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    Description Appearance: Surface Mount Voidless-Hermetically-Sealed Ultra Fast Recovery Glass Rectifiers

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    Deepa Devaraj
    dso

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    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd

    Description Appearance: Surface Mount Voidless-Hermetically-Sealed Ultra Fast Recovery Glass Rectifiers

    Uploaded by

    Deepa Devaraj
    53 views0 pages
    dso

    Original Title

    1n5806

    Copyright

    © Attribution Non-Commercial (BY-NC)

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    dso

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    53 views0 pages

    Description Appearance: Surface Mount Voidless-Hermetically-Sealed Ultra Fast Recovery Glass Rectifiers

    Uploaded by

    Deepa Devaraj
    dso

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 0

    SURFACE MOUNT VOIDLESS-

    HERMETICALLY-SEALED ULTRA FAST


    RECOVERY GLASS RECTIFIERS

    W
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    C
    O
    M
    S COTTS DALE DI VI S I ON
    1N5802US thru 1N5806US

    1
    N
    5
    8
    0
    2
    U
    S


    1
    N
    5
    8
    0
    6
    U
    S



    DESCRI PTI ON

    APPEARANCE

    This Ultrafast Recovery surface mount rectifier diode series is military qualified to MIL-
    PRF-19500/477 and is ideal for high-reliability applications where a failure cannot be
    tolerated. These industry-recognized 2.5 Amp rated rectifiers for working peak reverse
    voltages from 50 to 150 volts are hermetically sealed with voidless-glass construction
    using an internal Category I metallurgical bond. They are also available in axial-
    leaded package configurations for thru-hole mounting (see separate data sheet for
    1N5802 thru 1N5806). Microsemi also offers numerous other rectifier products to meet
    higher and lower current ratings with various recovery time speed requirements
    including standard, fast and ultrafast device types in both through-hole and surface
    mount packages.


    Package A
    or D-5A
    IMPORTANT: For the most current data, consult MICROSEMIs website: http://www.microsemi.com

    FEATURES APPLI CATI ONS / BENEFI TS

    Surface mount package series equivalent to the J EDEC
    registered 1N5802 to 1N5806 series
    Voidless hermetically sealed glass package
    Extremely robust construction
    Triple-layer passivation
    Internal Category I Metallurgical bonds
    J AN, J ANTX, J ANTXV, and J ANS available per MIL-PRF-
    19500/477
    Axial-leaded equivalents available (see 1N5802 thru 1N5806)

    Ultrafast recovery 2.5 Amp rectifier series 50 to 150 V
    Military and other high-reliability applications
    Switching power supplies or other applications
    requiring extremely fast switching & low forward loss
    High forward surge current capability
    Low thermal resistance
    Controlled avalanche with peak reverse power
    capability
    Inherently radiation hard as described in Microsemi
    MicroNote 050

    MAXI MUM RATI NGS MECHANI CAL AND PACKAGI NG

    J unction Temperature: -65
    o
    C to +175
    o
    C
    Storage Temperature: -65
    o
    C to +175
    o
    C
    Average Rectified Forward Current (I
    O
    ): 2.5 A @ T
    EC
    =75C
    Thermal Resistance: 13 C/W junction to end cap
    Thermal Impedance: 4.5
    o
    C/W @ 10 ms heating time
    Forward Surge Current: 35 Amps @ 8.3 ms half-sine
    Capacitance: 25 pF @ V
    R
    =10 Volts, f =1 MHz
    Solder temperature: 260C for 10 s (maximum)
    CASE: Hermetically sealed voidless hard glass with
    Tungsten slugs
    TERMINALS: End caps are Copper with Tin/Lead
    (Sn/Pb) finish. Note: Previous inventory had solid
    Silver end caps with Tin/Lead (Sn/Pb) finish.
    MARKING and POLARITY: Cathode band only
    Tape & Reel option: Standard per EIA-481-B
    Weight: 193 mg
    See package dimensions and recommended pad
    layout on last page

    ELECTRI CAL CHARACTERI STI CS
    TYPE
    WORKING
    PEAK
    REVERSE
    VOLTAGE
    V
    RWM
    BREAKDOWN
    VOLTAGE
    (MIN.)

    @ 100A
    V
    BR

    AVERAGE
    RECTIFIED
    CURRENT
    I
    O1
    @
    T
    EC
    =+75C
    (NOTE 1)
    AVERAGE
    RECTIFIED
    CURRENT
    I
    O2
    @
    T
    A
    =+55C
    (Note 2)
    MAXIMUM
    FORWARD
    VOLTAGE
    @ 1 A
    (8.3 ms pulse)
    V
    F

    REVERSE
    CURRENT
    (MAX)
    @ V
    RWM

    I
    R

    SURGE
    CURRENT
    (MAX)
    I
    FSM

    (NOTE 3)
    REVERSE
    RECOVERY
    TIME (MAX)
    (NOTE 4)
    t
    rr

    VOLTS VOLTS AMPS AMPS VOLTS A AMPS ns
    25
    o
    C 100
    o
    C 25
    o
    C 125
    o
    C

    1N5802US
    1N5803US
    1N5804US
    1N5805US
    1N5806US
    50
    75
    100
    125
    150
    55
    80
    110
    135
    160
    2.5
    2.5
    2.5
    2.5
    2.5
    1.0
    1.0
    1.0
    1.0
    1.0
    0.875

    0.875

    0.875
    0.800

    0.800

    0.800
    1
    1
    1
    1
    1
    175
    175
    175
    175
    175
    35
    35
    35
    35
    35
    25
    25
    25
    25
    25
    NOTE 1: I
    O1
    is rated at 2.5 A @ T
    EC
    =75. Derate at 50 mA/C for T
    EC
    above 125C.
    NOTE 2: I
    O2
    is rated at 1.0 A @ T
    A
    =55C for PC boards where thermal resistance from mounting point to
    ambient is sufficiently controlled where T
    J (max)
    does not exceed 175C. Derate at 8.33 mA/C for T
    A
    above 55C.
    NOTE 3: T
    A
    =25
    o
    C @ I
    O
    =1.0 A and V
    RWM
    for ten 8.3 ms surges at 1 minute intervals
    Microsemi
    Scottsdale Division
    Page 1
    NOTE 4: I
    F
    =0.5 A, I
    RM
    =0.5 A, I
    R(REC)
    =.05 A
    Copyright 2009
    10-06-2009 REV C; SD41A.pdf
    8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

    SURFACE MOUNT VOIDLESS-
    HERMETICALLY-SEALED ULTRA FAST
    RECOVERY GLASS RECTIFIERS

    Microsemi
    Scottsdale Division
    8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

    Page 2
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    .
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    S COTTS DALE DI VI S I ON
    1N5802US thru 1N5806US

    1
    N
    5
    8
    0
    2
    U
    S


    1
    N
    5
    8
    0
    6
    U
    S

    SYMBOLS & DEFI NI TI ONS
    Symbol Definition
    V
    BR
    Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current

    V
    RWM

    Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature
    range
    I
    O

    Average Rectified Output Current: Output Current Averaged over a full cycle with a 50 Hz or 60 Hz sine-wave
    input and a 180 degree conduction angle
    V
    F
    Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current
    I
    R
    Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and temperature
    C Capacitance: The capacitance in pF at a frequency of 1 MHz and specified voltage
    t
    rr

    Reverse Recovery Time: The time interval between the instant the current passes through zero when changing
    from the forward direction to the reverse direction and a specified recovery decay point after a peak reverse
    current occurs.






    PACKAGE DI MENSI ONS AND PAD LAYOUT





    NOTE: This Package Outline has also previously PAD LAYOUT
    been identified as D-5A
    INCHES mm
    A 0.246 6.25
    B 0.067 1.70
    C 0.105 2.67
    Note: If mounting requires adhesive
    separate from the solder, an additional
    0.060 inch diameter contact may be
    placed in the center between the pads
    as an optional spot for cement.

    INCHES mm
    MIN MAX MIN MAX
    BD .097 .103 2.46 2.62
    BL .185 .200 4.70 5.08
    ECT .019 .028 0.48 0.71
    S .003 --- 0.08 ---


    Copyright 2009
    10-06-2009 REV C; SD41A.pdf

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