Using ADS8410/13 in Daisy-Chain Mode: Application Report

Download as pdf or txt
Download as pdf or txt
You are on page 1of 36

Application Report

SLAA296 May 2006

Using ADS8410/13 in Daisy-Chain Mode


Bhaskar Goswami, Vikash Sethia ....................................................................................... DAP Nyquist ABSTRACT Many applications require multiple analog-to-digital converters (ADC) in a system. Daisy chaining multiple ADCs enables the use of a single data receiver or a small FPGA. It offers easy and minimal digital routing. This application report describes how multiple ADCs (ADS8410/13) work in a daisy-chain mode. The device offers a high-speed (200 Mbps) LVDS serial interface. This application report also suggests a way to de-serialize high-speed serial data. It discusses the board design aspects and test guidelines. It also presents reference schematics and layouts for the boards. Finally, the reference board results are presented.

Contents 1 Introduction .......................................................................................... 2 2 Description of the Device .......................................................................... 2 3 Digital Interface ..................................................................................... 2 4 Definition of Daisy Chain .......................................................................... 3 5 Block Diagram ...................................................................................... 3 6 Timing ................................................................................................ 4 7 Board Design Aspects ............................................................................ 12 8 System Block Diagram ........................................................................... 17 9 De-Serialization.................................................................................... 19 10 Limitation on Number of Devices in the Chain ................................................ 20 11 Results .............................................................................................. 20 12 Conclusion ......................................................................................... 24 Appendix A ADS8413EVM Daisy Chain Schematics, Layout, and Photograph ............... 25 List of Figures 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Three Devices in Daisy Chain .................................................................... 3 Four Devices in Daisy-Chain Mode .............................................................. 4 Sample and Convert With Wait (Less Than 2-MSPS Throughput) .......................... 6 Sample and Convert With No Wait or Back to Back (2-MSPS Throughput)................ 6 Data Read With CS Low and BYTE = 0 ......................................................... 7 Start of Data Read Cycle With RD and CS Low and Device in Wait or Sample Phase .. 8 Start of Data Read Cycle With End of Conversion ............................................. 9 Data Read Cycle End With MODE C/D = 0 ..................................................... 9 Data Read Operation for Devices in Daisy-Chain Mode ..................................... 10 Data Propagation From Device n to Device n+1 in Daisy-Chain Mode .................... 11 Four Devices Placed in Straight Line Fashion ................................................ 12 Four Devices Placed in Circular Fashion ...................................................... 12 LVDS Driver/ Receiver in Point-to-Point Connection ......................................... 12 CLK_O and SYNC_O Connection Between Last Device and the Deserializers.......... 13 Terminating at Both Receivers .................................................................. 13 Terminating at One Receiver .................................................................... 13 Terminating at Source End ...................................................................... 14 Analog and Digital Circuitry Are Separated in the Layout With a Virtual Boundary ..... 15

SLAA296 May 2006 Submit Documentation Feedback

Using ADS8410/13 in Daisy-Chain Mode

www.ti.com

Introduction 19 20 21 22 23 24 25 26 27 Devices Are Rotated and Placed to Reduce LVDS Trace Length.......................... LVDS Routing ..................................................................................... First and Second Device in the Chain .......................................................... Third and Forth Device in the Chain ............................................................ Last ADC in the Chain and the Deserializers ................................................. CLK_I and CLK_O of Device 1 .................................................................. CLK_I and CLK_O of Device 2 ................................................................. CLK_I and CLK_O of Device 3 .................................................................. CLK_I and CLK_O of Device 4 .................................................................. List of Tables 1 2 3 4 CONVST and CSTART Timing Control.......................................................... 6 Clock Duty Cycle .................................................................................. 21 Linearity of Four Devices in the Chain ......................................................... 23 SNR and THD of Four Devices in the Chain .................................................. 23 16 17 18 19 20 21 22 22 23

Introduction
In many applications, multiple ADCs are used to convert several analog channels. For stand-alone ADCs (i.e., ADCs without an option for daisy chain or cascade) multiple digital outputs are sometimes multiplexed with a digital multiplexer. In other cases, a high pin-count FPGA or DSP is used to receive multiple digital outputs. To avoid this complexity, the ADS8410/13 offers a daisy-chain mode (explained in detail later) in which data from multiple devices are transmitted through the chain and is received from only the last device. Layout is simpler because of point-to-point connection. The serial LVDS (low voltage differential signaling) interface offers high- speed (200 Mbps) data transmission to enable the use of more devices for a given throughput. The low differential swing in LVDS mode causes lower ground bounce in the system and less crosstalk among the digital signals. This helps to achieve a better signal-to-noise ratio in a system.

Description of the Device


The ADS8410 and ADS8413 are 16-bit 2-MSPS A/D converters with 4-V internal reference. The devices include a capacitor-based SAR A/D converter with inherent sample and hold. These devices offer a 200-Mbps serial LVDS interface. The interface is designed to support cascading and daisy chaining of multiple devices. There is a mode to select 16/8-bit data frame to interface with shift registers for converting the data to parallel format. ADS8410 has pseudo-differential input stage. The IN swing of 200 mV is useful for compensating the ground voltage mismatch between the ADC and the sensor and also for canceling the common-mode noise. The ADS8413 has unipolar differential input range, which supports differential input swing of VREF to +VREF with a common mode of +VREF/2. The devices operate at a lower power when used at lower conversion rates, because of the nap feature. Nap mode shuts down the device partially when the device is not converting. These devices are available in a 48-pin QFN package.

Digital Interface
The ADS8410/13 offers 200 Mbps LVDS interface. LVDS is current output which terminates at the receiver with a 100- resistor which converts it to voltage. The high speed offers more device integration in a system at a given ADC sampling rate. LVDS has a typical differential swing of 680 mV (+680 mV for logic 1 and 680 mV for logic 0) which is better in a low-noise system. The differential nature of this signaling filters any common-mode noise.

Using ADS8410/13 in Daisy-Chain Mode

SLAA296 May 2006 Submit Documentation Feedback

www.ti.com

Definition of Daisy Chain

Definition of Daisy Chain


In daisy-chain mode, multiple devices are connected such that each device receives the previous devices data and transfers it along with its own data. Consider a situation where N devices are in the chain. The second device receives the first devices data and passes this data along with its own data to the third device. The third device sends its own data along with first and second devices data. The Nth device sends its own data with all N - 1 devices' data. Finally, one receiver is connected to the Nth device, which collects all the data from the Nth device. Figure 1 shows how three (N = 3) devices work in a daisy chain.
st
nd

1 Device

D1

2 Device

rd

D2

D1

3 Device

D3

D2

D1

Receiver

Figure 1. Three Devices in Daisy Chain

Block Diagram
Figure 2 shows how four devices are connected in a daisy chain using the ADS8410/13. MODE C/D (cascade or daisy-chain mode) has to be logic zero to operate in daisy-chain mode. The first device in the chain is identified by LAT Y/N = 0. For all other devices, LAT Y/N = 1. LAT Y/N signifies that the first device sends out data without latency and the other devices send out data with latency. Either CSTART (LVDS) or CONVST(CMOS) is used as a conversion start signal. Depending on the CLK I/E signal, the first device either takes in an external clock or generates an internal clock. This clock is used as the master clock for all the devices in the daisy chain, and the interface is synchronized with this clock. Other devices can only accept CLK_O from the previous device as an external clock. SDI (Serial Data Input) and SYNC_I (Frame Sync Input) of the first device should be logic 0 (+ve terminal to GND and ve terminal to +VBD). BUS_BUSY = 1 signifies that the device is busy sending out data in the bus. RD is Data Read Request to the Device and also acts as a handshake signal for daisy-chain and cascade operation. RD = 1 brings about a 3-state device output. BUS_BUSY of the last device can be connected to RD of the first device. Otherwise, BUS_BUSY of the last device should be kept floating. RD of the first device should be connected to GND in this case.

SLAA296 May 2006 Submit Documentation Feedback

Using ADS8410/13 in Daisy-Chain Mode

www.ti.com

Timing
VDD/GND

GND

GND

GND

GND

GND

GND

GND

VDD

VDD

VDD LAT Y/N CONVST CSZ

IN1

IN3

CLK I/E

CLK I/E

CLK I/E

IN4

ANALOG IN

ANALOG IN

ANALOG IN

ANALOG IN

LAT Y/N

LAT Y/N

MODE C/D

MODE C/D

MODE C/D

LAT Y/N

Device #1 SDI SDO

Device #2 SDI SDO CLK_O BUS_BUSY

Device #3 SDI SDO

Device #4 SDI SDO

SYNC_I SYNC_O CLK_I RD CLK_O BUS_BUSY

SYNC_I SYNC_O CLK_I RD

SYNC_I SYNC_O CLK_I RD CLK_O BUS_BUSY

SYNC_I SYNC_O CLK_I RD CLK_O BUS_BUSY

CONVST

CONVST

CONVST

CSTART

Separate CS , CONVST , CSTART

for each IC

Figure 2. Four Devices in Daisy-Chain Mode

6 6.1

Timing Timing Requirements


in the following timing table, all specifications are typical at 40C to 85C, +VA= +5 V, +VBD = +5 V and 3.3 V (unless otherwise noted).
PARAMETER SAMPLING AND CONVERSION RELATED tacq Acquisition time 100 391 100 40 5 5 +VBD = 5 V +VBD = 3.3 V +VBD = 5 V +VBD = 3.3 V 100 13 14 7 8 ns ns ns ns ns ns ns Figure 3, Figure 4 Figure 3, Figure 4 Figure 3 Figure 3, Figure 4 Figure 3 Figure 3, Figure 4 Figure 3, Figure 4 Figure 3, Figure 4 Figure 3 , Table 1 MIN TYP MAX UNIT REF

tconv Conversion time tw1 tw2 td1 td2 td3 td4 tw3 Pulse duration, CONVST high Pulse duration, CONVST low Delay time, CONVST rising edge to sample start Delay time, CONVST falling edge to conversion start Delay time, CONVST falling edge to busy high

Delay time, conversion end to busy low Pulse duration, CSTART high

CSTART

CSTART

CSTART

CSZ

CSZ

CS

MODE C/D

CLK I/E
ns ns

Using ADS8410/13 in Daisy-Chain Mode

SLAA296 May 2006 Submit Documentation Feedback

VDD

IN2

www.ti.com

Timing
PARAMETER tw4 Pulse duration, CSTART low MIN 45 TYP MAX UNIT ns REF Figure 3, Figure 4 , Table 1 Figure 3, Figure 4 Table 1 Figure 3, Figure 4 Table 1 Figure 3, Figure 4 Table 1

td5

Delay time, CSTART rising edge to sample start

7.5

ns

td6

Delay time, CSTART falling edge to conversion start +VBD = 5 V

7.5 15.5 16.5

ns

td7

Delay time, CSTART falling edge to busy high

+VBD = 3.3 V

ns

I/O RELATED td8 td9 td10 td11 td12 td13 tw5 td14 td15 td16 tpd1 td18 td19 tclk Delay time, RD falling edge while CS low to BUS_BUSY high Delay time, RD falling edge while CS low to SYNC_O and SDO out of 3-state condition (for device with LAT_Y/N pulled low) +VBD = 5 V +VBD = 3.3 V 16 28 29 22 7 8 6 +VBD = 5 V +VBD = 3.3 V 5 + 4*tCLK 5.5 + 4*tCLK 5 +VBD = 5 V +VBD = 3.3 V +VBD = 5 V +VBD = 3.3 V 4*tCLK 6 4*tCLK 6.5 1.3 1.4 4*tCLK 2.5 4*tCLK 3 4 11 + 0.5*tCLK 7 8 40 40.5 190 200 210 9 + tCLK 8 + 5*tCLK 8.5 + 5*tCLK ns ns Figure 6 Figure 7 ns Figure 6

Delay time, pre_conversion end (point A) to SYNC_O and SDO out of 3-state condition Delay time, pre_conversion end (point A) to BUS_BUSY high Delay time, conversion phase end to SYNC_O high Delay time, RD falling edge while CS low to SYNC_O high Pulse duration, RD low for device in no latency mode Delay time, CLK_O rising edge to data valid Delay time, BUS_BUSY low to SYNC_O high in daisy-chain mode indicating receiving device to output data Delay time, CLK_O to SDO and SYNC_O 3-state Propagation delay time, SYNC_I to SYNC_O in daisy-chain mode Delay time, RD rising edge to BUS_BUSY high for device with LAT_Y/N = 1 Delay time, point A indicating clear for bus 3-state release to BUSY falling edge CLK frequency (serial data rate) +VBD = 5 V +VBD = 3.3 V +VBD = 5 V +VBD = 3.3 V +VBD = 5 V +VBD = 3.3 V

ns ns ns ns ns

Figure 7 Figure 7 Figure 6 Figure 9 Figure 6, Figure 7 Figure 8, Figure 10 Figure 8, Figure 10 Figure 10 Figure 9

ns ns ns ns

ns MHz

Figure 7

6.2

Sample and Convert


The sampling and conversion process is controlled by the CSTART (LVDS) or CONVST (CMOS) signal. Both signals are functionally identical. The following diagrams show control with CONVST. The rising edge of CONVST (or CSTART) starts the sample phase, if the conversion has completed and the device is in the wait state. Figure 4 shows the case when the device is in the conversion phase at the rising edge of CONVST. In this case, the sample phase starts immediately at the end of the conversion phase, and there is no wait state.

SLAA296 May 2006 Submit Documentation Feedback

Using ADS8410/13 in Daisy-Chain Mode

www.ti.com

Timing

Figure 3. Sample and Convert With Wait (Less Than 2-MSPS Throughput)

Figure 4. Sample and Convert With No Wait or Back to Back (2-MSPS Throughput) The device ends the sample phase and enters the conversion phase on the falling edge of CONVST (CSTART). A high level on the BUSY output indicates an ongoing conversion. The device conversion time is fixed. The falling edge of CONVST (CSTART) during the conversion phase aborts the ongoing conversion. A data read after a conversion abort fetches invalid data. Valid data is only available after a sample phase and a conversion phase has completed. The timing diagram for control with CSTART is similar to Figure 3 and Figure 4. Table 1 shows the equivalent timing for control with CONVST and CSTART. Table 1. CONVST and CSTART Timing Control
TIMING FOR CONTROL WITH CONVST tw1 tw2 t1 t2 t3 TIMING FOR CONTROL WITH CSTART tw3 tw4 t5 t6 t7

6.3

Data Read Operation


The ADS8413 supports a 200-MHz serial LVDS interface for data read operation. The three signal LVDS interface (SDO, CLK_O, and SYNC_O) is well suited for high-speed data transfers. An application with a single device or multiple devices can be implemented with a daisy-chain or cascade configuration. The following sections discuss data read timing when a single device is used.

Using ADS8410/13 in Daisy-Chain Mode

SLAA296 May 2006 Submit Documentation Feedback

www.ti.com

Timing

6.3.1

Data Read for a Single Device (See Table 1 for Device Configuration) For a single device, the two possible read cycle starts are: a data read cycle start during a wait or sample phase or a data read cycle start at the end of a conversion phase. Read cycle end conditions can change depending on MODE C/D selection. Figure 5 explains the data read cycle. The details of a read frame start with the two previous listed conditions and a read cycle end with MODE C/D selection are explained in Figure 6, Figure 7, and Figure 8, respectively.
See Figure 6 See Figures 7 and 8

RD

SYNC_O CLK_O 1F 1R 2R 18F 18R

SDO D15 BUS BUSY D14 D0

Figure 5. Data Read With CS Low and BYTE = 0 As shown in Figure 5, a new data read cycle is initiated with the falling edge of RD, if CS is low and the device is in a wait or sample phase. The device releases the LVDS o/p (SYNC_O, SDO) from 3-state and sets BUS_BUSY high at the start of the read cycle. The SYNC_O cycle is 16 clocks wide (rising edge to rising edge) if the BYTE input is held low and can be used to synchronize a data frame. The clock count begins with the first CLK_O falling edge after a SYNC_O rising edge. The MSB is latched out on the second rising edge (2R) and each subsequent data bit is latched out on the rising edge of the clock. The receiver can shift data bits on the falling edges of the clock. The next rising edge of SYNC_O coincides with the 16th rising edge of the clock. D0 is latched out on the 17th rising edge of the clock. The receiver can latch the de-serialized 16-bit word on the 18th rising edge (18R, or the second rising edge after a SYNC_O rising edge). CS high during a data read results in a 3-state SYNC_O and SDO condition. These signals remain in the 3-state condition until the start of the next data read cycle. 6.3.2 Data Read Cycle Start During Wait or Sample Phase As shown in Figure 6, the falling edge of RD, with CS low and when the device is in a wait or sample phase, triggers the start of a read cycle. The cycle starts when BUS_BUSY goes high and SYNC_O, SDO are released from the 3-state condition. SYNC_O is low at the start and rises to a high level td13 ns after the falling edge of RD. As shown in Figure 6, the MSB is shifted on the 2nd rising edge of the clock (2R). Other details about the data read cycle are discussed in the previous section (see Figure 5).

SLAA296 May 2006 Submit Documentation Feedback

Using ADS8410/13 in Daisy-Chain Mode

www.ti.com

Timing
td9 RD

td13 td8 BUSY

BUS_BUSY 0R CLK_O 1F 1R 3R

SYNC_O td14 SDO_O MSB MSB - 1

Figure 6. Start of Data Read Cycle With RD and CS Low and Device in Wait or Sample Phase

6.3.3

Data Read Cycle Start at End of Conversion Phase (Read Without Latency, Back-to-Back) This mode is optimized for a data read immediately after the end of a conversion phase and ensures that the data read is complete before the sample end while running at 2 MSPS. Point A in Figure 7 indicates pre_conversion_end; it occurs td19 ns before the falling edge of BUSY or [(td2 + tcnv + td4) td19] ns after the falling edge of CONVST. A read cycle is initiated at point A if RD is issued before point A while CS is low. Alternately, RD and CS can be held low. At the start of the read cycle, BUS_BUSY rises to a high level and the LVDS outputs are released from the 3-state condition. The rising edge of SYNC_O, occurs td12 ns after the conversion end. As shown in Figure 7, the MSB is shifted on the 2nd rising edge of the clock (2R). Other details about the data read cycle are discussed in the previous section (see Figure 5).

Using ADS8410/13 in Daisy-Chain Mode

SLAA296 May 2006 Submit Documentation Feedback

www.ti.com

Timing
Conversion Phase A td19 Conversion End

RD_REQ (Int) td11 BUSY td10 BUS_BUSY O/P

td4

0R CLK_O td12 SYNC_O

1F

1R

2R

3R

td14 SDO_O MSB MSB 1

Figure 7. Start of Data Read Cycle With End of Conversion

6.3.4

Data Read Cycle End (With MODE C/D = 0) A data read cycle ends after all 16 bits have been serially latched out. Figure 8 shows the timing of the falling edge of BUS_BUSY and the rising edge of SYNC_O with respect to SDO. SYNC_O rises on the 16th rising edge of CLK_O. As shown in Figure 6 and Figure 7, the MSB is shifted out on the 2nd rising edge of CLK_O. Therefore, the LSB-1 is shifted out on the 16th rising edge of CLK_O.
CONVST CS = 0

BUS_BUSY td15 SYNC_O

15R CLK_O

16R

17R

18R

td16 SDO LSB 1 LSB

Figure 8. Data Read Cycle End With MODE C/D = 0

SLAA296 May 2006 Submit Documentation Feedback

Using ADS8410/13 in Daisy-Chain Mode

www.ti.com

Timing

The next two rising edges of CLK_O are shown as 17R and 18R in Figure 8. On 17R, the LSB is latched out, and on 18R, SDO and SYNC-O go to a 3-state condition. Note that BUS_BUSY falls td15 ns before the rising edge of SYNC_O when MODE C/D = 0. Care must be taken not to allow LVDS bus usage by any other device until the end of the read cycle or (td15 + 2/fclk + td16) ns after the falling edge of BUS_BUSY.

6.4

Timing Diagrams for Daisy-Chain Operation


The conversion speed for n devices in the chain must be selected such that: 1/conversion speed > read startup delay + n (data frame duration) + td16 Read startup delay = 10 ns + (td19 td4) + td12 + 2/fCLK Data frame duration = 16/fCLK Note that it is unnecessary for all devices in the chain to sample the data simultaneously. But, all of the devices must operate with the same exact conversion speed.
nth CONV n + 1 Tracking n + 1 Conversion

CONVST #1

See Figure 6 for details CS tw5 RD #1 BUS_BUSY #n (Last device) BUS_BUSY #1 RD #2

SDO #1 SDI #2

16Bit Data nth conversion See Figure 12 for details

SYNC_O #1 SYNC_I #2 td18 BUS_BUSY #2 RD #3 SDO #2 SDI #3 #1 16Bits nth conversion #2 16Bits nth conversion

SYNC_O #2 SYNC_I #3

Figure 9. Data Read Operation for Devices in Daisy-Chain Mode

6.5

Data Read Operation


On power up, BUS_BUSY of all of the devices is low. The devices receive CONVST or CSTART to sample and start the conversion. The first device in the chain starts the data read cycle at the end of its conversion. BUS_BUSY of device 1 (connected to RD of device 2) goes high on the read cycle start. Device 2 BUS_BUSY goes high on the rising edge of RD #1. This propagates until the last device in the

10

Using ADS8410/13 in Daisy-Chain Mode

SLAA296 May 2006 Submit Documentation Feedback

www.ti.com

Timing

chain. Device 2 receives CLK_I, SDI, and SYNC_I from device 1, and it passes all of these signals to the next device. Device 2 (and every subsequent device in the chain) passes the received signals to its output until it sees the falling edge of RD #1 (same as BUS_BUSY of the previous device). In daisy-chain mode, BUS_BUSY for any device falls when it has passed all of the previous device data followed by its own data. The falling edge of BUS_BUSY occurs before the rising edge of SYNC_O. This indicates to the receiving device that the previous data chain is over, and it is now the receiving device's turn to output the data. The device outputs the data from the last completed conversion. BUS_BUSY of the last device in the chain is fed back to RD of the first device (or device 1 RD tied to 0). This makes sure that RD of device 1 is low before its conversion is over. The chain continues with only one external signal (CONVST or CSTART) when CS is held low. Every device LVDS output goes to a 3-state condition once all data transfer through the device has been completed. CS going high during the data read cycle of any device places its SYNC_O and SDO in a 3-state condition. This halts the propagation of data through the chain. To reset this condition, it is necessary to assert CS high for all devices. The new read sequence starts only after CS for all devices is low before point A as shown in Figure 7. The high pulse on CS must be at least 20 ns wide. It is better to connect CS of all of the devices together to avoid undesired halting of the daisy chain.
CS = 0

BUS_BUSY #1 RD #2 td15 SYNC_O #1 SYNC_I #2 15R CLK_O #1 CLK_I #2 16R 17R td16 18R

SDO #1 SDO #2

LSB 1 #1

LSB #1

BUSY_BUS #2 = 1 17F 17R CLK_O #2 18R

tpd1 SYNC_O #2 #1 DATA LSB 1 #1

LSB #1

MSB

MSB 1

#2 DATA

Figure 10. Data Propagation From Device n to Device n+1 in Daisy-Chain Mode As shown in Figure 10, a propagation delay of tpd1 occurs from SYNC_I to SYNC_O or SDI to SDO. Note that the data frames of all devices in the chain appear seamless at the last device output. The rising edge of SYNC_O occurs at an interval of 16 clocks (or 8 clocks in BYTE mode); this can be used as data frame sync. The deserializer at the output of the last device can shift the data on every falling edge of the clock and it can latch the parallel 16-bit word on the second rising edge of CLK_O (shown as 18R) after every rising edge of SYNC_O.
SLAA296 May 2006 Submit Documentation Feedback Using ADS8410/13 in Daisy-Chain Mode 11

www.ti.com

Board Design Aspects

7 7.1

Board Design Aspects Placement


Consider an application where four devices are operated in daisy-chain mode. There aretwo ways to do this layout. The chain can be in a straight line fashion (as in Figure 11) or in a circular fashion (as in Figure 12).
1 Device
st

2 Device

nd

3 Device

rd

4 Device

th

Receiver

Figure 11. Four Devices Placed in Straight Line Fashion

3 Device

rd

4 Device

th

Receiver

2 Device

nd

1 Device

st

Figure 12. Four Devices Placed in Circular Fashion Any one of the layouts can be chosen depending on the area and shape of the printed-circuit board.

7.2

Signal Integrity
The device offers high speed LVDS CLK_O (Clock Output), SDO (Serial Data Output) and SYNC_O (Frame Sync Output) signals which have a typical rise time of only 700 ps. According to LVDS standards, the receiver termination needs to be 100 (shunt resistance between +ve and ve terminal of each LVDS signals) to have proper voltage swing. To avoid reflection, the differential characteristic impedance needs to match with the 100- termination. So, CLK_O, SDO, and SYNC_O differential traces need to have 100- differential characteristic impedance.

7.3

Termination Strategy
For point-to-point connection, LVDS signals are terminated with a 100- resistor at the receiver end as shown in Figure 13.

ADC

100 W

ADC

Figure 13. LVDS Driver/ Receiver in Point-to-Point Connection The differential characteristic impedance of the line should be maintained close to 100 . This strategy is followed for signals which connect one ADC to another ADC. As an example, this is followed for the traces between CLK_O of the first device and CLK_I (Clock Input) of the second device. This method is not valid for the signals which connect the last device in the chain to two deserializers which are in cascade (as shown in Figure 14).

12

Using ADS8410/13 in Daisy-Chain Mode

SLAA296 May 2006 Submit Documentation Feedback

www.ti.com

Board Design Aspects

ADC

SN65LVDS152

SN65LVDS152

Figure 14. CLK_O and SYNC_O Connection Between Last Device and the Deserializers One way to terminate this structure is to have two 100- resistor termination at both receiver ends (see Figure 15). But because LVDS is a current source, two parallel resistors drive the voltage swing to half. If your receiver has lower threshold than one half of LVDS differential swing and you have enough noise margin for your system, you can use this termination strategy.

ADC

100 W SN65LVDS152

100 W SN65LVDS152

Figure 15. Terminating at Both Receivers Another way to terminate is to put the termination at any one of the receiver ends. In this case, the signal is reflected from the receiver which is not terminated. Make sure that the trace length of the unterminated end from the common point is smaller than 0.6 inch (see Figure 16). This is valid for an FR4 printed-circuit board.
Smaller Than 0.6 inch

ADC

SN65LVDS152

100 W SN65LVDS152

Figure 16. Terminating at One Receiver One more way to terminate in this case is to terminate at the driver end. The signal gets reflected from the receiver ends once and gets absorbed at the driver end fully. Ensure that the trace length of the unterminated trace from the common point (see Figure 17, in this case point A to B, C to D, A to E, or C to F) is less than 0.6 inch.

SLAA296 May 2006 Submit Documentation Feedback

Using ADS8410/13 in Daisy-Chain Mode

13

www.ti.com

Board Design Aspects


A ADC 100 W B

D SN65LVDS152 E

F SN65LVDS152

Figure 17. Terminating at Source End

7.4

Layout Guidelines
ADS8410/13 offers high-speed digital interface. Analog and digital layout should not be mixed up. Analog placement and routing should be separated from the digital placement and routing as far as possible. The black line in Figure 18 is a virtual boundary for the analog and digital placement. Analog circuitry (operational amplifiers and reference input) is on the left side of the boundary. The digital circuitry (deserializer, clock multiplier, and digital buffers) is on the right side of the boundary.

14

Using ADS8410/13 in Daisy-Chain Mode

SLAA296 May 2006 Submit Documentation Feedback

www.ti.com

Board Design Aspects

Figure 18. Analog and Digital Circuitry Are Separated in the Layout With a Virtual Boundary Each device (ADS8410/13) is rotated appropriately and placed such that LVDS outputs from the previous device and LVDS inputs of the device connects in the shortest path. In Figure 19, the arrows indicate pin number 1 for each device. Note that a device is rotated by 90 degrees with respect to the previous device to make the LVDS lines short.

SLAA296 May 2006 Submit Documentation Feedback

Using ADS8410/13 in Daisy-Chain Mode

15

www.ti.com

Board Design Aspects

Figure 19. Devices Are Rotated and Placed to Reduce LVDS Trace Length ADS8410/13 offers high-speed (200 Mbps) LVDS interface. Therefore, it is important to meet setup and hold time requirements for LVDS signals. To achieve this, the length of CLK_O to CLK_I, SDO to SDI, and SYNC_O to SYNC_I (Figure 20) should be equal. This is valid for LVDS signals between two devices and also the LVDS signals between last device and the deserializers. Any length mismatch should be less than 100 mils (1 mil = 1/1000 inch). Sometimes, traces are made serpentine in nature to match the length. Figure 20 shows routing of LVDS signals between device 1 and 2. Also note that LVDS pairs are routed differentially to make the differential characteristic impedance constant.

16

Using ADS8410/13 in Daisy-Chain Mode

SLAA296 May 2006 Submit Documentation Feedback

www.ti.com

System Block Diagram

CLK_I CLK_O

SDI SYNC_I

SDO

SYNC_O

Dev 2 Dev 1

Figure 20. LVDS Routing

System Block Diagram


Figure 21 and Figure 22 show how four devices in a daisy chain are tested. Figure 21 shows how first and second devices are connected. A pattern generator is used to generate necessary control signals and clock. A 25-MHz clock is generated from the pattern generator and is multiplied by a clock multiplier (CDCF5801) to get a 200-MHz LVDS clock. CMOS to LVDS drivers (SN75LVDS389) are used to convert from CMOS/ TTL to LVDS.

SLAA296 May 2006 Submit Documentation Feedback

Using ADS8410/13 in Daisy-Chain Mode

17

www.ti.com

System Block Diagram


DUT #2 CS BUS_BUSY CLK_O CONVST CSTART SDO SYNC_O CLK_I SDI SYNC_I RD

DUT#3

CMOS BUS_ BUSY BUSY LAT Y/N CLK I/E BYTE, MODE C/D NAP, PD CS, RD CONVST DUT #1

LVDS CLK_O SDO SYNC_O SDI SYNC_I CSTART CLK_I 200 MHz CLK Pattern Generator

CMOS to LVDS Driver

VDD/GND Through Jumper Settings

Clock multiplier (has PLL inside)

25 MHz CLK

Figure 21. First and Second Device in the Chain Figure 22 shows how third and forth devices are connected. Serial data from the forth device is converted to parallel by two cascaded SN65LVDS152

18

Using ADS8410/13 in Daisy-Chain Mode

SLAA296 May 2006 Submit Documentation Feedback

www.ti.com

De-Serialization
Last DUT #4 BUS_BUSY To capture card CLK_O SDO SYNC_O RD CS CLK_I SDI SYNC_I

D0-D15

Deserialiser

CMOS BUS_ BUSY BUSY CLK_O SDO

LVDS

Pattern Generator DUT #2

VDD/GND Through Jumper Settings

BUS_BUSY#2

SYNC_O LAT Y/N CLK I/E BYTE, MODE C/D NAP, PD RD CS, CONVST

CLK_I SDI SYNC_I CSTART

Diff Driver

DUT #3

Figure 22. Third and Forth Device in the Chain

De-Serialization
The interface is compatible with the TI deserializer SN65LVDS152. SN65LVDS152 is a 10-bit deserializer. Two such devices are cascaded to get 16-bit parallel data output. The following diagram shows the connection of the deserializer with the ADC (this is the last ADC in the chain). Figure 23 shows this connection with the necessary terminations.

SLAA296 May 2006 Submit Documentation Feedback

Using ADS8410/13 in Daisy-Chain Mode

19

www.ti.com

Limitation on Number of Devices in the Chain

DI+ DILCI+ LCICLK_O+ CLK_OSDO + SDOSYNC_O+ SYNC_OADS8410/13

MCIMCI+

COCO+

SN65LVDS152
DI+ DILCI+ LCICOCO+ MCIMCI+

100 W Resistor

SN65LVDS152

Figure 23. Last ADC in the Chain and the Deserializers

10

Limitation on Number of Devices in the Chain


Theoretically, the number of devices that can be in daisy chained are unlimited. If more than four devices are used, the sampling rate needs to be reduced. Seethe Timing Diagrams for Daisy Chain Operation section of the ADS8410/13 data sheet for the relation between sampling rate and the number of devices in a daisy chain. However, the duty cycle of the clock output (CLK_O) can be degraded to 40%60% with the internal clock mode operation or with the external clock mode operation (provided external input clock (CLK_I) duty cycle is 50%) at 200 MHz. CLK_O of device 1 is CLK_I of device 2. So, device 2 sees a clock with 40%60% duty cycle as the external input clock. CLK_O of device 2 is further degraded. Therefore, as the number of devices increases in a chain, the clock duty cycle of the last device can degrade further which may cause setup and hold-time violation. But typically, four devices can be operated in a daisy chain with a 200-MHz external or internal clock. If the clock frequency is reduced, more devices can be integrated in the chain.

11

Results

11.1 Clock Duty Cycle


One important parameter when multiple devices are daisy chained is the clock duty cycle. An external clock is used as an input to the first device, or the internal clock from the first device is used for the master clock. This clock then travels through four devices and finally comes out from the fourth device as CLK_O. SDO and SYNC_O are generated from the positive edge of CLK_O, but they are latched at the deserializer at the negative edge of CLK_O. Any degradation in the duty cycle shifts the negative edge of CLK_O with respect to the positive edge of CLK_O. This may violate setup and hold time. Careful design of transmitters and receivers of ADS8410/13 ensures that the duty cycle degradation is within the limit. Table 2 lists the measured duty cycle with both external and internal clock.

20

Using ADS8410/13 in Daisy-Chain Mode

SLAA296 May 2006 Submit Documentation Feedback

www.ti.com

Results

Table 2. Clock Duty Cycle


DUTY CYCLE INPUT CLOCK External clock Internal clock 49% CLK_O #1 56% 52% CLK_O #2 47% 54% CLK_O #3 58% 51% CLK_O #4 43% 54%

The following Figure 24 through Figure 27 show CLK_I and CLK_O for four devices in a daisy chain. Blue color denotes CLK_I, and pink color denotes CLK_O. An external clock of 49% duty cycle is used in these examples.

Figure 24. CLK_I and CLK_O of Device 1

SLAA296 May 2006 Submit Documentation Feedback

Using ADS8410/13 in Daisy-Chain Mode

21

www.ti.com

Results

Figure 25. CLK_I and CLK_O of Device 2

Figure 26. CLK_I and CLK_O of Device 3

22

Using ADS8410/13 in Daisy-Chain Mode

SLAA296 May 2006 Submit Documentation Feedback

www.ti.com

Results

Figure 27. CLK_I and CLK_O of Device 4

11.2 Linearity Across Devices


Table 3 shows DNL and INL of ADS8413 versus the device number in the daisy chain. The data has been captured for four devices in the chain at 200-MHz external clock, and 2-MSPS throughput. Table 3. Linearity of Four Devices in the Chain
DEVICE 1 2 3 4 DNL MAX 0.88 0.87 0.88 0.79 MIN 0.68 0.77 0.70 0.73 INL MAX 1.13 1.59 1.14 1.36 MIN 1.62 1.15 1.30 1.21

11.3 SNR and THD Across Devices


Table 4 shows the ac performance of ADS8413 in the daisy chain. The data has been collected for four devices with the input-signal frequency of 20 kHz at a sampling rate of 2 MSPS and an external clock of 200 MHz. Table 4. SNR and THD of Four Devices in the Chain
DEVICE 1 2 3 SNR 91.07 90.54 91.38 THD 103.66 105.74 101.08

SLAA296 May 2006 Submit Documentation Feedback

Using ADS8410/13 in Daisy-Chain Mode

23

www.ti.com

Conclusion

Table 4. SNR and THD of Four Devices in the Chain (continued)


DEVICE 4 SNR 91.39 THD 101.12

11.4 Overdrive Test


The ADS8410/13 works in daisy-chain mode excellently even if one or more devices are overdriven with input voltage more than device power supply. This was tested with a power supply of 5 V. The inputs (IN+, and IN) were overdriven by 5.3 V (+0.3 V for IN in case of ADS8410) and 0.3V (absolute maximum rating). The overdriven device outputs SDO, SYNC_O, and CLK_O normally. The data from the overdriven device may not be correct because absolute input voltage range is lower than this (0.2 to Vref + 0.2). All other devices (without overdrive) function normally in the chain.

12

Conclusion
Daisy-chain mode offers a free-running clock which helps to synchronize digital circuitry easily. The free-running nature of the clock offers the flexibility to use a PLL in the digital system. This system can run with its own internal clock (clock is generated from the first device) or an external clock. The external clock should be a free-running clock. The full frame (conversion and acquisition) of the sampling time of the ADC is available for data transfer. This allows using four devices with a throughput of 2 MSPS. No performance degradation was seen with four devices in a daisy-chain configuration.

24

Using ADS8410/13 in Daisy-Chain Mode

SLAA296 May 2006 Submit Documentation Feedback

www.ti.com

Appendix A

Appendix A ADS8413EVM Daisy Chain Schematics, Layout, and Photograph A.1 Schematics
The daisy chain schematics are affixed to this page.

SLAA296 May 2006 Submit Documentation Feedback

Using ADS8410/13 in Daisy-Chain Mode

25

4
VCC3.3 JUMPERX3P
3 1 2

3
LAT Y/N_B

2
LAT Y/N_A CLK I/E_A MODE C/D

AVDD(REF)

LAT Y/N

BYTE

AVSS(REF)

REFM

REFM

CLK I/E

NAP

PD

24 23 22 21 20 19 18 17 16 15 14 13

INPA VCC3.3 JUMPERX3P


3 1 2

J75 GND CLK I/E_A INMA J76 GND CLK I/E_B

1 0ohms

R209

J199 J188

1 1
A

INP1

NAP

REFOUT NC AVDD

RD BUSY BVSS

J40

PD

DUT8

J2041 J2071 R307

AVSS INP INM AVSS(IN) AVDD(IN) AVDD(COMP) PBKG(DIG) CSTART+ CSTARTAVSS(COMP) DVSS DVDD PBKG(ANA)

BVDD SYNC_O+ SYNC_OSDO+ SDOSDI+(HIGH/LO) CLK_O+ SDI-(HIGH/LO) CLK_OCLK_I+ CLK_ILVSS LVDD

20ohms 1 0ohms

R204 R211

SYNC_I+(M/S)

3 1 2

A A A

CS1

J33

CONVST1

12 11 10 9 8 7 6 5 4 3 2 1

AVDD(REF)

LAT Y/N

AVSS(REF)

CLK I/E

24 23 22 21 20 19 18 17 16 15 14 13

37 38 39 40 41 42 43 44 45 46 47 48

VCC3.3

JUMPERX3P
3 1 2

MODE C/D

CONVST

REFIN LAT Y/N_A

10uF

C1 C3 C4 R1 + R2 0ohms 0.01uF C93


1% 0ohms 1%

1uF

BYTE

PD

CS

REFM

REFM

NAP

BUS_BUSY1 49.9ohms TP1 TP105 49.9ohms BUSY1

TP7 TP105 RD

REFIN REFOUT NC AVDD

BUS_BUSY RD BUSY BVSS

J41

R17 R18
A

TP2 TP105SYNC_O1+

AVSS(REF)

AVDD(REF)

LAT Y/N

REFM

REFM

INP1 INM1 VCC3.3 JUMPERX3P


3 1 2

BVDD

NAP

INP INM AVSS(IN) AVDD(IN) AVDD(COMP) PBKG(DIG)

J34

BYTE

VA VA

7X7 48RGZ SINGLE GND DUT10


A

SYNC_O+ SYNC_OSDO+ SDOCLK_O+

100ohms SYNC_O11%

SDI+(HIGH/LO)

SYNC_I+(M/S)

SDI-(HIGH/LO)

SYNC_I-(M/S)

CSTART+

CSTART-

AVSS(COMP) DVSS DVDD PBKG(ANA)

CLK_OCLK_I+ CLK_ILVSS LVDD

100ohms 1% VA CLK_O1+ 100ohms CLK_O11%

R29

SDO1+ SDO1-

R27

VCC3.3

JUMPERX3P
3 1 2

SDI+(HIGH/LO)

J35

PD

SYNC_I+(M/S)

PBKG(DIG)

CSTART+

CLK_I+

CLK_I-

1pF 100ohms 1%

VCC3.3

JUMPERX3P
3 1 2

J36

NAP

C330

100ohms 1pF 1%

R58

TP105 TP115 TP105 TP116

CLK_I+ SDI-

VA

13 14 15 16 17 18 19 20 21 22 23 24

TP105 TP30
A

C328 R61
VCC3.3 JUMPERX3P
3 1 2

1pF MODE C/D

100ohms 1%

TP105 TP117 TP105 TP118

SDI+ SYNC_I-

TP105 TP31
A

J30

TP105 TP8
A

C329 R57
1pF

100ohms 1%

TP105 TP121 TP105 TP122

SYNC_I+ CSTART1-

TP105 TP29
A

CSTART1+

0.0022uF

0.0039uF

C27 C24
A

0.0039uF

C28 C32
A

0.022uF

C31
A

0.001uF

VA 0.0039uF 0.022uF

VA

BVDD 0.001uF

C26 C23
0.001uF
A

C5
A

0.0022uF

VA

VA

VA

VA

C30 C25
0.0039uF
A

C7 C22
A

0.1uF this value has to be changed to 4.7u

A
EXAS INSTRUMENTS TSEMICONDUCTOR OPERATIONS
SCALE CODE IDENTITY NUMBER
SHEET @REV C N SIZE @EDGE_NUMBER REV 01 07

01295

H=4ND; V=4LA

DVSS

LVSS

DVDD

C335 R62

CSTART-

PBKG(ANA)

SDI-(HIGH/LO)

SYNC_I-(M/S)

TP105 TP113 TP105 TP114

CLK_I-

TP105 TP33

1 2 3 4 5 6 7 8 9 10 11 12

CS

PD

AVSS

BVDD

BYTE

DUT12

CLK I/E

CONVST

R28

MODE C/D

0F VA

C
REFM NC AVDD AVSS INP INM

48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25

REFOUT

AVSS(IN) AVDD(IN) AVDD(COMP) AVSS(COMP)

25 26 27 28 29 30 31 32 33 34 35 36

25 26 27 28 29 30 31 32 33 34 35 36

SYNC_I-(M/S)

VCC3.3

JUMPERX3P

J197 J190

1 1

INM1 0ohms VA BYTE

7X7 48RGZ SINGLE GND DUT8


A

BUS_BUSY RD BUSY BVSS BVDD SYNC_O+ SYNC_OSDO+ SDOCLK_O+ CLK_OLVDD

48PIN,QFP,OZTEK

DUT9

37 38 39 40 41 42 43 44 45 46 47 48

20ohms

R210

MODE C/D

CONVST

REFIN

BUS_BUSY

CS

12 11 10 9 8 7 6 5 4 3 2 1

J32

4
REF_5V 1 2 3 4

3
U10
NC NC VREF NC

NC +Vin EN GND

C86 C80
A

0.1uF 0.001uF

8 7 6 5

1Kohms

R60
1%

C85
1uF
A

VRE4141K

1Kohms

R67
+

REF_DC

OPV0.1uF

OPV+ 0.1uF

1Kohms 1%
A

R59

C91
A

10uF 1uF
A

C84 C89 0.1uF


A

C60
A

C59 C35
A

0F

0ohms
A

R43

49.9ohms OPV+ 7
V+

R23
8

C341 U4
6
Ccomp

2 REF_DC 3

+ V-

R82
0ohms DC
+

DIS

0F

AD8021AR
LOG REF

0ohms
A

R176 R186

49.9ohms OPV+ 7
V+

R173
8

C230 C228 C229 0.1uF


10uF 1uF
A A A

0F

R184
A

J60 1
A

0ohms

J59 1

49.9ohms DC OPV-

R175

C344
0F

OPV0.1uF

OPV+ 0.1uF

C346
A

C345
A

R185

J61 1 J66 1

0ohms

OPV0.1uF

OPV+ 0.1uF

C62
A

C61
A

OPV0.1uF

OPV+ 0.1uF

C342 C347
A

C348
A

0ohms
A

R181

49.9ohms OPV+ 7
V+

R172
8

OPV0.1uF

OPV+ 0.1uF

0ohms
A

R41

49.9ohms OPV+ 7
V+

R21
8

R182
A

0ohms
A

J57 1

49.9ohms 4 1 5 C343 DC 0F OPV-

R174

V-

0F

J67 1

LOG REF

J52 GND

Ccomp

C33

1 0ohms

R189

0ohms

R191

DIS

C64

C63

0ohms

R177

LOG REF

V-

OPV-

J53 GND

1 5

0ohms

R180

0F

Ccomp

1 0ohms

R190

0ohms

R192

DIS

C37

1 5

0ohms

2 3

U124
6 INMB

AD8021AR

2 3

U123
6

AD8021AR

INPB

R49
A

J24 1
A

LOG REF

J6 GND

+ V-

Ccomp

1 0ohms 0ohms

R47

0ohms

R34

DIS

0ohms

R42

B
REF_REFIN 0ohms
+

2 3

U6
6 INMA REF_5V 1 2 3 4
NC +Vin EN GND

AD8021AR

U7
NC NC VREF NC

J27 1

49.9ohms DC OPV-

R70

C38
0F

1 5

C46 C6
A

0.1uF 0.001uF

8 7 6 5

C45
1uF
A

VRE4141K

1Kohms

R66 R64
A

R75

REFIN

C92 C83 C90 0.1uF


10uF 1uF
A A A

R74

J25 1 J18 1

0.1uF

0.1uF

0ohms

0ohms

R73

OPV-

OPV+

1Kohms 1%

C87
A

C88 C81
A

C34
0F 0ohms
A

0F

R38 R39 R35

49.9ohms OPV+ 7
V+

R22
8

0ohms
A

R65

49.9ohms OPV+ 7
V+

R56
8

DIS

0ohms 1 0ohms

Ccomp

R50
A

J19 1
A

0ohms

J26 1

49.9ohms 4 1 5 C36 DC 0F OPV-

R69

LOG REF

J7 GND

V-

V-

C82
0F

LOG REF

1 5

Ccomp

R48

U5
6 INPA REF_REFIN

2 3

U9
6

0ohms

AD8021AR

AD8021AR

0ohms

R72

REFIN

A
CODE IDENTITY NUMBER

DIS

EXAS INSTRUMENTS TSEMICONDUCTOR OPERATIONS


SCALE

OPV-

SHEET @REV C N SIZE @EDGE_NUMBER REV 02 07

01295

H=4ND; V=4LA

4
TP105 TP49
A

3
SDO+

2
VCC3.3 CLK_I VCC3.3 100ohms 1%

TP105 TP124 TP105 TP123

C326
1pF

100ohms SDO- 1% SYNC_O+


A

R165

TP105 TP129 TP105 TP131 TP105 TP48


A

C340

SYNC_O100ohms 1pF VCC3.3 1%

R160

VCC3.3 VCC3.3

C9
A

C8 C11 C10
VCC3.3 COA

0.001uF 0.001uF 0.001uF 0.001uF

R63
CO+

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

U3
DI+ DIGND LCI+ LCIGND CO_EN Vcc GND Vcc Vcc GND GND EN COCO+ Vcc LVI MCIMCI+ GND DCO DO-9 DO-8 DO-7 DO-6 DO-5 DO-4 DO-3 DO-2 DO-1 DO-0

32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17

VCC3.3 CLK_O+ CLK_OA

R162

C323
1pF

TP105 TP128 TP105 TP126

TP105 TP42
A A

R20 R19 R3 R4 R5 R6 R7 R8 R9 R10

49.9ohms 49.9ohms 49.9ohms 49.9ohms 49.9ohms 49.9ohms 49.9ohms 49.9ohms 49.9ohms 49.9ohms

D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 CLK_I

VCC3.3

VCC3.3

C17
A

C16 C19 C18 C21 C20

0.001uF 0.001uF 0.001uF 0.001uF 0.001uF 0.001uF

1 2 3 4 5 6 7 8 9 10 11 12

U1
VDDREF REFCLK VDDP GNDP GND LEADLAG GNDPA VDDPA VDDPD STOPB PWRDNB P0 P1 VDDO GNDO CLKOUT NC GNDO VDDO MULT0 MULT1 P2

1
24 23 22 21 20 19 18 17 16 15 14 13 VCC3.3 VCC3.3
A A

35.7ohms

R30

CLK_IB

DLYCTRL CLKOUTB

A VCC3.3

JUMPERX3P VCC3.3
3 1 2 A

J2 VCC3.3

JUMPERX3P VCC3.3 3 J4
1 2 A

CDCF5801DBQ

VCC3.3

U126
OE 19
A

100ohms

SN65LVDS152DA

JUMPERX3P
3 1 2

C365C357
1uF CLK_IA

20 Vcc 0.1uF GND 10

U127 R193

DIR 1 A1 2 A2 A3 A4 A5 A6 A7 A8 3 4 5 6 7 8 9

G3 3EN1[BA] 3EN2[AB] 1 2
18 B1 17 16 15 14 13 12 11 CSTART_IN3

J187

A 49.9ohms CSTART3

CO+ 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

CLK_IB

U2
DI+ DIGND LCI+ LCIGND CO_EN Vcc GND Vcc Vcc GND GND EN COCO+ Vcc LVI MCIMCI+ GND DCO DO-9 DO-8 DO-7 DO-6 DO-5 DO-4 DO-3 DO-2 DO-1 DO-0

COSYNC_O+
A

SYNC_O-

R161 C322 100ohms


1% 1pF VCC3.3 VCC3.3
A

VCC3.3

C13
A

C12 C15 C14

0.001uF 0.001uF 0.001uF 0.001uF

VCC3.3

32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17

VCC3.3

CLK_O+

R200 49.9ohms CS3 R198 49.9ohms CSTART2 R194 CS2 49.9ohms R197 49.9ohms CSTART1 R195 CS1 49.9ohms R199
RD 49.9ohms
A

R163 C339 R11 R12 R13 R14 R15 R16

B2 CS_IN3 B3 CSTART_IN2 B4 CS_IN2 B5 CSTART_IN1 B6 CS_IN1 B7 RD_IN B8

1pF 100ohms 1% CLK_OA

SN74AHC245DW

49.9ohms 49.9ohms 49.9ohms 49.9ohms 49.9ohms 49.9ohms

D10 D11 D12 D13 D14 D15

VCC3.3

U127
OE 19
A

C366C358
1uF

20 Vcc 0.1uF GND 10

U126
A

DIR 1 A1 2 A2 A3 A4 A5 A6 A7 A8 3 4 5 6 7 8 9

49.9ohms CSTART4 CS4 49.9ohms

R196

G3 3EN1[BA] 3EN2[AB] 1 2
18 B1 17 16 15 14 13 12 11 B2 B3 B4 B5 B6 B7 B8 CSTART_IN4 CS_IN4

R201

SN65LVDS152DA

SN74AHC245DW

CSTART1+ 100ohms 1% SYNC_I+ 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 SN75LVDS389DBT CSTART1SYNC_I100ohms 1% SDI+ 100ohms SDI1%

R166

0.0039uF

0.0022uF

VCC3.3

C311C310C460
0.001uF
A A

VCC3.3 VCC3.3 CSTART1 SYNC_I SDI CLK_IA VCC3.3 CSTART2 CSTART3 CSTART4 VCC3.3

J220

0.0022uF

VCC3.3 0.0039uF

C79 C78 C462


0.001uF
A

0.0039uF

0.0022uF

VCC3.3

VCC3.3
A

J222

0.001uF

100ohms 1% CSTART4-

R299

R229

J221

C321C320 C461

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

U125

R167

1Kohms CONVST1

R215
JUMPERX3P
3 1 2

R168

CSTART1 J68

1Kohms CONVST4

R224
JUMPERX3P
3 1 2

CSTART1 J219 0

100ohms CLK_I1%

R169

CLK_I+

R214

CSTART4 0

CSTART4 J84

1Kohms

VCC3.3

100ohms CSTART21%

R171

CSTART2+

49.9ohms 1%

R296

R225

VCC3.3 49.9ohms 1% 1Kohms CONVST3 CSTART2 CSTART3 0

R297

1Kohms

100ohms CSTART31% CSTART4+

R170

CSTART3+

1Kohms CONVST2

R228
JUMPERX3P
3 1 2

R226
JUMPERX3P
3 1 2

CSTART2

J83

J85

CSTART3

A
CODE IDENTITY NUMBER

1Kohms

R227

1Kohms

VCC3.3

49.9ohms 1%

R295

VCC3.3

49.9ohms 1%

R298

EXAS INSTRUMENTS TSEMICONDUCTOR OPERATIONS


SCALE

SHEET @REV C N SIZE @EDGE_NUMBER REV 03 07

01295

H=4ND; V=4LA

P5 1 2 P2PIN MC 1,5/2-G-5,08 2

R53 CR1 LED3

348ohms

C53

700H

L2

1
+

VA

10uF

C56
A

10uF

C70
1uF
A

2
A

700H

L5

1
+

REF_5V

C54
A

10uF P4 1 2 P2PIN MC 1,5/2-G-5,08 BVDD

C69
1uF
A

D0 1 J5 D1 3 J5 D2 5 J5 D3 7 J5 D4 9 J5 D5 11 J5 D6 13 J5 D7 15 J5 D8 17 J5 D9 19 J5 D10 21 J5 D11 23 J5 D12 25 J5 D13 27 J5 D14 29 J5 D15 31 CLK_I SDI SYNC_I RD_IN 1 3 5 7 9 11 13 15 17 19 2 4 A 6 8 10 A 12 P8 14 16 18 A 20

J5 J5 J5 J5 J5 J5 J5 J5 J5 J5 J5 J5 J5 J5 J5 J5 J5 33 J5 35 J5 37 J5 39

R55 CR2 LED5

348ohms

C55 C67
10uF 1uF

J5 J5 J5 J5 J5

2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40
A

P6 1 2 VCC3.3

TSS-110-02-G-D

R52 CR5 LED1

P2PIN MC 1,5/2-G-5,08

348ohms

C58 C73
10uF 1uF

CS_IN1 CSTART_IN1 CS_IN2 CSTART_IN2 CS_IN3 CSTART_IN3 CS_IN4 CSTART_IN4

1 3 5 7 9 11 13 15 17 19

2 4 6 8 10 12 P9 14 16 18 20
A

TSS-110-02-G-D

2.87Kohms

OPV+

1 2 3
MC 1,5/3-G-50

P7

C75

10uF
+

C76
1uF

R51

C74

LED2

CR4

10uF

C77
1uF

OPV-

A
EXAS INSTRUMENTS TSEMICONDUCTOR OPERATIONS
SCALE CODE IDENTITY NUMBER
SHEET @REV C N SIZE @EDGE_NUMBER REV 04 07

01295

H=4ND; V=4LA

LAT Y/N_B CLK I/E_B MODE C/D NAP

PD VA

C
TP53 BUS_BUSY2 TP105 VCC3.3
3

BYTE CS2
A

CONVST2

AVDD(REF)

LAT Y/N

AVSS(REF)

CLK I/E

MODE C/D

CONVST

24 23 22 21 20 19 18 17 16 15 14 13

INPB J142 GND

20ohms 1 0ohms J200 J189

R277

37 38 39 40 41 42 43 44 45 46 47 48

REFIN INP2

10uF

C373C376 C379 R230 + R233 0.01uF 0ohms


1% 0ohms 1% 0F
A

1uF

BYTE

REFM

REFM

NAP

PD

CS

12 11 10 9 8 7 6 5 4 3 2 1

REFIN REFOUT NC AVDD AVSS INP INM AVSS(IN) AVDD(IN) AVDD(COMP) PBKG(DIG)

BUS_BUSY RD BUSY BVSS BVDD SYNC_O+ SYNC_OSDO+ SDOCLK_O+

49.9ohmsTP79 49.9ohms

R242 R240
A

TP105 BUSY2 TP77 TP105 SYNC_O2+ J180

R278
20ohms 1 0ohms

J2081 J211 1
INM2

DUT11

1 1

C424

1 2

BUS_BUSY1 4

VA
A

7X7 48RGZ SINGLE DUT13 GND

R276 R275

INP2 INM2 VA VA

BVDD

100ohms SYNC_O21%

R248

JUMPER4P,THRU

INMB J141 GND

SDI+(HIGH/LO)

SYNC_I+(M/S)

SDI-(HIGH/LO)

SYNC_I-(M/S)

J202 J192

1 1
A

R306
A

0ohms

CSTART+

CSTART-

AVSS(COMP) DVSS DVDD PBKG(ANA)

CLK_OCLK_I+ CLK_ILVSS LVDD

100ohms 1% VA

R250

SDO2+ SDO2CLK_O2+

B
A

100ohms CLK_O21%
A

25 26 27 28 29 30 31 32 33 34 35 36

R252

C441 R262
VA

TP105 TP109 TP105 TP110

CLK_O1-

TP105 TP57

1pF 100ohms 1%

C442 R263
0.0022uF 0.0039uF 0.0039uF 0.0022uF VA VA VA 0.022uF VA

TP105 TP108 TP105 TP107

CLK_O1+ SDO1-

TP105 TP56
A

C411C404
A

C410C394
A

C420
A

0.001uF

0.0039uF
A

C400 C406

1pF 100ohms 1% TP105 TP55


A

C437 R261

TP105 TP112 TP105 TP111

SDO1+ SYNC_O1-

TP105 TP59
A

1pF 100ohms 1%

VA 0.0039uF 0.022uF

VA

BVDD 0.001uF

C398C392
0.001uF
A

C382
A

C384C390
A

C443 R264
1pF

TP105 TP120 TP105 TP119

SYNC_O1+ CSTART2-

TP105 TP58
A

0.1uF this value has to be changed to 4.7u

100ohms 1%

CSTART2+

A
EXAS INSTRUMENTS TSEMICONDUCTOR OPERATIONS
SCALE CODE IDENTITY NUMBER
SHEET @REV C N SIZE @EDGE_NUMBER REV 05 07

01295

H=4ND; V=4LA

D
LAT Y/N_B CLK I/E_B MODE C/D NAP

PD VA CS3 BYTE
A

CONVST3 BUS_BUSY3

TP61 TP105

AVDD(REF)

LAT Y/N

AVSS(REF)

CLK I/E

MODE C/D

CONVST

24 23 22 21 20 19 18 17 16 15 14 13

37 38 39 40 41 42 43 44 45 46 47 48

REFIN

10uF

C374C378C381 R231 + R234 0ohms 0.01uF C425


1% 0ohms 1%

1uF

12 11 10 9 8 7 6 5 4 3 2 1

BYTE

REFM

REFM

NAP

PD

VCC3.3 49.9ohms 49.9ohms TP105 TP78


3

REFIN REFOUT NC AVDD

BUS_BUSY RD BUSY BVSS

CS

R244 R238
A

BUSY3 BVDD

TP75 TP105 SYNC_O3+

J181

1 2

BUS_BUSY2 4

DUT10

VA 0F

R269
INPA J145 GND 20ohms 1 0ohms

INP3 INM3

AVSS INP INM AVSS(IN) AVDD(IN) AVDD(COMP) PBKG(DIG) CSTART+ CSTARTAVSS(COMP) DVSS DVDD PBKG(ANA)

BVDD SYNC_O+ SYNC_OSDO+ SDOSDI+(HIGH/LO) CLK_O+ SDI-(HIGH/LO) CLK_OCLK_I+ CLK_ILVSS LVDD

R268

SYNC_I+(M/S)

INMA J146 GND

20ohms 1 0ohms

R271

J2051 J2061
INM3

SYNC_I-(M/S)

J198 J191

1 1

INP3

VA VA

7X7 48RGZ SINGLE GND DUT12


A

100ohms SYNC_O31% SDO3+

R254

JUMPER4P,THRU

100ohms SDO31% VA CLK_O3+ 100ohms CLK_O31% TP105 TP93 TP105 TP94 CLK_O2-

R256

J196 J194

R305
A A

0ohms
A A A

25 26 27 28 29 30 31 32 33 34 35 36

R270

R258

1 1

TP105 TP67
A

R251 C438
TP105 TP63
A

1pF 100ohms 1%

R249 C447
VA 0.0039uF VA 0.0039uF VA 0.022uF VA

TP105 TP85 TP105 TP86

CLK_O2+ SDO2-

VA

TP105 TP64
A

1pF 100ohms 1% 0.0022uF 0.0022uF

C413C405
A

C412C396
A

C419
A

0.001uF

C402C408
0.0039uF
A

R247 C446

TP105 TP89 TP105 TP90

SDO2+ SYNC_O2-

TP105 TP65
A

1pF 100ohms 1%

VA 0.0039uF 0.022uF

VA

BVDD 0.001uF

R265 C444
1pF 0.1uF this value has to be changed to 4.7u

TP105 TP99 TP105 TP100

SYNC_O2+ CSTART3-

TP105 TP62
A

C399C393
0.001uF
A

C383
A

C386C389
A

100ohms 1%

CSTART3+

A
EXAS INSTRUMENTS TSEMICONDUCTOR OPERATIONS
SCALE CODE IDENTITY NUMBER
SHEET @REV C N SIZE @EDGE_NUMBER REV 06 07

01295

H=4ND; V=4LA

D
0.0022uF 0.0039uF

C415C407
A

0.0039uF

C414C397
A

0.022uF

C421
A

0.0022uF

VA

VA

VA 0.001uF

VA

LAT Y/N_B CLK I/E_B TP105 TP68


A

C403C409
0.0039uF
A

MODE C/D NAP

VA 0.0039uF 0.022uF

VA

BVDD 0.001uF

PD 0.1uF this value has to be changed to 4.7u VA CONVST4 12 11 10 9 8 7 6 5 4 3 2 1


A

C401C395
0.001uF
A

C385
A

C388C391
A

BYTE

CS4

AVDD(REF)

LAT Y/N

AVSS(REF)

CLK I/E

MODE C/D

CONVST

24 23 22 21 20 19 18 17 16 15 14 13

37 38 39 40 41 42 43 44 45 46 47 48

REFIN

10uF

C375C377C380 R232 + R235 0ohms 0.01uF C426


0F
A A

1uF

TP66 TP105 TP74 TP105 49.9ohms VCC3.3


3

BYTE

REFM

REFM

NAP

PD

1% 0ohms 1%

REFIN REFOUT NC AVDD

BUS_BUSY RD BUSY BVSS

CS

R236

DUT13

VA INP4 INM4 INPB J144 GND 20ohms 1 0ohms J201 J193

49.9ohms BUSY4 TP76 TP105 R239 SYNC_O+ BVDD 100ohms 1% SYNC_OSDO+

J182

1 2

BUS_BUSY3 4

AVSS INP INM AVSS(IN) AVDD(IN) AVDD(COMP) PBKG(DIG) CSTART+ CSTARTAVSS(COMP) DVSS DVDD PBKG(ANA)

BVDD SYNC_O+ SYNC_OSDO+ SDOSDI+(HIGH/LO) CLK_O+ SDI-(HIGH/LO) CLK_OCLK_I+ CLK_ILVSS LVDD

R259

JUMPER4P,THRU

R273

SYNC_I+(M/S)

R272
20ohms 1 0ohms

J2091 J2101
INM4

SYNC_I-(M/S)

1 1

INP4

VA VA

7X7 48RGZ SINGLE GND DUT11


A

100ohms SDO1% VA CLK_O+ 100ohms CLK_O1% CLK_O3-

R266

INMB J143 GND

R280

J203 J195

1 1
A

R304
A

0ohms
A A

25 26 27 28 29 30 31 32 33 34 35 36

R274

R260

C440 R257
VA

1pF 100ohms 1%

TP105 TP83 TP105 TP84

TP105 TP70
A

CLK_O3+ SDO3-

C439 R255

1pF 100ohms 1%

TP105 TP87 TP105 TP88

TP105 TP71
A

SDO3+ SYNC_O3-

C448 R253

1pF 100ohms 1%

TP105 TP91 TP105 TP92

TP105 TP72
A

SYNC_O3+ CSTART4TP105 TP73 CSTART4+


A

C445 R246
1pF

100ohms 1%

TP105 TP98 TP105 TP97

A
EXAS INSTRUMENTS TSEMICONDUCTOR OPERATIONS
SCALE CODE IDENTITY NUMBER
SHEET @REV C N SIZE @EDGE_NUMBER REV 07 07

01295

H=4ND; V=4LA

www.ti.com

Daisy Chain Board Layout

A.2

Daisy Chain Board Layout


The daisy chain board layout is affixed to this page.

26

Using ADS8410/13 in Daisy-Chain Mode

SLAA296 May 2006 Submit Documentation Feedback

GND GND GND GND GND

GND

GND

GND

1
GND GND GND

1
5
2 1

1
4 3
2 1
2 1
2 1

1
1 2 1 2 1 2 GND GND GND 2 1
1 2

GND

2 1
1 2 3

GND

6 7 8
2 1

2 1

2 1

2 1 2

1 2

1 2

2 2 1

2
1

1 2

2
1 1 1 1 1 1

1
1 2 1 2 1

1 1 2 1 2

1 2 2 1 1 2

1 2

1 2

1 2 1 2

3 2 1

1 2 1 2

1 2

1 2 1 2 1

1 2

1 2

1 2 1 2 1

1 2

4 3 2 1

4 3 2 1

4 3 2 1

3 2 1

2 1 2 2 1 1 2 1 2

2
1 2 2 1 1 2 1 2 1 2 2 1 2

6 7 8

20
1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11

19 17 15 13 11 9 7 5 3 1 20 18 16 14 12 10 8 6 4 2 19 17 15 13 11 9 7 5 3 1

1 2

1 2

2 1

18 16 14 12 10 8

1
1 2 2 1 1 2 1 2 1 2 1 2 1 1 2 1 2 1 2

5 6 7 8

5 6 7 8

5 6 7 8

6 7 8

GND

GND
2 2

GND

GND

GND

GND
1

GND

GND

1
1 2 2 1

1
GND GND GND GND

1
GND

1
GND GND

GND

1 1 1 1 1 1 1

6 4 2

1 1
1 1 2 3 4 5 6 7 8 9
2 1

1
2 1 2

2 1

2
1

10
2 1 2 1

1 2

1 2

1
2 1
2

1 2

1
2

2
20 19 18 17 16 15 14 13 12 11

1
2 1

40 38 36

39 37 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1

1 1
1 1

1
2 1
2

GND
2 1

GND

1 2

1 2

1 2

1 1 1

2 2 1

1 1 1
2 1 1
1

1
1

34
1

1
2 2 1 1

1
1 2
1

32 30 28
1 2

1 2

1 2 1 1 1
2 1 2
1 2

1
2 1

1 1

2 2 1 2 1 2 1

1
2 1

26 24
1 2

22
1 2

1 1

1 1

1 1

1 1

2
1 1

20
1 2

1 2 3 4
1 2

8 7 6 5

18
1
1

1 3
1 1

4
1 2
1

16 14

12 10 8 6

2 2

1 1 2 1

3 4 1 2

4
2

5 6 7 8

4 3 2 1

1 1
1 2
1 2

1 1 1 1 1

1 1 1

1 1
2 1 2

1
1 2

2
1 2

1
1 2

1 1 2
2 1

1
1

2
1

2 1 2

1
1 2 1 2 1 2

2
13 14 15 16 17 18 19 20 21 22 23 24 12 11 10 9 8 7 6 5 4 3 2 1

1 1

1 2

1
1 2
1
1 2

2 1

1 1 1 2

1
2

2 1

2 1

1 1

GND
1 2

1 2

1 2

2 1

3
1 2

3
1 2

3
1 2

3
1 2

1 2
1 2 1 2

1 2

1 2

1 2

1 2

1 2

1 2

1 2

1 2

1 1

2 1
2

4 3 4 3 4 3

6 5 6 5 6 5

8 7 8 7 8 7

GND

2
1

10 9 10 9 10 9

12 11 12 11 12 11

14 13 14 13 14 13

16 15 16 15 16 15

18 17 18 17 18 17

20 19 20 19 20 19

3 1 1 1 1 1 1 3

2
1

2 1 1 1 1 1 1 1 2
1

GND

GND

2 1

2 1

2 1

2 1

GND

GND

1 GND GND
2 1 2 1 2 1 2 1

GND

GND

1
GND GND

1
GND GND GND

1
GND

1
GND GND

www.ti.com

Daisy Chain Board Photograph

A.3

Daisy Chain Board Photograph

SLAA296 May 2006 Submit Documentation Feedback

Using ADS8410/13 in Daisy-Chain Mode

27

IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers Low Power Wireless amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti.com/lpw Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless

Mailing Address:

Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2007, Texas Instruments Incorporated

You might also like