 Positive reference voltage output Positive reference voltage input
MSP430G2955 MSP430G2855 MSP430G2755

Table 2. Terminal Functions (continued)

TERMINAL NAME P2.5/ TA1.0/ ROSC XIN/ P2.6 XOUT/ P2.7 P3.0/ UCB0STE/ UCA0CLK/ A5 P3.1/ UCB0SIMO/ UCB0SDA P3.2/ UCB0SOMI/ UCB0SCL P3.3/ UCB0CLK/ UCA0STE P3.4/ UCA0TXD/ UCA0SIMO P3.5/ UCA0RXD/ UCA0SOMI P3.6/ TA1.1/ A6 P3.7/ TA1.2/ A7 P4.0/ TB0.0/ CA0 P4.1/ TB0.1/ CA1 P4.2/ TB0.2/ CA2 19 17 I/O 18 16 I/O 17 15 I/O 28 26 I/O 27 25 I/O 26 24 I/O 25 23 I/O 14 12 I/O 13 11 I/O 12 10 I/O 11 9 I/O 6 5 3 2 I/O I/O 3 40 I/O NO. DA RHA General-purpose digital I/O pin Timer_A, capture: CCI0B input or BSL receive, compare: OUT0 output Input for external DCO resistor to define DCO frequency Input terminal of crystal oscillator General-purpose digital I/O pin Output terminal of crystal oscillator General-purpose digital I/O pin (2) General-purpose digital I/O pin USCI_B0 slave transmit enable USCI_A0 clock input/output ADC10, analog input A5 General-purpose digital I/O pin USCI_B0 slave in, master out in SPI mode USCI_B0 SDA I2C data in I2C mode General-purpose digital I/O pin USCI_B0 slave out, master in SPI mode USCI_B0 SCL I2C clock in I2C mode General-purpose digital I/O pin USCI_B0 clock input/output USCI_A0 slave transmit enable General-purpose digital I/O pin USCI_A0 transmit data output in UART mode USCI_A0 slave in, master out in SPI mode General-purpose digital I/O pin USCI_A0 receive data input in UART mode USCI_A0 slave out, master in SPI mode General-purpose digital I/O pin Timer_A, capture: CCI1B input or BSL receive, compare: OUT2 output ADC10 analog input A6 General-purpose digital I/O pin Timer_A, capture: CCI2B input or BSL receive, compare: OUT2 output ADC10 analog input A7 General-purpose digital I/O pin Timer_B, capture: CCI0A input, compare: OUT0 output Comparator_A+, CA0 input General-purpose digital I/O pin Timer_B, capture: CCI1A input, compare: OUT1 output Comparator_A+, CA1 input General-purpose digital I/O pin Timer_B, capture: CCI2A input, compare: OUT2 output Comparator_A+, CA2 input I/O DESCRIPTION
(2)
If XOUT/P2.7 is used as an input, excess current flows until P2SEL.7 is cleared. This is due to the oscillator output driver connection to this pad after reset. Submit Documentation Feedback 5
MSP430G2955 MSP430G2855 MSP430G2755

Table 2. Terminal Functions (continued)

TERMINAL NAME P4.3/ TB0.0/ A12/ CA3 P4.4/ TB0.1/ A13/ CA4 P4.5/ TB0.2/ A14/ CA5 P4.6/ TBOUTH/ CAOUT/ A15/ CA6 P4.7/ TBCLK/ CAOUT/ CA7 RST/ NMI/SBWTDIO TEST/ 1 SBWTCK DVCC AVCC DVSS AVSS QFN Pad 2 16 4 15 NA 38, 39 14 1, 4 13 Pad NA 37 I 7 5 I 24 22 I/O 23 21 I/O 22 20 I/O 21 19 I/O 20 18 I/O NO. DA RHA General-purpose digital I/O pin Timer_B, capture: CCI0B input, compare: OUT0 output ADC10 analog input A12 Comparator_A+, CA3 input General-purpose digital I/O pin Timer_B, capture: CCI1B input, compare: OUT1 output ADC10 analog input A13 Comparator_A+, CA4 input General-purpose digital I/O pin Timer_B, compare: OUT2 output ADC10 analog input A14 Comparator_A+, CA5 input General-purpose digital I/O pin Timer_B, switch all TB0 to TB3 outputs to high impedance Comparator_A+ Output ADC10 analog input A15 Comparator_A+, CA6 input General-purpose digital I/O pinCB0 Timer_B, clock signal TBCLK input Comparator_A+ Output Comparator_A+, CA7 input Reset or nonmaskable interrupt input Spy-Bi-Wire test data input/output during programming and test Selects test mode for JTAG pins on Port 1. The device protection fuse is connected to TEST. Spy-Bi-Wire test clock input during programming and test Digital supply voltage Analog supply voltage Digital ground reference Analog ground reference QFN package pad; connection to DVSS recommended. I/O DESCRIPTION
MSP430G2955 MSP430G2855 MSP430G2755

SHORT-FORM DESCRIPTION CPU

The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All operations, other than program-flow instructions, are performed as register operations in conjunction with seven addressing modes for source operand and four addressing modes for destination operand. The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-toregister operation execution time is one cycle of the CPU clock. Four of the registers, R0 to R3, are dedicated as program counter, stack pointer, status register, and constant generator, respectively. The remaining registers are general-purpose registers. Peripherals are connected to the CPU using data, address, and control buses, and can be handled with all instructions. The instruction set consists of the original 51 instructions with three formats and seven address modes and additional instructions for the expanded address range. Each instruction can operate on word and byte data.
Program Counter PC/R0
Stack Pointer
SP/R1 SR/CG1/R2
Status Register
Constant Generator
CG2/R3 R4
General-Purpose Register
R5
R6 R7
General-Purpose Register General-Purpose Register
R8 R9
General-Purpose Register General-Purpose Register
R10 R11
R12 R13
Instruction Set
The instruction set consists of 51 instructions with three formats and seven address modes. Each instruction can operate on word and byte data. Table 3 shows examples of the three types of instruction formats; Table 4 shows the address modes.
R14 R15
Table 3. Instruction Word Formats

INSTRUCTION FORMAT Dual operands, source-destination Single operands, destination only Relative jump, un/conditional EXAMPLE ADD R4,R5 CALL R8 JNE OPERATION R4 + R5 ---> R5 PC -->(TOS), R8--> PC Jump-on-equal bit = 0
Table 4. Address Mode Descriptions (1)

ADDRESS MODE Register Indexed Symbolic (PC relative) Absolute Indirect Indirect autoincrement Immediate (1) S = source, D = destination S D SYNTAX MOV Rs,Rd MOV X(Rn),Y(Rm) MOV EDE,TONI MOV &MEM,&TCDAT MOV @Rn,Y(Rm) MOV @Rn+,Rm MOV #X,TONI MOV @R10,Tab(R6) MOV @R10+,R11 MOV #45,TONI EXAMPLE MOV R10,R11 MOV 2(R5),6(R6) OPERATION R10 -- --> R11 M(2+R5) -- --> M(6+R6) M(EDE) -- --> M(TONI) M(MEM) -- --> M(TCDAT) M(R10) -- --> M(Tab+R6) M(R10) -- --> R11 R10 + 2-- --> R10 #45 -- --> M(TONI)
MSP430G2955 MSP430G2855 MSP430G2755

Operating Modes
The MSP430 has one active mode and five software selectable low-power modes of operation. An interrupt event can wake up the device from any of the low-power modes, service the request, and restore back to the low-power mode on return from the interrupt program. The following six operating modes can be configured by software: Active mode (AM) All clocks are active. Low-power mode 0 (LPM0) CPU is disabled. ACLK and SMCLK remain active. MCLK is disabled. Low-power mode 1 (LPM1) CPU is disabled ACLK and SMCLK remain active. MCLK is disabled. DCO's dc generator is disabled if DCO not used in active mode. Low-power mode 2 (LPM2) CPU is disabled. ACLK remains active. MCLK and SMCLK are disabled. DCO's dc generator remains enabled. Low-power mode 3 (LPM3) CPU is disabled. ACLK remains active. MCLK and SMCLK are disabled. DCO's dc generator is disabled. Low-power mode 4 (LPM4) CPU is disabled. ACLK, MCLK, and SMCLK are disabled. DCO's dc generator is disabled. Crystal oscillator is stopped.
MSP430G2955 MSP430G2855 MSP430G2755

Interrupt Vector Addresses

The interrupt vectors and the power-up starting address are located in the address range 0FFFFh to 0FFC0h. The vector contains the 16-bit address of the appropriate interrupt handler instruction sequence. If the reset vector (located at address 0FFFEh) contains 0FFFFh (for example, flash is not programmed), the CPU goes into LPM4 immediately after power-up. Table 5. Interrupt Sources, Flags, and Vectors
INTERRUPT SOURCE Power-Up External Reset Watchdog Timer+ Flash key violation PC out-of-range (1) NMI Oscillator fault Flash memory access violation Timer0_B3 Timer0_B3 Comparator_A+ Watchdog Timer+ Timer0_A3 Timer0_A3 USCI_A0 or USCI_B0 receive USCI_B0 I2C status USCI_A0 or USCI_B0 transmit USCI_B0 I2C receive or transmit ADC10 Reserved I/O Port P2 (up to eight flags) I/O Port P1 (up to eight flags) Timer1_A3 Timer1_A3 See See (1) (2) (3) (4) (5) (6) (7) (8)
(7) (8)
INTERRUPT FLAG PORIFG RSTIFG WDTIFG KEYV (2) NMIIFG OFIFG ACCVIFG (2) (3) TB0CCR0 CCIFG (4) TB0CCR2 TB0CCR1 CCIFG, TBIFG (2) (4) CAIFG
(4)
SYSTEM INTERRUPT
WORD ADDRESS
PRIORITY
Reset
0FFFEh
31, highest
(non)-maskable (non)-maskable (non)-maskable maskable maskable maskable maskable

(4)
0FFFCh 0FFFAh 0FFF8h 0FFF6h 0FFF4h 0FFF2h 0FFF0h 0FFEEh 0FFECh 0FFEAh 0FFE8h 0FFE6h 0FFE4h 0FFE2h 0FFE0h 0FFDEh 0FFDEh to 0FFC0h
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 to 0, lowest
WDTIFG TA0CCR0 CCIFG TA0CCR2 TA0CCR1 CCIFG, TAIFG (5) (4) UCA0RXIFG, UCB0RXIFG (2) (5) UCA0TXIFG, UCB0TXIFG ADC10IFG (4) P2IFG.0 to P2IFG.7 (2) (4) P1IFG.0 to P1IFG.7
(2) (4) (2) (6)
maskable maskable maskable maskable maskable maskable maskable maskable maskable
TA1CCR0 CCIFG (4) TA1CCR2 TA1CCR1 CCIFG, TAIFG (2) (4)
A reset is generated if the CPU tries to fetch instructions from within the module register memory address range (0h to 01FFh) or from within unused address ranges. Multiple source flags (non)-maskable: the individual interrupt-enable bit can disable an interrupt event, but the general interrupt enable cannot. Interrupt flags are located in the module. In SPI mode: UCB0RXIFG. In I2C mode: UCALIFG, UCNACKIFG, ICSTTIFG, UCSTPIFG. In UART or SPI mode: UCB0TXIFG. In I2C mode: UCB0RXIFG, UCB0TXIFG. This location is used as bootstrap loader security key (BSLSKEY). A 0xAA55 at this location disables the BSL completely. A zero (0h) disables the erasure of the flash if an invalid password is supplied. The interrupt vectors at addresses 0FFDEh to 0FFC0h are not used in this device and can be used for regular program code if necessary.
MSP430G2955 MSP430G2855 MSP430G2755

Special Function Registers (SFRs)

Most interrupt and module enable bits are collected into the lowest address space. Special function register bits not allocated to a functional purpose are not physically present in the device. Simple software access is provided with this arrangement.
Legend rw: rw-0,1: rw-(0,1): Bit can be read and written. Bit can be read and written. It is reset or set by PUC. Bit can be read and written. It is reset or set by POR. SFR bit is not present in device.
Table 6. Interrupt Enable Register 1 and 2

Address 00h 7 6 5 ACCVIE rw-0 WDTIE OFIE NMIIE ACCVIE Address 01h 4 NMIIE rw-0 3 2 1 OFIE rw-0 0 WDTIE rw-0
Watchdog timer interrupt enable. Inactive if watchdog mode is selected. Active if Watchdog timer is configured in interval timer mode. Oscillator fault interrupt enable (Non)maskable interrupt enable Flash access violation interrupt enable 7 6 5 4 3 UCB0TXIE rw-0 2 UCB0RXIE rw-0 1 UCA0TXIE rw-0 0 UCA0RXIE rw-0
UCA0RXIE UCA0TXIE UCB0RXIE UCB0TXIE
USCI_A0 receive interrupt enable USCI_A0 transmit interrupt enable USCI_B0 receive interrupt enable USCI_B0 transmit interrupt enable
Table 7. Interrupt Flag Register 1 and 2

Address 02h 7 6 5 4 NMIIFG rw-0 WDTIFG OFIFG PORIFG RSTIFG NMIIFG Address 03h 3 RSTIFG rw-(0) 2 PORIFG rw-(1) 1 OFIFG rw-1 0 WDTIFG rw-(0)
Set on watchdog timer overflow (in watchdog mode) or security key violation. Reset on VCC power-on or a reset condition at the RST/NMI pin in reset mode. Flag set on oscillator fault. Power-on reset interrupt flag. Set on VCC power-up. External reset interrupt flag. Set on a reset condition at RST/NMI pin in reset mode. Reset on VCC power-up. Set via RST/NMI pin 7 6 5 4 3 UCB0TXIFG rw-1 2 UCB0RXIFG rw-0 1 UCA0TXIFG rw-1 0 UCA0RXIFG rw-0
UCA0RXIFG UCA0TXIFG UCB0RXIFG UCB0TXIFG
USCI_A0 receive interrupt flag USCI_A0 transmit interrupt flag USCI_B0 receive interrupt flag USCI_B0 transmit interrupt flag
10
MSP430G2955 MSP430G2855 MSP430G2755

Memory Organization
Table 8. Memory Organization
MSP430G2755 Memory Main: interrupt vector Main: code memory Information memory RAM (total) Extended Mirrored RAM (mirrored at 0x18FF to 0x1100) Peripherals Size Flash Flash Size Flash Size Size Size 32kB 0xFFFF to 0xFFC0 0xFFFF to 0x8000 256 Byte 0x10FF to 0x1000 4kB 0x20FF to 0x1100 2KB 0x20FF to 0x1900 2KB 0x18FF to 0x1100 Size 2KB 0x09FF to 0x0200 16-bit 8-bit 8-bit SFR 0x01FF to 0x0100 0x00FF to 0x0010 0x000F to 0x0000 MSP430G2855 48kB 0xFFFF to 0xFFC0 0xFFFF to 0x4000 256 Byte 0x10FF to 0x1000 4kB 0x20FF to 0x1100 2KB 0x20FF to 0x1900 2KB 0x18FF to 0x1100 2KB 0x09FF to 0x0200 0x01FF to 0x0100 0x00FF to 0x0010 0x000F to 0x0000 MSP430G2955 56kB 0xFFFF to 0xFFC0 0xFFFF to 0x2100 256 Byte 0x10FF to 0x1000 4kB 0x20FF to 0x1100 2KB 0x20FF to 0x1900 2KB 0x18FF to 0x1100 2KB 0x09FF to 0x0200 0x01FF to 0x0100 0x00FF to 0x0010 0x000F to 0x0000
Bootstrap Loader (BSL)

The MSP430 BSL enables users to program the flash memory or RAM using a UART serial interface. Access to the MSP430 memory via the BSL is protected by user-defined password. For complete description of the features of the BSL and its implementation, see the MSP430 Programming Via the Bootstrap Loader User's Guide (SLAU319). Table 9. BSL Function Pins
BSL FUNCTION Data transmit Data receive DA PACKAGE PINS 32 - P1.1 10 - P2.2 RHA PACKAGE PINS 30 - P1.1 8 - P2.2
Flash Memory
The flash memory can be programmed via the Spy-Bi-Wire or JTAG port or in-system by the CPU. The CPU can perform single-byte and single-word writes to the flash memory. Features of the flash memory include: Flash memory has n segments of main memory and four segments of information memory (A to D) of 64 bytes each. Each segment in main memory is 512 bytes in size. Segments 0 to n may be erased in one step, or each segment may be individually erased. Segments A to D can be erased individually or as a group with segments 0 to n. Segments A to D are also called information memory. Segment A contains calibration data. After reset segment A is protected against programming and erasing. It can be unlocked but care should be taken not to erase this segment if the device-specific calibration data is required.
11
MSP430G2955 MSP430G2855 MSP430G2755

Peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all instructions. For complete module descriptions, see the MSP430x2xx Family User's Guide (SLAU144). Oscillator and System Clock The clock system is supported by the basic clock module that includes support for a 32768-Hz watch crystal oscillator, an internal very-low-power low-frequency oscillator and an internal digitally controlled oscillator (DCO). The basic clock module is designed to meet the requirements of both low system cost and low power consumption. The internal DCO provides a fast turn-on clock source and stabilizes in less than 1 s. The basic clock module provides the following clock signals: Auxiliary clock (ACLK), sourced either from a 32768-Hz watch crystal or the internal LF oscillator. Main clock (MCLK), the system clock used by the CPU. Sub-Main clock (SMCLK), the sub-system clock used by the peripheral modules. The DCO settings to calibrate the DCO output frequency are stored in the information memory segment A. Main DCO Characteristics All ranges selected by RSELx overlap with RSELx + 1: RSELx = 0 overlaps RSELx = 1, ... RSELx = 14 overlaps RSELx = 15. DCO control bits DCOx have a step size as defined by parameter SDCO. Modulation control bits MODx select how often fDCO(RSEL,DCO+1) is used within the period of 32 DCOCLK cycles. The frequency fDCO(RSEL,DCO) is used for the remaining cycles. The frequency is an average equal to:
faverage = 32 fDCO(RSEL,DCO) fDCO(RSEL,DCO+1) MOD fDCO(RSEL,DCO) + (32 MOD) fDCO(RSEL,DCO+1)
12
MSP430G2955 MSP430G2855 MSP430G2755

Calibration Data Stored in Information Memory Segment A Calibration data is stored for both the DCO and for ADC10 organized in a tag-length-value (TLV) structure. Table 10. Tags Used by the Devices
NAME TAG_DCO_30 TAG_ADC10_1 TAG_EMPTY ADDRESS 0x10F6 0x10DA VALUE 0x01 0x10 0xFE ADC10_1 calibration tag Identifier for empty memory areas DESCRIPTION DCO frequency calibration at VCC = 3 V and TA = 30C at calibration
Table 11. Labels Used by the Devices

LABEL CAL_ADC_25T85 CAL_ADC_25T30 CAL_ADC_25VREF_FACTOR CAL_ADC_15T85 CAL_ADC_15T30 CAL_ADC_15VREF_FACTOR CAL_ADC_OFFSET CAL_ADC_GAIN_FACTOR CAL_BC1_1MHZ CAL_DCO_1MHZ CAL_BC1_8MHZ CAL_DCO_8MHZ CAL_BC1_12MHZ CAL_DCO_12MHZ CAL_BC1_16MHZ CAL_DCO_16MHZ ADDRESS OFFSET 0x0010 0x000E 0x000C 0x000A 0x0008 0x0006 0x0004 0x0002 0x0009 0x0008 0x0007 0x0006 0x0005 0x0004 0x0003 0x0002 SIZE word word word word word word word word byte byte byte byte byte byte byte byte CONDITION AT CALIBRATION AND DESCRIPTION INCHx = 0x1010, REF2_5 = 1, TA = 85C INCHx = 0x1010, REF2_5 = 1, TA = 30C REF2_5 = 1, TA = 30C, IVREF+ = 1 mA INCHx = 0x1010, REF2_5 = 0, TA = 85C INCHx = 0x1010, REF2_5 = 0, TA = 30C REF2_5 = 0, TA = 30C, IVREF+ = 0.5 mA External VREF = 1.5 V, fADC10CLK = 5 MHz External VREF = 1.5 V, fADC10CLK = 5 MHz -
Brownout The brownout circuit is implemented to provide the proper internal reset signal to the device during power on and power off. Digital I/O Four 8-bit I/O ports are implemented: All individual I/O bits are independently programmable. Any combination of input, output, and interrupt condition (port P1 and port P2 only) is possible. Edge-selectable interrupt input capability for all bits of port P1 and port P2. Read and write access to port-control registers is supported by all instructions. Each I/O has an individually programmable pullup or pulldown resistor. Each I/O has an individually programmable pin oscillator enable bit to enable low-cost touch sensing. Watchdog Timer (WDT+) The primary function of the watchdog timer (WDT+) module is to perform a controlled system restart after a software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not needed in an application, the module can be disabled or configured as an interval timer and can generate interrupts at selected time intervals.
13
MSP430G2955 MSP430G2855 MSP430G2755

Timer_A3 (TA0, TA1) Timer0_A3 and Timer1_A3 are 16-bit timers/counters with three capture/compare registers. Timer_A3 can support multiple capture/compares, PWM outputs, and interval timing. Timer_A3 also has extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare registers. Table 12. Timer0_A3 Signal Connections
INPUT PIN NUMBER DA38 P1.0 - 31 RHA40 P1.0-29 DEVICE INPUT SIGNAL TACLK ACLK SMCLK P2.1 - 9 P1.1 - 32 P2.2 - 10 P2.1 - 7 P1.1 - 30 P2.2 - 8 TACLK TA0.0 ACLK VSS VCC P1.2 - 33 P2.3 - 29 P1.2 - 31 P2.3 - 27 TA0.1 TA0.1 VSS VCC P1.3 - 34 P1.3 - 32 TA0.2 ACLK (internal) VSS VCC MODULE INPUT NAME TACLK ACLK SMCLK INCLK CCI0A CCI0B GND VCC CCI1A CCI1B GND VCC CCI2A CCI2B GND VCC CCR2 TA2 P1.3 - 34 P2.4 - 30 P1.7 - 38 P1.3 - 32 P2.4 - 28 P1.7 - 36 CCR1 TA1 P1.2 - 33 P2.3 - 29 P1.6 - 37 P1.2 - 31 P2.3 - 27 P1.6 - 35 CCR0 TA0 P1.1- 32 P2.2 - 10 P1.5 - 36 P1.1 - 30 P2.2 - 8 P1.5 - 34 Timer NA MODULE BLOCK MODULE OUTPUT SIGNAL OUTPUT PIN NUMBER DA38 RHA40
Table 13. Timer1_A3 Signal Connections

INPUT PIN NUMBER DA38 P2.0 - 8 RHA40 P2.0 - 6 DEVICE INPUT SIGNAL TACLK ACLK SMCLK PinOsc P2.5 - 3 PinOsc P2.5 - 40 TACLK TA1.0 TA1.0 VSS VCC P3.6 - 27 P3.6 - 25 TA1.1 CAOUT VSS VCC P3.7 - 28 PinOsc P3.7 - 26 PinOsc TA1.2 TA1.2 VSS VCC MODULE INPUT NAME TACLK ACLK SMCLK INCLK CCI0A CCI0B GND VCC CCI1A CCI1B GND VCC CCI2A CCI2B GND VCC CCR2 TA2 P3.7 - 28 P3.7 - 26 CCR1 TA1 P3.6 - 27 P3.6 - 25 CCR0 TA0 P2.5 - 3 P2.5 - 40 Timer NA MODULE BLOCK MODULE OUTPUT SIGNAL OUTPUT PIN NUMBER DA38 RHA40
14
MSP430G2955 MSP430G2855 MSP430G2755

Timer_B3 (TB0) Timer0_B3 is a 16-bit timer/counter with three capture/compare registers. Timer0_B3 can support multiple capture/compares, PWM outputs, and interval timing. Timer0_B3 also has extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare registers. Table 14. Timer0_B3 Signal Connections
INPUT PIN NUMBER DA38 P4.7 - 24 RHA40 P4.7 - 22 DEVICE INPUT SIGNAL TBCLK ACLK SMCLK P4.7 - 27 P4.0 - 17 P4.3 -20 P4.7 - 22 P4.0 - 15 P4.3 - 18 TBCLK TB0.0 TB0.0 VSS VCC P4.1 - 18 P4.4 - 21 P4.1 - 16 P4.4 - 19 TB0.1 TB0.1 VSS VCC P4.2 - 19 P4.2 - 17 TB0.2 ACLK (internal) VSS VCC MODULE INPUT NAME TBCLK ACLK SMCLK INCLK CCI0A CCI0B GND VCC CCI1A CCI1B GND VCC CCI2A CCI2B GND VCC CCR2 TB2 P4.2 - 19 P4.5 - 22 P4.2 - 17 P4.5 - 20 CCR1 TB1 P4.1 - 18 P4.4 - 21 P4.1 - 16 P4.4 - 19 CCR0 TB0 P4.0 - 17 P4.3 - 20 P4.0 - 15 P4.3 - 18 Timer NA MODULE BLOCK MODULE OUTPUT SIGNAL OUTPUT PIN NUMBER DA38 RHA40
Universal Serial Communications Interface (USCI) The USCI module is used for serial data communication. The USCI module supports synchronous communication protocols such as SPI (3 or 4 pin) and I2C, and asynchronous communication protocols such as UART, enhanced UART with automatic baudrate detection (LIN), and IrDA. USCI_A0 provides support for SPI (3 or 4 pin), UART, enhanced UART, and IrDA. USCI_B0 provides support for SPI (3 or 4 pin) and I2C. Comparator_A+ The primary function of the comparator_A+ module is to support precision slope analog-to-digital conversions, battery-voltage supervision, and monitoring of external analog signals. ADC10 The ADC10 module supports fast 10-bit analog-to-digital conversions. The module implements a 10-bit SAR core, sample select control, reference generator, and data transfer controller (DTC) for automatic conversion result handling, allowing ADC samples to be converted and stored without any CPU intervention.
15
MSP430G2955 MSP430G2855 MSP430G2755

Peripheral File Map Table 15. Peripherals With Word Access

MODULE ADC10 REGISTER DESCRIPTION ADC data transfer start address ADC memory ADC control register 1 ADC control register 0 Timer0_B3 Capture/compare register Capture/compare register Capture/compare register Timer_B register Capture/compare control Capture/compare control Capture/compare control Timer_B control Timer_B interrupt vector Timer0_A3 Capture/compare register Capture/compare register Capture/compare register Timer_A register Capture/compare control Capture/compare control Capture/compare control Timer_A control Timer_A interrupt vector Timer1_A3 Capture/compare register Capture/compare register Capture/compare register Timer_A register Capture/compare control Capture/compare control Capture/compare control Timer_A control Timer_A interrupt vector Flash Memory Flash control 3 Flash control 2 Flash control 1 Watchdog Timer+ Watchdog/timer control REGISTER NAME ADC10SA ADC10MEM ADC10CTL1 ADC10CTL0 TB0CCR2 TB0CCR1 TB0CCR0 TB0R TB0CCTL2 TB0CCTL1 TB0CCTL0 TB0CTL TB0IV TA0CCR2 TA0CCR1 TA0CCR0 TA0R TA0CCTL2 TA0CCTL1 TA0CCTL0 TA0CTL TA0IV TA1CCR2 TA1CCR1 TA1CCR0 TA1R TA1CCTL2 TA1CCTL1 TA1CCTL0 TA1CTL TA1IV FCTL3 FCTL2 FCTL1 WDTCTL OFFSET 1BCh 1B4h 1B2h 1B0h 0196h 0194h 0192h 0190h 0186h 0184h 0182h 0180h 011Eh 0176h 0174h 0172h 0170h 0166h 0164h 0162h 0160h 012Eh 0156h 0154h 0152h 0150h 0146h 0144h 0142h 0140h 011Ch 012Ch 012Ah 0128h 0120h
16
MSP430G2955 MSP430G2855 MSP430G2755

Table 16. Peripherals With Byte Access

MODULE USCI_B0 REGISTER DESCRIPTION USCI_B0 transmit buffer USCI_B0 receive buffer USCI_B0 status USCI B0 I2C Interrupt enable USCI_B0 bit rate control 1 USCI_B0 bit rate control 0 USCI_B0 control 1 USCI_B0 control 0 USCI_B0 I2C slave address USCI_B0 I2C own address USCI_A0 USCI_A0 transmit buffer USCI_A0 receive buffer USCI_A0 status USCI_A0 modulation control USCI_A0 baud rate control 1 USCI_A0 baud rate control 0 USCI_A0 control 1 USCI_A0 control 0 USCI_A0 IrDA receive control USCI_A0 IrDA transmit control USCI_A0 auto baud rate control ADC10 ADC analog enable 0 ADC analog enable 1 ADC data transfer control register 1 ADC data transfer control register 0 Comparator_A+ Comparator_A+ port disable Comparator_A+ control 2 Comparator_A+ control 1 Basic Clock System+ Basic clock system control 3 Basic clock system control 2 Basic clock system control 1 DCO clock frequency control Port P4 Port P4 selection 2 Port P4 resistor enable Port P4 selection Port P4 direction Port P4 output Port P4 input Port P3 Port P3 selection 2 Port P3 resistor enable Port P3 selection Port P3 direction Port P3 output Port P3 input REGISTER NAME UCB0TXBUF UCB0RXBUF UCB0STAT UCB0CIE UCB0BR1 UCB0BR0 UCB0CTL1 UCB0CTL0 UCB0SA UCB0OA UCA0TXBUF UCA0RXBUF UCA0STAT UCA0MCTL UCA0BR1 UCA0BR0 UCA0CTL1 UCA0CTL0 UCA0IRRCTL UCA0IRTCTL UCA0ABCTL ADC10AE0 ADC10AE1 ADC10DTC1 ADC10DTC0 CAPD CACTL2 CACTL1 BCSCTL3 BCSCTL2 BCSCTL1 DCOCTL P4SEL2 P4REN P4SEL P4DIR P4OUT P4IN P3SEL2 P3REN P3SEL P3DIR P3OUT P3IN OFFSET 06Fh 06Eh 06Dh 06Ch 06Bh 06Ah 069h 068h 011Ah 0118h 067h 066h 065h 064h 063h 062h 061h 060h 05Fh 05Eh 05Dh 04Ah 04Bh 049h 048h 05Bh 05Ah 059h 053h 058h 057h 056h 044h 011h 01Fh 01Eh 01Dh 01Ch 043h 010h 01Bh 01Ah 019h 018h
17
MSP430G2955 MSP430G2855 MSP430G2755

Table 16. Peripherals With Byte Access (continued)

MODULE Port P2 REGISTER DESCRIPTION Port P2 selection 2 Port P2 resistor enable Port P2 selection Port P2 interrupt enable Port P2 interrupt edge select Port P2 interrupt flag Port P2 direction Port P2 output Port P2 input Port P1 Port P1 selection 2 Port P1 resistor enable Port P1 selection Port P1 interrupt enable Port P1 interrupt edge select Port P1 interrupt flag Port P1 direction Port P1 output Port P1 input Special Function SFR interrupt flag 2 SFR interrupt flag 1 SFR interrupt enable 2 SFR interrupt enable 1 REGISTER NAME P2SEL2 P2REN P2SEL P2IE P2IES P2IFG P2DIR P2OUT P2IN P1SEL2 P1REN P1SEL P1IE P1IES P1IFG P1DIR P1OUT P1IN IFG2 IFG1 IE2 IE1 OFFSET 042h 02Fh 02Eh 02Dh 02Ch 02Bh 02Ah 029h 028h 041h 027h 026h 025h 024h 023h 022h 021h 020h 003h 002h 001h 000h
18
MSP430G2955 MSP430G2855 MSP430G2755

Absolute Maximum Ratings (1)

Voltage applied at VCC to VSS Voltage applied to any pin (2) Diode current at any device pin Storage temperature range, Tstg (3) (1) (2) (3) Unprogrammed device Programmed device 0.3 V to 4.1 V 0.3 V to VCC + 0.3 V 2 mA 55C to 150C 55C to 150C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is applied to the TEST pin when blowing the JTAG fuse. Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
Recommended Operating Conditions

Typical values are specified at VCC = 3.3 V and TA = 25C (unless otherwise noted)
MIN VCC VSS TA Supply voltage Supply voltage Operating free-air temperature VCC = 1.8 V, Duty cycle = 50% 10% fSYSTEM Processor frequency (maximum MCLK frequency using the USART module) (1) (2) VCC = 2.7 V, Duty cycle = 50% 10% VCC = 3.3 V, Duty cycle = 50% 10% (1) (2) -40 dc dc dc During program execution During flash programming or erase 1.8 2.2 0 85 6 12 16 MHz NOM MAX 3.6 3.6 UNIT V V C
The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse duration of the specified maximum frequency. Modules might have a different maximum input clock specification. See the specification of the respective module in this data sheet.
Legend : 16 MHz
System Frequency - MHz
Supply voltage range , during flash memory programming 12 MHz Supply voltage range , during program execution 6 MHz
1.8 V
2.7 V 2.2 V Supply Voltage - V
3.3 V 3.6 V
Note:
Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum VCC of 2.2 V.
Figure 1. Safe Operating Area
19
MSP430G2955 MSP430G2855 MSP430G2755

Electrical Characteristics Active Mode Supply Current Into VCC Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) (2)
PARAMETER TEST CONDITIONS fDCO = fMCLK = fSMCLK = 1 MHz, fACLK = 0 Hz, Program executes in flash, BCSCTL1 = CALBC1_1MHZ, DCOCTL = CALDCO_1MHZ, CPUOFF = 0, SCG0 = 0, SCG1 = 0, OSCOFF = 0 TA VCC 2.2 V MIN TYP 250 A MAX UNIT
IAM,1MHz
Active mode (AM) current at 1 MHz
3V
350
450
(1) (2)
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current. The currents are characterized with a Micro Crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF. The internal and external load capacitance is chosen to closely match the required 9 pF.
Typical Characteristics, Active Mode Supply Current (Into VCC)

5.0 4.0
4.0 Active Mode Current mA
f DCO = 16 MHz Active Mode Current mA 3.0
TA = 85 C TA = 25 C
3.0 f DCO = 12 MHz 2.0
2.0
VCC = 3 V TA = 85 C TA = 25 C
1.0
f DCO = 8 MHz f DCO = 1 MHz
1.0 VCC = 2.2 V 0.0 0.0
0.0 1.5
2.0
2.5
3.0
3.5
4.0
4.0
8.0
12.0
16.0
VCC Supply Voltage V Figure 2. Active Mode Current vs VCC, TA = 25C
f DCO DCO Frequency MHz Figure 3. Active Mode Current vs DCO Frequency
20
MSP430G2955 MSP430G2855 MSP430G2755

Low-Power Mode Supply Currents (Into VCC) Excluding External Current

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER TEST CONDITIONS fMCLK = 0 MHz, fSMCLK = fDCO = 1 MHz, fACLK = 32768 Hz, BCSCTL1 = CALBC1_1MHZ, DCOCTL = CALDCO_1MHZ, CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 fMCLK = fSMCLK = 0 MHz, fDCO = 1 MHz, fACLK = 32768 Hz, BCSCTL1 = CALBC1_1MHZ, DCOCTL = CALDCO_1MHZ, CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 fDCO = fMCLK = fSMCLK = 0 MHz, fACLK = 32768 Hz, CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 fDCO = fMCLK = fSMCLK = 0 MHz, fACLK from internal LF oscillator (VLO), CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 fDCO = fMCLK = fSMCLK = 0 MHz, fACLK = 0 Hz, CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 TA VCC MIN
(2)
TYP
MAX
UNIT
ILPM0,1MHz
Low-power mode 0 (LPM0) current (3)
25C
2.2 V
56
ILPM2
25C
2.2 V
22
ILPM3,LFXT1
25C
2.2 V
1.0
1.5
ILPM3,VLO
Low-power mode 3 current, (LPM3) (4)
25C 25C 85C
2.2 V 2.2 V 2.2 V
0.5 0.1 1.6
0.7 0.5 2.5
ILPM4
(1) (2) (3) (4) (5)
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current. The currents are characterized with a Micro Crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF. The internal and external load capacitance is chosen to closely match the required 9 pF. Current for brownout and WDT clocked by SMCLK included. Current for brownout and WDT clocked by ACLK included. Current for brownout included.
Typical Characteristics, Low-Power Mode Supply Currents

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
2.0 ILPM4 Lowpower mode current A 1.8 ILPM3 Lowpower mode current A 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 40.0 20.0 0.0 VCC = 1.8 V VCC = 3.6 V VCC = 3 V VCC = 2.2 V 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 40.0 20.0 0.0
VCC = 1.8 V
VCC = 3.6 V VCC = 3 V VCC = 2.2 V
20.0 40.0 60.0 80.0 100.0 120.0
20.0 40.0 60.0 80.0 100.0 120.0
TA Temperature C Figure 4. LPM3 Current vs Temperature
TA Temperature C
Figure 5. LPM4 Current vs Temperature
21
MSP430G2955 MSP430G2855 MSP430G2755

Schmitt-Trigger Inputs, Ports Px

PARAMETER VIT+ VIT Vhys RPull CI Positive-going input threshold voltage Negative-going input threshold voltage Input voltage hysteresis (VIT+ VIT) Pullup or pulldown resistor Input capacitance For pullup: VIN = VSS For pulldown: VIN = VCC VIN = VSS or VCC TEST CONDITIONS VCC 3V 3V 3V 3V MIN 0.45 VCC 1.35 0.25 VCC 0.75 0.3 20 35 5 TYP MAX 0.75 VCC 2.25 0.55 VCC 1.65 1 50 UNIT V V V k pF
Leakage Current, Ports Px

PARAMETER Ilkg(Px.y) (1) (2) High-impedance leakage current
(1) (2)
TEST CONDITIONS
VCC 3V
MIN
MAX 50
UNIT nA
The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted. The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup/pulldown resistor is disabled.
Outputs, Ports Px
PARAMETER VOH VOL (1) High-level output voltage Low-level output voltage TEST CONDITIONS I(OHmax) = 6 mA (1) I(OLmax) = 6 mA (1) VCC 3V 3V MIN TYP VCC 0.3 VSS + 0.3 MAX UNIT V V
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed 48 mA to hold the maximum voltage drop specified.
Output Frequency, Ports Px

PARAMETER fPx.y fPort_CLK (1) (2) Port output frequency (with load) Clock output frequency TEST CONDITIONS Px.y, CL = 20 pF, RL = 1 k Px.y, CL = 20 pF (2)
(1) (2)
VCC 3V 3V
MIN
TYP 12 16
MAX
UNIT MHz MHz
A resistive divider with two 0.5-k resistors between VCC and VSS is used as load. The output is connected to the center tap of the divider. The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
22
MSP430G2955 MSP430G2855 MSP430G2755

Typical Characteristics, Outputs

TYPICAL LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE
30 I OL Typical Low-Level Output Current mA I OL Typical Low-Level Output Current mA VCC = 2.2 V P1.7 25 TA = 85C TA = 25C 50 VCC = 3 V P1.7 40 TA = 85C 30 TA = 25C
TYPICAL LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE
20
15
20
10
10
0 0 0.5 1 1.5 2 2.5 VOL Low-Level Output Voltage V Figure 6.
0 0 0.5 1 1.5 2 2.5 3 3.5 VOL Low-Level Output Voltage V Figure 7.
TYPICAL HIGH-LEVEL OUTPUT CURRENT vs HIGH-LEVEL OUTPUT VOLTAGE

0 I OH Typical High-Level Output Current mA I OH Typical High-Level Output Current mA VCC = 2.2 V P1.7 5 0
TYPICAL HIGH-LEVEL OUTPUT CURRENT vs HIGH-LEVEL OUTPUT VOLTAGE

VCC = 3 V P1.7 10
10
20
15 TA = 85C 20
30 TA = 85C 40 TA = 25C 50 0 0.5 1 1.5 2 2.5 3 3.5
25 0
TA = 25C 0.5 1 1.5 2 2.5 VOH High-Level Output Voltage V Figure 8.
VOH High-Level Output Voltage V Figure 9.
23
MSP430G2955 MSP430G2855 MSP430G2755

Pin-Oscillator Frequency Ports Px

PARAMETER foP1.x foP2.x foP2.6/7 foP3.x foP4.x (1) (2) Port output oscillation frequency Port output oscillation frequency Port output oscillation frequency Port output oscillation frequency Port output oscillation frequency TEST CONDITIONS P1.y, CL = 10 pF, RL = 100 k
(1) (2)
VCC 3V 3V 3V 3V 3V
MIN
TYP 1400 900 1800 1000 700 1800 1000 1800 1000
MAX
UNIT kHz kHz kHz kHz kHz
P1.y, CL = 20 pF, RL = 100 k (1) (2) P2.0 to P2.5, CL = 10 pF, RL = 100 k (1) (2) P2.0 to P2.5, CL = 20 pF, RL = 100 k (1) (2) P2.6 and P2.7, CL = 20 pF, RL = 100 k (1) (2) P3.y, CL = 10 pF, RL = 100 k (1) (2) P3.y, CL = 20 pF, RL = 100 k (1) (2) P4.y, CL = 10 pF, RL = 100 k (1) (2) P4.y, CL = 20 pF, RL = 100 k (1) (2)
A resistive divider with two 50-k resistors between VCC and VSS is used as load. The output is connected to the center tap of the divider. The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
Typical Characteristics, Pin-Oscillator Frequency

TYPICAL OSCILLATING FREQUENCY vs LOAD CAPACITANCE
1.50 fosc Typical Oscillation Frequency MHz 1.35 1.20 1.05 0.90 0.75 0.60 0.45 0.30 0.15 0.00 10 50 100 CLOAD External Capacitance pF P1.y P2.0 to P2.5 P2.6 and P2.7 fosc Typical Oscillation Frequency MHz VCC = 3.0 V 1.50 1.35 1.20 1.05 0.90 0.75 0.60 0.45 0.30 0.15 0.00 10 50 100 CLOAD External Capacitance pF P1.y P2.0 to P2.5 P2.6 and P2.7 VCC = 2.2 V
TYPICAL OSCILLATING FREQUENCY vs LOAD CAPACITANCE
A. One output active at a time. Figure 10.
A. One output active at a time. Figure 11.
24
MSP430G2955 MSP430G2855 MSP430G2755

POR and BOR (1) (2)

PARAMETER VCC(start) V(B_IT-) Vhys(B_IT-) td(BOR) t(reset) (1) (2) See Figure 12 See Figure 12 through Figure 14 See Figure 12 See Figure 12 Pulse duration needed at RST/NMI pin to accepted reset internally 2.2 V 2 TEST CONDITIONS dVCC/dt 3 V/s dVCC/dt 3 V/s dVCC/dt 3 V/s VCC MIN TYP 0.7 V(B_IT-) 1.35 140 2000 MAX UNIT V V mV s s
The current consumption of the brownout module is already included in the ICC current consumption data. The voltage level V(B_IT-) + Vhys(B_IT-)is 1.8 V. During power up, the CPU begins code execution following a period of td(BOR) after VCC = V(B_IT-) + Vhys(B_IT-). The default DCO settings must not be changed until VCC VCC(min), where VCC(min) is the minimum supply voltage for the desired operating frequency.
VCC Vhys(B_IT) V(B_IT) VCC(start)
0 t d(BOR)
Figure 12. POR and BOR vs Supply Voltage
25
MSP430G2955 MSP430G2855 MSP430G2755

Typical Characteristics, POR and BOR

2 VCC = 3 V Typical Conditions VCC(drop) V 1.5 1 0.5 0 0.001 VCC(drop) VCC 3V t pw
1 1000 1 ns 1 ns t pw Pulse Width s t pw Pulse Width s Figure 13. VCC(drop) Level With a Square Voltage Drop to Generate a POR and BOR Signal VCC t pw
2 VCC = 3 V VCC(drop) V 1.5 1 Typical Conditions
3V
VCC(drop) 0.5 0 0.001 t f = tr 1 1000 tf tr
t pw Pulse Width s t pw Pulse Width s Figure 14. VCC(drop) Level With a Triangle Voltage Drop to Generate a POR and BOR Signal
26
MSP430G2955 MSP430G2855 MSP430G2755

DCO Frequency
PARAMETER RSELx < 14 VCC fDCO(0,0) fDCO(0,3) fDCO(1,3) fDCO(2,3) fDCO(3,3) fDCO(4,3) fDCO(5,3) fDCO(6,3) fDCO(7,3) fDCO(8,3) fDCO(9,3) fDCO(10,3) fDCO(11,3) fDCO(12,3) fDCO(13,3) fDCO(14,3) fDCO(15,3) fDCO(15,7) SRSEL SDCO Supply voltage DCO frequency (0, 0) DCO frequency (0, 3) DCO frequency (1, 3) DCO frequency (2, 3) DCO frequency (3, 3) DCO frequency (4, 3) DCO frequency (5, 3) DCO frequency (6, 3) DCO frequency (7, 3) DCO frequency (8, 3) DCO frequency (9, 3) DCO frequency (10, 3) DCO frequency (11, 3) DCO frequency (12, 3) DCO frequency (13, 3) DCO frequency (14, 3) DCO frequency (15, 3) DCO frequency (15, 7) Frequency step between range RSEL and RSEL+1 Frequency step between tap DCO and DCO+1 Duty cycle RSELx = 14 RSELx = 15 RSELx = 0, DCOx = 0, MODx = 0 RSELx = 0, DCOx = 3, MODx = 0 RSELx = 1, DCOx = 3, MODx = 0 RSELx = 2, DCOx = 3, MODx = 0 RSELx = 3, DCOx = 3, MODx = 0 RSELx = 4, DCOx = 3, MODx = 0 RSELx = 5, DCOx = 3, MODx = 0 RSELx = 6, DCOx = 3, MODx = 0 RSELx = 7, DCOx = 3, MODx = 0 RSELx = 8, DCOx = 3, MODx = 0 RSELx = 9, DCOx = 3, MODx = 0 RSELx = 10, DCOx = 3, MODx = 0 RSELx = 11, DCOx = 3, MODx = 0 RSELx = 12, DCOx = 3, MODx = 0 RSELx = 13, DCOx = 3, MODx = 0 RSELx = 14, DCOx = 3, MODx = 0 RSELx = 15, DCOx = 3, MODx = 0 RSELx = 15, DCOx = 7, MODx = 0 SRSEL = fDCO(RSEL+1,DCO)/fDCO(RSEL,DCO) SDCO = fDCO(RSEL,DCO+1)/fDCO(RSEL,DCO) Measured at SMCLK output 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 3V 4.30 6.00 8.60 12.0 16.0 1.35 1.08 50 7.8 0.54 0.80 1.6 2.3 3.4 4.25 7.30 9.60 13.9 18.5 26.0 TEST CONDITIONS VCC MIN 1.8 2.2 3 0.06 0.07 0.15 0.21 0.30 0.41 0.58 1.06 1.50 TYP MAX 3.6 3.6 3.6 0.14 0.17 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz ratio ratio % V UNIT
27
MSP430G2955 MSP430G2855 MSP430G2755

Calibrated DCO Frequencies, Tolerance

PARAMETER 1-MHz tolerance over temperature (1) 1-MHz tolerance over VCC TEST CONDITIONS BCSCTL1 = CALBC1_1MHZ, DCOCTL = CALDCO_1MHZ, calibrated at 30C and 3 V BCSCTL1 = CALBC1_1MHZ, DCOCTL = CALDCO_1MHZ, calibrated at 30C and 3 V BCSCTL1 = CALBC1_1MHZ, DCOCTL = CALDCO_1MHZ, calibrated at 30C and 3 V BCSCTL1 = CALBC1_8MHZ, DCOCTL = CALDCO_8MHZ, calibrated at 30C and 3 V BCSCTL1 = CALBC1_8MHZ, DCOCTL = CALDCO_8MHZ, calibrated at 30C and 3 V BCSCTL1 = CALBC1_8MHZ, DCOCTL = CALDCO_8MHZ, calibrated at 30C and 3 V BCSCTL1 = CALBC1_12MHZ, DCOCTL = CALDCO_12MHZ, calibrated at 30C and 3 V BCSCTL1 = CALBC1_12MHZ, DCOCTL = CALDCO_12MHZ, calibrated at 30C and 3 V BCSCTL1 = CALBC1_12MHZ, DCOCTL = CALDCO_12MHZ, calibrated at 30C and 3 V BCSCTL1 = CALBC1_16MHZ, DCOCTL = CALDCO_16MHZ, calibrated at 30C and 3 V BCSCTL1 = CALBC1_16MHZ, DCOCTL = CALDCO_16MHZ, calibrated at 30C and 3 V BCSCTL1 = CALBC1_16MHZ, DCOCTL = CALDCO_16MHZ, calibrated at 30C and 3 V TA 0C to 85C VCC 3V MIN -3 TYP 0.5 MAX 3 UNIT %
30C
1.8 V to 3.6 V
-3
1-MHz tolerance overall 8-MHz tolerance over temperature (1) 8-MHz tolerance over VCC
-40C to 85C
1.8 V to 3.6 V
-6
0C to 85C
3V
-3
0.5
30C
2.2 V to 3.6 V
-3
-40C to 85C
2.2 V to 3.6 V
-6
0C to 85C
3V
-3
0.5
30C
2.7 V to 3.6 V
-3
-40C to 85C
2.7 V to 3.6 V
-6
0C to 85C
3V
-3
0.5
30C
3.3 V to 3.6 V
-3
16-MHz tolerance overall (1)
-40C to 85C
3.3 V to 3.6 V
-6
This is the frequency change from the measured frequency at 30C over temperature.
28
MSP430G2955 MSP430G2855 MSP430G2755

Wake-Up From Lower-Power Modes (LPM3, LPM4)

PARAMETER tDCO,LPM3/4 tCPU,LPM3/4 (1) (2) DCO clock wake-up time from LPM3 or LPM4 (1) CPU wake-up time from LPM3 or LPM4 (2) TEST CONDITIONS BCSCTL1 = CALBC1_1MHZ, DCOCTL = CALDCO_1MHZ VCC 3V MIN TYP 1.5 1/fMCLK + tClock,LPM3/4 MAX UNIT s
The DCO clock wake-up time is measured from the edge of an external wake-up signal (for example, a port interrupt) to the first clock edge observable externally on a clock pin (MCLK or SMCLK). Parameter applicable only if DCOCLK is used for MCLK.
Typical Characteristics, DCO Clock Wake-Up Time From LPM3 or LPM4
10.00 DCO Wake Time s
RSELx = 0...11 1.00 RSELx = 12...15
0.10 0.10
1.00
10.00
DCO Frequency MHz Figure 15. DCO Wake-Up Time From LPM3 vs DCO Frequency
29
MSP430G2955 MSP430G2855 MSP430G2755

DCO With External Resistor ROSC (1)

PARAMETER fDCO,ROSC DT DV (1) DCO output frequency with ROSC Temperature drift Drift with VCC TEST CONDITIONS DCOR = 1, RSELx = 4, DCOx = 3, MODx = 0, TA = 25C DCOR = 1, RSELx = 4, DCOx = 3, MODx = 0 DCOR = 1, RSELx = 4, DCOx = 3, MODx = 0 VCC 3V 3V 3V MIN TYP 1.95 0.1 10 MAX UNIT MHz %/C %/V
ROSC = 100 k. Metal film resistor, type 0257, 0.6 W with 1% tolerance and TK = 50 ppm/C.
Typical Characteristics - DCO With External Resistor ROSC

DCO FREQUENCY vs ROSC VCC = 2.2 V, TA = 25C
10.00 10.00
DCO FREQUENCY vs ROSC VCC = 3 V, TA = 25C
DCO Frequency MHz
1.00
DCO Frequency MHz
1.00
0.10 RSELx = 4
0.10 RSELx = 4
0.01 10.00
100.00
1000.00
10000.00
0.01 10.00
100.00
1000.00
10000.00
ROSC External Resistor kW Figure 16.
ROSC External Resistor kW Figure 17.
DCO FREQUENCY vs TEMPERATURE VCC = 3 V

2.50 2.25 DCO Frequency MHz 2.00 1.75 DCO Frequency MHz 1.50 1.25 1.00 0.75 0.50 0.25 0.00 50.0 25.0 0.0 25.0 ROSC = 1M ROSC = 270k ROSC = 100k 2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 100.0 0.00 2.0 2.5
DCO FREQUENCY vs SUPPLY VOLTAGE TA = 25C
ROSC = 100k
ROSC = 270k
ROSC = 1M
50.0
75.0
3.0
3.5
4.0
TA Temperature C Figure 18.
VCC Supply Voltage V Figure 19.
30
MSP430G2955 MSP430G2855 MSP430G2755

Crystal Oscillator, XT1, Low-Frequency Mode (1)

PARAMETER fLFXT1,LF fLFXT1,LF,logic LFXT1 oscillator crystal frequency, LF mode 0 or 1 TEST CONDITIONS XTS = 0, LFXT1Sx = 0 or 1 VCC 1.8 V to 3.6 V 1.8 V to 3.6 V 10000 MIN TYP 32768 32768 500 k 200 1 5.5 8.5 11 2.2 V 2.2 V 30 10 50 70 10000 % Hz pF 50000 MAX UNIT Hz Hz
LFXT1 oscillator logic level square wave input frequency, XTS = 0, XCAPx = 0, LFXT1Sx = 3 LF mode Oscillation allowance for LF crystals XTS = 0, LFXT1Sx = 0, fLFXT1,LF = 32768 Hz, CL,eff = 6 pF XTS = 0, LFXT1Sx = 0, fLFXT1,LF = 32768 Hz, CL,eff = 12 pF XTS = 0, XCAPx = 0 XTS = 0, XCAPx = 1 XTS = 0, XCAPx = 2 XTS = 0, XCAPx = 3 Duty cycle, LF mode XTS = 0, Measured at P2.0/ACLK, fLFXT1,LF = 32768 Hz XTS = 0, XCAPx = 0, LFXT1Sx = 3 (4)
OALF
CL,eff
Integrated effective load capacitance, LF mode (2)
fFault,LF (1)
Oscillator fault frequency, LF mode (3)
(2)
(3) (4)
To improve EMI on the XT1 oscillator, the following guidelines should be observed. (a) Keep the trace between the device and the crystal as short as possible. (b) Design a good ground plane around the oscillator pins. (c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT. (d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins. (e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins. (f) If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins. (g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This signal is no longer required for the serial programming adapter. Includes parasitic bond and package capacitance (approximately 2 pF per pin). Because the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the used crystal. Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag. Frequencies in between might set the flag. Measured with logic-level input frequency but also applies to operation with crystals.
Internal Very-Low-Power Low-Frequency Oscillator (VLO)

PARAMETER fVLO dfVLO/dT VLO frequency VLO frequency temperature drift TA -40C to 85C -40C to 85C 25C VCC 3V 3V 1.8 V to 3.6 V MIN 4 TYP 12 0.5 4 MAX 20 UNIT kHz %/C %/V
dfVLO/dVCC VLO frequency supply voltage drift
31
MSP430G2955 MSP430G2855 MSP430G2755

Crystal Oscillator LFXT1, High-Frequency Mode (1)

PARAMETER fLFXT1,HF0 fLFXT1,HF1 LFXT1 oscillator crystal frequency, HF mode 0 LFXT1 oscillator crystal frequency, HF mode 1 LFXT1 oscillator crystal frequency, HF mode 2 LFXT1 oscillator logic-level square-wave input frequency, HF mode TEST CONDITIONS XTS = 1, LFXT1Sx = 0 XTS = 1, LFXT1Sx = 1 VCC 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V fLFXT1,HF2 XTS = 1, LFXT1Sx = 2 2.2 V to 3.6 V 3 V to 3.6 V 1.8 V to 3.6 V XTS = 1, LFXT1Sx = 3 XTS = 1, LFXT1Sx = 0, fLFXT1,HF = 1 MHz, CL,eff = 15 pF OAHF Oscillation allowance for HF crystals (see Figure 20 and Figure 21) XTS = 1, LFXT1Sx = 1, fLFXT1,HF = 4 MHz, CL,eff = 15 pF XTS = 1, LFXT1Sx = 2, fLFXT1,HF = 16 MHz, CL,eff = 15 pF CL,eff Integrated effective load capacitance, HF mode (2) XTS = 1 (3) XTS = 1, Measured at P2.0/ACLK, fLFXT1,HF = 10 MHz XTS = 1, Measured at P2.0/ACLK, fLFXT1,HF = 16 MHz XTS = 1, LFXT1Sx = 3 (5) 40 2.2 V, 3 V 40 2.2 V, 3 V 30 50 60 300 kHz 2.2 V to 3.6 V 3 V to 3.6 V fLFXT1,HF,logic MIN 0.4 1 2 2 2 0.4 0.4 0.4 2700 TYP MAX 1 4 10 12 16 10 12 16 MHz MHz UNIT MHz MHz
800
300 1 50 60 % pF
Duty cycle, HF mode
fFault,HF (1)
Oscillator fault frequency (4)
(2) (3) (4) (5)
To improve EMI on the XT1 oscillator the following guidelines should be observed: (a) Keep the trace between the device and the crystal as short as possible. (b) Design a good ground plane around the oscillator pins. (c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT. (d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins. (e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins. (f) If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins. (g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This signal is no longer required for the serial programming adapter. Includes parasitic bond and package capacitance (approximately 2 pF per pin). Because the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the used crystal. Requires external capacitors at both terminals. Values are specified by crystal manufacturers. Frequencies below the MIN specification set the fault flag, frequencies above the MAX specification do not set the fault flag, and frequencies in between might set the flag. Measured with logic-level input frequency, but also applies to operation with crystals.
32
MSP430G2955 MSP430G2855 MSP430G2755

Typical Characteristics - LFXT1 Oscillator in HF Mode (XTS = 1)

OSCILLATION ALLOWANCE vs CRYSTAL FREQUENCY CL,eff = 15 pF, TA = 25C
100000.00 800.0 LFXT1Sx = 3 700.0 10000.00 XT Oscillator Supply Current uA Oscillation Allowance Ohms 600.0 500.0 400.0 300.0 200.0 100.0 LFXT1Sx = 1 10.00 0.10 1.00 10.00 100.00 0.0 0.0 4.0 8.0 12.0 16.0 20.0 LFXT1Sx = 2
OSCILLATOR SUPPLY CURRENT vs CRYSTAL FREQUENCY CL,eff = 15 pF, TA = 25C
1000.00 LFXT1Sx = 3 100.00 LFXT1Sx = 1 LFXT1Sx = 2
Crystal Frequency MHz
Figure 20.
Crystal Frequency MHz Figure 21.
Timer_A, Timer_B
PARAMETER fTA/B tTA/B,cap Timer_A or Timer_B input clock frequency Timer_A or Timer_B capture timing TEST CONDITIONS SMCLK, duty cycle = 50% 10% TA0, TA1, TB0 3V 20 VCC MIN TYP fSYSTEM MAX UNIT MHz ns
33
MSP430G2955 MSP430G2855 MSP430G2755

USCI (UART Mode)

PARAMETER fUSCI fmax,BITCLK t (1) (2) USCI input clock frequency Maximum BITCLK clock frequency (equals baudrate in MBaud) (1) UART receive deglitch time (2) TEST CONDITIONS SMCLK, duty cycle = 50% 10% 3V 3V 2 50 100 600 VCC MIN TYP fSYSTEM MAX UNIT MHz MHz ns
The DCO wake-up time must be considered in LPM3 and LPM4 for baud rates above 1 MHz. Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are correctly recognized, their duration should exceed the maximum specification of the deglitch time.
USCI (SPI Master Mode)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 22 and Figure 23)
PARAMETER fUSCI tSU,MI tHD,MI tVALID,MO USCI input clock frequency SOMI input data setup time SOMI input data hold time SIMO output data valid time UCLK edge to SIMO valid, CL = 20 pF
1/fUCxCLK CKPL = 0 UCLK CKPL = 1 tLO/HI tLO/HI tSU,MI tHD,MI SOMI tHD,MO tVALID,MO SIMO
TEST CONDITIONS SMCLK, duty cycle = 50% 10%
VCC 3V 3V 3V
MIN 75 0
TYP
MAX fSYSTEM
UNIT MHz ns ns
20
ns
Figure 22. SPI Master Mode, CKPH = 0

1/fUCxCLK CKPL = 0 UCLK CKPL = 1 tLO/HI tLO/HI tSU,MI SOMI tHD,MO tVALID,MO SIMO
tHD,MI
Figure 23. SPI Master Mode, CKPH = 1

34 Submit Documentation Feedback
MSP430G2955 MSP430G2855 MSP430G2755

USCI (SPI Slave Mode)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 24 and Figure 25)
PARAMETER tSTE,LEAD tSTE,LAG tSTE,ACC tSTE,DIS tSU,SI tHD,SI tVALID,SO STE lead time, STE low to clock STE lag time, Last clock to STE high STE access time, STE low to SOMI data out STE disable time, STE high to SOMI high impedance SIMO input data setup time SIMO input data hold time SOMI output data valid time
tSTE,LEAD STE 1/fUCxCLK CKPL = 0 UCLK CKPL = 1 tLO/HI tLO/HI tSU,SI tHD,SI SIMO tHD,SO tVALID,SO
TEST CONDITIONS
VCC 3V 3V 3V 3V 3V 3V
MIN 10
TYP 50 50 50
MAX
UNIT ns ns ns ns ns ns
15 10 50 75
UCLK edge to SOMI valid, CL = 20 pF
3V
tSTE,LAG
ns
tSTE,ACC SOMI
tSTE,DIS
Figure 24. SPI Slave Mode, CKPH = 0

tSTE,LEAD STE 1/fUCxCLK CKPL = 0 UCLK CKPL = 1 tLO/HI tLO/HI tHD,SI tSU,SI SIMO tSTE,LAG
tSTE,ACC SOMI
tHD,MO tVALID,SO
tSTE,DIS
Figure 25. SPI Slave Mode, CKPH = 1
35
MSP430G2955 MSP430G2855 MSP430G2755

USCI (I2C Mode)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 26)
PARAMETER fUSCI fSCL tHD,STA tSU,STA tHD,DAT tSU,DAT tSU,STO tSP USCI input clock frequency SCL clock frequency Hold time (repeated) START Setup time for a repeated START Data hold time Data setup time Setup time for STOP Pulse duration of spikes suppressed by input filter
tHD,STA SDA tLOW SCL tHIGH tSP tSU,STA tHD,STA
TEST CONDITIONS SMCLK, duty cycle = 50% 10%
VCC 3V
MIN 0 4.0 0.6 4.7 0.6 0 250 4.0 50
TYP
MAX fSYSTEM 400
UNIT MHz kHz s s ns ns s
fSCL 100 kHz fSCL > 100 kHz fSCL 100 kHz fSCL > 100 kHz
3V 3V 3V 3V 3V 3V
100
600
ns
tBUF
tSU,DAT tHD,DAT
tSU,STO
Figure 26. I2C Mode Timing
Comparator_A+
PARAMETER I(DD) I(Refladder/
RefDiode)
TEST CONDITIONS CAON = 1, CARSEL = 0, CAREF = 0 CAON = 1, CARSEL = 0, CAREF = 1, 2, or 3, No load at CA0 and CA1
VCC 3V 3V 3V 3V 3V 3V 3V
MIN
TYP 45 45
MAX
UNIT A A
See
(1)
V(IC) V(Ref025) V(Ref050) V(RefVT) V(offset) Vhys
Common-mode input voltage (Voltage at 0.25 VCC node) / VCC (Voltage at 0.5 VCC node) / VCC See Figure 27 and Figure 28 Offset voltage
(2)
CAON = 1 PCA0 = 1, CARSEL = 1, CAREF = 1, No load at CA0 and CA1 PCA0 = 1, CARSEL = 1, CAREF = 2, No load at CA0 and CA1 PCA0 = 1, CARSEL = 1, CAREF = 3, No load at CA0 and CA1, TA = 85C CAON = 1 TA = 25C, Overdrive 10 mV, Without filter: CAF = 0 TA = 25C, Overdrive 10 mV, With filter: CAF = 1
0 0.24 0.48 490 10 0.7 120
VCC-1
mV mV mV ns s
Input hysteresis Response time (low-to-high and high-to-low)
3V
t(response)
3V 1.5
(1) (2)
The leakage current for the Comparator_A+ terminals is identical to Ilkg(Px.y) specification. The input offset voltage can be cancelled by using the CAEX bit to invert the Comparator_A+ inputs on successive measurements. The two successive measurements are then summed together.
36
MSP430G2955 MSP430G2855 MSP430G2755

Typical Characteristics Comparator_A+

650 VCC = 3 V
V(RefVT) Reference Voltage mV
650 VCC = 2.2 V

V(RefVT) Reference Voltage mV
600 Typical 550
600 Typical 550
500
500
450
450
400 -45 -5 15 35 55 75 95 115 TA Free-Air Temperature C Figure 27. V(RefVT) vs Temperature, VCC = 3 V 100 -25
400 -45 -5 15 35 55 75 95 115 TA Free-Air Temperature C Figure 28. V(RefVT) vs Temperature, VCC = 2.2 V -25
Short Resistance kW
VCC = 1.8 V VCC = 2.2 V 10 VCC = 3 V
VCC = 3.6 V
1 0 0.2 0.4 0.6 0.8 1 VIN/VCC Normalized Input Voltage V/V Figure 29. Short Resistance vs VIN/VCC
37
MSP430G2955 MSP430G2855 MSP430G2755

10-Bit ADC, Power Supply and Input Range Conditions

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER VCC VAx Analog supply voltage Analog input voltage
(2)
TEST CONDITIONS VSS = 0 V All Ax terminals, Analog inputs selected in ADC10AE register fADC10CLK = 5.0 MHz, ADC10ON = 1, REFON = 0, ADC10SHT0 = 1, ADC10SHT1 = 0, ADC10DIV = 0 fADC10CLK = 5.0 MHz, ADC10ON = 0, REF2_5V = 0, REFON = 1, REFOUT = 0 fADC10CLK = 5.0 MHz, ADC10ON = 0, REF2_5V = 1, REFON = 1, REFOUT = 0 fADC10CLK = 5.0 MHz, ADC10ON = 0, REFON = 1, REF2_5V = 0, REFOUT = 1, ADC10SR = 0 fADC10CLK = 5.0 MHz, ADC10ON = 0, REFON = 1, REF2_5V = 0, REFOUT = 1, ADC10SR = 1 Only one terminal Ax can be selected at one time 0 V VAx VCC
TA
VCC
MIN 2.2
TYP
MAX 3.6 VCC
UNIT V V
3V
IADC10
ADC10 supply current
(3)
25C
3V
0.6
mA
0.25 25C 3V 0.25 mA
IREF+
Reference supply current, reference buffer disabled (4)
IREFB,0
Reference buffer supply current with ADC10SR = 0 (4)
25C
3V
1.1
mA
IREFB,1
Reference buffer supply current with ADC10SR = 1 (4) Input capacitance Input MUX ON resistance
25C
3V
0.5
mA
CI RI (1) (2) (3) (4)
25C 25C
3V 3V 1000
27
pF
The leakage current is defined in the leakage current table with Px.y/Ax parameter. The analog input voltage range must be within the selected reference voltage range VR+ to VR for valid conversion results. The internal reference supply current is not included in current consumption parameter IADC10. The internal reference current is supplied via terminal VCC. Consumption is independent of the ADC10ON control bit, unless a conversion is active. The REFON bit enables the built-in reference to settle before starting an A/D conversion.
38
MSP430G2955 MSP430G2855 MSP430G2755

10-Bit ADC, Built-In Voltage Reference

PARAMETER VCC,REF+ VREF+ ILD,VREF+ Positive built-in reference analog supply voltage range Positive built-in reference voltage Maximum VREF+ load current IVREF+ = 500 A 100 A, Analog input voltage VAx 0.75 V, REF2_5V = 0 IVREF+ = 500 A 100 A, Analog input voltage VAx 1.25 V, REF2_5V = 1 IVREF+ = 100 A900 A, VAx 0.5 VREF+, Error of conversion result 1 LSB, ADC10SR = 0 IVREF+ 1 mA, REFON = 1, REFOUT = 1 IVREF+ = const with 0 mA IVREF+ 1 mA IVREF+ = 0.5 mA, REF2_5V = 0, REFON = 0 1 IVREF+ = 0.5 mA, REF2_5V = 1, REFON = 1, REFBURST = 1, ADC10SR = 0 TEST CONDITIONS IVREF+ 1 mA, REF2_5V = 0 IVREF+ 1 mA, REF2_5V = 1 IVREF+ IVREF+max, REF2_5V = 0 IVREF+ IVREF+max, REF2_5V = 1 3V 3V VCC MIN 2.2 2.9 1.41 2.35 1.5 2.5 1.59 2.65 1 2 3V 2 LSB TYP MAX UNIT V V mA
VREF+ load regulation
VREF+ load regulation response time CVREF+ TCREF+ tREFON Maximum capacitance at VREF+ pin Temperature coefficient (1) Settling time of internal reference voltage to 99.9% VREF Settling time of reference buffer to 99.9% VREF
3V
400
ns
3V 3V 3.6 V
100 100 30
pF ppm/ C s
tREFBURST (1)
3V
Calculated using the box method: (MAX(-40 to 85C) MIN(-40 to 85C)) / MIN(-40 to 85C) / (85C (40C))
39
MSP430G2955 MSP430G2855 MSP430G2755

10-Bit ADC, External Reference (1)

PARAMETER Positive external reference input voltage range (2) Negative external reference input voltage range (4) Differential external reference input voltage range, VEREF = VEREF+ VEREF TEST CONDITIONS VEREF+ > VEREF, SREF1 = 1, SREF0 = 0 VEREF VEREF+ VCC 0.15 V, SREF1 = 1, SREF0 = 1 (3) VEREF+ > VEREF VEREF+ > VEREF
(5)
VCC
MIN 1.4 1.4 0 1.4
TYP
MAX VCC
UNIT
VEREF+
V 3 1.2 VCC 1 A 3V 3V 0 1 A V V
VEREF VEREF
IVEREF+
Static input current into VEREF+
0 V VEREF+ VCC, SREF1 = 1, SREF0 = 0 0 V VEREF+ VCC 0.15 V 3 V, SREF1 = 1, SREF0 = 1 (3) 0 V VEREF VCC
3V
IVEREF (1) (2) (3) (4) (5)
Static input current into VEREF
The external reference is used during conversion to charge and discharge the capacitance array. The input capacitance, CI, is also the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the recommendations on analog-source impedance to allow the charge to settle for 10-bit accuracy. The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced accuracy requirements. Under this condition the external reference is internally buffered. The reference buffer is active and requires the reference buffer supply current IREFB. The current consumption can be limited to the sample and conversion period with REBURST = 1. The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced accuracy requirements. The accuracy limits the minimum external differential reference voltage. Lower differential reference voltage levels may be applied with reduced accuracy requirements.
10-Bit ADC, Timing Parameters

PARAMETER fADC10CLK fADC10OSC ADC10 input clock frequency ADC10 built-in oscillator frequency TEST CONDITIONS For specified performance of ADC10 linearity parameters ADC10SR = 0 ADC10SR = 1 VCC 3V 3V 3V MIN 0.45 0.45 3.7 2.06 13 ADC10DIV 1/fADC10CLK 100 TYP MAX 6.3 1.5 6.3 3.51 s UNIT MHz MHz
ADC10DIVx = 0, ADC10SSELx = 0, fADC10CLK = fADC10OSC ADC10 built-in oscillator, ADC10SSELx = 0, fADC10CLK = fADC10OSC
tCONVERT
Conversion time
fADC10CLK from ACLK, MCLK, or SMCLK: ADC10SSELx 0

(1)
tADC10ON (1)
Turn-on settling time of the ADC
ns
The condition is that the error in a conversion started after tADC10ON is less than 0.5 LSB. The reference and input signal are already settled.
10-Bit ADC, Linearity Parameters (1)

PARAMETER EI ED EO EG ET (1) Integral linearity error Differential linearity error Offset error Gain error Total unadjusted error The reference buffer's offset adds to the gain, and offset, and total unadjusted error. Source impedance RS < 100 TEST CONDITIONS VCC 3V 3V 3V 3V 3V 1.1 2 MIN TYP MAX 1 1 1 2 5 UNIT LSB LSB LSB LSB LSB
40
MSP430G2955 MSP430G2855 MSP430G2755

10-Bit ADC, Temperature Sensor and Built-In VMID

PARAMETER ISENSOR TCSENSOR tSensor(sample) IVMID VMID tVMID(sample) (1) (2) Sample time required if channel 10 is selected (3) Current into divider at channel 11 VCC divider at channel 11 Sample time required if channel 11 is selected (5) Temperature sensor supply current (1) TEST CONDITIONS REFON = 0, INCHx = 0Ah, TA = 25C ADC10ON = 1, INCHx = 0Ah
(2)
VCC 3V 3V 3V 3V 3V 3V
MIN
TYP 60 3.55
MAX
UNIT A mV/C s
ADC10ON = 1, INCHx = 0Ah, Error of conversion result 1 LSB ADC10ON = 1, INCHx = 0Bh ADC10ON = 1, INCHx = 0Bh, VMID 0.5 VCC ADC10ON = 1, INCHx = 0Bh, Error of conversion result 1 LSB
30
(4)
A V ns
1.5 1220
(3) (4) (5)
The sensor current ISENSOR is consumed if (ADC10ON = 1 and REFON = 1) or (ADC10ON = 1 and INCH = 0Ah and sample signal is high). When REFON = 1, ISENSOR is included in IREF+. When REFON = 0, ISENSOR applies during conversion of the temperature sensor input (INCH = 0Ah). The following formula can be used to calculate the temperature sensor output voltage: VSensor,typ = TCSensor (273 + T [C] ) + VOffset,sensor [mV] or VSensor,typ = TCSensor T [C] + VSensor(TA = 0C) [mV] The typical equivalent impedance of the sensor is 51 k. The sample time required includes the sensor-on time tSENSOR(on). No additional current is needed. The VMID is used during sampling. The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed.
Flash Memory
PARAMETER VCC(PGM/ERASE) fFTG IPGM IERASE tCPT tCMErase tRetention tWord tBlock, tBlock,
0
TEST CONDITIONS
VCC
MIN 2.2 257
TYP
MAX 3.6 476
UNIT V kHz mA mA ms ms cycles years tFTG tFTG tFTG tFTG tFTG tFTG
Program or erase supply voltage Flash timing generator frequency Supply current from VCC during program Supply current from VCC during erase Cumulative program time (1) Cumulative mass erase time Program and erase endurance Data retention duration Word or byte program time Block program time for first byte or word Block program time for each additional byte or word Block program end-sequence wait time Mass erase time Segment erase time TJ = 25C See See See See See See
(2) (2) (2) (2) (2) (2)
2.2 V, 3.6 V 2.2 V, 3.6 V 2.2 V, 3.6 V 2.2 V, 3.6 V 20 104 100
1 1
5 7 10
105 30 25 18 6 10593 4819
tBlock, 1-63
End
tMass Erase tSeg Erase (1) (2)
The cumulative program time must not be exceeded when writing to a 64-byte flash block. This parameter applies to all programming methods: individual word write, individual byte write, and block write modes. These values are hardwired into the Flash Controller's state machine (tFTG = 1/fFTG).
41
MSP430G2955 MSP430G2855 MSP430G2755

RAM
PARAMETER V(RAMh) (1) RAM retention supply voltage
(1)
TEST CONDITIONS CPU halted
MIN 1.6
MAX
UNIT V
This parameter defines the minimum supply voltage VCC when the data in RAM remains unchanged. No program execution should happen during this supply voltage condition.
JTAG and Spy-Bi-Wire Interface

PARAMETER fSBW tSBW,Low tSBW,En tSBW,Ret fTCK RInternal (1) (2) Spy-Bi-Wire input frequency Spy-Bi-Wire low clock pulse duration Spy-Bi-Wire enable time (TEST high to acceptance of first clock edge Spy-Bi-Wire return to normal operation time TCK input frequency (2) Internal pulldown resistance on TEST
(1)
VCC 2.2 V 2.2 V ) 2.2 V 2.2 V 2.2 V 2.2 V
MIN 0 0.025 15 0 25
TYP
MAX 20 15 1 100 5
UNIT MHz s s s MHz k
60
90
Tools accessing the Spy-Bi-Wire interface need to wait for the maximum tSBW,En time after pulling the TEST/SBWTCK pin high before applying the first SBWTCK clock edge. fTCK may be restricted to meet the timing requirements of the module selected.
JTAG Fuse (1)

PARAMETER VCC(FB) VFB IFB tFB (1) Supply voltage during fuse-blow condition Voltage level on TEST for fuse blow Supply current into TEST during fuse blow Time to blow fuse TEST CONDITIONS TA = 25C MIN 2.5 6 7 100 1 MAX UNIT V V mA ms
Once the fuse is blown, no further access to the JTAG/Test, Spy-Bi-Wire, and emulation feature is possible, and JTAG is switched to bypass mode.
42
MSP430G2955 MSP430G2855 MSP430G2755

PORT SCHEMATICS Port P1 Pin Schematic: P1.0 to P1.3, Input/Output With Schmitt Trigger
PxSEL.y PxDIR.y 0 1 Direction 0: Input 1: Output
PxSEL2.y PxSEL.y PxREN.y 1 0 1 0 PxSEL2.y PxSEL.y PxOUT.y 0 From Module 1 2 0 3 P1.0/TA0CLK/ADCCLK P1.1/TA0.0 P1.2/TA0.1 P1.3/TA0.2 1 DVSS DVCC 0 1 1
TAx.y TAxCLK
PxIN.y EN To Module D PxIE.y PxIRQ.y PxIFG.y PxSEL.y PxIES.y Interrupt Edge Select EN Q Set
43
MSP430G2955 MSP430G2855 MSP430G2755

Table 17. Port P1 (P1.0 to P1.3) Pin Functions

PIN NAME (P1.x) P1.0/ TA0CLK/ ADC10CLK Pin Osc P1.1/ TA0.0/ Pin Osc P1.2/ TA0.1/ Pin Osc P1.3/ TA0.2/ Pin Osc (1) X = don't care 3 2 1 0 x P1.x (I/O) TA0.TACLK ACLK Capacitive sensing P1.x (I/O) Timer0_A3.CCI0A Timer0_A3.TA0 Capacitive sensing P1.x (I/O) Timer0_A3.CCI1A Timer0_A3.TA1 Capacitive sensing P1.x (I/O) Timer0_A3.CCI2A Timer0_A3.TA2 Capacitive sensing FUNCTION CONTROL BITS / SIGNALS (1) P1DIR.x I: 0; O: 1 0 1 X I: 0; O: 1 0 1 X I: 0; O: 1 0 1 X I: 0; O: 1 0 1 X P1SEL.x 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 P1SEL2.x 0 0 0 1 0 0 0 1 0 0 0 1 0 0 0 1
44
MSP430G2955 MSP430G2855 MSP430G2755

Port P1 Pin Schematic: P1.4 to P1.7, Input/Output With Schmitt Trigger

PxSEL2.y PxSEL.y PxDIR.y From Module
0 1 2 3 Direction 0: Input 1: Output
From Module PxSEL2.y PxSEL.y PxREN.y
0 1 0 1 DVSS DVCC 0 1 1
PxSEL2.y PxSEL.y
PxOUT.y From Module
0 1 2 3
0 TAx.y TAxCLK PxIN.y
P1.4/SMCLK/TCK P1.5/TA0.0/TMS P1.6/TA0.1/TDI/TCLK P1.7/TA0.2/TDO/TDI
EN To Module D PxIE.y PxIRQ.y PxIFG.y PxSEL.y PxIES.y From JTAG To JTAG * Note: MSP430G2x53 devices only. MSP430G2x13 devices have no ADC10. Q EN Set Interrupt Edge Select
45
MSP430G2955 MSP430G2855 MSP430G2755


PIN NAME (P1.x) P1.4/ SMCLK/ TCK/ Pin Osc P1.5/ TA0.0/ TMS/ Pin Osc P1.6/ TA0.1/ TDI/ TCLK/ Pin Osc P1.7/ TA0.2/ TDO/ TDI/ Pin Osc (1) X = don't care 7 6 5 4 x P1.x (I/O) SMCLK TCK Capacitive sensing P1.x (I/O) Timer0_A3.TA0 TMS Capacitive sensing P1.x (I/O) Timer0_A3.TA1 TDI TCLK Capacitive sensing P1.x (I/O) Timer0_A3.TA2 TDO TDI Capacitive sensing FUNCTION CONTROL BITS / SIGNALS (1) P1DIR.x I: 0; O: 1 1 X X I: 0; O: 1 1 X X I: 0; O: 1 1 X X X I: 0; O: 1 1 X X X P1SEL.x 0 1 X 0 0 1 X 0 0 1 X X 0 0 1 X X 0 P1SEL2.x 0 0 X 1 0 0 X 1 0 0 X X 1 0 0 X X 1 JTAG Mode 0 0 1 0 0 0 1 0 0 0 1 1 0 0 0 1 1 0
46
MSP430G2955 MSP430G2855 MSP430G2755


To ADC10 INCHx = y
ADC10AE0.y PxSEL2.y PxSEL.y PxDIR.y 0,2,3 1 Direction 0: Input 1: Output
PxSEL2.y PxSEL.y PxREN.y 1 0 1 0 1 DVSS DVCC PxOUT.y From Module 0 1 2 0 TAx.y TAxCLK 3 Bus Keeper EN P2.0/TA0CLK/ACLK/A0 P2.1/TA0INCLK/SMCLK/A1 P2.2/TA0.0/A2 0 1 1
PxSEL2.y PxSEL.y
PxIN.y EN To Module D PxIE.y PxIRQ.y Q PxIFG.y PxSEL.y PxIES.y Interrupt Edge Select EN Set
47
MSP430G2955 MSP430G2855 MSP430G2755

SREF2 To ADC10 VREFTo ADC10 INCHx = y 0 1 VSS
PxSEL2.y PxSEL.y PxREN.y 1 0 1 0 1 DVSS DVCC PxOUT.y From ADC10 0 TAx.y TAxCLK 0 1 2 3 Bus Keeper EN P2.3/TA0.1/A3/VREF-/VEREF0 1 1
PxSEL2.y PxSEL.y
48
MSP430G2955 MSP430G2855 MSP430G2755

To ADC10 VREF+ To ADC10 INCHx = y
PxSEL2.y PxSEL.y PxREN.y 1 0 1 0 1 DVSS DVCC PxOUT.y From ADC10 0 1 2 0 TAx.y TAxCLK 3 Bus Keeper EN P2.4/TA0.2/A4/VREF+/VEREF+ 0 1 1
PxSEL2.y PxSEL.y
49
MSP430G2955 MSP430G2855 MSP430G2755

to/from DCO DCOR PxSEL2.y PxSEL.y PxDIR.y 0,2,3 1 Direction 0: Input 1: Output
PxSEL2.y PxSEL.y PxREN.y 1 0 1 0 1 DVSS DVCC PxOUT.y From ADC10 0 TAx.y TAxCLK 0 1 2 3 Bus Keeper EN P2.5/TA1.0/ROSC 0 1 1
PxSEL2.y PxSEL.y
50
MSP430G2955 MSP430G2855 MSP430G2755


CONTROL BITS / SIGNALS (1) PIN NAME (P2.x) P2.0/ TA1CLK/ ACLK/ A0/ Pin Osc P2.1/ TA0INCLK/ SMCLK/ A1/ Pin Osc P2.2/ TA0.0/ 2 A2/ Pin Osc P2.3/ TA0.1/ A3/ VREF-/ VEREF-/ Pin Osc P2.4/ TA0.2/ A4/ VREF+/ VEREF+/ Pin Osc P2.5/ TA1.0/ 5 ROSC/ Pin Osc (1) X = don't care 4 3 1 0 x P2.x (I/O) Timer1_A3.TACLK ACLK output A0 Capacitive sensing P2.x (I/O) Timer0_A3.TAINCLK SMCLK output A1 Capacitive sensing P2.x (I/O) Timer0_A3.CCI0B Timer0_A3.TA0 A2 Capacitive sensing P2.x (I/O) Timer0_A3.CCI1B Timer0_A3.TA1 A3 VREFVEREFCapacitive sensing P2.x (I/O) Timer0_A3.CCI2B Timer0_A3.TA2 A4 VREF+ VEREF+ Capacitive sensing P2.x (I/O) Timer1_A3.CCI0A Timer1_A3.TA0 ROSC (DCOR = 1 to enable its function) Capacitive sensing FUNCTION P2DIR.x I: 0; O: 1 0 1 X X I: 0; O: 1 0 1 X X I: 0; O: 1 0 1 X X I: 0; O: 1 0 1 X X X X I: 0; O: 1 0 1 X X X X I: 0; O: 1 0 1 X X P2SEL.x 0 1 1 X 0 0 1 1 X 0 0 1 1 X 0 0 1 1 X X X 0 0 1 1 X X X 0 0 1 1 X 0 P2SEL2.x 0 0 0 X 1 0 0 0 X 1 0 0 0 X 1 0 0 0 X X X 1 0 0 0 X X X 1 0 0 0 X 1 ADC10AE.y INCH.y=1 0 0 0 1 (y = 0) 0 0 0 0 1 (y = 1) 0 0 0 0 1 (y = 2) 0 0 0 0 1 (y = 3) 1 1 0 0 0 0 1 (y = 4) 1 1 0 0 0 0 0 0
51
MSP430G2955 MSP430G2855 MSP430G2755

Port P2 Pin Schematic: P2.6, Input/Output With Schmitt Trigger
LF off PxSEL.6 and PxSEL.7 BCSCTL3.LFXT1Sx = 11
XOUT/P2.7
LFXT1CLK PxSEL.y PxDIR.y 0 1
0 1
Direction 0: Input 1: Output
PxSEL2.y PxSEL.y PxREN.y 1 0 1 0 1 DVSS DVCC PxOUT.y From Module 0 1 2 3 TAx.y TAxCLK PxIN.y EN To Module D PxIE.y PxIRQ.y PxIFG.y PxSEL.y PxIES.y Interrupt Edge Select Q EN Set XIN/P2.6 0 1 1
PxSEL2.y PxSEL.y
52
MSP430G2955 MSP430G2855 MSP430G2755

Table 20. Port P2 (P2.6) Pin Functions

CONTROL BITS / SIGNALS (1) PIN NAME (P2.x) x FUNCTION P2DIR.x 0 I: 0; O: 1 X P2SEL.6 P2SEL.7 1 1 0 X 0 X P2SEL2.6 P2SEL2.7 0 0 0 0 1 X
XIN/ P2.6/ Pin Osc (1) X = don't care 6
XIN P2.x (I/O) Capacitive sensing
53
MSP430G2955 MSP430G2855 MSP430G2755

Port P2 Pin Schematic: P2.7, Input/Output With Schmitt Trigger
LF off PxSEL.6 and PxSEL.7 BCSCTL3.LFXT1Sx = 11
XIN
LFXT1CLK PxSEL.y PxDIR.y 0 1
0 1
from P2.6
Direction 0: Input 1: Output
PxSEL2.y PxSEL.y PxREN.y 1 0 1 0 1 DVSS DVCC 0 1 2 3 TAx.y TAxCLK XOUT/P2.7 0 1 1
PxSEL2.y PxSEL.y PxOUT.y From Module
PxIN.y EN To Module D PxIE.y PxIRQ.y Q PxIFG.y PxSEL.y PxIES.y EN Set Interrupt Edge Select
54
MSP430G2955 MSP430G2855 MSP430G2755

Table 21. Port P2 (P2.7) Pin Functions

CONTROL BITS / SIGNALS (1) PIN NAME (P2.x) x FUNCTION P2DIR.x 1 I: 0; O: 1 X P2SEL.6 P2SEL.7 1 1 0 X 0 X P2SEL2.6 P2SEL2.7 0 0 0 0 1 X
XOUT/ P2.7/ Pin Osc (1) X = don't care 7
XOUT P2.x (I/O) Capacitive sensing
55
MSP430G2955 MSP430G2855 MSP430G2755


To ADC10 INCHx = y
ADC10AE0.y
PxSEL2.y PxSEL.y
PxDIR.y From Module
0 1 0 1 DVSS DVCC 0 1 1
PxSEL2.y PxSEL.y
PxOUT.y From Module
0 1 2 3 Bus Keeper EN
P3.0/UCB0STE/UCA0CLK/A5
EN To Module D PxIE.y PxIRQ.y PxIFG.y PxSEL.y PxIES.y Q EN Set Interrupt Edge Select
56
MSP430G2955 MSP430G2855 MSP430G2755

PxSEL2.y PxSEL.y PxDIR.y From Module
0 1 0 1 DVSS DVCC 0 1 1
PxSEL2.y PxSEL.y
PxOUT.y From Module
0 1 2 3
P3.1/UCB0SIMO/UCB0SDA P3.2/UCB0SOMI/UCB0SCL P3.3/UCB0CLK/UCA0STE P3.4/UCA0TXD/UCA0SIMO P3.5/UCA0RXD/UCA0SOMI
57
MSP430G2955 MSP430G2855 MSP430G2755

To ADC10 INCHx = y
PxSEL2.y PxSEL.y PxREN.y 1 0 1 0 1 DVSS DVCC PxOUT.y From Module 0 1 2 0 TAx.y TAxCLK 3 Bus Keeper EN P3.6/TA1.1/A6 P3.7/TA1.2/A7 0 1 1
PxSEL2.y PxSEL.y
58
MSP430G2955 MSP430G2855 MSP430G2755


CONTROL BITS / SIGNALS (1) PIN NAME (P3.x) P3.0/ UCB0STE/ UCA0CLK/ A5/ Pin Osc P3.1/ UCB0SIMO/ UCB0SDA/ Pin Osc P3.2/ UCB0SOMI/ UCB0SCL/ Pin Osc P3.3/ UCB0CLK/ UCA0STE/ Pin Osc P3.4/ UCA0TXD/ UCA0SIMO/ Pin Osc P3.5/ UCA0RXD/ UCA0TXD/ Pin Osc P3.6/ TA1.1/ 6 A6/ Pin Osc P3.7/ TA1.2/ 7 A7/ Pin Osc (1) X = don't care 5 4 3 2 1 0 x P3.x (I/O) UCB0STE UCA0CLK A5 Capacitive sensing P3.x (I/O) UCB0SIMO UCB0SDA Capacitive sensing P3.x (I/O) UCB0SOMI UCB0SCL Capacitive sensing P3.x (I/O) UCB0CLK UCA0STE Capacitive sensing P3.x (I/O) UCA0TXD UCA0SIMO Capacitive sensing P3.x (I/O) UCA0RXD UCA0TXD Capacitive sensing P3.x (I/O) Timer1_A3.CCI1A Timer1_A3.TA1 A6 Capacitive sensing P3.x (I/O) Timer1_A3.CCI2A Timer1_A3.TA2 A7 Capacitive sensing FUNCTION P3DIR.x I: 0; O: 1 from USCI from USCI X X I: 0; O: 1 from USCI from USCI X I: 0; O: 1 from USCI from USCI X I: 0; O: 1 from USCI from USCI X I: 0; O: 1 from USCI from USCI X I: 0; O: 1 from USCI from USCI X I: 0; O: 1 0 1 X X I: 0; O: 1 0 1 X X P3SEL.x 0 1 1 X 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 X 0 0 1 1 X 0 P3SEL2.x 0 0 0 X 1 0 0 0 1 0 0 0 1 0 0 0 1 0 0 0 1 0 0 0 1 0 0 0 X 1 0 0 0 X 1 ADC10AE.y INCH.y=1 0 0 0 1 (y = 5) 0 n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a 0 0 0 1 (y = 6) 0 0 0 0 1 (y = 7) 0
59
MSP430G2955 MSP430G2855 MSP430G2755


To Comparator From Comparator
CAPD.y
PxSEL2.y PxSEL.y
PxDIR.y From Module
0 1 0 1 DVSS DVCC 0 1 1
PxSEL2.y PxSEL.y
PxOUT.y From Module
P4.0/TB0.0/CA0 P4.1/TB0.1/CA1 P4.2/TB0.2/CA2
60
MSP430G2955 MSP430G2855 MSP430G2755

To Comparator From Comparator To ADC10 * INCHx = y * CAPD.y ADC10AE0.y *
PxSEL2.y PxSEL.y
PxDIR.y From Module
0 1 0 1 DVSS DVCC 0 1 1
PxSEL2.y PxSEL.y
PxOUT.y From Module
P4.3/TB0.0/A12/CA3 P4.4/TB0.1/A13/CA4 P4.5/TB0.2/A14/CA5 P4.6/TBOUTH/CAOUT/A15/CA6
61
MSP430G2955 MSP430G2855 MSP430G2755

To Comparator From Comparator
CAPD.y
PxSEL2.y PxSEL.y
PxDIR.y From Module
0 1 0 1 DVSS DVCC 0 1 1
PxSEL2.y PxSEL.y
PxOUT.y From Module
P4.7/TB0CLK/CAOUT/CA7
62
MSP430G2955 MSP430G2855 MSP430G2755


PIN NAME (P4.x) P4.0/ TB0.0/ 0 CA0/ Pin Osc P4.1/ TB0.1/ 1 CA1/ Pin Osc P4.2/ TB0.2/ 2 CA2/ Pin Osc P4.3/ TB0.0/ A12/ CA3/ Pin Osc P4.4/ TB0.1/ A13/ CA4/ Pin Osc P4.5/ TB0.2/ A14/ CA5/ Pin Osc P4.6/ TB0OUTH/ CAOUT/ A15/ CA6/ Pin Osc P4.7/ TB0CLK/ CAOUT/ CA7/ Pin Osc (1) X = don't care 7 6 5 4 3 CONTROL BITS / SIGNALS (1) x P4.x (I/O) Timer0_B3.CCI0A Timer0_B3.TA0 CA0 Capacitive sensing P4.x (I/O) Timer0_B3.CCI1A Timer0_B3.TA1 CA1 Capacitive sensing P4.x (I/O) Timer0_B3.CCI2A Timer0_B3.TA2 CA2 Capacitive sensing P4.x (I/O) Timer0_B3.CCI0A Timer0_B3.TA0 A12 CA3 Capacitive sensing P4.x (I/O) Timer0_B3.CCI1A Timer0_B3.TA1 A13 CA4 Capacitive sensing P4.x (I/O) Timer0_B3.TB2 A14 CA5 Capacitive sensing P4.x (I/O) TBOUTH CAOUT A15 CA6 Capacitive sensing P4.x (I/O) Timer0_B3.TBCLK CAOUT CA7 Capacitive sensing FUNCTION P4DIR.x I: 0; O: 1 0 1 X X I: 0; O: 1 0 1 X X I: 0; O: 1 0 1 X X I: 0; O: 1 0 1 X X X I: 0; O: 1 0 1 X X X I: 0; O: 1 1 X X X I: 0; O: 1 0 1 X X X I: 0; O: 1 0 1 X X P4SEL.x 0 1 1 X 0 0 1 1 X 0 0 1 1 X 0 0 1 1 X X 0 0 1 1 X X 0 0 1 X X 0 0 1 1 X X 0 0 1 1 X 0 P4SEL2.x 0 0 0 X 1 0 0 0 X 1 0 0 0 X 1 0 0 0 X X 1 0 0 0 X X 1 0 0 X X 1 0 0 0 X X 1 0 0 0 X 1 ADC10AE.y INCH.y=1 n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a 0 0 0 1 (y =12) 0 0 0 0 0 1 (y = 13) 0 0 0 0 1 (y = 14) 0 0 0 0 0 1 (y = 15) 0 0 n/a n/a n/a n/a n/a CAPD.y 0 0 0 1 (y = 0) 0 0 0 0 1 (y = 1) 0 0 0 0 1 (y = 2) 0 0 0 0 0 1 (y = 3) 0 0 0 0 0 1 (y = 4) 0 0 0 0 1 (y = 5) 0 0 0 0 0 1 (y = 6) 0 0 0 0 1 (y = 7) 0
63
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jun-2013
PACKAGING INFORMATION
Orderable Device MSP430G2755IDA38 MSP430G2755IDA38R MSP430G2755IRHA40R MSP430G2755IRHA40T MSP430G2855IDA38 MSP430G2855IDA38R MSP430G2855IRHA40R MSP430G2855IRHA40T MSP430G2955IDA38 MSP430G2955IDA38R MSP430G2955IRHA40R MSP430G2955IRHA40T Status
(1)
Package Type Package Pins Package Drawing Qty TSSOP TSSOP VQFN VQFN TSSOP TSSOP VQFN VQFN TSSOP TSSOP VQFN VQFN DA DA RHA RHA DA DA RHA RHA DA DA RHA RHA 38 38 40 40 38 38 40 40 38 38 40 40 40 2000 2500 250 40 2000 2500 250 40 2000 2500 250
Eco Plan
(2)
Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU
MSL Peak Temp

(3)
Op Temp (C)
Device Marking
(4/5)
Samples
ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-3-260C-168 HR Level-3-260C-168 HR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-3-260C-168 HR Level-3-260C-168 HR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-3-260C-168 HR Level-3-260C-168 HR
G2755 G2755 G2755 G2755 G2855 G2855 G2855 G2855 G2955 G2955 G2955 G2955
(1)
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jun-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(4)
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Audio Amplifiers Data Converters DLP Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID OMAP Applications Processors Wireless Connectivity www.ti.com/audio amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/omap TI E2E Community e2e.ti.com www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2014, Texas Instruments Incorporated Applications Automotive and Transportation Communications and Telecom Computers and Peripherals Consumer Electronics Energy and Lighting Industrial Medical Security Space, Avionics and Defense Video and Imaging www.ti.com/automotive www.ti.com/communications www.ti.com/computers www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical www.ti.com/security www.ti.com/space-avionics-defense www.ti.com/video

MSP 430 G 2955

Uploaded by

Copyright:

Available Formats

MSP 430 G 2955

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

MSP 430 G 2955

Uploaded by

Copyright:

Available Formats

MSP430G2955 MSP430G2855 MSP430G2755

www.ti.com SLAS800 MARCH 2013

MIXED SIGNAL MICROCONTROLLER

Copyright 2013, Texas Instruments Incorporated

MSP430G2955 MSP430G2855 MSP430G2755

Table 1. Available Options (1) (2)

Device Pinout, 38-Pin TSSOP (DA Package)

Submit Documentation Feedback

Copyright 2013, Texas Instruments Incorporated

Product Folder Links: MSP430G2955 MSP430G2855 MSP430G2755

MSP430G2955 MSP430G2855 MSP430G2755

Device Pinout, 40-Pin QFN (RHA Package)

Functional Block Diagram

Basic Clock System+

2x8 I/O, Interrupt capability, Pullup or pulldown resistors

16MHz CPU incl. 16 Registers

Timer0_B3 3 CC Registers, Shadow Register

USCI_A0: UART, LIN, IrDA,SPI USCI_B0: SPI,I2C

Copyright 2013, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Links: MSP430G2955 MSP430G2855 MSP430G2755

MSP430G2955 MSP430G2855 MSP430G2755

Table 2. Terminal Functions

I/O General-purpose digital I/O pin 29 I/O

I/O I/O I/O

Product Folder Links: MSP430G2955 MSP430G2855 MSP430G2755

MSP430G2955 MSP430G2855 MSP430G2755

Table 2. Terminal Functions (continued)

Copyright 2013, Texas Instruments Incorporated

Product Folder Links: MSP430G2955 MSP430G2855 MSP430G2755

MSP430G2955 MSP430G2855 MSP430G2755

Table 2. Terminal Functions (continued)

Submit Documentation Feedback

Copyright 2013, Texas Instruments Incorporated

Product Folder Links: MSP430G2955 MSP430G2855 MSP430G2755

MSP430G2955 MSP430G2855 MSP430G2755

SHORT-FORM DESCRIPTION CPU

General-Purpose Register General-Purpose Register

General-Purpose Register General-Purpose Register

Table 3. Instruction Word Formats

Table 4. Address Mode Descriptions (1)

Copyright 2013, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Links: MSP430G2955 MSP430G2855 MSP430G2755

MSP430G2955 MSP430G2855 MSP430G2755

Submit Documentation Feedback

Copyright 2013, Texas Instruments Incorporated

Product Folder Links: MSP430G2955 MSP430G2855 MSP430G2755

MSP430G2955 MSP430G2855 MSP430G2755

Interrupt Vector Addresses

(non)-maskable (non)-maskable (non)-maskable maskable maskable maskable maskable

maskable maskable maskable maskable maskable maskable maskable maskable maskable

TA1CCR0 CCIFG (4) TA1CCR2 TA1CCR1 CCIFG, TAIFG (2) (4)

Copyright 2013, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Links: MSP430G2955 MSP430G2855 MSP430G2755

MSP430G2955 MSP430G2855 MSP430G2755

Special Function Registers (SFRs)

Table 6. Interrupt Enable Register 1 and 2