MAX3232 3V TO 5.

5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER WITH 15kV ESD PROTECTION

SLLS410I JANUARY 2000 REVISED JANUARY 2004

D RS-232 Bus-Pin ESD Protection Exceeds D D D D D D D D D

15 kV Using Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates Up To 250 kbit/s Two Drivers and Two Receivers Low Supply Current . . . 300 A Typical External Capacitors . . . 4 0.1 F Accepts 5-V Logic Input With 3.3-V Supply Alternative High-Speed Pin-Compatible Device (1 Mbit/s) SNx5C3232 Applications Battery-Powered Systems, PDAs, Notebooks, Laptops, Palmtop PCs, and Hand-Held Equipment

D, DB, DW, OR PW PACKAGE (TOP VIEW)

C1+ V+ C1 C2+ C2 V DOUT2 RIN2

1 2 3 4 5 6 7 8

16 15 14 13 12 11 10 9

VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2

description/ordering information
ORDERING INFORMATION
TA SOIC (D) SOIC (DW) 0C to 70C SSOP (DB) TSSOP (PW) SOIC (D) SOIC (DW) 40C to 85C SSOP (DB) TSSOP (PW) PACKAGE Tube of 40 Reel of 2500 Tube of 40 Reel of 2000 Tube of 80 Reel of 2000 Tube of 90 Reel of 2000 Tube of 40 Reel of 2500 Tube of 40 Reel of 2000 Tube of 80 Reel of 2000 Tube of 90 Reel of 2000 ORDERABLE PART NUMBER MAX3232CD MAX3232CDR MAX3232CDW MAX3232CDWR MAX3232CDB MAX3232CDBR MAX3232CPW MAX3232CPWR MAX3232ID MAX3232IDR MAX3232IDW MAX3232IDWR MAX3232IDB MAX3232IDBR MAX3232IPW MAX3232IPWR MB3232I MB3232I MAX3232I MAX3232I MA3232C MA3232C MAX3232C MAX3232C TOP-SIDE MARKING

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright 2004, Texas Instruments Incorporated

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

SLLS410I JANUARY 2000 REVISED JANUARY 2004

MAX3232 3V TO 5.5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER WITH 15kV ESD PROTECTION
description/ordering information (continued)
The MAX3232 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with 15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/s driver output slew rate. Function Tables
EACH DRIVER INPUT DIN L H OUTPUT DOUT H L

H = high level, L = low level EACH RECEIVER INPUT RIN L H Open OUTPUT ROUT H L H

H = high level, L = low level, Open = input disconnected or connected driver off

logic diagram (positive logic)

11 DIN1 10 DIN2 12 ROUT1 9 ROUT2 8 RIN2 13 RIN1 7 DOUT2 14 DOUT1

POST OFFICE BOX 655303

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MAX3232 3V TO 5.5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER WITH 15kV ESD PROTECTION
SLLS410I JANUARY 2000 REVISED JANUARY 2004

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 6 V Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 7 V Negative output supply voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 7 V Supply voltage difference, V+ V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V Input voltage range, VI: Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 6 V Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 V to 25 V Output voltage range, VO: Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2 V to 13.2 V Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to VCC + 0.3 V Package thermal impedance, JA (see Notes 2 and 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 82C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 57C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . 108C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65C to 150C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to network GND. 2. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. 3. The package thermal impedance is calculated in accordance with JESD 51-7.

recommended operating conditions (see Note 4 and Figure 4)

MIN Supply voltage VIH VIL VI TA Driver high-level input voltage Driver low-level input voltage Driver input voltage Receiver input voltage MAX3232C Operating free-air temperature MAX3232I DIN VCC = 3.3 V VCC = 5 V VCC = 3.3 V VCC = 5 V DIN DIN 3 4.5 2 2.4 0.8 0 25 0 40 5.5 25 70 85 V C V V NOM 3.3 5 MAX 3.6 5.5 V UNIT

NOTE 4: Test conditions are C1C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2C4 = 0.33 F at VCC = 5 V 0.5 V.

electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER ICC TEST CONDITIONS MIN TYP MAX 1 UNIT mA Supply current No load, VCC = 3.3 V or 5 V 0.3 All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. NOTE 4: Test conditions are C1C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2C4 = 0.33 F at VCC = 5 V 0.5 V.

POST OFFICE BOX 655303

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SLLS410I JANUARY 2000 REVISED JANUARY 2004

MAX3232 3V TO 5.5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER WITH 15kV ESD PROTECTION
DRIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER VOH VOL IIH IIL IOS High-level output voltage Low-level output voltage High-level input current Low-level input current Short-circuit output current TEST CONDITIONS DOUT at RL = 3 k to GND, DOUT at RL = 3 k to GND, VI = VCC VI at GND VCC = 3.6 V, VCC = 5.5 V, VO = 0 V VO = 0 V DIN = GND DIN = VCC MIN 5 5 TYP 5.4 5.4 0.01 0.01 35 1 1 60 MAX UNIT V V A A mA

ro Output resistance VCC, V+, and V = 0 V, VO = 2 V 300 10M W All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. NOTE 4: Test conditions are C1C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2C4 = 0.33 F at VCC = 5 V 0.5 V.

switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER Maximum data rate tsk(p) SR(tr) Pulse skew Slew rate, transition region (see Figure 1) TEST CONDITIONS CL = 1000 pF, One DOUT switching, CL = 150 pF to 2500 pF RL = 3 k to 7 k, VCC = 3.3 V RL = 3 k, See Figure 1 RL = 3 k to 7 k, See Figure 2 CL = 150 pF to 1000 pF CL = 150 pF to 2500 pF 6 4 MIN 150 TYP 250 300 30 30 MAX UNIT kbit/s ns V/s

All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. Pulse skew is defined as |tPLH tPHL| of each channel of the same device. NOTE 4: Test conditions are C1C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2C4 = 0.33 F at VCC = 5 V 0.5 V.

POST OFFICE BOX 655303

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MAX3232 3V TO 5.5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER WITH 15kV ESD PROTECTION
SLLS410I JANUARY 2000 REVISED JANUARY 2004

RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER VOH VOL VIT+ VIT Vhys ri High-level output voltage Low-level output voltage Positive-going input threshold voltage Negative-going input threshold voltage Input hysteresis (VIT+ VIT) Input resistance TEST CONDITIONS IOH = 1 mA IOL = 1.6 mA VCC = 3.3 V VCC = 5 V VCC = 3.3 V VCC = 5 V 0.6 0.8 MIN VCC0.6 V TYP VCC0.1 V 0.4 1.5 1.8 1.2 1.5 0.3 7 V V kW 2.4 2.4 V MAX UNIT V V

VI = 3 V to 25 V 3 5 All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. NOTE 4: Test conditions are C1C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2C4 = 0.33 F at VCC = 5 V 0.5 V.

switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 3)
PARAMETER tPLH tPHL tsk(p) Propagation delay time, low- to high-level output Propagation delay time, high- to low-level output Pulse skew CL= 150 pF TEST CONDITIONS MIN TYP 300 300 300 MAX UNIT ns ns ns

All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. Pulse skew is defined as |tPLH tPHL| of each channel of the same device. NOTE 4: Test conditions are C1C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2C4 = 0.33 F at VCC = 5 V 0.5 V.

PARAMETER MEASUREMENT INFORMATION

Input Generator (see Note B) RS-232 Output 50 RL CL (see Note A) Output TEST CIRCUIT tTHL 3V 3 V SR(tr) + 6V or t VOLTAGE WAVEFORMS TLH 3V 3 V 3V 1.5 V 1.5 V 0V tTLH VOH VOL

THL

NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.

Figure 1. Driver Slew Rate

POST OFFICE BOX 655303

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SLLS410I JANUARY 2000 REVISED JANUARY 2004

MAX3232 3V TO 5.5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER WITH 15kV ESD PROTECTION
PARAMETER MEASUREMENT INFORMATION
3V Generator (see Note B) RS-232 Output 50 RL CL (see Note A) Output TEST CIRCUIT Input tPHL 50% VOLTAGE WAVEFORMS 1.5 V 1.5 V 0V tPLH VOH 50% VOL

NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.

Figure 2. Driver Pulse Skew

Input Output Generator (see Note B) 50 CL (see Note A) Output TEST CIRCUIT tPHL

3V 1.5 V 1.5 V 3 V tPLH VOH 50% VOLTAGE WAVEFORMS 50% VOL

NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.

Figure 3. Receiver Propagation Delay Times

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

MAX3232 3V TO 5.5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER WITH 15kV ESD PROTECTION
SLLS410I JANUARY 2000 REVISED JANUARY 2004

APPLICATION INFORMATION
1 VCC 16 + CBYPASS = 0.1F 2 + C3 3 V+ GND 15

C1+

+ C1

14 C1 13 C2+ 5 k DOUT1

4 + C2

RIN1

5 C2 12 6 C4 DOUT2 + 7 10 DIN2 V 11 ROUT1

DIN1

RIN2

8 5 k

ROUT2

C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. VCC vs CAPACITOR VALUES VCC 3.3 V 0.3 V 5 V 0.5 V 3 V to 5.5 V C1 0.1 F 0.047 F 0.1 F C2, C3, C4 0.1 F 0.33 F 0.47 F

Figure 4. Typical Operating Circuit and Capacitor Values

POST OFFICE BOX 655303

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11-Apr-2013

PACKAGING INFORMATION
Orderable Device MAX3232CD MAX3232CDB MAX3232CDBE4 MAX3232CDBG4 MAX3232CDBR MAX3232CDBRE4 MAX3232CDBRG4 MAX3232CDE4 MAX3232CDG4 MAX3232CDR MAX3232CDRE4 MAX3232CDRG4 MAX3232CDW MAX3232CDWG4 MAX3232CDWR MAX3232CDWRE4 MAX3232CDWRG4 Status
(1)

Package Type Package Pins Package Drawing Qty SOIC SSOP SSOP SSOP SSOP SSOP SSOP SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC D DB DB DB DB DB DB D D D D D DW DW DW DW DW 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 40 80 80 80 2000 2000 2000 40 40 2500 2500 2500 40 40 2000 2000 2000

Eco Plan
(2)

Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU

MSL Peak Temp

(3)

Op Temp (C) 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70

Top-Side Markings
(4)

Samples

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM

MAX3232C MA3232C MA3232C MA3232C MA3232C MA3232C MA3232C MAX3232C MAX3232C MAX3232C MAX3232C MAX3232C MAX3232C MAX3232C MAX3232C MAX3232C MAX3232C

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Orderable Device MAX3232CPW MAX3232CPWE4 MAX3232CPWG4 MAX3232CPWR MAX3232CPWRE4 MAX3232CPWRG4 MAX3232ID MAX3232IDB MAX3232IDBE4 MAX3232IDBG4 MAX3232IDBR MAX3232IDBRE4 MAX3232IDBRG4 MAX3232IDE4 MAX3232IDG4 MAX3232IDR MAX3232IDRE4 MAX3232IDRG4

Status
(1)

Package Type Package Pins Package Drawing Qty TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP SOIC SSOP SSOP SSOP SSOP SSOP SSOP SOIC SOIC SOIC SOIC SOIC PW PW PW PW PW PW D DB DB DB DB DB DB D D D D D 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 90 90 90 2000 2000 2000 40 80 80 80 2000 2000 2000 40 40 2500 2500 2500

Eco Plan
(2)

Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU

MSL Peak Temp

(3)

Op Temp (C) 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85

Top-Side Markings
(4)

Samples

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM

MA3232C MA3232C MA3232C MA3232C MA3232C MA3232C MAX3232I MB3232I MB3232I MB3232I MB3232I MB3232I MB3232I MAX3232I MAX3232I MAX3232I MAX3232I MAX3232I

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Orderable Device MAX3232IDW MAX3232IDWE4 MAX3232IDWG4 MAX3232IDWR MAX3232IDWRE4 MAX3232IDWRG4 MAX3232IPW MAX3232IPWE4 MAX3232IPWG4 MAX3232IPWR MAX3232IPWRE4 MAX3232IPWRG4 SN003232CPWR

Status
(1)

Package Type Package Pins Package Drawing Qty SOIC SOIC SOIC SOIC SOIC SOIC TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP DW DW DW DW DW DW PW PW PW PW PW PW PW 16 16 16 16 16 16 16 16 16 16 16 16 16 40 40 40 2000 2000 2000 90 90 90 2000 2000 2000 2000

Eco Plan
(2)

Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU

MSL Peak Temp

(3)

Op Temp (C) -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 0 to 70

Top-Side Markings
(4)

Samples

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM

MAX3232I MAX3232I MAX3232I MAX3232I MAX3232I MAX3232I MB3232I MB3232I MB3232I MB3232I MB3232I MB3232I MA3232C

(1)

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined.

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Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF MAX3232 :

Enhanced Product: MAX3232-EP

NOTE: Qualified Version Definitions:

Enhanced Product - Supports Defense, Aerospace and Medical Applications

Addendum-Page 4

PACKAGE MATERIALS INFORMATION

www.ti.com 5-Jul-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins Type Drawing SOIC SOIC SOIC TSSOP TSSOP SSOP SOIC SOIC SOIC TSSOP D DW DW PW PW DB D DW DW PW 16 16 16 16 16 16 16 16 16 16

SPQ

Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 16.4 16.4 16.4 12.4 12.4 16.4 16.4 16.4 16.4 12.4 6.5 10.75 10.75 7.0 6.9 8.2 6.5 10.75 10.75 6.9

B0 (mm) 10.3 10.7 10.7 5.6 5.6 6.6 10.3 10.7 10.7 5.6

K0 (mm) 2.1 2.7 2.7 1.6 1.6 2.5 2.1 2.7 2.7 1.6

P1 (mm) 8.0 12.0 12.0 8.0 8.0 12.0 8.0 12.0 12.0 8.0

W Pin1 (mm) Quadrant 16.0 16.0 16.0 12.0 12.0 16.0 16.0 16.0 16.0 12.0 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1

MAX3232CDRG4 MAX3232CDWR MAX3232CDWRG4 MAX3232CPWR MAX3232CPWRG4 MAX3232IDBR MAX3232IDRG4 MAX3232IDWR MAX3232IDWRG4 MAX3232IPWR

2500 2000 2000 2000 2000 2000 2500 2000 2000 2000

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PACKAGE MATERIALS INFORMATION

www.ti.com 5-Jul-2013

*All dimensions are nominal

Device MAX3232CDRG4 MAX3232CDWR MAX3232CDWRG4 MAX3232CPWR MAX3232CPWRG4 MAX3232IDBR MAX3232IDRG4 MAX3232IDWR MAX3232IDWRG4 MAX3232IPWR

Package Type SOIC SOIC SOIC TSSOP TSSOP SSOP SOIC SOIC SOIC TSSOP

Package Drawing D DW DW PW PW DB D DW DW PW

Pins 16 16 16 16 16 16 16 16 16 16

SPQ 2500 2000 2000 2000 2000 2000 2500 2000 2000 2000

Length (mm) 333.2 366.0 367.0 364.0 367.0 367.0 333.2 366.0 367.0 367.0

Width (mm) 345.9 364.0 367.0 364.0 367.0 367.0 345.9 364.0 367.0 367.0

Height (mm) 28.6 50.0 38.0 27.0 35.0 38.0 28.6 50.0 38.0 35.0

Pack Materials-Page 2

MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001

DB (R-PDSO-G**)
28 PINS SHOWN 0,65 28 0,38 0,22 15 0,15 M

PLASTIC SMALL-OUTLINE

0,25 0,09 5,60 5,00 8,20 7,40

Gage Plane 1 A 14 08 0,25 0,95 0,55

Seating Plane 2,00 MAX 0,05 MIN 0,10

PINS ** DIM A MAX

14

16

20

24

28

30

38

6,50

6,50

7,50

8,50

10,50

10,50

12,90

A MIN

5,90

5,90

6,90

7,90

9,90

9,90

12,30 4040065 /E 12/01

NOTES: A. B. C. D.

All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150

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