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    Enhanced P L A P: Olyimide Aminate ND Repreg

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    outra_pessoa
    This document describes EP2 Enhanced Polyimide Laminate and Prepreg, an engineered polyimide product with improved properties over traditional polyimides. It has a glass transition temperature of 250°C, lower moisture absorption and thermal expansion, and higher thermal conductivity. EP2 also has improved copper adhesion, reduced cure times, and meets various industry standards. Recommended processing conditions and applications are provided.

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    Enhanced P L A P: Olyimide Aminate ND Repreg

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    outra_pessoa
    63 views4 pages
    This document describes EP2 Enhanced Polyimide Laminate and Prepreg, an engineered polyimide product with improved properties over traditional polyimides. It has a glass transition temperature of 250°C, lower moisture absorption and thermal expansion, and higher thermal conductivity. EP2 also has improved copper adhesion, reduced cure times, and meets various industry standards. Recommended processing conditions and applications are provided.

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    EP-2

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    This document describes EP2 Enhanced Polyimide Laminate and Prepreg, an engineered polyimide product with improved properties over traditional polyimides. It has a glass transition temperature of 250°C, lower moisture absorption and thermal expansion, and higher thermal conductivity. EP2 also has improved copper adhesion, reduced cure times, and meets various industry standards. Recommended processing conditions and applications are provided.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    63 views4 pages

    Enhanced P L A P: Olyimide Aminate ND Repreg

    Uploaded by

    outra_pessoa
    This document describes EP2 Enhanced Polyimide Laminate and Prepreg, an engineered polyimide product with improved properties over traditional polyimides. It has a glass transition temperature of 250°C, lower moisture absorption and thermal expansion, and higher thermal conductivity. EP2 also has improved copper adhesion, reduced cure times, and meets various industry standards. Recommended processing conditions and applications are provided.

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    of 4

    EP2

    Enhanced POLYIMIDE LAMINATE AND PREPREG


    EP2 Enhanced Polyimide is the next generation of polyimide and prepreg products, engineered for improved properties and processing and for applications requiring optimum thermal performance. EP2 is a filled product, yet with significantly improved copper adhesion compared to traditional polyimides. Reduced water absorption, higher thermal conductivity and reduced CTE are all achieved while maintaining the full 250C Tg of polyimide for thermal stability through process and application. Reduced cure cycle compared to traditional polyimides offers reduced process throughput times.

    Features:
    Glass Transition Temperature of 250C Lower electrical loss results in improved signal integrity Low Z-Axis expansion (0.65% 50 to 260C) reduces stress on PTHs through process and thermal cycling. Copper Peel 25% higher than traditional unfilled polyimides Moisture Absorption reduced by 25% compared to traditional polyimide Decomposition temperature (5% Td) of 424C for excellent high temperature service life and process temperature resistance Reduced cure time by 25-50% compared to traditional polyimides Electrical and Mechanical Properties meet the requirements of IPC-4101/40 and 41 Toughened, non-MDA chemistry resists drill fracturing Fully compatible with lead-free solder processing Meets NASA Outgassing requirements Meets the UL-V0 Flammability Requirements RoHS and WEEE Compliant

    Typical Applications:

    PCBs that are subjected to high temperatures during processing and rework, such as lead-free soldering. Reduced risk of latent PTH damage due to low Z-Direction CTE. Applications with significant service life expectations at high temperatures, such as aircraft engine instrumentation, on-engine applications, down-hole drilling and industrial sensor packages, under-hood automotive controls and burn-in Testing of ICs (Burn-In Boards). TECHNOLOGY ENABLING INNOVATION

    Typical Properties:
    Property 1. Electrical Properties
    Dielectric Constant (may vary with Resin %) @ 1 MHz @ 1 GHz Dissipation Factor @ 1 MHz @ 1 GHz Volume Resistivity C96/35/90 E24/125 Surface Resistivity C96/35/90 E24/125 Electrical Strength Dielectric Breakdown Arc Resistance M-cm M-cm M M Volts/mil (kV/mm) kV sec 0.006 4.2

    EP2
    Units Value Test Method

    IPC TM-650 2.5.5.3 IPC TM-650 2.5.5.9 IPC TM-650 2.5.5.3 IPC TM-650 2.5.5.9 IPC TM-650 2.5.17.1 IPC TM-650 2.5.17.1 IPC TM-650 2.5.17.1 IPC TM-650 2.5.17.1 IPC TM-650 2.5.6.2 IPC TM-650 2.5.6 IPC TM-650 2.5.1

    2.8x108 3.9x108 1.2x108 1.3x108 1400 (55.9) 65 >120

    2. Thermal Properties
    Glass Transition Temperature (Tg) TMA DSC Decomposition Temperature (Td) Initial 5% T260 T288 T300 CTE (x,y) CTE (z) < Tg > Tg z-axis Expansion (50-260C) C C C C min min min ppm/C ppm/C ppm/C % 250 IPC TM-650 2.4.24 IPC TM-650 2.4.25 IPC TM-650 2.3.41 IPC TM-650 2.3.41 IPC TM-650 2.4.24.1 IPC TM-650 2.4.24.1 IPC TM-650 2.4.24.1 IPC TM-650 2.4.41 IPC TM-650 2.4.24 IPC TM-650 2.4.24 IPC TM-650 2.4.24

    363 424 >60 15 10 13-14 25 150 0.65

    3. Mechanical Properties
    Peel Strength to Copper (1 oz/35 micron) After Thermal Stress At Elevated Temperatures After Process Solutions Youngs Modulus Flexural Strength (lengthwise/crosswise) Tensile Strength Compressive Modulus Poissons Ratio (x, y) lb/in (N/mm) lb/in (N/mm) lb/in (N/mm) Mpsi (GPa) kpsi (MPa) kpsi (MPa) kpsi (MPa) % g/cm3 W/mK 8.5 (1.5) 8.0 (1.4) 8.4 (1.5) 4.0 (27.6) 72/58 (496/400) 35 (239) 0.21, 0.19 0.16 1.6 0.45 V0 IPC TM-650 2.4.8 IPC TM-650 2.4.8.2 IPC TM-650 2.4.8 IPC TM-650 2.4.18.3 IPC TM-650 2.4.4 IPC TM-650 2.4.18.3 ASTM D-695 ASTM D-3039 IPC TM-650 2.6.2.1 ASTM D792 Method A ASTM E1461 UL-94

    4. Physical Properties
    Water Absorption Density Thermal Conductivity Flammability Class

    Results listed above are typical properties, provided without warranty, expressed or implied, and without liability. Properties may vary, depending on design and application. Arlon reserves the right to change or update these values.

    Availability:
    Arlon Part Number EP20482 EP20484 EP20683 EP26781 EP28078 EP22661 EP22848 Glass Style Resin % Nominal Press Thickness (mils) 2.5 3.0 3.5 4.0 5.0 6.0 8.0 Flow %

    104 104 106 1067 1080 2116 7828

    82% 84% 83% 81% 78% 61% 48%

    28 30 28 24 26 20 14

    Recommended Process Conditions:


    Process inner-layers through develop, etch, and strip using standard industry practices. Use brown oxide on inner layers. Adjust dwell time in the oxide bath to ensure uniform coating. Bake inner layers in a rack for 60 minutes at 225F - 250F (107C - 121C) immediately prior to lay-up. Store prepreg at 60-70F at or below 30% RH. Vacuum desiccate the prepreg for 8 - 12 hours prior to lamination. Lamination Cycle: 1) Pre-vacuum for 30 - 45 minutes 2) Control the heat rise to 8F - 12F (4C - 6C) per minute between 150F and 250F (65C and 121C). Vacuum lamination is preferred. Start point vacuum lamination pressures are shown in the table below:
    Panel Size in cm psi Pressure kg/sq cm
    19 25 28

    12 x 18 16 x 18 18 x 24

    40 x 46 30 x 46 46 x 61

    275 350 400

    Pressure / 29 Vacuum psi kg/cm2


    200 250 300 14.0 17.5 21.0

    3) Product temperature at start of cure = 410F (210C). 4) Cure time at temperature = 60 minutes for Inner cores, 90 minutes final lamination 5) Cool down under pressure at 10F/min (5C/min) Drill at 325-350 SFM with 0.8 to 1.0mil chip-load. Undercut bits are recommended for vias 0.018 (0.045cm) and smaller De-smear using alkaline permanganate or plasma with settings appropriate for polyimide; plasma is preferred for positive etchback Conventional plating processes are compatible with EP2. May not require plasma etchback (3 point contact) for reliable plating performance. Standard profiling parameters may be used; chip breaker style router bits are not recommended Bake for 1 - 2 hours at 250F (121C) prior to solder reflow or HASL.

    EP2

    North America: 9433 Hyssop Drive, Rancho Cucamonga, California 91730 Tel: (909) 987-9533 Fax: (909) 987-8541 1100 Governor Lea Road, Bear, Delaware, 19701 Tel: (302) 834-2100, (800) 635-9333 Fax: (302) 834-2574 Northern Europe: 44 Wilby Avenue, Little Lever, Bolton, Lancaster, BL31QE, UK Tel/Fax: (44) 120-457-6068 Southern Europe: 1 Bis Rue de la Remarde, 91530 Saint Cheron, France Tel: (33) 871-096-082 Fax: (33) 164-566-489 Arlon Material Technologies No. 20 Datong Road, Export Processing Zone, Suzhou New & High District, Jiangsu, China Tel (86) 512-6269-6966 Fax: (86) 512-6269-6038 Arlon Electronic Materials (Suzhou) Co., Ltd. Building 7, Da Xing Industrial Park of Suzhou New & High District Jinangsu, China 21500 Tel: (86) 512-6672-1698 Fax: (86) 512-6672-1697 Eastern China: Room 11/401, No. 8, Hong Gu Road, Shanghai, China, 200336 Tel/Fax: (86) 21-6209-0202 Southern China: Room 601, Unit 1, Building 6, Liyuanxincun, Road Holiday, Hua qiaocheng, Nanshan District, Shenzhen City, China Tel: (86) 755-26906612 Fax: (86) 755-26921357

    TECHNOLOGY ENABLING INNOVATION

    Rev 1.6

    www.arlon-med.com

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