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Flyer SiC Technology

The document discusses silicon carbide components and their advantages for applications requiring high power output and energy efficiency such as solar power, drives and UPS systems. It provides details on silicon carbide diodes and switches, their use in hybrid modules and full silicon carbide modules, and SEMIKRON's silicon carbide chip and packaging technology.

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Sandro Morero
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66 views2 pages

Flyer SiC Technology

The document discusses silicon carbide components and their advantages for applications requiring high power output and energy efficiency such as solar power, drives and UPS systems. It provides details on silicon carbide diodes and switches, their use in hybrid modules and full silicon carbide modules, and SEMIKRON's silicon carbide chip and packaging technology.

Uploaded by

Sandro Morero
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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SILICON CARBIDE COMPONENTS

Leading Chip and Packaging Technology for Highest Energy Efciency

Solar, Drives, UPS Very high power output & power density Allows smaller passive components Compact design: reduced weight & volume Highest reliability with sinter technology

SiC Diode SiC Switch

SiC Technology

SiC hybrid module: high efciency at high switching frequencies


SiC freewheeling diode plus Si-IGBT Virtually no diode switching Iosses Very high efciency: @ 30 kHz with Si-Diode: 94,5 % with SiC-Diode: 97 % Ideal for high frequency applications Package miniaturisation

300 A SKiM 93 Inverter


100

Efciency in %

98 96 94 92 90

Si-IGBT + SiC-Diode Si-IGBT + Si-Diode


0 10 20 30 40

Switching frequency in kHz

Full SiC module: +150 % power output @ 30 kHz


SiC MOSFET plus SiC freewheeling diode
Pout in kW

14 12 10 8 6 4 2 0 0

20 A MiniSKiiP

Extreme high power output and outstanding energy savings Package miniaturisation Ideal for high frequency applications Normally-off switch, easy to use with standard drivers

SiC MOSFET Si IGBT


10 20 30 40

Switching frequency in kHz

High performance SiC chips combined with leading SEMIKRON package technology
Chip mounting by solder or sinter interconnects for high temperature operation and highest reliability Solder or solder-less (spring contacts) PCB assembly Broad power range in multiple packages Samples on request Customer-specic solutions

10 kW SEMITOP

SiC

MiniSKiiP

SiC

300 kW SKiM 63/93

SiC

Australia Brasil Cesko China

SEMIKRON INTERNATIONAL GmbH P .O. Box 820251 90253 Nrnberg Deutschland Tel: +49 911-6559-234 Fax: +49 911-6559-262 [email protected] www.semikron.com
NOTE: All information is based on our present knowledge and is to be used for information purposes only. The specications of our components may not be considered as an assurance of component characteristics.

11 28 61 40 11/2012

Intnl. Tel. +61 3- 85 61 56 00 +55 11-41 86 95 00 +420 378 051 400 +852 34 26 33 66 +86 756-3 39 67 07

Intnl. Espaa France India Indonesia Italia

Tel. +34 9 36 33 58 90 +33 1-30 86 80 00 +91 22-27 62 86 00 +62 2 15 80 60 44 +39 06-9 11 42 41

Japan Korea Mexico Nederland sterreich

Intnl. Tel. +81 3-68 95 13 96 +82 32-3 46 28 30 +52 55 53 00 11 51 +31 55-5 29 52 95 +43 1-58 63 65 80

Polska Russia Schweiz Slovensko Suid-Afrika

Intnl. +48 +7812 +41 +421 +27

Tel. 22-6 15 79 84 232-98 25 44-9 14 13 33 3 37 97 03 05 12-3 45 60 60

Suomi Sverige Trkiye UK USA

Intnl. Tel. +358 10-321 79 50 +46 8-731 74 00 +90 216-511 50 46 +44 19 92-58 46 77 +1 603-8 83 81 02

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