BurrBrown Products

from Texas Instruments

OPA2727
OPA2727
OPA727
OPA728
OPA727
OPA728
OPA4727

-V
B
V
OUT
+12V
OPA727
l

e-trim

www.ti.com

www.ti.com

1
2
3
4
8
7
6
5
NC
(1)
V+
OUT
NC
(1)
NC
(1)
-IN
+IN
V-
1
2
3
4
8
7
6
5
V+
OUT B
-IN B
+IN B
OUT A
-IN A
+IN A
V-
A
B
1
2
3
4
8
7
6
5
NC
(1)
V+
OUT
NC
(1)
NC
(1)
-IN
+IN
V-
Exposed
Thermal
Die Pad
on
Underside
(2)
1
2
3
4
8
7
6
5
V+
OUT B
-IN B
+IN B
OUT A
-IN A
+IN A
V-
Exposed
Thermal
Die Pad
on
Underside
(2)
1
2
3
4
8
7
6
5
Enable
V+
OUT
NC
(1)
REF
(3)
-IN
+IN
V-
1
2
3
4
5
6
7
14
13
12
11
10
9
8
OUT D
-IN D
+IN D
V-
+IN C
-IN C
OUT C
OUT A
-IN A
+IN A
V+
+IN B
-IN B
OUT B
A D
B C
1
2
3
4
8
7
6
5
Enable
V+
OUT
NC
(1)
REF
(3)
-IN
+IN
V-
Exposed
Thermal
Die Pad
on
Underside(2)

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Frequency (Hz)
10 100 1k 10k 100k 1M 10M 100M
180
160
140
120
100
80
60
40
20
0
20
180
160
140
120
100
80
60
40
20
0
20
G
a
i
n
(
d
B
)
P
h
a
s
e
(
)

Phase
Gain
Frequency (Hz)
10 100 1k 10k 100k 1M 10M
120
100
80
60
40
20
0
C
M
R
R
(
d
B
)
(V) V (V+) 2V
CM
Frequency (Hz)
100 1k 10k 100k 1M 10M 100M
100
90
80
70
60
50
40
30
20
10
0
P
S
R
R
(
d
B
)
Frequency (Hz)
10k 100k 1M 10M
7
6
5
4
3
2
1
0
A
m
p
l
i
t
u
d
e
(
V
)
V = 6V
S

Indicates maximum output
for no visible distortion.
Frequency (Hz)
1k 10k 100k 1M 10M 100M
140
120
100
80
60
40
20
C
h
a
n
n
e
l
S
e
p
a
r
a
t
i
o
n
(
d
B
)
Frequency (Hz)
10 100 1k 10k 100k 1M 10M
1000
100
10
1
V
o
l
t
a
g
e
N
o
i
s
e
(
n
V
/
H
z
)

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10k
1k
100
10
1
0.1
0.01
I
(
p
A
)
O
S
Temperature ( C)
50 25 0 25 50 75 100 125 150
6 4
Common-- Mode Voltage (V)
100k
10k
1k
100
10
10
100
1k
10k
100k
I
n
p
u
t
B
i
a
s
C
u
r
r
e
n
t
(
p
A
)
+125 C
+125 C
+85 C
+85 C
+25 C
+25 C
2 0 2 4 6
I < 10pA
B

140
130
120
110
100
90
80
A
(
d
B
)
O
L
Temperature ( C)
50 25
R =
L
1kW
R = 100k
L
W
0 25 50 75 100 125 150 50 25
120
100
80
60
P
S
R
R
(
d
B
)
Temperature ( C)
0 25 50 75 100 125 150
50 25
Temperature ( C)
5
4
3
2
1
0
I
(
m
A
)
Q
0 25 50 75 100 125 150
Temperature ( C)
50 25
110
100
90
80
70
60
C
M
R
R
(
d
B
)
0 25 50 75 100 125 150
(V) V (V+) 2V
CM

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Supply Voltage (V)
3 4 5 6 7 8 9 10 11 12 13 14
5.0
4.8
4.6
4.4
4.2
4.0
3.8
3.6
3.4
3.2
3.0
I
Q
p
e
r
A
m
p
l
i
f
i
e
r
(
m
A
)
90
80
70
60
50
40
30
20
10
0
S
h
o
r
t
--
C
i
r
c
u
i
t
(
m
A
)
Temperature ( C)
50 25
Sourcing
Sinking
0 25 50 75 100 125 150
Output Current (mA)
0
6
4
2
0
2
4
6
O
u
t
p
u
t
V
o
l
t
a
g
e
(
V
)
125 C
40 C
40 C
25 C
10 20 30 40 50 60 70 80
Supply Voltage (V)
3
.
5
4
.
5
5
.
5
6
.
5
7
.
5
8
.
5
9
.
5
1
0
.
5
1
1
.
5
1
2
.
5
1
3
.
5
90
80
70
60
50
40
30
20
10
0
S
h
o
r
t
--C
i
r
c
u
i
t
C
u
r
r
e
n
t
(
m
A
)
Sourcing
Sinking
Frequency (Hz)
0.01
0.001
0.0001
T
H
D
+
N
o
i
s
e
(
%
)
10 100 1k 10k 100k
R = 600
V = 2Vrms
BW = 80kHz
L
OUT
W
Noninverting Gain (V/V)
5000
4500
4000
3500
3000
2500
2000
1500
1000
500
0
0.01%
0.1%
S
e
t
t
l
i
n
g
T
i
m
e
(
n
s
)
1 100 10

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Capacitive Load (pF)
90
80
70
60
50
40
30
20
10
0
O
v
e
r
s
h
o
o
t
(
%
)
G = +1
G = 1
C = 3pF
F
G = +5
C = 1pF
F
10 100 1000
Offset Voltage ( V) m

1
5
0

1
4
0

1
3
0

1
2
0

1
1
0

1
0
0

9
0

8
0

7
0

6
0

5
0

4
0

3
0

2
0

1
0 0
1
0
2
0
3
0
4
0
5
0
6
0
7
0
8
0
9
0
1
0
0
1
1
0
1
2
0
1
3
0
1
4
0
1
5
0
P
o
p
u
l
a
t
i
o
n
V = 5V
S

P
o
p
u
l
a
t
i
o
n
Offset Voltage Drift ( V/ C) m
0
V = 5V
S

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
Offset Voltage Drift ( V/ C) m
0
0
.
1
0
.
2
0
.
3
0
.
4
0
.
5
0
.
6
0
.
7
0
.
8
0
.
9
1
.
0
1
.
1
1
.
2
1
.
3
1
.
4
1
.
5
1
.
6
1
.
7
1
.
8
1
.
9
2
.
0
2
.
1
2
.
2
2
.
3
2
.
4
2
.
5
2
.
6
2
.
7
2
.
8
2
.
9
3
.
0
P
o
p
u
l
a
t
i
o
n
V = 5V
S

100ns/div
1
0
m
V
/
d
i
v
G = +1
R = 10k
C = 20pF
L
L
W
O
f
f
s
e
t

V
o
l
t
a
g
e

(
V
)
m
Temperature ( C)
50
300
200
100
0
100
200
300
4s
7 Representative Units Shown
V = 5V
S

25 0 25 50 75 100 125
4s

www.ti.com
400ns/div
1
V
/
d
i
v
G = +1
R = 10k
C = 20pF
L
L
W
200ns/div
1
0
m
V
/
d
i
v
OPA 7 27
C = 2pF
F
C = 3pF
F
C = 4pF
F
C
20pF
L
G = 1
C
F
R
F
10kW
10kW
1
V
/
d
i
v
400ns/div
C
4pF
F
C
20pF
L
G = 1
R
F
10kW
10kW
OPA 7 27

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V = DGND
REF
Digital
Logic
Enable
OPA728
+12V
a) Single-Supply Configuration
b) Dual-Supply Configuration
V = D
REF
GND
REF
REF
Digital
Logic
Enable
OPA728
+5V
-5V
V
OUT
V
OUT

R OPA727
V+
V-
V
IN
V
OUT
10mA max
I
OVERLOAD

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75W
OPA727
ADS8342
16-Bit ADC
AIN
Common
330pF
V
IN
2.5V
+5V
-5V
+5V
-5V

R
S
20W
OPA727
C
L
R
L
V
IN
V
OUT
V+

OPA727 V
OUT
10MW
+5V
-5V
C
D
R
F
C
F
(1)
< 1pF
l
NOTE: (1) C is optional to prevent gain peaking.
F
It includes the stray capacitance of .
F
R

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1
2pR
F
C
F
+
GBW
4pR
F
C
D

f
*3dB
+
GBW
2pR
F
C
D
Hz

OPA727 V
OUT
10MW
V+
R
F
C
F
(1)
< 1pF
l
NOTE: (1) C is optional to prevent gain peaking.
F
It includes the stray capacitance of .
F
R
+V
Bias

www.ti.com
DC Gain = 1
1/2
OPA2727
C
1
1nF
C
2
330pF
R
2
15.9kW
R
1
1.93kW
2.2nF
C
3
C
4
100pF
R
4
22.3kW
R
3
2.07kW
Cutoff Frequency = 50kHz
1/2
OPA2727
V
O

PACKAGE OPTION ADDENDUM

www.ti.com 18-Oct-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (C) Device Marking
(4/5)
Samples
OPA2727AID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR O2727A
2727A
OPA2727AIDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR O2727A
2727A
OPA2727AIDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR O2727A
2727A
OPA2727AIDRBR ACTIVE SON DRB 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR NSD
OPA2727AIDRBRG4 ACTIVE SON DRB 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR NSD
OPA2727AIDRBT ACTIVE SON DRB 8 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR NSD
OPA2727AIDRBTG4 ACTIVE SON DRB 8 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR NSD
OPA2727AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR O2727A
2727A
OPA4727AIPW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR OPA4727
OPA4727AIPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR OPA4727
OPA4727AIPWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR OPA4727
OPA4727AIPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR OPA4727
OPA727AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI Level-2-260C-1 YEAR AUE
OPA727AIDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR AUE
OPA727AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI Level-2-260C-1 YEAR AUE
OPA727AIDGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR AUE
OPA727AIDRBT ACTIVE SON DRB 8 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR NSF
PACKAGE OPTION ADDENDUM
www.ti.com 18-Oct-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (C) Device Marking
(4/5)
Samples
OPA727AIDRBTG4 ACTIVE SON DRB 8 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR NSF
OPA728AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 AUF
OPA728AIDGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 AUF
OPA728AIDRBT ACTIVE SON DRB 8 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 NSG
OPA728AIDRBTG4 ACTIVE SON DRB 8 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 NSG

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Oct-2013
Addendum-Page 3

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
OPA2727AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA2727AIDRBR SON DRB 8 2500 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
OPA2727AIDRBT SON DRB 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
OPA4727AIPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
OPA727AIDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA727AIDGKT VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA727AIDRBT SON DRB 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
OPA728AIDGKT VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA728AIDRBT SON DRB 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA2727AIDR SOIC D 8 2500 367.0 367.0 35.0
OPA2727AIDRBR SON DRB 8 2500 367.0 367.0 35.0
OPA2727AIDRBT SON DRB 8 250 210.0 185.0 35.0
OPA4727AIPWR TSSOP PW 14 2000 367.0 367.0 35.0
OPA727AIDGKR VSSOP DGK 8 2500 367.0 367.0 35.0
OPA727AIDGKT VSSOP DGK 8 250 210.0 185.0 35.0
OPA727AIDRBT SON DRB 8 250 210.0 185.0 35.0
OPA728AIDGKT VSSOP DGK 8 250 210.0 185.0 35.0
OPA728AIDRBT SON DRB 8 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2
IMPORTANT NOTICE
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
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