Maxwell and HFSS Coupling to ANSYS 12.
Martin Vogel, PhD
Product Management
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Why couple simulators for electromagnetics and multi-physics?
Electronics produce heat, which can cause malfunctions. Courtesy of
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Existing Electromagnetics Multiphysics Links
Electromagnetic simulators: Maxwell SIwave
HFSS
ANSYS Mechanical Thermal Solvers
ANSYS FLUENT Thermodynamics and fluid flow
ANSYS ICEPAK cooling of electronics
ANSYS Mechanical Stress Solver
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Example 1 Raytheon High-Power Connector
Microstrip terminated by shorting diode Copper housing Kovar and glass More connector, gold, Teflon Semi-rigid coaxial cable, silver, Teflon, copper
Port
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Cross section of critical part:
Gold pin Kovar Glass Air Teflon Gold pin
Microstrip
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Before turning power on
Co-axial pin connecting to microstrip trace Courtesy of
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Soon after turning power on
Excessive heat has destroyed the connector. Courtesy of
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Analyze the model in HFSS
Pin connecting to trace
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Export info from HFSS
Geometry, e.g. in STEP format
Small file with link info
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Request thermal simulation(s) in Workbench. Import the geometry.
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Specify volume and surface losses. Workbench will access HFSS.
HFSS Volume loss HFSS Surface Loss
Simply picked all metal faces
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Add boundary conditions for convection and cooling.
Convection on many faces Cooling on bottom face
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Temperature reaches almost 300 deg C in kovar and glass.
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Transient simulation gives same final temperature after 20 seconds.
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Use one of the thermal solutions as input for a structural analysis.
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Deformation up to 2 m
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Stress mostly in inner conductor
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Finalize the design.
Kovar, responsible for the high temperatures, has been replaced by a different metal. Temperatures may still be high, which Teflon cannot handle. Accurate analysis wanted.
Involve CFD to analyze the cooling. Use the two-way thermal coupling to account for temperature-dependent materials.
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Use CFD to determine the film coefficient for the water cooling at the bottom.
Convection on many faces Cooling on bottom face
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Connector array with water cooling
Water, velocity 1 ft/s
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Mesh in Fluent
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Fluent velocity results
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Fluent temperature results
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Replace water cooling by film coefficients
Film coefficient ranges from 5700 to 2300 W/(m2 K) depending on position.
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Why two-way thermal?
Teflon loss tangent increases with temperature. Run-away effect possible.
Glass transition
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Two-way thermal link Ansoft Workbench Mechanical
Solve in Ansoft at initial temperature. Export electromagnetic loss to WB Mechanical. Determine temperatures in WB Mechanical. Export temperatures to HFSS. Material parameters change. T < threshold? Yes Done
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Solve in Ansoft with new temperatures.
No
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Two-way thermal analysis:
Final temperatures with normal Teflon
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EM Power Losses as function of two-way thermal iteration
Volume Loss in normal Teflon Surface Loss on metals
Volume Loss in low-loss Teflon
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Temperatures as function of two-way thermal iteration
Tmax Normal Teflon
Tmax Low-Loss Teflon Tmin Normal Teflon Tmin Low-Loss Teflon
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Two-way thermal analysis:
Final temperatures with low-loss Teflon
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Example 2, with Ansoft Maxwell: battery charger for medical implants
Battery Titanium case, implanted in body Coil outside body, on skin, powered by external source Coil in implant, inductively coupled, picks up power to charge battery
Electronics
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Induced current has maximum at 50 kHz.
Maximum
Limited by losses in coil
Limited by skin effect in titanium case
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Magnetic field coupling
Induced currents in second coil reduce the magnetic field here. This is the intended behavior.
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Final temperature at 50 kHz
Maximum 43.8 0C
Due to skin effect in titanium, temperature exceeds 43 deg C after a few minutes. This would be uncomfortable and probably violates safety regulations.
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Final temperature at 10 kHz
Maximum 38.4 0C
At 10 kHz, final temperature is safe. Secondary coil picks up about as much power, but skin effect heats the titanium case much less.
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Conclusions
Links between HFSS/Maxwell and ANSYS Workbench are available in the graphical user interfaces -> easy to set up. Advanced applications can be handled.
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