Intel Core2 Duo Mobile Processor, Intel Core2 Solo Mobile Processor and Intel Core2 Extreme Mobile

Processor on 45-nm Process

Datasheet
For platforms based on Mobile Intel 4 Series Express Chipset Family March 2009

Document Number: 320120-004

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. 64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel 64 architecture. Performance will vary depending on your hardware and software configurations. Consult with your system vendor for more information. Enhanced Intel SpeedStep Technology for specified units of this processor are available. See the Processor Spec Finder at http:// processorfinder.intel.com or contact your Intel representative for more information. Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
Intel Virtualization Technology requires a computer system with an enabled Intel processor, BIOS, virtual machine monitor (VMM) and, for some uses, certain platform software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.

Intel, Pentium, Centrino, Intel Core Duo, Intel SpeedStep, MMX and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright 2008-2009, Intel Corporation. All rights reserved.

Datasheet

Contents
1 Introduction .............................................................................................................. 7 1.1 Terminology ....................................................................................................... 8 1.2 References ......................................................................................................... 9 Low Power Features ................................................................................................ 11 2.1 Clock Control and Low-Power States .................................................................... 11 2.1.1 Core Low-Power State Descriptions........................................................... 13 2.1.1.1 Core C0 State........................................................................... 13 2.1.1.2 Core C1/AutoHALT Powerdown State ........................................... 13 2.1.1.3 Core C1/MWAIT Powerdown State ............................................... 14 2.1.1.4 Core C2 State........................................................................... 14 2.1.1.5 Core C3 State........................................................................... 14 2.1.1.6 Core C4 State........................................................................... 14 2.1.1.7 Core Deep Power Down Technology (Code Name C6) State ............ 15 2.1.2 Package Low-power State Descriptions...................................................... 15 2.1.2.1 Normal State............................................................................ 15 2.1.2.2 Stop-Grant State ...................................................................... 15 2.1.2.3 Stop-Grant Snoop State............................................................. 16 2.1.2.4 Sleep State .............................................................................. 16 2.1.2.5 Deep Sleep State ...................................................................... 16 2.1.2.6 Deeper Sleep State ................................................................... 17 2.2 Enhanced Intel SpeedStep Technology .............................................................. 19 2.3 Extended Low-Power States................................................................................ 20 2.4 FSB Low Power Enhancements ............................................................................ 21 2.4.1 Dynamic FSB Frequency Switching ........................................................... 21 2.4.2 Enhanced Intel Dynamic Acceleration Technology .................................... 22 2.5 VID-x .............................................................................................................. 23 2.6 Processor Power Status Indicator (PSI-2) Signal .................................................... 23 Electrical Specifications ........................................................................................... 25 3.1 Power and Ground Pins ...................................................................................... 25 3.2 Decoupling Guidelines ........................................................................................ 25 3.2.1 VCC Decoupling...................................................................................... 25 3.2.2 FSB AGTL+ Decoupling ........................................................................... 25 3.2.3 FSB Clock (BCLK[1:0]) and Processor Clocking ........................................... 25 3.3 Voltage Identification and Power Sequencing ........................................................ 26 3.4 Catastrophic Thermal Protection .......................................................................... 29 3.5 Reserved and Unused Pins.................................................................................. 29 3.6 FSB Frequency Select Signals (BSEL[2:0])............................................................ 29 3.7 FSB Signal Groups............................................................................................. 30 3.8 CMOS Signals ................................................................................................... 31 3.9 Maximum Ratings.............................................................................................. 31 3.10 Processor DC Specifications ................................................................................ 32 Package Mechanical Specifications and Pin Information .......................................... 51 4.1 Package Mechanical Specifications ....................................................................... 51 4.2 Processor Pinout and Pin List .............................................................................. 59 4.3 Alphabetical Signals Reference ............................................................................ 93 Thermal Specifications and Design Considerations ................................................ 101 5.1 Monitoring Die Temperature ............................................................................. 108 5.1.1 Thermal Diode ..................................................................................... 108 5.1.2 Intel Thermal Monitor......................................................................... 109

Datasheet

5.2 5.3

5.1.3 Digital Thermal Sensor .......................................................................... 111 Out of Specification Detection............................................................................ 112 PROCHOT# Signal Pin ...................................................................................... 112

Figures
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Core Low-Power States .............................................................................................12 Package Low-Power States ........................................................................................13 Dynamic FSB Frequency Switching Protocol..................................................................22 Active VCC and ICC Loadline for Standard Voltage, Low-Power SV (25 W) and Dual-Core, Extreme Edition Processors ........................................................................................43 Deeper Sleep VCC and ICC Loadline for Standard-Voltage, Low-Power SV (25 W) and DualCore Extreme Edition Processors ................................................................................44 Deeper Sleep VCC and ICC Loadline for Low-Power Standard-Voltage Processors ..............45 Active VCC and ICC Loadline for Low-Voltage, Ultra-Low-Voltage and Power Optimized Performance Processor ..............................................................................................46 Deeper Sleep VCC and ICC Loadline for Low-Voltage, Ultra-Low-Voltage and Power Optimized Performance Processor ..............................................................................................47 6-MB and 3-MB on 6-MB Die Micro-FCPGA Package Drawing (Sheet 1 of 2) ......................52 3-MB die Micro-FCPGA Processor Package Drawing (Sheet 1 of 2) ...................................53 3-MB Die Micro-FCPGA Processor Package Drawing (Sheet 2 of 2)...................................54 3-MB Die Micro-FCBGA Processor Package Drawing (Sheet 1 of 2) ..................................55 3-MB Die Micro-FCBGA Processor Package Drawing (Sheet 2 of 2) ..................................56 Intel Core 2 Duo Mobile Processor (POP and LV) Die Micro-FCBGA Processor Package Drawing ..................................................................................................................57 Intel Core 2 Duo Mobile Processor (ULV SC and ULV DC) Die Micro-FCBGA Processor Package Drawing ..................................................................................................................58 Processor Pinout (Top Package View, Left Side) ............................................................59 Processor Pinout (Top Package View, Right Side) ..........................................................60 Intel Core 2 Duo Mobile Processor in SFF Package Top View Upper Left Side .....................80 Intel Core 2 Duo Mobile Processor in SFF Package Top View Upper Right Side ...................81 Intel Core 2 Duo Mobile Processor in SFF Package Top View Lower Left Side .....................82 Intel Core 2 Duo Mobile Processor in SFF Package Top View Lower Right Side ...................83

Tables
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Coordination of Core Low-Power States at the Package Level..........................................13 Voltage Identification Definition ..................................................................................26 BSEL[2:0] Encoding for BCLK Frequency......................................................................29 FSB Pin Groups ........................................................................................................30 Processor Absolute Maximum Ratings..........................................................................31 Voltage and Current Specifications for the Dual-Core, Extreme Edition Processors .............32 Voltage and Current Specifications for the Dual-Core, Standard-Voltage Processors ...........34 Voltage and Current Specifications for the Dual-Core, Low-Power Standard-Voltage Processors (25 W) in Standard Package ......................................................................................35 Voltage and Current Specifications for the Dual-Core, Power Optimized Performance (25 W) SFF Processors.........................................................................................................37 Voltage and Current Specifications for the Dual-Core, Low-Voltage SFF Processor .............38 Voltage and Current Specifications for the Dual-Core, Ultra-Low-Voltage SFF Processor .....40 Voltage and Current Specifications for the Ultra-Low-Voltage, Single-Core (5.5 W) SFF Processor...............................................................................................41 AGTL+ Signal Group DC Specifications ........................................................................48 CMOS Signal Group DC Specifications..........................................................................49 Open Drain Signal Group DC Specifications ..................................................................49

Datasheet

16 17 18 19 20 21 22 23 24 25 26 27 28

Pin Name Listing ...................................................................................................... 61 Pin # Listing............................................................................................................ 72 Intel Core 2 Duo Mobile Processor in SFF Package Listing by Ball Name ........................... 84 Signal Description .................................................................................................... 93 Power Specifications for the Dual-Core Extreme Edition Processor................................. 101 Power Specifications for the Dual-Core Standard Voltage Processor............................... 102 Power Specifications for the Dual-Core Low Power Standard Voltage Processors (25 W) in Standard Package .................................................................................................. 103 Power Specifications for the Dual-Core Power Optimized Performance (25 W) SFF Processors ............................................................................................................ 104 Power Specifications fro the Dual-Core Low Voltage (LV) SFF Processors ....................... 105 Power Specifications for the Dual-Core Ultra-Low-Voltage (ULV) Processors ................... 106 Power Specifications for the Single-Core Ultra-Low-Voltage (5.5 W) SFF Processors ........ 107 Thermal Diode Interface ......................................................................................... 108 Thermal Diode Parameters Using Transistor Model...................................................... 109

Datasheet

Revision History
Document Number 320120 Revision Number -001 Initial Release Chapter Update Chapter 1: Added introduction to the Intel Core 2 Duo Processor in SFF Package Section 4.1: Added the package coplanarity information for the processors in SFF Package Figure Update Added Figure Added Figure Added Figure Added Figure Added Figure Table Update 320120 -003 7 8 14 15 18 through Figure 21 Description Date July 2008

320120

-002

August 2008

Added Table 9 Added Table 10 Added Table 11 Added Table 12 Updated Table 16: Added Intel Core 2 Duo SFF Package Processor Ball listing by Pin name Added Table 18 Added Table 23 Added Table 24 Added Table 25 January 2009

Added information for Intel Core 2 Duo T9800, T9550, P9600, P8700 Added information for Intel Core 2 Duo processor skus below: Updated Table 7 and 21 with T9900 Updated Table 9 and 23 with SP9600 Updated Table 10 and 24 with SL9600 Updataed Table 11 and 25 with SU9600 Updated Table 12 and 26 with SU3500

320120

-004

March 2009

Datasheet

Introduction

Introduction
The Intel Core2 Duo mobile processor, Intel Core2 Duo mobile processor lowvoltage (LV), ultra low-voltage (ULV) in small form factor (SFF) package and Intel Core2 Extreme mobile are high-performance, low-power mobile processor based on the Intel Core microarchitecture for Intel Centrino 2 processor technology. This document contains electrical, mechanical and thermal specifications for the following processors: The Intel Core 2 Duo processors and Intel Core 2 Extreme processors support the Mobile Intel 4 Series Express Chipset and Intel ICH9M I/O controller. Dual-core extreme edition (DC-XE) Standard voltage (SV) 25-W processor in standard package (Power Optimized Performance-POP) The Intel Core 2 Duo processor in SFF package supports the Mobile Intel GS45 Express Chipset and Intel ICH9M SFF I/O controller. This document contains electrical, mechanical and thermal specifications for: Power Optimized Performance (POP) in SFF package Low-voltage (LV) Processor in SFF package Ultra-low voltage (ULV) dual-core (DC) and single-core (SC) Processors in SFF package

Notes:

In this document 1. Intel Core 2 Duo processor, and the Intel Core 2 Extreme processor are referred to as the processor 2. Intel Core 2 Duo LV/ULV/POP processors are referred to as SFF processor 3. Mobile Intel 4 Series Express Chipset is referred as the GMCH. Key features include: Dual-core processor for mobile with enhanced performance Supports Intel architecture with Intel Wide Dynamic Execution Supports L1 cache-to-cache (C2C) transfer On-die, primary 32-KB instruction cache and 32-KB, write-back data cache in each core The processor in DC-XE, standard voltage (SV) and LV have an on-die, up to 6-MB second-level, shared cache with Advanced Transfer Cache architecture The processor in ULV single-core and dual-core have an on-die, up to 3-MB second-level, shared cache with Advanced Transfer Cache architecture Streaming SIMD extensions 2 (SSE2), streaming SIMD extensions 3 (SSE3), supplemental streaming SIMD extensions 3 (SSSE3) and SSE4.1 instruction sets The processor in DC-XE, SV and LV are offered at 1066-MHz, source-synchronous front side bus (FSB) The processor in ULV are offered at 800-MHz, source-synchronous FSB Advanced power management features including Enhanced Intel SpeedStep Technology and dynamic FSB frequency switching

Datasheet 7

Introduction

Digital thermal sensor (DTS) Intel 64 architecture Supports enhanced Intel Virtualization Technology Enhanced Intel Dynamic Acceleration Technology and Enhanced Multi-Threaded Thermal Management (EMTTM) Supports PSI2 functionality SV processor offered in Micro-FCPGA and Micro-FCBGA packaging technologies Processor in POP, LV and ULV are offered in Micro-FCBGA packaging technologies only Execute Disable Bit support for enhanced security Intel Deep Power Down low-power state with P_LVL6 I/O support Support for Intel Trusted Execution Technology Half ratio support (N/2) for core to bus ratio

1.1

Terminology
Term Definition A # symbol after a signal name refers to an active low signal, indicating a signal is in the active state when driven to a low level. For example, when RESET# is low, a reset has been requested. Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where the name does not imply an active state but describes part of a binary sequence (such as address or data), the # symbol implies that the signal is inverted. For example, D[3:0] = HLHL refers to a hex A, and D[3:0]# = LHLH also refers to a hex A (H= High logic level, L= Low logic level). Refers to the interface between the processor and system core logic (also known as the chipset components). Advanced Gunning Transceiver Logic. Used to refer to Assisted GTL+ signaling technology on some Intel processors. Refers to a non-operational state. The processor may be installed in a platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air. Under these conditions, processor landings should not be connected to any supply voltages, have any I/Os biased or receive any clocks. Upon exposure to free air (i.e., unsealed packaging or a device removed from packaging material) the processor must be handled in accordance with moisture sensitivity labeling (MSL) as indicated on the packaging material. Technology that provides power management capabilities to laptops. Processor core die with integrated L1 and L2 cache. All AC timing and signal integrity specifications are at the pads of the processor core.

Front Side Bus (FSB) AGTL+

Storage Conditions

Enhanced Intel SpeedStep Technology Processor Core

Datasheet

Introduction

Term

Definition The Execute Disable bit allows memory to be marked as executable or nonexecutable, when combined with a supporting operating system. If code attempts to run in non-executable memory the processor raises an error to the operating system. This feature can prevent some classes of viruses or worms that exploit buffer overrun vulnerabilities and can thus help improve the overall security of the system. See the Intel 64 and IA-32 Architectures Software Developer's Manuals for more detailed information. 64-bit memory extensions to the IA-32 architecture. Processor virtualization that, when used in conjunction with Virtual Machine Monitor software, enables multiple, robust independent software environments inside a single platform. Intel Core 2 Duo processors and Intel Core 2 Extreme processors support the N/2 feature that allows having fractional core-to-bus ratios. This feature provides the flexibility of having more frequency options and being able to have products with smaller frequency steps. Thermal Design Power. The processor core power supply. The processor ground. Low-voltage Ultra-Low-Voltage Dual-core Extreme Edition

Execute Disable Bit

Intel 64 Technology Intel Virtualization Technology Half ratio support (N/2) for Core to Bus ratio TDP VCC VSS LV ULV DC-XE

1.2

References
Material and concepts available in the following documents may be beneficial when reading this document.
Document Intel Core2 Duo Mobile Processor, Intel Core2 Solo Mobile Processor, Intel Core2 Extreme Processor on 45-nm Technology Specification Update Mobile Intel 4 Series Express Chipset Family Datasheet Mobile Intel 4 Series Express Chipset Family Specification Update Intel I/O Controller Hub 9 (ICH9)/ I/O Controller Hub 9M (ICH9M) Datasheet Intel I/O Controller Hub 9 (ICH9)/ I/O Controller Hub 9M (ICH9M) Specification Update Intel 64 and IA-32 Architectures Software Developer's Manuals Volume 1: Basic Architecture Volume 2A: Instruction Set Reference, A-M 253665 253666 Document Number 320121 320122 320123 316972 316973

Datasheet 9

Introduction

Document Volume 2B: Instruction Set Reference, N-Z Volume 3A: System Programming Guide Volume 3B: System Programming Guide

Document Number 253667 253668 253669

NOTE: Contact your Intel representative for the latest revision of this document.

10

Datasheet

Low Power Features

2
2.1

Low Power Features

Clock Control and Low-Power States
The processor supports low-power states both at the individual core level and the package level for optimal power management. A core may independently enter the C1/AutoHALT, C1/MWAIT, C2, C3, C4, Intel Enhanced Deeper Sleep and Intel Deep Power Down Technology low-power states. When both cores coincide in a common core low-power state, the central power management logic ensures the entire processor enters the respective package lowpower state by initiating a P_LVLx (P_LVL2, P_LVL3, P_LVL4, P_LVL5,P_LVL6) I/O read to the GMCH. The processor implements two software interfaces for requesting low-power states: MWAIT instruction extensions with sub-state hints and P_LVLx reads to the ACPI P_BLK register block mapped in the processors I/O address space. The P_LVLx I/O reads are converted to equivalent MWAIT C-state requests inside the processor and do not directly result in I/O reads on the processor FSB. The P_LVLx I/O Monitor address does not need to be set up before using the P_LVLx I/O read interface. The sub-state hints used for each P_LVLx read can be configured through the IA32_MISC_ENABLES model specific register (MSR). If a core encounters a GMCH break event while STPCLK# is asserted, it asserts the PBE# output signal. Assertion of PBE# when STPCLK# is asserted indicates to system logic that individual cores should return to the C0 state and the processor should return to the Normal state. Figure 1 shows the core low-power states and Figure 2 shows the package low-power states for the processor. Table 1 maps the core low-power states to package low-power states.

Datasheet 11

Low Power Features

Figure 1.

Core Low-Power States

Stop Grant STPCLK# asserted STPCLK# deasserted C1/MWAIT Core state break MWAIT(C1) C0 Core State break P_LVL4 or P_LVL5/P_LVL6 MWAIT(C4/C6) C4 /C6 STPCLK# deasserted STPCLK# STPCLK# asserted deasserted STPCLK# asserted HLT instruction

C1/Auto Halt

Halt break P_LVL2 or MWAIT(C2)

Core state break P_LVL3 or Core MWAIT(C3) state break

C2

C3

halt break = A20M# transition, INIT#, INTR, NMI, PREQ#, RESET#, SMI#, or APIC interrupt core state break = (halt break OR Monitor event) AND STPCLK# high (not asserted) STPCLK# assertion and de-assertion have no effect if a core is in C2, C3, or C4. Core C4 state supports the package level Deep C4 sub-state. P_LVL5/P_LVL6 read is issued once the L2 cache is reduced to zero.

12

Datasheet

Low Power Features

Figure 2.

Package Low-Power States

STPCLK# asserted Normal STPCLK# deasserted Snoop Snoop serviced occurs Stop Grant

SLP# asserted Sleep SLP# deasserted

DPSLP# asserted Deep Sleep DPSLP# deasserted

DPRSTP# asserted Deeper Sleep DPRSTP# deasserted

Stop Grant Snoop

Deeper Sleep includes the Deeper Sleep state, Deep C4 sub-state, and C6

Table 1.

Coordination of Core Low-Power States at the Package Level

Package State Core0 State C0 C11 C2 C3 C4/Deep Power Down Technology C0 Normal Normal Normal Normal Normal C11 Normal Normal Normal Normal Normal C2 Normal Normal Stop-Grant Stop-Grant Stop-Grant Core1 State C3 Normal Normal Stop-Grant Deep Sleep Deep Sleep C4/Deep Power Down Technology State (Code Named C6 State) Normal Normal Stop-Grant Deep Sleep Deeper Sleep /Intel Enhanced Deeper Sleep/ Intel Deep Power Down

NOTE: 1. AutoHALT or MWAIT/C1.

2.1.1
2.1.1.1

Core Low-Power State Descriptions

Core C0 State
This is the normal operating state for cores in the processor.

2.1.1.2

Core C1/AutoHALT Powerdown State

C1/AutoHALT is a low-power state entered when a core executes the HALT instruction. The processor core will transition to the C0 state upon occurrence of SMI#, INIT#, LINT[1:0] (NMI, INTR), or FSB interrupt messages. RESET# will cause the processor to immediately initialize itself. A System Management Interrupt (SMI) handler will return execution to either Normal state or the AutoHALT Powerdown state. See the Intel 64 and IA-32 Architectures Software Developer's Manuals, Volume 3A/3B: System Programmer's Guide for more information.

Datasheet 13

Low Power Features

The system can generate a STPCLK# while the processor is in the AutoHALT Powerdown state. When the system deasserts the STPCLK# interrupt, the processor will return execution to the HALT state. While in AutoHALT Powerdown state, the dual-core processor will process bus snoops and snoops from the other core. The processor core will enter a snoopable sub-state (not shown in Figure 1) to process the snoop and then return to the AutoHALT Powerdown state.

2.1.1.3

Core C1/MWAIT Powerdown State

C1/MWAIT is a low-power state entered when the processor core executes the MWAIT(C1) instruction. Processor behavior in the MWAIT state is identical to the AutoHALT state except that Monitor events can cause the processor core to return to the C0 state. See the Intel 64 and IA-32 Architectures Software Developer's Manuals, Volume 2A: Instruction Set Reference, A-M and Volume 2B: Instruction Set Reference, N-Z, for more information.

2.1.1.4

Core C2 State
Individual cores of the dual-core processor can enter the C2 state by initiating a P_LVL2 I/O read to the P_BLK or an MWAIT(C2) instruction, but the processor will not issue a Stop-Grant Acknowledge special bus cycle unless the STPCLK# pin is also asserted. While in the C2 state, the dual-core processor will process bus snoops and snoops from the other core. The processor core will enter a snoopable sub-state (not shown in Figure 1) to process the snoop and then return to the C2 state.

2.1.1.5

Core C3 State
Individual cores of the dual-core processor can enter the C3 state by initiating a P_LVL3 I/O read to the P_BLK or an MWAIT(C3) instruction. Before entering C3, the processor core flushes the contents of its L1 caches into the processors L2 cache. Except for the caches, the processor core maintains all its architectural states in the C3 state. The Monitor remains armed if it is configured. All of the clocks in the processor core are stopped in the C3 state. Because the cores caches are flushed the processor keeps the core in the C3 state when the processor detects a snoop on the FSB or when the other core of the dual-core processor accesses cacheable memory. The processor core will transition to the C0 state upon occurrence of a Monitor event, SMI#, INIT#, LINT[1:0] (NMI, INTR), or FSB interrupt message. RESET# will cause the processor core to immediately initialize itself.

2.1.1.6

Core C4 State
Individual cores of the dual-core processor can enter the C4 state by initiating a P_LVL4 or P_LVL5 I/O read to the P_BLK or an MWAIT(C4) instruction. The processor core behavior in the C4 state is nearly identical to the behavior in the C3 state. The only difference is that if both processor cores are in C4, the central power management logic will request that the entire processor enter the Deeper Sleep package low-power state (see Section 2.1.2.6). To enable the package-level Intel Enhanced Deeper Sleep state, Dynamic Cache Sizing and Intel Enhanced Deeper Sleep state fields must be configured in the PMG_CST_CONFIG_CONTROL MSR. Refer to Section 2.1.2.6 for further details on Intel Enhanced Deeper Sleep state.

14

Datasheet

Low Power Features

2.1.1.7

Core Deep Power Down Technology (Code Name C6) State

Deep Power Down Technology state is a new, power-saving state which is being implemented on the processor. In Deep Power Down Technology the processor saves its entire architectural state onto an on-die SRAM hence allowing it to lower its main core voltage to any value, even as low as 0-V. When the core enters Deep Power Down Technology state, it saves the processor state that is relevant to the processor context in an on-die SRAM that resides on a separate power plane VCCP (I/O power supply). This allows the main core Vcc to be lowered to any arbitrary voltage including 0-V. The on-die storage for saving the processor state is implemented as a per-core SRAM.

2.1.2
2.1.2.1

Package Low-power State Descriptions

Normal State
This is the normal operating state for the processor. The processor remains in the Normal state when at least one of its cores is in the C0, C1/AutoHALT, or C1/MWAIT state.

2.1.2.2

Stop-Grant State
When the STPCLK# pin is asserted, each core of the dual-core processor enters the Stop-Grant state within 20 bus clocks after the response phase of the processor-issued Stop-Grant Acknowledge special bus cycle. Processor cores that are already in the C2, C3, or C4 state remain in their current low-power state. When the STPCLK# pin is deasserted, each core returns to its previous core low-power state. Since the AGTL+ signal pins receive power from the FSB, these pins should not be driven (allowing the level to return to VCCP) for minimum power drawn by the termination resistors in this state. In addition, all other input pins on the FSB should be driven to the inactive state. RESET# causes the processor to immediately initialize itself, but the processor will stay in Stop-Grant state. When RESET# is asserted by the system, the STPCLK#, SLP#, DPSLP#, and DPRSTP# pins must be deasserted prior to RESET# deassertion as per AC Specification T45. When re-entering the Stop-Grant state from the Sleep state, STPCLK# should be deasserted after the deassertion of SLP# as per AC Specification T75. While in Stop-Grant state, the processor will service snoops and latch interrupts delivered on the FSB. The processor will latch SMI#, INIT# and LINT[1:0] interrupts and will service only one of each upon return to the Normal state. The PBE# signal may be driven when the processor is in Stop-Grant state. PBE# will be asserted if there is any pending interrupt or Monitor event latched within the processor. Pending interrupts that are blocked by the EFLAGS.IF bit being clear will still cause assertion of PBE#. Assertion of PBE# indicates to system logic that the entire processor should return to the Normal state. A transition to the Stop-Grant Snoop state occurs when the processor detects a snoop on the FSB (see Section 2.1.2.3). A transition to the Sleep state (see Section 2.1.2.4) occurs with the assertion of the SLP# signal.

Datasheet 15

Low Power Features

2.1.2.3

Stop-Grant Snoop State

The processor responds to snoop or interrupt transactions on the FSB while in StopGrant state by entering the Stop-Grant Snoop state. The processor will stay in this state until the snoop on the FSB has been serviced (whether by the processor or another agent on the FSB) or the interrupt has been latched. The processor returns to the Stop-Grant state once the snoop has been serviced or the interrupt has been latched.

2.1.2.4

Sleep State
The Sleep state is a low-power state in which the processor maintains its context, maintains the phase-locked loop (PLL), and stops all internal clocks. The Sleep state is entered through assertion of the SLP# signal while in the Stop-Grant state. The SLP# pin should only be asserted when the processor is in the Stop-Grant state. SLP# assertions while the processor is not in the Stop-Grant state is out of specification and may result in unapproved operation. In the Sleep state, the processor is incapable of responding to snoop transactions or latching interrupt signals. No transitions or assertions of signals (with the exception of SLP#, DPSLP# or RESET#) are allowed on the FSB while the processor is in Sleep state. Snoop events that occur while in Sleep state or during a transition into or out of Sleep state will cause unpredictable behavior. Any transition on an input signal before the processor has returned to the Stop-Grant state will result in unpredictable behavior. If RESET# is driven active while the processor is in the Sleep state, and held active as specified in the RESET# pin specification, then the processor will reset itself, ignoring the transition through the Stop-Grant state. If RESET# is driven active while the processor is in the Sleep state, the SLP# and STPCLK# signals should be deasserted immediately after RESET# is asserted to ensure the processor correctly executes the Reset sequence. While in the Sleep state, the processor is capable of entering an even lower power state, the Deep Sleep state, by asserting the DPSLP# pin (See Section 2.1.2.5). While the processor is in the Sleep state, the SLP# pin must be deasserted if another asynchronous FSB event needs to occur.

2.1.2.5

Deep Sleep State

The Deep Sleep state is entered through assertion of the DPSLP# pin while in the Sleep state. BCLK may be stopped during the Deep Sleep state for additional platform-level power savings. BCLK stop/restart timings on appropriate GMCH-based platforms with the CK505 clock chip are as follows: Deep Sleep entry: the system clock chip may stop/tristate BCLK within 2 BCLKs of DPSLP# assertion. It is permissible to leave BCLK running during Deep Sleep. Deep Sleep exit: the system clock chip must drive BCLK to differential DC levels within 2-3 ns of DPSLP# deassertion and start toggling BCLK within 10 BCLK periods. To re-enter the Sleep state, the DPSLP# pin must be deasserted. BCLK can be restarted after DPSLP# deassertion as described above. A period of 15 microseconds (to allow for PLL stabilization) must occur before the processor can be considered to be in the Sleep state. Once in the Sleep state, the SLP# pin must be deasserted to re-enter the Stop-Grant state. While in Deep Sleep state, the processor is incapable of responding to snoop transactions or latching interrupt signals. No transitions of signals are allowed on the FSB while the processor is in Deep Sleep state. When the processor is in Deep Sleep

16

Datasheet

Low Power Features

state, it will not respond to interrupts or snoop transactions. Any transition on an input signal before the processor has returned to Stop-Grant state will result in unpredictable behavior.

2.1.2.6

Deeper Sleep State

The Deeper Sleep state is similar to the Deep Sleep state but further reduces core voltage levels. One of the potential lower core voltage levels is achieved by entering the base Deeper Sleep state. The Deeper Sleep state is entered through assertion of the DPRSTP# pin while in the Deep Sleep state. The following lower core voltage level is achieved by entering the Intel Enhanced Deeper Sleep state which is a sub-state of Deeper Sleep state. Intel Enhanced Deeper Sleep state is entered through assertion of the DPRSTP# pin while in the Deep Sleep only when the L2 cache has been completely shut down. Refer to Section 2.1.2.6.1 and Section 2.1.2.6.3 for further details on reducing the L2 cache and entering Intel Enhanced Deeper Sleep state. In response to entering Deeper Sleep, the processor drives the VID code corresponding to the Deeper Sleep core voltage on the VID[6:0] pins. Exit from Deeper Sleep or Intel Enhanced Deeper Sleep state is initiated by DPRSTP# deassertion when either core requests a core state other than C4 or either core requests a processor performance state other than the lowest operating point.

2.1.2.6.1

Intel Enhanced Deeper Sleep State Intel Enhanced Deeper Sleep state is a sub-state of Deeper Sleep that extends powersaving capabilities by allowing the processor to further reduce core voltage once the L2 cache has been reduced to zero ways and completely shut down. The following events occur when the processor enters Intel Enhanced Deeper Sleep state: The last core entering C4 issues a P_LVL4 or P_LVL5 I/O read or an MWAIT(C4) instruction and then progressively reduces the L2 cache to zero Once the L2 cache has been reduced to zero, the processor triggers a special chipset sequence to notify the chipset to redirect all FSB traffic, except APIC messages, to memory. The snoops are replied as misses by the chipset and are directed to main memory instead of the L2 cache. This allows for higher residency of the processors Intel Enhanced Deeper Sleep state. The processor drives the VID code corresponding to the Intel Enhanced Deeper Sleep state core voltage on the VID[6:0] pins.

2.1.2.6.2

Deep Power Down State Technology (Code Named C6) State When both cores have entered the CC6 state and the L2 cache has been shrunk down to zero ways, the processor will enter the Deep Power Down Technology state. To do so both cores save their architectural states in the on-die SRAM that resides in the VCCP domain. At this point, the core VCC will be dropped to the lowest core voltage closer to 0-V. The processor is now in an extremely low-power state. In Intel Deep Power Down Technology state, the processor does not need to be snooped as all the caches are flushed before entering this state.

Datasheet 17

Low Power Features

2.1.2.6.3

Dynamic Cache Sizing Dynamic Cache Sizing allows the processor to flush and disable a programmable number of L2 cache ways upon each Deeper Sleep entry under the following conditions: The second core is already in C4 and Intel Enhanced Deeper Sleep state or Deep Power Down Technology state (C6) is enabled (as specified in Section 2.1.1.6). The C0 timer that tracks continuous residency in the Normal package state has not expired. This timer is cleared during the first entry into Deeper Sleep to allow consecutive Deeper Sleep entries to shrink the L2 cache as needed. The FSB speed to processor core speed ratio is below the predefined L2 shrink threshold. The number of L2 cache ways disabled upon each Deeper Sleep entry is configured in the BBL_CR_CTL3 MSR. The C0 timer is referenced through the CLOCK_CORE_CST_CONTROL_STT MSR. The shrink threshold under which the L2 cache size is reduced is configured in the PMG_CST_CONFIG_CONTROL MSR. If the FSB speed to processor core speed ratio is above the predefined L2 shrink threshold, then L2 cache expansion will be requested. If the ratio is zero, then the ratio will not be taken into account for Dynamic Cache Sizing decisions. Upon STPCLK# deassertion, the first core exiting Intel Enhanced Deeper Sleep state or Deep Power Down Technology state will expand the L2 cache to two ways and invalidate previously disabled cache ways. If the L2 cache reduction conditions stated above still exist when the last core returns to C4 and the package enters Intel Enhanced Deeper Sleep state or Deep Power Down Technology state (C6), then the L2 will be shrunk to zero again. If a core requests a processor performance state resulting in a higher ratio than the predefined L2 shrink threshold, the C0 timer expires, or the second core (not the one currently entering the interrupt routine) requests the C1, C2, or C3 states, then the whole L2 will be expanded upon the next interrupt event. In addition, the processor supports Full Shrink on L2 cache. When the MWAIT Deep Power Down Technology state instruction is executed with a hint=0x2 in ECX[3:0], the micro code will shrink all the active ways of the L2 cache in one step. This ensures that the package enters Deep Power Down Technology immediately when both cores are in CC6 instead of iterating till the cache is reduced to zero. The operating system (OS) is expected to use this hint when it wants to enter the lowest power state and can tolerate the longer entry latency. L2 cache shrink prevention may be enabled as needed on occasion through an MWAIT(C4) sub-state field. If shrink prevention is enabled, the processor does not enter Intel Enhanced Deeper Sleep state or Intel Deep Power Down state since the L2 cache remains valid and in full size.

18

Datasheet

Low Power Features

2.2

Enhanced Intel SpeedStep Technology

The processor features Enhanced Intel SpeedStep Technology. Following are the key features of Enhanced Intel SpeedStep Technology: Multiple voltage and frequency operating points provide optimal performance at the lowest power. Voltage and frequency selection is software-controlled by writing to processor MSRs: If the target frequency is higher than the current frequency, VCC is ramped up in steps by placing new values on the VID pins, and the PLL then locks to the new frequency. If the target frequency is lower than the current frequency, the PLL locks to the new frequency and the VCC is changed through the VID pin mechanism. Software transitions are accepted at any time. If a previous transition is in progress, the new transition is deferred until the previous transition completes. The processor controls voltage ramp rates internally to ensure glitch-free transitions. Low transition latency and large number of transitions possible per second: Processor core (including L2 cache) is unavailable for up to 10 s during the frequency transition. The bus protocol (BNR# mechanism) is used to block snooping. Improved Intel Thermal Monitor mode: When the on-die thermal sensor indicates that the die temperature is too high the processor can automatically perform a transition to a lower frequency and voltage specified in a software-programmable MSR. The processor waits for a fixed time period. If the die temperature is down to acceptable levels, an up-transition to the previous frequency and voltage point occurs. An interrupt is generated for the up and down Intel Thermal Monitor transitions enabling better system-level thermal management. Enhanced thermal management features: Digital Thermal Sensor and Out of Specification detection. Intel Thermal Monitor 1 (TM1) in addition to Intel Thermal Monitor 2 (TM2) in case of unsuccessful TM2 transition. Dual-core thermal management synchronization. Each core in the dual-core processor implements an independent MSR for controlling Enhanced Intel SpeedStep Technology, but both cores must operate at the same frequency and voltage. The processor has performance state coordination logic to resolve frequency and voltage requests from the two cores into a single frequency and voltage request for the package as a whole. If both cores request the same frequency and voltage, then the processor will transition to the requested common frequency and voltage. If the two cores have different frequency and voltage requests, then the processor will take the highest of the two frequencies and voltages as the resolved request and transition to that frequency and voltage. The processor also supports Dynamic FSB Frequency Switching and Intel Dynamic Acceleration Technology mode on select SKUs. The operating system can take advantage of these features and request a lower operating point called SuperLFM (due to Dynamic FSB Frequency Switching) and a higher operating point Intel Dynamic Acceleration Technology mode.

Datasheet 19

Low Power Features

2.3

Extended Low-Power States

Extended low-power states (CXE) optimize for power by forcibly reducing the performance state of the processor when it enters a package low-power state. Instead of directly transitioning into the package low-power state, the enhanced package lowpower state first reduces the performance state of the processor by performing an Enhanced Intel SpeedStep Technology transition down to the lowest operating point. Upon receiving a break event from the package low-power state, control will be returned to software while an Enhanced Intel SpeedStep Technology transition up to the initial operating point occurs. The advantage of this feature is that it significantly reduces leakage while in the Stop-Grant and Deeper Sleep states. Deep Power Down Technology is always enabled in the extended low power state as described above.

Note:

Long-term reliability cannot be assured unless all the Extended Low Power States are enabled. The processor implements two software interfaces for requesting enhanced package low-power states: MWAIT instruction extensions with sub-state hints and via BIOS by configuring IA32_MISC_ENABLES MSR bits to automatically promote package lowpower states to enhanced package low-power states.

Caution:

Extended Stop-Grant and Enhanced Deeper Sleep must be enabled via the BIOS for the processor to remain within specification. As processor technology changes, enabling the extended low power states becomes increasingly crucial when building computer systems. Maintaining the proper BIOS configuration is key to reliable, long-term system operation. Not complying to this guideline may affect the long-term reliability of the processor. Enhanced Intel SpeedStep Technology transitions are multistep processes that require clocked control. These transitions cannot occur when the processor is in the Sleep or Deep Sleep package low-power states since processor clocks are not active in these states. Extended Deeper Sleep is an exception to this rule when the Hard C4E configuration is enabled in the IA32_MISC_ENABLES MSR. This Extended Deeper Sleep state configuration will lower core voltage to the Deeper Sleep level while in Deeper Sleep and, upon exit, will automatically transition to the lowest operating voltage and frequency to reduce snoop service latency. The transition to the lowest operating point or back to the original software-requested point may not be instantaneous. Furthermore, upon very frequent transitions between active and idle states, the transitions may lag behind the idle state entry resulting in the processor either executing for a longer time at the lowest operating point or running idle at a high operating point. Observations and analyses show this behavior should not significantly impact total power savings or performance score while providing power benefits in most other cases.

Caution:

20

Datasheet

Low Power Features

2.4

FSB Low Power Enhancements

The processor incorporates FSB low power enhancements: Dynamic FSB Power Down BPRI# control for address and control input buffers Dynamic Bus Parking Dynamic On-Die Termination disabling Low VCCP (I/O termination voltage) Dynamic FSB frequency switching The processor incorporates the DPWR# signal that controls the data bus input buffers on the processor. The DPWR# signal disables the buffers when not used and activates them only when data bus activity occurs, resulting in significant power savings with no performance impact. BPRI# control also allows the processor address and control input buffers to be turned off when the BPRI# signal is inactive. Dynamic Bus Parking allows a reciprocal power reduction in GMCH address and control input buffers when the processor deasserts its BR0# pin. The On-Die Termination on the processor FSB buffers is disabled when the signals are driven low, resulting in additional power savings. The low I/O termination voltage is on a dedicated voltage plane independent of the core voltage, enabling low I/O switching power at all times.

2.4.1

Dynamic FSB Frequency Switching

Dynamic FSB frequency switching effectively reduces the internal bus clock frequency in half to further decrease the minimum processor operating frequency from the Enhanced Intel SpeedStep Technology performance states and achieve the Super Low Frequency Mode (Super LFM). This feature is supported at FSB frequencies of 1066 MHz, 800 MHz and 667 MHz and does not entail a change in the external bus signal (BCLK) frequency. Instead, both the processor and GMCH internally lower their BCLK reference frequency to 50% of the externally visible frequency. Both the processor and GMCH maintain a virtual BCLK signal (VBCLK) that is aligned to the external BCLK but at half the frequency. After a downward shift, it would appear externally as if the bus is running with a 133-MHz base clock in all aspects, except that the actual external BCLK remains at 266 MHz. See Figure 3 for details. The transition into Super LFM, a down-shift, is done following a handshake between the processor and GMCH. A similar handshake is used to indicate an up-shift, a change back to normal operating mode. Please ensure this feature is enabled and supported in the BIOS.

Datasheet 21

Low Power Features

Figure 3.

Dynamic FSB Frequency Switching Protocol

NOTES: 1. All common clock signals will be active for two BCLKs instead of one (e.g., ADS#, HIT#). 2. The double-pumped signal strobes will have only one transition per BCLK when active, instead of two. 3. The quad-pumped signal strobes will have only two transitions per BCLK when active, instead of four. 4. Same setup and hold times apply, but relative to every second rising BCLK. 5. Following a RESET#, the bus will be in the legacy full-frequency mode. 6. There will not be a down-shift right after RESET# deassertion. 7. There is no backing out of a transition into or out of half-frequency mode. Once the sequence starts it must be completed.

2.4.2

Enhanced Intel Dynamic Acceleration Technology

The processor supports Intel Dynamic Acceleration Technology mode. The Intel Dynamic Acceleration Technology feature allows one core of the processor to operate at a higher frequency point when the other core is inactive and the operating system requests increased performance. This higher frequency is called the opportunistic frequency and the maximum rated operating frequency is the ensured frequency. The processor includes a hysteresis mechanism that improves overall Intel Dynamic Acceleration Technology performance by decreasing unnecessary transitions of the cores in and out of Intel Dynamic Acceleration Technology mode. Normally, the processor would exit Intel Dynamic Acceleration Technology as soon as two cores are active. This can become an issue if the idle core is frequently awakened for a short periods (i.e., high timer tick rates). The hysteresis mechanism allows two cores to be active for a limited time before it transitions out of Intel Dynamic Acceleration Technology mode. Intel Dynamic Acceleration Technology mode enabling requires: Exposure, via BIOS, of the opportunistic frequency as the highest ACPI P state Enhanced Multi-Threaded Thermal Management (EMTTM) Intel Dynamic Acceleration Technology mode and EMTTM MSR configuration via BIOS.

22

Datasheet

Low Power Features

When in Intel Dynamic Acceleration Technology mode, it is possible for both cores to be active under certain internal conditions. In such a scenario the processor may draw a Instantaneous current (ICC_CORE_INST) for a short duration of tINST; however, the average ICC current will be lesser than or equal to ICCDES current specification. Please refer to the Processor DC Specifications section for more details.

2.5

VID-x
The processor implements the VID-x feature for improved control of core voltage levels when the processor enters a reduced power consumption state. VID-x applies only when the processor is in the Intel Dynamic Acceleration Technology performance state and one or more cores are in low-power state (i.e., CC3/CC4/CC6). VID-x provides the ability for the processor to request core voltage level reductions greater than one VID tick. The amount of VID tick reduction is fixed and only occurs while the processor is in Intel Dynamic Acceleration Technology mode. This improved voltage regulator efficiency during periods of reduced power consumption allows for leakage current reduction which results in platform power savings and extended battery life. When in Intel Dynamic Acceleration Technology mode, it is possible for both cores to be active under certain internal conditions. In such a scenario the processor may draw a Instantaneous current (ICC_CORE_INST) for a short duration of tINST; however, the average ICC current will be lesser than or equal to ICCDES current specification. Please refer to the Processor DC Specifications section for more details.

2.6

Processor Power Status Indicator (PSI-2) Signal

The processor incorporates the PSI# signal that is asserted when the processor is in a reduced power consumption state. PSI# can be used to improve intermediate and light load efficiency of the voltage regulator, resulting in platform power savings and extended battery life. The algorithm that the processor uses for determining when to assert PSI# is different from the algorithm used in previous mobile processors. PSI-2 functionality is expanded further to support three processor states: Both cores are in idle state Only one core active state Both cores are in active state PSI-2 functionality improves overall voltage regulator efficiency over a wide power range based on the C-state and P-state of the two cores. The combined C-state and Pstate of both cores are used to dynamically predict processor power. The real-time power prediction is compared against a set of predefined and configured values of CHH and CHL. CHH is indicative of the active C-state of both the cores and CHL is indicative that only one core is in active C-state and the other core is in low power core state. PSI-2# output is asserted upon crossing these thresholds indicating that the processor requires lower power. The voltage regulator will adapt its power output accordingly. Additionally the voltage regulator may switch to a single phase and/ or asynchronous mode when the processor is idle and fused leakage limit is less than or equal to the BIOS threshold value.

Datasheet 23

Low Power Features

24

Datasheet

Electrical Specifications

3
3.1

Electrical Specifications
Power and Ground Pins
For clean, on-chip power distribution, the processor will have a large number of VCC (power) and VSS (ground) inputs. All power pins must be connected to VCC power planes while all VSS pins must be connected to system ground planes. Use of multiple power and ground planes is recommended to reduce I*R drop. The processor VCC pins must be supplied the voltage determined by the VID (Voltage ID) pins.

3.2

Decoupling Guidelines
Due to its large number of transistors and high internal clock speeds, the processor is capable of generating large average current swings between low and full power states. This may cause voltages on power planes to sag below their minimum values if bulk decoupling is not adequate. Larger bulk storage, such as electrolytic capacitors, supply current during longer lasting changes in current demand by the component, such as coming out of an idle condition. Similarly, they act as a storage well for current when entering an idle condition from a running condition. Care must be taken in the board design to ensure that the voltage provided to the processor remains within the specifications listed in the tables in Section 3.10. Failure to do so can result in timing violations or reduced lifetime of the component.

3.2.1

VCC Decoupling
VCC regulator solutions need to provide bulk capacitance with a low Effective Series Resistance (ESR) and keep a low interconnect resistance from the regulator to the socket. Bulk decoupling for the large current swings when the part is powering on, or entering/exiting low-power states, should be provided by the voltage regulator solution depending on the specific system design.

3.2.2

FSB AGTL+ Decoupling

The processors integrate signal termination on the die as well as incorporate high frequency decoupling capacitance on the processor package. Decoupling must also be provided by the system motherboard for proper AGTL+ bus operation.

3.2.3

FSB Clock (BCLK[1:0]) and Processor Clocking

BCLK[1:0] directly controls the FSB interface speed as well as the core frequency of the processor. As in previous-generation processors, the processor core frequency is a multiple of the BCLK[1:0] frequency. The processor bus ratio multiplier will be set at its default ratio at manufacturing. The processor uses a differential clocking implementation.

Datasheet 25

Electrical Specifications

3.3

Voltage Identification and Power Sequencing

The processor uses seven voltage identification pins,VID[6:0], to support automatic selection of power supply voltages. The VID pins for the processor are CMOS outputs driven by the processor VID circuitry. Table 2 specifies the voltage level corresponding to the state of VID[6:0]. A 1 in the table refers to a high-voltage level and a 0 refers to a low-voltage level.

Table 2.

Voltage Identification Definition (Sheet 1 of 3)

VID6 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 VID5 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 VID4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 VID3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 VID2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 VID1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 VID0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 VCC (V) 1.5000 1.4875 1.4750 1.4625 1.4500 1.4375 1.4250 1.4125 1.4000 1.3875 1.3750 1.3625 1.3500 1.3375 1.3250 1.3125 1.3000 1.2875 1.2750 1.2625 1.2500 1.2375 1.2250 1.2125 1.2000 1.1875 1.1750 1.1625 1.1500 1.1375 1.1250 1.1125 1.1000 1.0875 1.0750 1.0625 1.0500 1.0375 1.0250 1.0125

26

Datasheet

Electrical Specifications

Table 2.

Voltage Identification Definition (Sheet 2 of 3)

VID6 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 VID5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 VID4 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 VID3 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 VID2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 VID1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 VID0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 VCC (V) 1.0000 0.9875 0.9750 0.9625 0.9500 0.9375 0.9250 0.9125 0.9000 0.8875 0.8750 0.8625 0.8500 0.8375 0.8250 0.8125 0.8000 0.7875 0.7750 0.7625 0.7500 0.7375 0.7250 0.7125 0.7000 0.6875 0.6750 0.6625 0.6500 0.6375 0.6250 0.6125 0.6000 0.5875 0.5750 0.5625 0.5500 0.5375 0.5250 0.5125 0.5000 0.4875 0.4750 0.4625 0.4500 0.4375 0.4250

Datasheet 27

Electrical Specifications

Table 2.

Voltage Identification Definition (Sheet 3 of 3)

VID6 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 VID5 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 VID4 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 VID3 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 VID2 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 VID1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 VID0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 VCC (V) 0.4125 0.4000 0.3875 0.3750 0.3625 0.3500 0.3375 0.3250 0.3125 0.3000 0.2875 0.2750 0.2625 0.2500 0.2375 0.2250 0.2125 0.2000 0.1875 0.1750 0.1625 0.1500 0.1375 0.1250 0.1125 0.1000 0.0875 0.0750 0.0625 0.0500 0.0375 0.0250 0.0125 0.0000 0.0000 0.0000 0.0000 0.0000 0.0000 0.0000 0.0000

28

Datasheet

Electrical Specifications

3.4

Catastrophic Thermal Protection

The processor supports the THERMTRIP# signal for catastrophic thermal protection. An external thermal sensor should also be used to protect the processor and the system against excessive temperatures. Even with the activation of THERMTRIP#, which halts all processor internal clocks and activity, leakage current can be high enough that the processor cannot be protected in all conditions without the removal of power to the processor. If the external thermal sensor detects a catastrophic processor temperature of approximately 125C (maximum), or if the THERMTRIP# signal is asserted, the VCC supply to the processor must be turned off within 500 ms to prevent permanent silicon damage due to thermal runaway of the processor. THERMTRIP# functionality is not ensured if the PWRGOOD signal is not asserted, and during Deep Power Down Technology State (C6).

3.5

Reserved and Unused Pins

All RESERVED (RSVD) pins must remain unconnected. Connection of these pins to VCC, VSS, or to any other signal (including each other) can result in component malfunction or incompatibility with future processors. See Section 4.2 for a pin listing of the processor and the location of all RSVD pins. For reliable operation, always connect unused inputs or bidirectional signals to an appropriate signal level. Unused active low AGTL+ inputs may be left as no-connects if AGTL+ termination is provided on the processor silicon. Unused active high inputs should be connected through a resistor to ground (VSS). Unused outputs can be left unconnected. The TEST1,TEST2,TEST3,TEST4,TEST5,TEST6,TEST7 pins are used for test purposes internally and can be left as No Connects.

3.6

FSB Frequency Select Signals (BSEL[2:0])

The BSEL[2:0] signals are used to select the frequency of the processor input clock (BCLK[1:0]). These signals should be connected to the clock chip and the appropriate chipset on the platform. The BSEL encoding for BCLK[1:0] is shown in Table 3.

Table 3.

BSEL[2:0] Encoding for BCLK Frequency

BSEL[2] L L L L H H H H BSEL[1] L L H H H H L L BSEL[0] L H H L L H H L BCLK Frequency 266 MHz RESERVED RESERVED 200 MHz RESERVED RESERVED RESERVED RESERVED

Datasheet 29

Electrical Specifications

3.7

FSB Signal Groups

The FSB signals have been combined into groups by buffer type in the following sections. In this document, the term AGTL+ Input refers to the AGTL+ input group as well as the AGTL+ I/O group when receiving. Similarly, AGTL+ Output refers to the AGTL+ output group as well as the AGTL+ I/O group when driving. With the implementation of a source-synchronous data bus, two sets of timing parameters are specified. One set is for common clock signals, which are dependent upon the rising edge of BCLK0 (ADS#, HIT#, HITM#, etc.), and the second set is for the source-synchronous signals which are relative to their respective strobe lines (data and address) as well as the rising edge of BCLK0. Asychronous signals are still present (A20M#, IGNNE#, etc.) and can become active at any time during the clock cycle. Table 4 identifies which signals are common clock, source synchronous, and asynchronous.

Table 4.

FSB Pin Groups

Signal Group AGTL+ Common Clock Input AGTL+ Common Clock I/O Type Synchronous to BCLK[1:0] Synchronous to BCLK[1:0] Signals1 BPRI#, DEFER#, PREQ#5, RESET#, RS[2:0]#, TRDY# ADS#, BNR#, BPM[3:0]#3, BR0#, DBSY#, DRDY#, HIT#, HITM#, LOCK#, PRDY#3, DPWR# Signals REQ[4:0]#, A[16:3]# AGTL+ Source Synchronous I/O A[35:17]# Synchronous to assoc. strobe D[15:0]#, DINV0# D[31:16]#, DINV1# D[47:32]#, DINV2# D[63:48]#, DINV3# Associated Strobe ADSTB[0]# ADSTB[1]# DSTBP0#, DSTBN0# DSTBP1#, DSTBN1# DSTBP2#, DSTBN2# DSTBP3#, DSTBN3#

AGTL+ Strobes CMOS Input Open Drain Output Open Drain I/O CMOS Output CMOS Input Open Drain Output FSB Clock Power/Other

Synchronous to BCLK[1:0] Asynchronous Asynchronous Asynchronous Asynchronous

ADSTB[1:0]#, DSTBP[3:0]#, DSTBN[3:0]# A20M#, DPRSTP#, DPSLP#, IGNNE#, INIT#, LINT0/ INTR, LINT1/NMI, PWRGOOD, SMI#, SLP#, STPCLK# FERR#, IERR#, THERMTRIP# PROCHOT#4 PSI#, VID[6:0], BSEL[2:0]

Synchronous to TCK TCK, TDI, TMS, TRST# Synchronous to TCK Clock TDO BCLK[1:0] COMP[3:0], DBR#2, GTLREF, RSVD, TEST2, TEST1, THERMDA, THERMDC, VCC, VCCA, VCCP, VCC_SENSE, VSS, VSS_SENSE

NOTES:See next page

30

Datasheet

Electrical Specifications

1. 2.

3. 4. 5.

Refer to Chapter 4 for signal descriptions and termination requirements. In processor systems where there is no debug port implemented on the system board, these signals are used to support a debug port interposer. In systems with the debug port implemented on the system board, these signals are no connects. BPM[2:1]# and PRDY# are AGTL+ output-only signals. PROCHOT# signal type is open drain output and CMOS input. On-die termination differs from other AGTL+ signals.

3.8

CMOS Signals
CMOS input signals are shown in Table 4. Legacy output FERR#, IERR# and other nonAGTL+ signals (THERMTRIP# and PROCHOT#) use Open Drain output buffers. These signals do not have setup or hold time specifications in relation to BCLK[1:0]. However, all of the CMOS signals are required to be asserted for more than four BCLKs for the processor to recognize them. See Section 3.10 for the DC specifications for the CMOS signal groups.

3.9

Maximum Ratings
Table 5 specifies absolute maximum and minimum ratings only, which lie outside the functional limits of the processor. Only within specified operation limits, can functionality and long-term reliability be expected. At conditions outside functional operation condition limits, but within absolute maximum and minimum ratings, neither functionality nor long-term reliability can be expected. If a device is returned to conditions within functional operation limits after having been subjected to conditions outside these limits, but within the absolute maximum and minimum ratings, the device may be functional, but with its lifetime degraded depending on exposure to conditions exceeding the functional operation condition limits. At conditions exceeding absolute maximum and minimum ratings, neither functionality nor long-term reliability can be expected. Moreover, if a device is subjected to these conditions for any length of time then, when returned to conditions within the functional operating condition limits, it will either not function, or its reliability will be severely degraded.

Caution:

Although the processor contains protective circuitry to resist damage from static electric discharge, precautions should always be taken to avoid high static voltages or electric fields. Processor Absolute Maximum Ratings
Symbol TSTORAGE TSTORAGE VCC VinAGTL+ VinAsynch_CMOS Parameter Processor Storage Temperature Processor Storage Temperature Any Processor Supply Voltage with Respect to VSS AGTL+ Buffer DC Input Voltage with Respect to VSS CMOS Buffer DC Input Voltage with Respect to VSS Min -40 -25 -0.3 -0.1 -0.1 1.45 1.45 1.45 Max 85 Unit C C V V V Notes1,2 3,4,5 6

Table 5.

NOTES: 1. For functional operation, all processor electrical, signal quality, mechanical and thermal specifications must be satisfied.

Datasheet 31

Electrical Specifications

2. 3.

4. 5. 6.

Excessive overshoot or undershoot on any signal will likely result in permanent damage to the processor. Storage temperature is applicable to storage conditions only. In this scenario, the processor must not receive a clock, and no lands can be connected to a voltage bias. Storage within these limits will not affect the long-term reliability of the device. For functional operation, please refer to the processor case temperature specifications. This rating applies to the processor and does not include any tray or packaging. Failure to adhere to this specification can affect the long-term reliability of the processor. For Intel Core2 Duo mobile processors in 22x22 mm package.

3.10

Processor DC Specifications
The processor DC specifications in this section are defined at the processor core (pads) unless noted otherwise. The tables list the DC specifications for the processor and are valid only while meeting specifications for junction temperature, clock frequency, and input voltages. The Highest Frequency Mode (HFM) and Lowest Frequency Mode (LFM) refer to the highest and lowest core operating frequencies supported on the processor. Active mode load line specifications apply in all states except in the Deep Sleep and Deeper Sleep states. VCC,BOOT is the default voltage driven by the voltage regulator at power up in order to set the VID values. Unless specified otherwise, all specifications for the processor are at TJ = 105 C. Read all notes associated with each parameter.

Table 6.
Symbol VCCDAM VCCHFM VCCLFM VCCSLFM VCC,BOOT VCCP VCCA VCCDPRSLP VDC4 VCCDPPWDN ICCDES

Voltage and Current Specifications for the Dual-Core, Extreme Edition Processors (Sheet 1 of 2)
Parameter VCC in Enhanced Intel Dynamic Acceleration Technology Mode VCC at Highest Frequency Mode (HFM) VCC at Lowest Frequency Mode (LFM) VCC at Super Low Frequency Mode (Super LFM) Default VCC Voltage for Initial Power Up AGTL+ Termination Voltage PLL Supply Voltage VCC at Deeper Sleep VCC at Intel Enhanced Deeper Sleep State VCC at Deep Power Down Technology State (C6) ICC for Processors Recommended Design Target ICC for Processors Min 1.0 1.0 0.85 0.8 1.00 1.425 0.65 0.6 0.35 1.20 1.05 1.5 1.10 1.575 0.85 0.85 0.7 60 59 34 24 Typ Max 1.325 1.275 1.1 1.0 Unit V V V V V V V V V V A 12 1, 2 1, 2 Notes 1, 2 1, 2 1, 2 1, 2 2, 6

ICC

Processor Number X9100

Core Frequency/Voltage 3.06 GHz & VCCHFM 1.6 GHz & VCCLFM 0.8 GHz & VCCSLFM

3, 4, 10

32

Datasheet

Electrical Specifications

Table 6.
Symbol IAH, ISGNT

Voltage and Current Specifications for the Dual-Core, Extreme Edition Processors (Sheet 2 of 2)
Parameter ICC Auto-Halt & Stop-Grant HFM SuperLFM ICC Sleep HFM SuperLFM ICC Deep Sleep HFM SuperLFM ICC Deeper Sleep (C4) ICC Intel Enhanced Deeper Sleep State ICC Deep Power Down Technology State (C6) VCC Power Supply Current Slew Rate at Processor Package Pin ICC for VCCA Supply ICC for VCCP Supply before VCC Stable ICC for VCCP Supply after VCC Stable Min Typ Max 29.7 16.7 28.8 16.5 26.8 16.0 12.2 11.7 11.0 600 130 4.5 2.5 Unit A Notes 3, 4, 10

ISLP

3, 4, 10

IDSLP IDPRSLP IDC4 IPPWDN dICC/DT ICCA ICCP

A A A A mA/s mA A A

3, 4, 10 3, 4 3, 4 3, 4 5, 7

8 9

NOTES: 1. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor during a power management event (Intel Thermal Monitor 2, Enhanced Intel SpeedStep Technology, or Enhanced Halt State). 2. The voltage specifications are assumed to be measured across VCC_SENSE and VSS_SENSE pins at socket with a 100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1-M minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled in the scope probe. 3. Specified at 105 C TJ. 4. Specified at the nominal VCC. 5. Measured at the bulk capacitors on the motherboard. 6. VCC,BOOT tolerance shown in Figure 4 and Figure 5. 7. Based on simulations and averaged over the duration of any change in current. Specified by design/ characterization at nominal VCC. Not 100% tested. 8. This is a power-up peak current specification, which is applicable when VCCP is high and VCC_CORE is low. 9. This is a steady-state ICC current specification, which is applicable when both VCCP and VCC_CORE are high. 10. The maximum delta between Intel Enhanced Deeper Sleep and LFM on the processor will be lesser than or equal to 300 mV. 11. The ICCDES (max) specification of 60 A is for Intel Core2 Extreme processors only.

Datasheet 33

Electrical Specifications

Table 7.
Symbol VCCDAM VCCHFM VCCLFM VCCSLFM VCC,BOOT VCCP VCCA VCCDPRSLP VDC4 VCCDPPWDN ICCDES

Voltage and Current Specifications for the Dual-Core, Standard-Voltage Processors

Parameter VCC in Enhanced Intel Dynamic Acceleration Technology Mode VCC at Highest Frequency Mode (HFM) VCC at Lowest Frequency Mode (LFM) VCC at Super Low Frequency Mode (Super LFM) Default VCC Voltage for Initial Power Up AGTL+ Termination Voltage PLL Supply Voltage VCC at Deeper Sleep VCC at Intel Enhanced Deeper Sleep State VCC at Deep Power Down Technology State (C6) ICC for Processors Recommended Design Target ICC for Processors Processor Number Core Frequency/Voltage 3.06 GHz & VCCHFM 2.93 GHz & VCCHFM 2.80 GHz & VCCHFM 2.66 GHz & VCCHFM 2.53 GHz & VCCHFM 1.6 GHz & VCCLFM 0.8 GHz & VCCSLFM Min 1.0 1.0 0.85 0.75 1.0 1.425 0.65 0.6 0.35 1.2 1.05 1.5 Typ Max 1.3 1.25 1.1 0.95 1.1 1.575 0.85 0.85 0.7 47 47 47 47 47 47 31.4 22.4 25.4 13.7 24.7 13.5 22.9 13.0 11.7 10.5 5.7 600 130 4.5 2.5 Unit V V V V V V V V V V A 1, 2 1, 2 1, 2 12 Notes 1, 2 1, 2 1, 2 1, 2 2, 6

ICC

T9900 T9800 T9600 T9550 T9400

3, 4, 10

IAH, ISGNT

ICC Auto-Halt & Stop-Grant HFM SuperLFM ICC Sleep HFM SuperLFM ICC Deep Sleep HFM SuperLFM ICC Deeper Sleep (C4) ICC Intel Enhanced Deeper Sleep ICC Deep Power Down Technology State (C6) VCC Power Supply Current Slew Rate at Processor Package Pin ICC for VCCA Supply ICCC for VCCP Supply before VCC Stable ICC for VCCP Supply after VCC Stable

3, 4, 10

ISLP

3, 4, 10

IDSLP IDPRSLP IDC4 IPPWDN dICC/DT ICCA ICCP

A A A A mA/s mA A A

3, 4, 10 3, 4 3, 4 3, 4 5, 7

8 9

NOTES:See next page.

34

Datasheet

Electrical Specifications

1.

2.

3. 4. 5. 6. 7. 8. 9. 10. 11. 12.

Each processor is programmed with a maximum valid voltage identification value (VID), which is set at manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor during a power management event (Intel Thermal Monitor 2, Enhanced Intel SpeedStep Technology, or Enhanced Halt State). The voltage specifications are assumed to be measured across VCC_SENSE and VSS_SENSE pins at socket with a 100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1-M minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled in the scope probe. Specified at 105 C TJ. Specified at the nominal VCC. Measured at the bulk capacitors on the motherboard. VCC,BOOT tolerance shown in Figure 7 and Figure 8. Based on simulations and averaged over the duration of any change in current. Specified by design/ characterization at nominal VCC. Not 100% tested. This is a power-up peak current specification that is applicable when VCCP is high and VCC_CORE is low. This is a steady-state ICCcurrent specification that is applicable when both VCCP and VCC_CORE are high. Processor ICC requirements in Intel Dynamic Acceleration Technology mode are lesser than ICC in HFM The maximum delta between Intel Enhanced Deeper Sleep and LFM on the processor will be lesser than or equal to 300 mV. Instantaneous current ICC_CORE_INST of 57 A has to be sustained for short time (tINST) of 35 s. Average current will be less than maximum specified ICCDES. VR OCP threshold should be high enough to support current levels described herein.

Table 8.
Symbol VCCDAM VCCHFM VCCLFM VCCSLFM VCC,BOOT VCCP VCCA VCCDPRSLP VDC4 VCCDPPWDN ICCDES

Voltage and Current Specifications for the Dual-Core, Low-Power Standard-Voltage Processors (25 W) in Standard Package
Parameter VCC in Enhanced Intel Dynamic Acceleration Technology Mode VCC at Highest Frequency Mode (HFM) VCC at Lowest Frequency Mode (LFM) VCC at Super Low Frequency Mode (Super LFM) Default VCC Voltage for Initial Power Up AGTL+ Termination Voltage PLL Supply Voltage VCC at Deeper Sleep VCC at Intel Enhanced Deeper Sleep State VCC at Deep Power Down Technology State (C6) ICC for Processors Recommended Design Target ICC for Processors Processor Number P9700 P9600 P8800 P9500 P8700 P8600 P8400 Core Frequency/Voltage 2.8 GHz & VCCHFM 2.667 GHz & VCCHFM 2.667 GHz & VCCHFM 2.53 GHz & VCCHFM 2.53 GHz & VCCHFM 2.4 GHz & VCCHFM 2.267 GHz & VCCHFM 1.6 GHz & VCCLFM 0.8 GHz & VCCSLFM Min 0.9 0.9 0.85 0.75 1.0 1.425 0.65 0.6 0.35 1.2 1.05 1.5 Typ Max 1.3 1.25 1.025 0.95 1.1 1.575 0.85 0.85 0.7 38 38 38 38 38 38 38 38 27.7 17.5 Unit V V V V V V V V V V A 1, 2 1, 2 1, 2 12 Notes 1, 2 1, 2 1, 2 1, 2 2, 6

ICC

3, 4, 10

Datasheet 35

Electrical Specifications

Table 8.
Symbol IAH, ISGNT

Voltage and Current Specifications for the Dual-Core, Low-Power Standard-Voltage Processors (25 W) in Standard Package
Parameter ICC Auto-Halt & Stop-Grant HFM SuperLFM ICC Sleep HFM SuperLFM ICC Deep Sleep HFM SuperLFM ICC Deeper Sleep ICC Intel Enhanced Deeper Sleep ICC Deep Power Down Technology State (C6) VCC Power Supply Current Slew Rate at Processor Package Pin ICC for VCCA Supply ICCC for VCCP Supply before VCC Stable ICC for VCCP Supply after VCC Stable Min Typ Max 15.3 10.5 14.6 10.3 12.9 9.8 7.3 6.7 4.3 600 130 4.5 2.5 Unit A Notes 3, 4, 10

ISLP

3, 4, 10

IDSLP IDPRSLP IDC4 IPPWDN dICC/DT ICCA ICCP

A A A A mA/s mA A A

3, 4, 10 3, 4 3, 4 3, 4 5, 7

8 9

NOTES:. 1. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor during a power management event (Intel Thermal Monitor 2, Enhanced Intel SpeedStep Technology, or Enhanced Halt State). 2. The voltage specifications are assumed to be measured across VCC_SENSE and VSS_SENSE pins at socket with a 100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1-M minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled in the scope probe. 3. Specified at 105 C TJ. 4. Specified at the nominal VCC. 5. Measured at the bulk capacitors on the motherboard. 6. VCC,BOOT tolerance shown in Figure 4 and Figure 5. 7. Based on simulations and averaged over the duration of any change in current. Specified by design/ characterization at nominal VCC. Not 100% tested. 8. This is a power-up peak current specification that is applicable when VCCP is high and VCC_CORE is low. 9. This is a steady-state ICCcurrent specification that is applicable when both VCCP and VCC_CORE are high. 10. Processor ICC requirements in Intel Dynamic Acceleration Technology mode are lesser than ICC in HFM 11. The maximum delta between Intel Enhanced Deeper Sleep and LFM on the processor will be lesser than or equal to 300 mV. 12. Instantaneous current ICC_CORE_INST of 49 A has to be sustained for short time (tINST) of 35 s. Average current will be less than maximum specified ICCDES. VR OCP threshold should be high enough to support current levels described herein.

36

Datasheet

Electrical Specifications

Table 9.
Symbol VCCDAM VCCHFM VCCLFM VCCSLFM VCC,BOOT VCCP VCCA VCCDPRSLP VDC4 VCCDPPWDN ICCDES

Voltage and Current Specifications for the Dual-Core, Power Optimized Performance (25 W) SFF Processors
Parameter VCC in Enhanced Intel Dynamic Acceleration Technology Mode VCC at Highest Frequency Mode (HFM) VCC at Lowest Frequency Mode (LFM) VCC at Super Low Frequency Mode (Super LFM) Default VCC Voltage for Initial Power Up AGTL+ Termination Voltage PLL Supply Voltage VCC at Deeper Sleep VCC at Intel Enhanced Deeper Sleep State VCC at Deep Power Down Technology State (C6) ICC for Processors Recommended Design Target Processor Number SP9600 Core Frequency/Voltage 2.53 GHz & VCCHFM 2.4 GHz & VCCHFM 2.26 GHz & VCCHFM 1.2 GHz & VCCLFM 0.8 GHz & VCCSLFM ICC Auto-Halt & Stop-Grant HFM SuperLFM ICC Sleep HFM SuperLFM ICC Deep Sleep HFM SuperLFM ICC Deeper Sleep ICC Intel Enhanced Deeper Sleep State ICC Deep Power Down Technology State (C6) VCC Power Supply Current Slew Rate at Processor Package Pin ICC for VCCA Supply ICC for VCCP Supply before VCC Stable ICC for VCCPSupply after VCC Stable Min 0.9 0.9 0.85 0.75 1.00 1.425 0.65 0.6 0.35 Typ 1.20 1.05 1.5 Max 1.275 1.2125 1.025 0.95 1.10 1.575 0.85 0.85 0.7 37 37 37 37 28 17 14.8 8.8 Unit V V V V V V V V V V A 1, 2 1, 2 1, 2 5 Notes 1, 2 1, 2 1, 2 1, 2 2, 6, 8

ICC

SP9400 SP9300

3, 4, 12

IAH, ISGNT

3, 4, 12

ISLP

14.2 8.6 12.5 8.1 6.9 5.9 3.5 600 130 4.5 2.5

3, 4, 12

IDSLP IDPRSLP IDC4 IDPWDN dICC/DT ICCA ICCP

A A A A mA/s mA A A

3, 4, 12 3, 4 3, 4 3, 4 7, 9

10 11

NOTES: 1. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. Note

Datasheet 37

Electrical Specifications

2.

3. 4. 5. 6. 7. 8. 9. 10. 11. 12.

that this differs from the VID employed by the processor during a power management event (Intel Thermal Monitor 2, Enhanced Intel SpeedStep Technology, or Enhanced Halt State). The voltage specifications are assumed to be measured across VCC_SENSE and VSS_SENSE pins at socket with a 100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1-M minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled in the scope probe. Specified at 105 C TJ. Specified at the nominal VCC. Measured at the bulk capacitors on the motherboard. VCC,BOOT tolerance shown in Figure 7 and Figure 8. Based on simulations and averaged over the duration of any change in current. Specified by design/ characterization at nominal VCC. Not 100% tested. This is a power-up peak current specification that is applicable when VCCP is high and VCC_CORE is low. This is a steady-state ICC current specification that is applicable when both VCCP and VCC_CORE are high. Processor ICC requirements in Intel Dynamic Acceleration Technology mode are lesser than ICC in HFM The maximum delta between Intel Enhanced Deeper Sleep and LFM on the processor will be lesser than or equal to 300 mV. Instantaneous current ICC_CORE_INST of 44 A has to be sustained for short time (tINST) of 35 s. Average current will be less than maximum specified ICCDES. VR OCP threshold should be high enough to support current levels described herein.

Table 10.
Symbol VCCDAM VCCHFM VCCLFM VCCSLFM VCC,BOOT VCCP VCCA VCCDPRSLP VDC4 VCCDPPWDN ICCDES

Voltage and Current Specifications for the Dual-Core, Low-Voltage SFF Processor
Parameter VCC in Enhanced Intel Dynamic Acceleration Technology Mode VCC at Highest Frequency Mode (HFM) VCC at Lowest Frequency Mode (LFM) VCC at Super Low Frequency Mode (Super LFM) Default VCC Voltage for Initial Power Up AGTL+ Termination Voltage PLL Supply Voltage VCC at Deeper Sleep VCC at Intel Enhanced Deeper Sleep State VCC at Deep Power Down Technology State (C6) ICC for Processors Recommended Design Target Processor Number SL9600 Core Frequency/Voltage 2.13 GHz & VCCHFM 1.86 GHz & VCCHFM 1.6 GHz & VCCHFM 1.6 GHz & VCCLFM 0.8 GHz & VCCSLFM Min 0.9 0.9 0.85 0.75 1.00 1.425 0.65 0.6 0.35 Typ 1.20 1.05 1.5 Max 1.25 1.175 1.025 0.95 1.10 1.575 0.85 0.85 0.7 27 27 27 27 25.5 15 12.3 8.2 11.8 8.0 Unit V V V V V V V V V V A 1, 2 1, 2 1, 2 5 Notes 1, 2 1, 2 1, 2 1, 2 2, 6, 8

ICC

SL9400 SL9300

3, 4, 12

IAH, ISGNT

ICC Auto-Halt & Stop-Grant HFM SuperLFM ICC Sleep HFM SuperLFM

3, 4, 12

ISLP

3, 4, 12

38

Datasheet

Electrical Specifications

Table 10.
Symbol IDSLP IDPRSLP IDC4 IDPWDN dICC/DT ICCA ICCP

Voltage and Current Specifications for the Dual-Core, Low-Voltage SFF Processor
Parameter ICC Deep Sleep HFM SuperLFM ICC Deeper Sleep ICC Intel Enhanced Deeper Sleep ICC Deep Power Down Technology State (C6) VCC Power Supply Current Slew Rate at Processor Package Pin ICC for VCCA Supply ICC for VCCP Supply before VCC Stable ICC for VCCP Supply after VCC Stable Min Typ Max 10.5 7.5 6.5 5.6 3.2 600 130 4.5 2.5 Unit A A A A mA/s mA A A 10 11 Notes 3, 4, 12 3, 4 3, 4 3, 4 7, 9

NOTES: 1. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor during a power management event (Intel Thermal Monitor 2, Enhanced Intel SpeedStep Technology, or Enhanced Halt State). 2. The voltage specifications are assumed to be measured across VCC_SENSE and VSS_SENSE pins at socket with a 100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1-M minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled in the scope probe. 3. Specified at 105 C TJ. 4. Specified at the nominal VCC. 5. Measured at the bulk capacitors on the motherboard. 6. VCC,BOOT tolerance shown in Figure 7 and Figure 8. 7. Based on simulations and averaged over the duration of any change in current. Specified by design/ characterization at nominal VCC. Not 100% tested. 8. This is a power-up peak current specification that is applicable when VCCP is high and VCC_CORE is low. 9. This is a steady-state ICC current specification that is applicable when both VCCP and VCC_CORE are high. 10. Processor ICC requirements in Intel Dynamic Acceleration Technology mode are lesser than ICC in HFM 11. The maximum delta between Intel Enhanced Deeper Sleep and LFM on the processor will be lesser than or equal to 300 mV. 12. Instantaneous current ICC_CORE_INST of 36 A has to be sustained for short time (tINST) of 35 s. Average current will be less than maximum specified ICCDES. VR OCP threshold should be high enough to support current levels described herein.

Datasheet 39

Electrical Specifications

Table 11.
Symbol VCCDAM VCCHFM VCCLFM VCCSLFM VCC,BOOT VCCP VCCA VCCDPRSLP VDC4 VCCDPPWDN ICCDES

Voltage and Current Specifications for the Dual-Core, Ultra-Low-Voltage SFF Processor
Parameter VCC in Enhanced Intel Dynamic Acceleration Technology Mode VCC at Highest Frequency Mode (HFM) VCC at Lowest Frequency Mode (LFM) VCC at Super Low Frequency Mode (Super LFM) Default VCC Voltage for Initial Power Up AGTL+ Termination Voltage PLL Supply Voltage VCC at Deeper Sleep VCC at Intel Enhanced Deeper Sleep State VCC at Deep Power Down Technology State (C6) ICC for Processors Recommended Design Target Processor Number Core Frequency/Voltage 1.6 1.4 1.2 1.2 0.8 GHz GHz GHz GHz GHz & & & & & VCCHFM VCCHFM VCCHFM VCCLFM VCCSLFM Min 0.8 0.775 0.8 0.725 1.00 1.425 0.65 0.6 0.35 Typ 1.20 1.05 1.5 Max 1.1625 1.1 0.975 0.925 1.10 1.575 0.8 0.8 0.6 18 18 18 18 18 13 6.3 4.4 5.9 4.2 5.0 3.7 3.2 2.8 2.4 600 130 4.5 2.5 Unit V V V V V V V V V V A 1, 2 1, 2 1, 2 5 Notes 1, 2 1, 2 1, 2 1, 2 2, 6, 8

ICC

SU9600 SU9400 SU9300

3, 4, 12

IAH, ISGNT

ICC Auto-Halt & Stop-Grant HFM SuperLFM ICC Sleep HFM SuperLFM ICC Deep Sleep HFM SuperLFM ICC Deeper Sleep ICC Intel Enhanced Deeper Sleep State ICC Deep Power Down Technology State (C6) VCC Power Supply Current Slew Rate at Processor Package Pin ICC for VCCA Supply ICC for VCCP Supply before VCC Stable ICC for VCCPSupply after VCC Stable

3, 4, 12

ISLP

3, 4, 12

IDSLP IDPRSLP IDC4 IDPWDN dICC/DT ICCA ICCP

A A A A mA/s mA A A

3, 4, 12 3, 4 3, 4 3, 4 7, 9

10 11

NOTES:See next page.

40

Datasheet

Electrical Specifications

1.

2.

3. 4. 5. 6. 7. 8. 9. 10. 11. 12.

Each processor is programmed with a maximum valid voltage identification value (VID), which is set at manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor during a power management event (Intel Thermal Monitor 2, Enhanced Intel SpeedStep Technology, or Enhanced Halt State). The voltage specifications are assumed to be measured across VCC_SENSE and VSS_SENSE pins at socket with a 100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1-M minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled in the scope probe. Specified at 105 C TJ. Specified at the nominal VCC. Measured at the bulk capacitors on the motherboard. VCC,BOOT tolerance shown in Figure 7 and Figure 8. Based on simulations and averaged over the duration of any change in current. Specified by design/ characterization at nominal VCC. Not 100% tested. This is a power-up peak current specification that is applicable when VCCP is high and VCC_CORE is low. This is a steady-state ICC current specification that is applicable when both VCCP and VCC_CORE are high. Processor ICC requirements in Intel Dynamic Acceleration Technology mode are lesser than ICC in HFM The maximum delta between Intel Enhanced Deeper Sleep and LFM on the processor will be lesser than or equal to 300 mV. Instantaneous current ICC_CORE_INST of 24 A has to be sustained for short time (tINST) of 35s. Average current will be less than maximum specified ICCDES. VR OCP threshold should be high enough to support current levels described herein.

Table 12.
Symbol VCCHFM VCCLFM VCCSLFM VCC,BOOT VCCP VCCA VCCDPRSLP VDC4 VCCDPPWDN ICCDES

Voltage and Current Specifications for the Ultra-Low-Voltage, Single-Core (5.5 W) SFF Processor
Parameter VCC at Highest Frequency Mode (HFM) VCC at Lowest Frequency Mode (LFM) VCC at Super Low Frequency Mode (Super LFM) Default VCC Voltage for Initial Power Up AGTL+ Termination Voltage PLL Supply Voltage VCC at Deeper Sleep VCC at Intel Enhanced Deeper Sleep State VCC at Deep Power Down Technology State (C6) ICC for Processors Recommended Design Target Processor Number Core Frequency/Voltage 1.4 1.2 1.2 0.8 GHz GHz GHz GHz & & & & VCCHFM VCCHFM VCCLFM VCCSLFM Min 0.775 0.8 0.725 1.00 1.425 0.65 0.6 0.35 Typ 1.20 1.05 1.5 Max 1.1 0.975 0.925 1.10 1.575 0.8 0.8 0.6 9 9 9 9 7 4.4 3.7 4.1 3.5 Unit V V V V V V V V V A 1, 2 1, 2 1, 2 5 Notes 1, 2 1, 2 1, 2 2, 6, 8

ICC

SU3500 SU3300

3, 4, 12

IAH, ISGNT

ICC Auto-Halt & Stop-Grant HFM SuperLFM ICC Sleep HFM SuperLFM

3, 4, 12

ISLP

3, 4, 12

Datasheet 41

Electrical Specifications

Table 12.
Symbol IDSLP IDPRSLP IDC4 IDPWDN dICC/DT ICCA ICCP

Voltage and Current Specifications for the Ultra-Low-Voltage, Single-Core (5.5 W) SFF Processor
Parameter ICC Deep Sleep HFM SuperLFM ICC Deeper Sleep ICC Intel Enhanced Deeper Sleep State ICC Deep Power Down Technology State (C6) VCC Power Supply Current Slew Rate at Processor Package Pin ICC for VCCA Supply ICC for VCCP Supply before VCC Stable ICC for VCCPSupply after VCC Stable Min Typ Max 3.3 3.0 2.1 1.9 1.7 600 130 4.5 2.5 Unit A A A A mA/s mA A A 10 11 Notes 3, 4, 12 3, 4 3, 4 3, 4 7, 9

NOTES: 1. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor during a power management event (Intel Thermal Monitor 2, Enhanced Intel SpeedStep Technology, or Enhanced Halt State). 2. The voltage specifications are assumed to be measured across VCC_SENSE and VSS_SENSE pins at socket with a 100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1-M minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled in the scope probe. 3. Specified at 100 C TJ. 4. Specified at the nominal VCC. 5. Measured at the bulk capacitors on the motherboard. 6. VCC,BOOT tolerance shown in Figure 4 and Figure 5. 7. Based on simulations and averaged over the duration of any change in current. Specified by design/ characterization at nominal VCC. Not 100% tested. 8. This is a power-up peak current specification that is applicable when VCCP is high and VCC_CORE is low. 9. This is a steady-state ICC current specification that is applicable when both VCCP and VCC_CORE are high. 10. Processor ICC requirements in Intel Dynamic Acceleration Technology mode are lesser than ICC in HFM 11. The maximum delta between Intel Enhanced Deeper Sleep and LFM on the processor will be lesser than or equal to 300 mV.

42

Datasheet

Electrical Specifications

Figure 4.

Active VCC and ICC Loadline for Standard Voltage, Low-Power SV (25 W) and Dual-Core, Extreme Edition Processors

VCC-CORE [V]
Slope = -2.1 mV/A at package VccSense, VssSense pins. Differential Remote Sense required.
VCC-CORE max {HFM|LFM} VCC-CORE, DC max {HFM|LFM}

10mV= RIPPLE

VCC-CORE nom {HFM|LFM}

VCC-CORE, DC min {HFM|LFM} VCC-CORE min {HFM|LFM} +/-VCC-CORE Tolerance = VR St. Pt. Error 1/

0
Note 1 / V C C - C O R E S et P oi n t Er ro r T o l er a nce i s pe r b el o w : T ol e ra n c e -- - - -- - - -- - -- - + / - 1. 5% + / - 11 .5 mV V C C - C O R E V ID V ol t ag e R an ge -- - - -- - - -- - -- - - -- - - -- - - -- - - -- - -- - - -- - - -- - - -- - - -- - -- - - -- V C C - C O R E > 0 .7 50 0 V 0 . 50 00 V < /= V c c _ c o r e </ = 0. 75 00 0 V

ICC-CORE max {HFM|LFM}

ICC-CORE [A]

Datasheet 43

Electrical Specifications

Figure 5.

Deeper Sleep VCC and ICC Loadline for Standard-Voltage, Low-Power SV (25 W) and Dual-Core Extreme Edition Processors

VCC-CORE [V]
Slope = -2.1 mV/A at package VccSense, VssSense pins. Differential Remote Sense required.
VCC-CORE max {HFM|LFM} VCC-CORE, DC max {HFM|LFM} VCC-CORE nom {HFM|LFM}

13mV= RIPPLE

VCC-CORE, DC min {HFM|LFM} VCC-CORE min {HFM|LFM} +/-VCC-CORE Tolerance = VR St. Pt. Error 1/

0
Note 1/ V C C - C O R E Set Point Error Tolerance is per below :

ICC-CORE max {HFM|LFM}

ICC-CORE [A]

Tolerance V C C - C O R E VID Voltage Range --------------- -------------------------------------------------------+/-[(VID*1.5%)-3mV] V C C - C O R E > 0.7500V +/-(11.5mV-3mV) Total tolerance window including ripple is +/-35mV for C6 0.5000V </= V C C - C O R E </= 0.7500V 0.3000V </= V C C - C O R E < 0.5000V

NOTE: Deeper Sleep mode tolerance depends on VID value.

44

Datasheet

Electrical Specifications

Figure 6.

Deeper Sleep VCC and ICC Loadline for Low-Power Standard-Voltage Processors

VCC-CORE [V]
VCC-CORE max {HFM|LFM} VCC-CORE, DC max {HFM|LFM} VCC-CORE nom {HFM|LFM}

Slope = -4.0 mV/A at package VccSense, VssSense pins. Differential Remote Sense required.

10mV= RIPPLE

VCC-CORE, DC min {HFM|LFM} VCC-CORE min {HFM|LFM} +/-VCC-CORE Tolerance = VR St. Pt. Error 1/

Note 1/ V CC- CORE Set Point Error Tolerance is per below :

ICC-CORE max {HFM|LFM}

ICC-CORE [A]

Tolerance V CC- CORE VID Voltage Range --------------- -------------------------------------------------------+/-[(VID*1.5%)-3mV] V CC- CORE > 0.7500V +/-(11.5mV-3mV) Total tolerance window including ripple is +/-35mV for C6 0.5000V </= V CC- CORE </= 0.7500V 0.3000V </= V CC- CORE < 0.5000V

NOTES: 1. Applies to low-power standard-voltage 22-mm (dual-core) processors. 2. Deeper Sleep mode tolerance depends on VID value.

Datasheet 45

Electrical Specifications

Figure 7.

Active VCC and ICC Loadline for Low-Voltage, Ultra-Low-Voltage and Power Optimized Performance Processor

VCC-CORE [V]
Slope = -4.0 mV/A at package VccSense, VssSense pins. Differential Remote Sense required.
VCC-CORE max {HFM|LFM} VCC-CORE, DC max {HFM|LFM} VCC-CORE nom {HFM|LFM}

10mV= RIPPLE

VCC-CORE, DC min {HFM|LFM} VCC-CORE min {HFM|LFM} +/-VCC-CORE Tolerance = VR St. Pt. Error 1/

Note 1/ V C C - C O R E Set Point Error Tolerance is per below : {HFM|LFM} Tolerance V C C - C O R E VID Voltage Range --------------- -------------------------------------------------------+/-1.5% V C C - C O R E > 0.7500V +/-11.5mV +/-25mV 0.5000V </= V C C - C O R E </= 0.7500V 0.3000V </= V C C - C O R E < 0.5000V

ICC-CORE max

ICC-CORE [A]

NOTES: 1. Applies to Low-Voltage, Ultra-Low-Voltage and Power Optimised Performance processors in 22 mmx22 mm package. 2. Active mode tolerance depends on VID value

46

Datasheet

Electrical Specifications

Figure 8.

Deeper Sleep VCC and ICC Loadline for Low-Voltage, Ultra-Low-Voltage and Power Optimized Performance Processor

VCC-CORE [V]
VCC-CORE max {HFM|LFM} VCC-CORE, DC max {HFM|LFM} VCC-CORE nom {HFM|LFM}

Slope = -4.0 mV/A at package VccSense, VssSense pins. Differential Remote Sense required.

10mV= RIPPLE

VCC-CORE, DC min {HFM|LFM} VCC-CORE min {HFM|LFM} +/-VCC-CORE Tolerance = VR St. Pt. Error 1/

Note 1/ V CC- CORE Set Point Error Tolerance is per below :

ICC-CORE max {HFM|LFM}

ICC-CORE [A]

Tolerance V CC- CORE VID Voltage Range --------------- -------------------------------------------------------+/-[(VID*1.5%)-3mV] V CC- CORE > 0.7500V +/-(11.5mV-3mV) Total tolerance window including ripple is +/-35mV for C6 0.5000V </= V CC- CORE </= 0.7500V 0.3000V </= V CC- CORE < 0.5000V

NOTES: 1. Applies to Low-Voltage, Ultra-Low-Voltage and Power Optimised Performance processors in 22 mmx22 mm package. 2. Deeper Sleep mode tolerance depends on VID value.

Datasheet 47

Electrical Specifications

Table 13.
Symbol VCCP GTLREF RCOMP RODT/A RODT/D RODT/Cntrl VIH VIL VOH RTT/A RTT/D RTT/Cntrl RON/A RON/D RON/Cntrl ILI Cpad

AGTL+ Signal Group DC Specifications

Parameter I/O Voltage Reference Voltage Compensation Resistor Termination Resistor Address Termination Resistor Data Termination Resistor Control Input High Voltage Input Low Voltage Output High Voltage Termination Resistance Address Termination Resistance Data Termination Resistance Control Buffer On Resistance Address Buffer On Resistance Data Buffer On Resistance Control Input Leakage Current Pad Capacitance Min 1.00 0.65 27.23 49 49 49 0.82 -0.10 0.90 50 50 50 23 23 23 1.80 Typ 1.05 0.70 27.5 55 55 55 1.05 0 VCCP 55 55 55 25 25 25 2.30 Max 1.10 0.72 27.78 63 63 63 1.20 0.55 1.10 61 61 61 29 29 29 100 2.75 Unit V V V V V A pF 6 10 11, 12 11, 13 11, 14 3,6 2,4 6 7, 12 7, 13 7, 14 5, 12 5, 13 5, 14 8 9 Notes1

NOTES: 1. Unless otherwise noted, all specifications in this table apply to all processor frequencies. 2. VIL is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low value. 3. VIH is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high value. 4. VIH and VOH may experience excursions above VCCP. However, input signal drivers must comply with the signal quality specifications. 5. This is the pulldown driver resistance. Measured at 0.31*VCCP. RON (min) = 0.418*RTT, RON (typ) = 0.455*RTT, RON (max) = 0.527*RTT. RTT typical value of 55 is used for RON typ/min/max calculations. 6. GTLREF should be generated from VCCP with a 1% tolerance resistor divider. The VCCP referred to in these specifications is the instantaneous VCCP. 7. RTT is the on-die termination resistance measured at VOL of the AGTL+ output driver. Measured at 0.31*VCCP. RTT is connected to VCCP on die. Refer to processor I/O buffer models for I/V characteristics. 8. Specified with on-die RTT and RON turned off. Vin between 0 and VCCP. 9. Cpad includes die capacitance only. No package parasitics are included. 10. This is the external resistor on the comp pins. 11. On-die termination resistance, measured at 0.33*VCCP. 12. Applies to Signals A[35:3]. 13. Applies to Signals D[63:0]. 14. Applies to Signals BPRI#, DEFER#, PREQ#, PREST#, RS[2:0]#, TRDY#, ADS#, BNR#, BPM[3:0], BR0#, DBSY#, DRDY#, HIT#, HITM#, LOCK#, PRDY#, DPWR#, DSTB[1:0]#, DSTBP[3:0] and DSTBN[3:0]#.

48

Datasheet

Electrical Specifications

Table 14.
Symbol VCCP VIL VIH VOL VOH IOL IOH ILI Cpad1 Cpad2

CMOS Signal Group DC Specifications

Parameter I/O Voltage Input Low Voltage CMOS Input High Voltage Output Low Voltage Output High Voltage Output Low Current Output High Current Input Leakage Current Pad Capacitance Pad Capacitance for CMOS Input Min 1.00 -0.10 0.7*VCCP -0.10 0.9*VCCP 1.5 1.5 1.80 0.95 Typ 1.05 0.00 VCCP 0 VCCP 2.30 1.2 Max 1.10 0.3*VCCP VCCP+0.1 0.1*VCCP VCCP+0.1 4.1 4.1 100 2.75 1.45 Unit V V V V V mA mA A pF pF 2 2 2 2 3 4 5 6 7 Notes1

NOTES: 1. Unless otherwise noted, all specifications in this table apply to all processor frequencies. 2. The VCCP referred to in these specifications refers to instantaneous VCCP. 3. Measured at 0.1 *VCCP. 4. Measured at 0.9 *VCCP. 5. For Vin between 0 V and VCCP. Measured when the driver is tristated. 6. Cpad1 includes die capacitance only for DPRSTP#, DPSLP#, PWRGOOD. No package parasitics are included. 7. Cpad2 includes die capacitance for all other CMOS input signals. No package parasitics are included.

Table 15.
Symbol VOH VOL IOL ILO Cpad

Open Drain Signal Group DC Specifications

Parameter Output High Voltage Output Low Voltage Output Low Current Output Leakage Current Pad Capacitance Min VCCP5% 0 16 1.80 Typ VCCP 2.30 Max VCCP+5% 0.20 50 200 2.75 Unit V V mA A pF 2 4 5 Notes1 3

NOTES: 1. Unless otherwise noted, all specifications in this table apply to all processor frequencies. 2. Measured at 0.2 V. 3. VOH is determined by value of the external pull-up resistor to VCCP. 4. For Vin between 0 V and VOH. 5. Cpad includes die capacitance only. No package parasitics are included.

Datasheet 49

Electrical Specifications

50

Datasheet

Package Mechanical Specifications and Pin Information

Package Mechanical Specifications and Pin Information

Package Mechanical Specifications
The processor (XE and SV) is available in 478-pin Micro-FCPGA packages as well as 479-ball Micro-FCBGA packages. The package mechanical dimensions are shown in Figure 9 through Figure 13. The processor (POP, LV, ULV DC and ULV SC) is available 956-ball Micro-FCBGA packages. The package mechanical dimensions are shown in Figure 14 and Figure 15. The maximum outgoing co-planarity is 0.2 mm (8 mils) for SFF processors. The mechanical package pressure specifications are in a direction normal to the surface of the processor. This protects the processor die from fracture risk due to uneven die pressure distribution under tilt, stack-up tolerances and other similar conditions. These specifications assume that a mechanical attach is designed specifically to load one type of processor. A 15-lbf load limit should not be exceeded on BGA packages so as to not impact solder joint reliability after reflow. This load limit ensures that impact to the package solder joints due to transient bend, shock, or tensile loading is minimized. The 15-lbf metric should be used in parallel with the 689-kPa (100 psi) pressure limit as long as neither limits are exceeded. In some cases, designing to 15 lbf will exceed the pressure specification of 689 kPa (100 psi) and therefore should be reduced to ensure both limits are maintained. Moreover, the processor package substrate should not be used as a mechanical reference or load-bearing surface for the thermal or mechanical solution.

4.1

Caution:

The Micro-FCBGA package incorporates land-side capacitors. The land-side capacitors are electrically conductive so care should be taken to avoid contacting the capacitors with other electrically conductive materials on the motherboard. Doing so may short the capacitors and possibly damage the device or render it inactive.

Datasheet

51

Figure 9.

52
G1 B1 H1

478 PINS

C2

B2

G2

H2 J2

C1 A

SIDE VIEW
J1

BOTTOM VIEW
SYMBOL B1 MILLIMETERS
MIN MAX

TOP VIEW
Die Underfill Package Substrate

COMMENTS 34.95 B2 C1 C2 F2 34.95 8.7 12.4 0.88 F3 1.862 2.102 35.05 35.05

0.37 MAX
F2 F3

G1 G2 H1 H2

31.75 BASIC 31.75 BASIC 15.875 BASIC 15.875 BASIC

0.356 0.254
0.65 MAX
J1 1.27 BASIC J2 1.27 BASIC

M C A B M C

A
0.65 MAX

FRONT VIEW

2.030.08

P W

0.255 6g

0.355

P
DETAIL SCALE 20

Keying Pins

A1, A2

A
B6887-01 D76563(1)

6-MB and 3-MB on 6-MB Die Micro-FCPGA Package Drawing (Sheet 1 of 2)

Package Mechanical Specifications and Pin Information

Datasheet

Figure 10.

Datasheet
B1 G1 H1

478 PINS

G2 B2

C2

H2 J1

A C1

Package Mechanical Specifications and Pin Information

SIDE VIEW
J2

BOTTOM VIEW

TOP VIEW
Die Package Substrate Underfill
SYMBOL B1 B2 C1 C2 MILLIMETERS
MIN MAX

COMMENTS 34.95 34.95 8.7 9.4 35.05 35.05

0.37 MAX
F2 F3

F2 F3 G1 1.742

0.88 1.962 31.75 BASIC

0.65 MAX 2.030.08

G2

31.75 BASIC

A
FRONT VIEW
0.65 MAX

H1 H2 J1

15.875 BASIC 15.875 BASIC 1.27 BASIC

0.356 0.254 P
DETAIL SCALE 20
J2 1.27 BASIC

M C A B M C

3-MB die Micro-FCPGA Processor Package Drawing (Sheet 1 of 2)

P W

0.255 6g Keying Pins

0.355

A1, A2

B6739-01 D76564(1)

53

Figure 11.

54
4X 7.00 6.985 13.97 1.625 1.625

0.3050.25 0.406 M C A B 0.254 M C

4X 7.00

13.97

6.985

4X 5.00

EDGE KEEP OUT ZONE 4X

CORNER KEEP OUT ZONE 4X

SIDE VIEW

1.5 MAX ALLOWABLE COMPONENT HEIGHT

3-MB Die Micro-FCPGA Processor Package Drawing (Sheet 2 of 2)

TOP VIEW

BOTTOM VIEW

Package Mechanical Specifications and Pin Information

B6740-01 D76564(2)

Datasheet

Figure 12.

Datasheet
B1 H1

SEE DETAIL 479 BALLS

G1

G2 B2

C2

H2

J2

Package Mechanical Specifications and Pin Information

A C1

SIDE VIEW

J1

BOTTOM VIEW

TOP VIEW
SYMBOL
MIN MAX

MILLIMETERS COMMENTS

B1 34.95 34.95 8.7 9.4 0.88 1.937 31.75 BASIC 31.75 BASIC 15.875 BASIC 15.875 BASIC 1.27 BASIC 1.27 BASIC 0.61 M N W 0.6 6g 0.69 0.8 2.207 35.05 35.05 B2

Die Package Substrate Underfill

F2 F3

FRONT VIEW
C2 F2 F3

C1

SEE DETAIL

A
M
G2 H1 H2 J1 J2 G1

3-MB Die Micro-FCBGA Processor Package Drawing (Sheet 1 of 2)

0.203 0.071

L C A B L

DETAIL A SCALE 20

0.203

DETAIL B SCALE 50

B6741-01 D93702(1)

55

Figure 13.

56
13.97 4X 7.00 6.985 1.625 4X 7.00 1.625 13.97 6.985 4X 5.00
EDGE KEEP OUT ZONE 4X CORNER KEEP OUT ZONE 4X

SIDE VIEW

0.55 MAX ALLOWABLE COMPONENT HEIGHT

3-MB Die Micro-FCBGA Processor Package Drawing (Sheet 2 of 2)

TOP VIEW

BOTTOM VIEW

Package Mechanical Specifications and Pin Information

B6742-01 D93702(2)

Datasheet

Datasheet
B1 B H1 (C1) G1 (C2) H2 B2 G2 J2
BC BA AW AU AR AN AL AJ AG AE AC AA W U R N L J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 BD BB AY AV AT AP AM AK AH AF AD AB Y V T P M K H F D B

Figure 14.

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

DIE C J1 (D1)

PACKAGE

SIDE VIEW

SEE DETAIL B

BOTTOM VIEW
SYMBOL MILLIMETERS B1
MIN MAX

Package Mechanical Specifications and Pin Information

TOP VIEW
A
(Metal Diameter)

COMMENTS 21.95 21.95 B2 C1 C2 22.05 22.05 8.68

0.460.04

SEE DETAIL A
Die Epoxy Underfill
F3

FRONT VIEW

0.390.02 (Solder Resist Opening)

D1 F3 F5 G1 G2 H1 H2 J1

12.4 0.926 1.437 0.205 1.647 0.355

Package Substrate

DETAIL SCALE 75 BGA LAND 956 PLACES

20.468 BASIC 20.468 BASIC 10.234 BASIC 10.234 BASIC J2 0.476 BASIC 0.476 BASIC

0.14 0.04

L A B C L A

F5
DETAIL SCALE 45

A
B6749-01 D88065(1)

Intel Core 2 Duo Mobile Processor (POP and LV) Die Micro-FCBGA Processor Package Drawing

57

Figure 15.

58
B1 B
0.203 A

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
G1 H1

(C1)

(C2) B2 G2 H2

J2

BC BA AW AU AR AN AL AJ AG AE AC AA W U R N L J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44

BD BB AY AV AT AP AM AK AH AF AD AB Y V T P M K H F D B

DIE C J1 (D1)

PACKAGE

SIDE VIEW

SEE DETAIL B

BOTTOM VIEW
SYMBOL MILLIMETERS B1 B2
MIN MAX

TOP VIEW
A
0.460.04

COMMENTS 21.95 21.95 C1 C2 22.05 22.05 8.68 9.41 0.926

(Metal Diameter)

SEE DETAIL A
Die Epoxy Underfill
F3

FRONT VIEW
0.390.02

(Solder Resist Opening)

D1 F3 F5 G1 G2 H1 H2 J1

1.437 0.205

1.647 0.355

Package Substrate

DETAIL SCALE 75 BGA LAND 956 PLACES

20.468 BASIC 20.468 BASIC 10.234 BASIC 10.234 BASIC J2 0.476 BASIC 0.476 BASIC

0.14 0.04

L A B C L A

F5
DETAIL SCALE 45

A
B6748-01 E38344(1)

Intel Core 2 Duo Mobile Processor (ULV SC and ULV DC) Die Micro-FCBGA Processor Package Drawing

Package Mechanical Specifications and Pin Information

Datasheet

Package Mechanical Specifications and Pin Information

4.2

Processor Pinout and Pin List

Figure 16 and Figure 17 show the processor (SV and XE) pinout as viewed from the top of the package. Table 16 provides the pin list, arranged numerically by pin number. Figure 16 through Figure 18 show the top view of the LV and ULV processor package. Table 18 lists the SFF processor ballout alphabetically by signal name. For signal descriptions, refer to Section 4.3.

Figure 16.
1 A1 B1 C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF RESET# VSS DBSY# BR0# VSS ADS# A[9]# VSS REQ[4]# ADSTB[0] # VSS A[15]# A[16]# VSS A[23]# ADSTB[1] # VSS COMP[3] COMP[2] VSS PREQ# BPM[2]# VSS TEST5 1

Processor Pinout (Top Package View, Left Side)

2 VSS RSVD VSS RSVD BNR# VSS TRDY# REQ[1] # VSS REQ[2] # A[13]# VSS A[8]# A[12]# VSS RSVD A[30]# VSS A[27]# A[17]# VSS A[34]# PRDY# VSS VID[6] VSS 2 3 SMI# INIT# TEST7 RSVD VSS RS[0]# RS[2]# VSS REQ[3] # REQ[0] # VSS A[7]# A[10]# VSS A[19]# A[26]# VSS RSVD A[32]# VSS A[35]# TDO VSS BPM[1] # VID[4] VID[5] 3 4 VSS LINT1 IGNNE # VSS HITM# RS[1]# VSS LOCK# A[3]# VSS A[5]# RSVD VSS A[14]# A[24]# VSS A[21]# A[31]# VSS A[29]# A[33]# VSS BPM[3] # BPM[0] # VSS VID[3] 4 5 FERR# DPSLP# VSS STPCLK # DPRSTP # VSS BPRI# DEFER# VSS A[6]# A[4]# VSS RSVD A[11]# VSS A[25]# A[18]# VSS A[28]# A[22]# VSS TMS TCK VSS VID[2] VID[1] 5 6 A20M# VSS LINT0 PWRGO OD VSS RSVD HIT# VSS VCCP VCCP VSS VCCP VCCP VSS VCCP VCCP VSS VCCP A[20]# VSS TDI TRST# VSS VID[0] PSI# VSS 6 VCC VCC VCC VCC VSS SENSE VCC SENSE 7 VSS VSS VSS VSS VSS VSS 8 VCC VCC VCC VCC VCC VCC 9 VCC VCC VCC VCC VCC VCC 10 VSS VSS VSS VSS VSS VSS 11 VCC VCC VCC VCC VCC VCC 12 VCC VSS VCC VSS VCC VSS 13 7 VCC VCC THERM TRIP# SLP# VCC VCC 8 VSS VSS VSS VSS VSS VSS 9 VCC VCC VCC VCC VCC VCC 10 VCC VCC VCC VCC VCC VCC 11 VSS VSS VSS VSS VSS VSS 12 VCC VCC VCC VCC VCC VCC 13 VCC VSS VCC VSS VCC VSS A B C D E F G H J K L M N P R T U V W Y A A A B A C A D A E A F

NOTES:
1. 2. Keying option for Micro-FCPGA, A1 and B1 are de-populated. Keying option for Micro-FCBGA, A1 is de-populated and B1 is VSS.

Datasheet

59

Package Mechanical Specifications and Pin Information

Figure 17.
14 A B C D E F G H J K L M N P R T U V W Y AA AB AC A D AE AF VSS VCC VSS VCC VSS VCC 14 VCC VCC VCC VCC VCC VCC 15 VSS VCC VSS VCC VSS VCC 15 VCC VCC VCC VCC VCC VCC

Processor Pinout (Top Package View, Right Side)

16 VSS VSS VSS VSS VSS VSS 17 VCC VCC VCC VCC VCC VCC 18 VCC VCC VCC VCC VCC VCC 19 VSS VSS VSS VSS VSS VSS 20 VCC VCC DBR# IERR# VCC VCC 21 BCLK[1] VSS BSEL[2] PROCHOT # VSS DRDY# VCCP VSS VCCP VCCP VSS VCCP VCCP VSS VCCP VCCP VSS VCCP VCCP VSS VSS VSS VSS VSS VSS VSS 16 VCC VCC VCC VCC VCC VCC 17 VCC VCC VCC VCC VCC VCC 18 VSS VSS VSS VSS VSS VSS 19 VCC VCC DINV[3 ]# D[54]# VCC VCC 20 D[50]# D[52]# VSS D[59]# D[58]# VSS 21 22 BCLK[0] BSEL[0] VSS RSVD D[0]# VSS D[3]# D[12]# VSS D[14]# D[22]# VSS D[16]# D[26]# VSS D[37]# DINV[2]# VSS D[41]# D[32]# VSS D[51]# D[60]# VSS D[55]# D[62]# 22 23 VSS BSEL[1] TEST1 VSS D[7]# D[4]# VSS D[15]# D[11]# VSS D[20]# D[23]# VSS D[25]# D[19]# VSS D[39]# D[36]# VSS D[42]# D[45]# VSS D[63]# D[61]# VSS D[56]# 23 24 THRMDA VSS TEST3 DPWR# VSS D[1]# D[9]# VSS D[10]# D[8]# VSS D[21]# DINV[1]# VSS D[28]# D[27]# VSS D[34]# D[43]# VSS D[46]# D[33]# VSS D[49]# D[48]# DSTBP[3] # 24 25 VSS THRMDC VSS TEST2 D[6]# VSS D[5]# DINV[0]# VSS D[17]# D[29]# VSS D[31]# D[24]# VSS D[30]# D[38]# VSS D[44]# D[40]# VSS D[47]# D[57]# VSS DSTBN[3] # VSS 25 26 TEST6 VCCA VCCA VSS D[2]# D[13]# VSS DSTBP[ 0]# DSTBN[ 0]# VSS DSTBN[ 1]# DSTBP[ 1]# VSS D[18]# COMP[0 ] VSS COMP[1 ] D[35]# VSS DSTBN[ 2]# DSTBP[ 2]# VSS D[53]# GTLREF VSS TEST4 26 A B C D E F G H J K L M N P R T U V W Y A A A B A C A D A E A F

60

Datasheet

Package Mechanical Specifications and Pin Information

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Direction Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch CMOS Common Clock Source Synch Source Synch Bus Clock Bus Clock Common Clock Common Clock Common Clock Common Clock Common Clock Direction Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input Input/ Output Input/ Output Input/ Output Input Input Input/ Output Input/ Output Output Output Input/ Output

A[3]# A[4]# A[5]# A[6]# A[7]# A[8]# A[9]# A[10]# A[11]# A[12]# A[13]# A[14]# A[15]# A[16]# A[17]# A[18]# A[19]# A[20]# A[21]# A[22]# A[23]#

J4 L5 L4 K5 M3 N2 J1 N3 P5 P2 L2 P4 P1 R1 Y2 U5 R3 W6 U4 Y5 U1

A[24]# A[25]# A[26]# A[27]# A[28]# A[29]# A[30]# A[31]# A[32]# A[33]# A[34]# A[35]# A20M# ADS# ADSTB[0]# ADSTB[1]# BCLK[0] BCLK[1] BNR# BPM[0]# BPM[1]# BPM[2]# BPM[3]#

R4 T5 T3 W2 W5 Y4 U2 V4 W3 AA4 AB2 AA3 A6 H1 M1 V1 A22 A21 E2 AD4 AD3 AD1 AC4

Datasheet

61

Package Mechanical Specifications and Pin Information

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Common Clock Common Clock CMOS CMOS CMOS Power/ Other Power/ Other Power/ Other Power/ Other Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Direction

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Direction Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output

BPRI# BR0# BSEL[0] BSEL[1] BSEL[2] COMP[0] COMP[1] COMP[2] COMP[3] D[0]# D[1]# D[2]# D[3]# D[4]# D[5]# D[6]# D[7]# D[8]# D[9]# D[10]# D[11]# D[12]# D[13]#

G5 F1 B22 B23 C21 R26 U26 AA1 Y1 E22 F24 E26 G22 F23 G25 E25 E23 K24 G24 J24 J23 H22 F26

Input Input/ Output Output Output Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output

D[14]# D[15]# D[16]# D[17]# D[18]# D[19]# D[20]# D[21]# D[22]# D[23]# D[24]# D[25]# D[26]# D[27]# D[28]# D[29]# D[30]# D[31]# D[32]# D[33]# D[34]# D[35]#

K22 H23 N22 K25 P26 R23 L23 M24 L22 M23 P25 P23 P22 T24 R24 L25 T25 N25 Y22 AB24 V24 V26

62

Datasheet

Package Mechanical Specifications and Pin Information

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Direction Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch CMOS Common Clock Common Clock Source Synch Source Synch Source Synch Source Synch CMOS CMOS Common Clock Common Clock Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Direction Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Output Input/ Output Input Input/ Output Input/ Output Input/ Output Input/ Output Input Input Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output

D[36]# D[37]# D[38]# D[39]# D[40]# D[41]# D[42]# D[43]# D[44]# D[45]# D[46]# D[47]# D[48]# D[49]# D[50]# D[51]# D[52]# D[53]# D[54]# D[55]# D[56]# D[57]#

V23 T22 U25 U23 Y25 W22 Y23 W24 W25 AA23 AA24 AB25 AE24 AD24 AA21 AB22 AB21 AC26 AD20 AE22 AF23 AC25

D[58]# D[59]# D[60]# D[61]# D[62]# D[63]# DBR# DBSY# DEFER# DINV[0]# DINV[1]# DINV[2]# DINV[3]# DPRSTP# DPSLP# DPWR# DRDY# DSTBN[0]# DSTBN[1]# DSTBN[2]# DSTBN[3]# DSTBP[0]# DSTBP[1]#

AE21 AD21 AC22 AD23 AF22 AC23 C20 E1 H5 H25 N24 U22 AC20 E5 B5 D24 F21 J26 L26 Y26 AE25 H26 M26

Datasheet

63

Package Mechanical Specifications and Pin Information

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Source Synch Source Synch Open Drain Power/ Other Common Clock Common Clock Open Drain CMOS CMOS CMOS CMOS Common Clock Common Clock Common Clock Open Drain CMOS CMOS Source Synch Source Synch Source Synch Source Synch Source Synch Common Clock Common Clock Direction Input/ Output Input/ Output Output Input Input/ Output Input/ Output Output Input Input Input Input Input/ Output Output Input Input/ Output Output Input Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Common Clock Common Clock Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved CMOS CMOS CMOS CMOS CMOS Open Drain Test Test Test Test Test Test Test Open Drain Power/ Other Power/ Other CMOS Common Clock CMOS Power/ Other Input Input Input Output Input Input Input Input Input Output Direction

DSTBP[2]# DSTBP[3]# FERR# GTLREF HIT# HITM# IERR# IGNNE# INIT# LINT0 LINT1 LOCK# PRDY# PREQ# PROCHOT# PSI# PWRGOOD REQ[0]# REQ[1]# REQ[2]# REQ[3]# REQ[4]# RESET# RS[0]#

AA26 AF24 A5 AD26 G6 E4 D20 C4 B3 C6 B4 H4 AC2 AC1 D21 AE6 D6 K3 H2 K2 J3 L1 C1 F3

RS[1]# RS[2]# RSVD RSVD RSVD RSVD RSVD RSVD RSVD RSVD RSVD SLP# SMI# STPCLK# TCK TDI TDO TEST1 TEST2 TEST3 TEST4 TEST5 TEST6 TEST7 THERMTRIP # THRMDA THRMDC TMS TRDY# TRST#

F4 G3 B2 D2 D3 D22 F6 M4 N5 T2 V3 D7 A3 D5 AC5 AA6 AB3 C23 D25 C24 AF26 AF1 A26 C3 C7 A24 B25 AB5 G2 AB6 A7

Input Input

Input

VCC

64

Datasheet

Package Mechanical Specifications and Pin Information

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Direction

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Direction

VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC

A9 A10 A12 A13 A15 A17 A18 A20 AA7 AA9 AA10 AA12 AA13 AA15 AA17 AA18 AA20 AB7 AB9 AB10 AB12 AB14

VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC

AB15 AB17 AB18 AB20 AC7 AC9 AC10 AC12 AC13 AC15 AC17 AC18 AD7 AD9 AD10 AD12 AD14 AD15 AD17 AD18 AE9 AE10

Datasheet

65

Package Mechanical Specifications and Pin Information

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Direction

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Direction

VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC

AE12 AE13 AE15 AE17 AE18 AE20 AF9 AF10 AF12 AF14 AF15 AF17 AF18 AF20 B7 B9 B10 B12 B14 B15 B17 B18

VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC

B20 C9 C10 C12 C13 C15 C17 C18 D9 D10 D12 D14 D15 D17 D18 E7 E9 E10 E12 E13 E15 E17

66

Datasheet

Package Mechanical Specifications and Pin Information

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Direction

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other CMOS CMOS CMOS CMOS CMOS CMOS CMOS Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Output Output Output Output Output Output Output Direction

VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCCA VCCA VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP

E18 E20 F7 F9 F10 F12 F14 F15 F17 F18 F20 B26 C26 G21 J6 J21 K6 K21 M6 M21 N6 N21

VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCSENSE VID[0] VID[1] VID[2] VID[3] VID[4] VID[5] VID[6] VSS VSS VSS VSS VSS VSS VSS VSS VSS

R6 R21 T6 T21 V6 V21 W21 AF7 AD6 AF5 AE5 AF4 AE3 AF3 AE2 A2 A4 A8 A11 A14 A16 A19 A23 A25

Datasheet

67

Package Mechanical Specifications and Pin Information

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Power/ Other Power/ Other Power/ other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Direction

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Direction

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS

AA2 AA5 AA8 AA11 AA14 AA16 AA19 AA22 AA25 AB1 AB4 AB8 AB11 AB13 AB16 AB19 AB23 AB26 AC3 AC6 AC8 AC11

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS

AC14 AC16 AC19 AC21 AC24 AD2 AD5 AD8 AD11 AD13 AD16 AD19 AD22 AD25 AE1 AE4 AE8 AE11 AE14 AE16 AE19 AE23

68

Datasheet

Package Mechanical Specifications and Pin Information

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Direction

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Direction

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS

AE26 AF2 AF6 AF8 AF11 AF13 AF16 AF19 AF21 AF25 B6 B8 B11 B13 B16 B19 B21 B24 C2 C5 C8 C11

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS

C14 C16 C19 C22 C25 D1 D4 D8 D11 D13 D16 D19 D23 D26 E3 E6 E8 E11 E14 E16 E19 E21

Datasheet

69

Package Mechanical Specifications and Pin Information

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Direction

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Direction

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS

E24 F2 F5 F8 F11 F13 F16 F19 F22 F25 G1 G4 G23 G26 H3 H6 H21 H24 J2 J5 J22 J25

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS

K1 K4 K23 K26 L3 L6 L21 L24 M2 M5 M22 M25 N1 N4 N23 N26 P3 P6 P21 P24 R2 R5

70

Datasheet

Package Mechanical Specifications and Pin Information

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Power/ Other Direction

Table 16.
Pin Name

Pin Name Listing

Pin # Signal Buffer Type Power/ Other Power/ Other Power/ Other Output Direction

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS

R22 R25 T1 T4 T23 T26 U3 U6 U21 U24 V2 V5 V22 V25 W1 W4 W23 W26 Y3 Y6

VSS VSS VSSSENSE

Y21 Y24 AE7

Datasheet

71

Package Mechanical Specifications and Pin Information

Table 17.
Pin # A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 AA1 AA2 AA3 AA4 AA5 AA6 AA7 AA8 AA9 AA10 AA11 AA12

Pin # Listing
Signal Buffer Type Power/Other CMOS Power/Other Open Drain CMOS Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Bus Clock Bus Clock Power/Other Power/Other Power/Other Test Power/Other Power/Other Source Synch Source Synch Power/Other CMOS Power/Other Power/other Power/Other Power/Other Power/Other Power/Other Input Input/ Output Input/ Output Input/ Output Input Input Output Input Input Directi on

Table 17.
Pin # AA13 AA14 AA15 AA16 AA17 AA18 AA19 AA20 AA21 AA22 AA23 AA24 AA25 AA26 AB1 AB2 AB3 AB4 AB5 AB6 AB7 AB8 AB9 AB10 AB11 AB12 AB13 AB14 AB15 AB16 AB17 AB18 AB19 AB20 AB21

Pin # Listing
Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Power/Other Source Synch Open Drain Power/Other CMOS CMOS Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Source Synch Input/ Output Input Input Input/ Output Output Input/ Output Input/ Output Input/ Output Input/ Output Directi on

Pin Name VSS SMI# VSS FERR# A20M# VCC VSS VCC VCC VSS VCC VCC VSS VCC VSS VCC VCC VSS VCC BCLK[1] BCLK[0] VSS THRMDA VSS TEST6 COMP[2] VSS A[35]# A[33]# VSS TDI VCC VSS VCC VCC VSS VCC

Pin Name VCC VSS VCC VSS VCC VCC VSS VCC D[50]# VSS D[45]# D[46]# VSS DSTBP[2] # VSS A[34]# TDO VSS TMS TRST# VCC VSS VCC VCC VSS VCC VSS VCC VCC VSS VCC VCC VSS VCC D[52]#

72

Datasheet

Package Mechanical Specifications and Pin Information

Table 17.
Pin # AB22 AB23 AB24 AB25 AB26 AC1 AC2 AC3 AC4 AC5 AC6 AC7 AC8 AC9 AC10 AC11 AC12 AC13 AC14 AC15 AC16 AC17 AC18 AC19 AC20 AC21 AC22 AC23 AC24 AC25 AC26 AD1 AD2

Pin # Listing
Signal Buffer Type Source Synch Power/Other Source Synch Source Synch Power/Other Common Clock Common Clock Power/Other Common Clock CMOS Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Common Clock Power/Other Input/ Output Input/ Output Output Input/ Output Input/ Output Input/ Output Input/ Output Input Input Output Input/ Output Input/ Output Directi on Input/ Output

Table 17.
Pin # AD3 AD4 AD5 AD6 AD7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 AD16 AD17 AD18 AD19 AD20 AD21 AD22 AD23 AD24 AD25 AD26 AE1 AE2 AE3 AE4 AE5 AE6 AE7 AE8 AE9 AE10 AE11 AE12

Pin # Listing
Signal Buffer Type Common Clock Common Clock Power/Other CMOS Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Power/Other Power/Other CMOS CMOS Power/Other CMOS CMOS Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Output Output Output Output Output Input Input/ Output Input/ Output Input/ Output Input/ Output Output Directi on Output Input/ Output

Pin Name D[51]# VSS D[33]# D[47]# VSS PREQ# PRDY# VSS BPM[3]# TCK VSS VCC VSS VCC VCC VSS VCC VCC VSS VCC VSS VCC VCC VSS DINV[3]# VSS D[60]# D[63]# VSS D[57]# D[53]# BPM[2]# VSS

Pin Name BPM[1]# BPM[0]# VSS VID[0] VCC VSS VCC VCC VSS VCC VSS VCC VCC VSS VCC VCC VSS D[54]# D[59]# VSS D[61]# D[49]# VSS GTLREF VSS VID[6] VID[4] VSS VID[2] PSI# VSSSENSE VSS VCC VCC VSS VCC

73

Datasheet

Package Mechanical Specifications and Pin Information

Table 17.
Pin # AE13 AE14 AE15 AE16 AE17 AE18 AE19 AE20 AE21 AE22 AE23 AE24 AE25 AE26 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 AF16 AF17 AF18 AF19 AF20 AF21

Pin # Listing
Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Test Power/Other CMOS CMOS CMOS Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Output Output Output Input/ Output Input/ Output Input/ Output Input/ Output Directi on

Table 17.
Pin # AF22 AF23 AF24 AF25 AF26 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 C1 C2 C3 C4 C5 C6 C7

Pin # Listing
Signal Buffer Type Source Synch Source Synch Source Synch Power/Other Test Reserved CMOS CMOS CMOS Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other CMOS CMOS Power/Other Power/Other Power/Other Common Clock Power/Other Test CMOS Power/Other CMOS Open Drain Input Output Input Input Output Output Input Input Input Directi on Input/ Output Input/ Output Input/ Output

Pin Name VCC VSS VCC VSS VCC VCC VSS VCC D[58]# D[55]# VSS D[48]# DSTBN[3] # VSS TEST5 VSS VID[5] VID[3] VID[1] VSS VCCSENS E VSS VCC VCC VSS VCC VSS VCC VCC VSS VCC VCC VSS VCC VSS

Pin Name D[62]# D[56]# DSTBP[3] # VSS TEST4 RSVD INIT# LINT1 DPSLP# VSS VCC VSS VCC VCC VSS VCC VSS VCC VCC VSS VCC VCC VSS VCC VSS BSEL[0] BSEL[1] VSS THRMDC VCCA RESET# VSS TEST7 IGNNE# VSS LINT0 THERMTRI P#

Datasheet

74

Package Mechanical Specifications and Pin Information

Table 17.
Pin # C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20

Pin # Listing
Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other CMOS CMOS Power/Other Test Test Power/Other Power/Other Power/Other Reserved Reserved Power/Other CMOS CMOS CMOS Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Open Drain Output Input Input Input Output Output Directi on

Table 17.
Pin # D21 D22 D23 D24 D25 D26 E1 E2 E3 E4 E5 E6 E7 E8 E9 E10 E11 E12 E13 E14 E15 E16 E17 E18 E19 E20 E21 E22 E23 E24 E25 E26 F1

Pin # Listing
Signal Buffer Type Open Drain Reserved Power/Other Common Clock Test Power/Other Common Clock Common Clock Power/Other Common Clock CMOS Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Common Clock Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input Input/ Output Input/ Output Input/ Output Directi on Input/ Output

Pin Name VSS VCC VCC VSS VCC VCC VSS VCC VSS VCC VCC VSS DBR# BSEL[2] VSS TEST1 TEST3 VSS VCCA VSS RSVD RSVD VSS STPCLK# PWRGOOD SLP# VSS VCC VCC VSS VCC VSS VCC VCC VSS VCC VCC VSS IERR#

Pin Name PROCHOT # RSVD VSS DPWR# TEST2 VSS DBSY# BNR# VSS HITM# DPRSTP# VSS VCC VSS VCC VCC VSS VCC VCC VSS VCC VSS VCC VCC VSS VCC VSS D[0]# D[7]# VSS D[6]# D[2]# BR0#

Datasheet

75

Package Mechanical Specifications and Pin Information

Table 17.
Pin # F2 F3 F4 F5 F6 F7 F8 F9 F10 F11 F12 F13 F14 F15 F16 F17 F18 F19 F20 F21 F22 F23 F24 F25 F26 G1 G2 G3 G4 G5 G6 G21 G22 G23 G24

Pin # Listing
Signal Buffer Type Power/Other Common Clock Common Clock Power/Other Reserved Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Common Clock Power/Other Source Synch Source Synch Power/Other Source Synch Power/Other Common Clock Common Clock Power/Other Common Clock Common Clock Power/Other Source Synch Power/Other Source Synch Input/ Output Input/ Output Input Input/ Output Input Input Input/ Output Input/ Output Input/ Output Input/ Output Input Input Directi on

Table 17.
Pin # G25 G26 H1 H2 H3 H4 H5 H6 H21 H22 H23 H24 H25 H26 J1 J2 J3 J4 J5 J6 J21 J22 J23 J24 J25 J26 K1 K2

Pin # Listing
Signal Buffer Type Source Synch Power/Other Common Clock Source Synch Power/Other Common Clock Common Clock Power/Other Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Power/Other Power/Other Power/Other Source Synch Source Synch Power/Other Source Synch Power/Other Source Synch Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input Input/ Output Input/ Output Directi on Input/ Output

Pin Name VSS RS[0]# RS[1]# VSS RSVD VCC VSS VCC VCC VSS VCC VSS VCC VCC VSS VCC VCC VSS VCC DRDY# VSS D[4]# D[1]# VSS D[13]# VSS TRDY# RS[2]# VSS BPRI# HIT# VCCP D[3]# VSS D[9]#

Pin Name D[5]# VSS ADS# REQ[1]# VSS LOCK# DEFER# VSS VSS D[12]# D[15]# VSS DINV[0]# DSTBP[0] # A[9]# VSS REQ[3]# A[3]# VSS VCCP VCCP VSS D[11]# D[10]# VSS DSTBN[0] # VSS REQ[2]#

76

Datasheet

Package Mechanical Specifications and Pin Information

Table 17.
Pin # K3 K4 K5 K6 K21 K22 K23 K24 K25 K26 L1 L2 L3 L4 L5 L6 L21 L22 L23 L24 L25 L26 M1 M2 M3 M4 M5 M6 M21

Pin # Listing
Signal Buffer Type Source Synch Power/Other Source Synch Power/Other Power/Other Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Source Synch Power/Other Source Synch Reserved Power/Other Power/Other Power/Other Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Directi on Input/ Output

Table 17.
Pin # M22 M23 M24 M25 M26 N1 N2 N3 N4 N5 N6 N21 N22 N23 N24 N25 N26 P1 P2 P3 P4 P5 P6 P21 P22 P23 P24 P25

Pin # Listing
Signal Buffer Type Power/Other Source Synch Source Synch Power/Other Source Synch Power/Other Source Synch Source Synch Power/Other Reserved Power/Other Power/Other Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Power/Other Source Synch Source Synch Power/Other Source Synch Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Directi on

Pin Name REQ[0]# VSS A[6]# VCCP VCCP D[14]# VSS D[8]# D[17]# VSS REQ[4]# A[13]# VSS A[5]# A[4]# VSS VSS D[22]# D[20]# VSS D[29]# DSTBN[1] # ADSTB[0] # VSS A[7]# RSVD VSS VCCP VCCP

Pin Name VSS D[23]# D[21]# VSS DSTBP[1] # VSS A[8]# A[10]# VSS RSVD VCCP VCCP D[16]# VSS DINV[1]# D[31]# VSS A[15]# A[12]# VSS A[14]# A[11]# VSS VSS D[26]# D[25]# VSS D[24]#

Datasheet

77

Package Mechanical Specifications and Pin Information

Table 17.
Pin # P26 R1 R2 R3 R4 R5 R6 R21 R22 R23 R24 R25 R26 T1 T2 T3 T4 T5 T6 T21 T22 T23 T24 T25 T26 U1 U2 U3 U4

Pin # Listing
Signal Buffer Type Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Power/Other Power/Other Power/Other Source Synch Source Synch Power/Other Power/Other Power/Other Reserved Source Synch Power/Other Source Synch Power/Other Power/Other Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Directi on Input/ Output Input/ Output

Table 17.
Pin # U5 U6 U21 U22 U23 U24 U25 U26 V1 V2 V3 V4 V5 V6 V21 V22 V23 V24 V25 V26 W1 W2 W3 W4 W5 W6 W21 W22 W23

Pin # Listing
Signal Buffer Type Source Synch Power/Other Power/Other Source Synch Source Synch Power/Other Source Synch Power/Other Source Synch Power/Other Reserved Source Synch Power/Other Power/Other Power/Other Power/Other Source Synch Source Synch Power/Other Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Power/Other Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Directi on Input/ Output

Pin Name D[18]# A[16]# VSS A[19]# A[24]# VSS VCCP VCCP VSS D[19]# D[28]# VSS COMP[0] VSS RSVD A[26]# VSS A[25]# VCCP VCCP D[37]# VSS D[27]# D[30]# VSS A[23]# A[30]# VSS A[21]#

Pin Name A[18]# VSS VSS DINV[2]# D[39]# VSS D[38]# COMP[1] ADSTB[1] # VSS RSVD A[31]# VSS VCCP VCCP VSS D[36]# D[34]# VSS D[35]# VSS A[27]# A[32]# VSS A[28]# A[20]# VCCP D[41]# VSS

78

Datasheet

Package Mechanical Specifications and Pin Information

Table 17.
Pin # W24 W25 W26 Y1 Y2 Y3 Y4 Y5 Y6 Y21 Y22 Y23 Y24 Y25 Y26

Pin # Listing
Signal Buffer Type Source Synch Source Synch Power/Other Power/Other Source Synch Power/Other Source Synch Source Synch Power/Other Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Input/ Output Directi on Input/ Output Input/ Output

Pin Name D[43]# D[44]# VSS COMP[3] A[17]# VSS A[29]# A[22]# VSS VSS D[32]# D[42]# VSS D[40]# DSTBN[2] #

Datasheet

79

Package Mechanical Specifications and Pin Information

Figure 18.

Intel Core 2 Duo Mobile Processor in SFF Package Top View Upper Left Side

BD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
VCC VCC VCC VCC VCC VCCS ENSE PSI# VID[0] VSS VSS

BC

BB

BA
VSS

AY
BPM[3] #

AW
VSS

AV

AU
TDO

AT

AR
A[35]#

AP

AN
A[17]#

AM

AL
A[31]#

AK

AJ
A[30]#

AH

AG
A[19]#

AF
COMP[ 3]

AE
COMP[ 2]

AD

AC
A[16]#

VSS VSS VID[5] VID[4] VSS VID[1] VID[3] VSS VID[2] VSS VSS VSSSE NSE VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VSS VSS VSS VSS VSS VSS BPM[1] # BPM[2] # VSS

PREQ# VSS VSS TCK TMS A[33]# VSS TDI VSS TRST# VSS VSS PRDY# VSS VCCP VSS VSS VCCP VCC VSS VSS VCC VSS VSS VCC VSS VSS VCC VSS VSS VCC

A[22]# VSS A[20]# A[29]# VSS VCCP VSS VCCP VSS VCCP VSS VCCP VCC VSS VCC VSS VCC VSS VCC VSS VCC

A[34]# VSS A[28]# ADSTB [1]# VSS VCCP VSS VCCP VCCP VCCP VCCP VCCP VCC VSS VCC VSS VCC VSS VCC VSS VCC

A[32]# VSS A[27]# RSVD0 4 VSS VCCP VSS VCCP VSS VCCP VSS VCCP VCC VSS VCC VSS VCC VSS VCC VSS VCC

A[21]# VSS A[18]# A[25]# VSS VCCP VSS VCCP VCCP VCCP VCCP VCCP VCCP VSS VCC VSS VCC VSS VCC VSS VCC

A[23]# VSS A[26]# RSVD0 3 VSS VCCP VSS VCCP VSS VCCP VSS VCCP VCCP VSS VCC VSS VCC VSS VCC VSS VCC

A[11]# VSS VSS A[12]# A[14]# A[10]# VSS VCCP VCCP VSS VCCP VCCP VSS VCCP VCCP VSS VCCP VCCP VCCP VSS VSS VCC VSS VSS VCC VSS VSS VCC VSS VSS VCC

VID[6]

A[24]#

VSS

VSS

BPM[0] #

VSS

TEST5

VCCP

VSS

VCCP

VCC

VCCP

VCC

VCC

VCC

VCC

VCC

VCC

VCC

VCC

80

Datasheet

Package Mechanical Specifications and Pin Information

Figure 19.

Intel Core 2 Duo Mobile Processor in SFF Package Top View Upper Right Side

AB AA 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
VCC VCC VSS VCC VSS VCC VSS VCCP VSS VCCP VCCP VCCP VCCP VSS VCCP VSS VCCP A[8]# A[13]# A[15]# VSS A[7]#

Y
RSVD0 2

W
A[5]#

V
RSVD0 1

U
REQ[2] #

R
REQ[0] #

N
LOCK#

L
TRDY#

J
DBSY#

G
VSS

E
VSS

A[9]# VSS VSS A[6]# VSS REQ[1] # VSS VCCP VCCP VSS VCCP VCCP VSS VCCP VCCP VSS VCCP VCCP VCCP VSS VSS VCC VSS VSS VCC VSS VSS VCC VSS VSS VCC

A[3]# VSS REQ[3] # DEFER # VSS VCCP VSS VCCP VCCP VCCP VCCP VCCP VCCP VSS VCC VSS VCC VSS VCC VSS VCC

BR0# VSS ADS# BPRI# VSS VCCP VSS VCCP VSS VCCP VSS VCCP VCCP VSS VCC VSS VCC VSS VCC VSS VCC

RS[0]# VSS RS[2]# BNR# VSS DBR# VSS RSVD0 5 VCCP VCCP VCCP VCCP VCCP VSS VCC VSS VCC VSS VCC VSS VCC

HIT# VSS RS[1]# RESET # VSS DPRST P# RSVD0 7 VSS VSS VCCP VCCP VCCP VCCP VSS VCC VSS VCC VSS VCC VSS VCC

HITM# VSS RSVD0 6 SMI# VSS PWRG OOD STPCL K# VSS IGNNE # VCCP VCCP VCCP VCCP VSS VCC VSS VCC VSS VCC VSS VCC

VSS VSS FERR# LINT1 VSS A20M# INIT# LINT0 SLP# VSS VCCP VCCP VCCP VSS VCC VSS VCC VSS VCC VSS VCC VCC VCC VSS VCC VSS VCC VSS VCCP VSS VCCP VCCP THER MTRIP # VSS DPSLP # VSS VSS VSS VSS VSS

VSS ADSTB [0]# REQ[4] # VSS VCCP VSS VCCP VSS VCCP VSS VCCP VCCP VSS VCC VSS VCC VSS VCC VSS VCC VCC VCC VCC VCC VCCP VCCP VCCP VSS VSS A[4]#

Datasheet

81

Package Mechanical Specifications and Pin Information

Figure 20.

Intel Core 2 Duo Mobile Processor in SFF Package Top View Lower Left Side

BD BC BB BA AY AW AV 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44
VSS VSS VSS VSS VSS VSS D[59]# D[61]# D[60]# VSS GTLRE F VSS VSS DINV[3 ]# D[55]# VSS DSTBN [3]# D[52]# VSS THRM DC D[58]# VSS D[54]# DSTBP [3]# VSS D[50]# VCC VSS THRM DA D[62]# D[56]# VSS D[48]# VCC VSS VCC VSS VSS VSS VSS VCC VSS VCC VSS VCC VSS VSS VCC VSS VCC VSS VCC VSS VCC VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC

AU
VSS

AT

AR
VSS

AP

AN AM AL
VSS VSS VCC VSS VSS VCC VSS VSS VCC VSS VSS VCC VSS VSS VCC VCC VCC VSS VCCP VCCP VSS VCCP VCCP VSS VSS VSS D[42]# D[46]# D[47]# VSS D[41]# DSTBP [2]# D[40]#

AK

AJ
VSS

AH AG
VSS VCC

AF

AE
VSS

AD

AC
VSS

VCC VSS VCC VSS VCC VSS VCC VSS VCC VCC VCC VSS VSS VSS VSS VSS D[57]# D[51]# VSS D[63]# D[49]# D[33]# D[53]# VSS VSS VSS VCC VSS VSS VSS VSS

VCC

VCC VSS VCC VSS VCC VSS VCC VSS VCC VCC VSS VCCP VCCP VCCP VCCP VSS D[43]# DINV[2 ]# VSS D[36]# DSTBN [2]#

VCC VSS VSS VCC VSS VSS VCC VSS VSS VCC VSS VSS VCC VCC VCC VSS VCCP VCCP VCCP VCCP VCCP VCCP VSS VSS D[35]# D[37]# TEST4 VSS D[44]# COMP[ 0] D[38]#

VCC VSS VCC VSS VCC VSS VCC VSS VCC VCC VSS VCCP VSS VCCP VSS VSS D[26]# D[27]# VSS TEST6 COMP[ 1]

VCC

VCC

VCC

VCC

VCC

VCC

VCC

VCC

VSS

VSS

VCCP

VSS

VCCP

VSS

D[45]#

D[34]#

VSS

VSS

D[32]#

D[39]#

82

Datasheet

Package Mechanical Specifications and Pin Information

Figure 21.

Intel Core 2 Duo Mobile Processor in SFF Package Top View Lower Right Side

AB 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44
D[19]# VSS D[25]# VCCP VCCP VSS VCC VCC VCC VCC VCC

AA
VSS

W
VSS

U
VSS

R
VSS

N
VSS

L
VSS

J
VSS

G
VSS

E
VSS

C
VSS

A
VSS

VCC VSS VCC VSS VCC VSS VCC VSS VCC VCC VSS VCCP VSS VCCP VSS VSS D[29]# D[24]# VSS D[28]# D[30]# DSTBP [1]# D[21]# VSS VCCP VCCP VCC VSS VSS VSS VSS

VCC VSS VCC VSS VCC VSS VCC VSS VCC VCC VSS VCCP VCCP VCCP VCCP VSS D[17]# D[23]# VSS DSTBN [1]# D[18]#

VCC VSS VCC VSS VCC VSS VCC VSS VCC VCC VSS VCCP VSS VCCP VSS VSS D[11]# D[20]# VSS DINV[1 ]# D[31]#

VCC VSS VCC VSS VCC VSS VCC VSS VCC VCC VSS VCCP VCCP VCCP VCCP VSS DINV[0 ]# D[10]# VSS D[22]# D[16]#

VCC VSS VCC VSS VCC VSS VCC VSS VCC VCC VSS VCCP VSS VCCP VSS VSS D[12]# D[8]# VSS D[15]# D[14]#

VCC VSS VCC VSS VCC VSS VCC VSS VCC VCC VSS VCCP VCCP VCCP VCCP VSS DSTBN [0]# DSTBP [0]# VSS D[3]# D[9]#

VCC VSS VCC VSS VCC VSS VCC VSS VCC VCC VSS VCCP VCCP VSS VSS D[6]# D[4]# D[13]# VSS D[1]# D[5]#

VCC VSS VCC VSS VCC VSS VCC VSS VCC VCCP VCCP VCCP VCCP TEST1 DRDY# VSS D[0]# D[7]# VSS D[2]# VSS

VCC VSS VCC VSS VCC VSS VCC VSS VCCP VCCP VCCA BCLK[ 1] VSS BSEL[1 ] PROC HOT# VSS TEST2 DPWR # VSS TEST3 VSS

VCC VSS VCC VSS VCC VSS VCC VSS VCCP VCCP VCCA BCLK[ 0] VSS BSEL[0 ] BSEL[2 ] VSS IERR# VSS VSS

Datasheet

83

Package Mechanical Specifications and Pin Information

Table 18.Intel Core 2 Duo Mobile Processor in SFF Package Listing by Ball Name
Signal Name A[3]# A[4]# A[5]# A[6]# A[7]# A[8]# A[9]# A[10]# A[11]# A[12]# A[13]# A[14]# A[15]# A[16]# A[17]# A[18]# A[19]# A[20]# A[21]# A[22]# A[23]# A[24]# A[25]# A[26]# A[27]# A[28]# A[29]# A[30]# A[31]# A[32]# A[33]# A[34]# A[35]# ADS# ADSTB[0]# ADSTB[1]# Ball Number P2 V4 W1 T4 AA1 AB4 T2 AC5 AD2 AD4 AA5 AE5 AB2 AC1 AN1 AK4 AG1 AT4 AK2 AT2 AH2 AF4 AJ5 AH4 AM4 AP4 AR5 AJ1 AL1 AM2 AU5 AP2 AR1 C7 M4 Y4 Signal Name BCLK[0] BCLK[1] BNR# BPM[0]# BPM[1]# BPM[2]# BPM[3]# BPRI# BR0# BSEL[0] BSEL[1] BSEL[2] COMP[0] COMP[1] COMP[2] COMP[3] D[0]# D[1]# D[2]# D[3]# D[4]# D[5]# D[6]# D[7]# D[8]# D[9]# D[10]# D[11]# D[12]# D[13]# D[14]# D[15]# D[16]# D[17]# D[18]# D[19]# Ball Number AN5 A35 C35 J5 AY8 BA7 BA5 AY2 L5 M2 A37 C37 B38 AE43 AD44 AE1 AF2 F40 G43 E43 J43 H40 H44 G39 E41 L41 K44 N41 T40 M40 M44 L43 P44 V40 V44 AB44 Signal Name D[20]# D[21]# D[22]# D[23]# D[24]# D[25]# D[26]# D[27]# D[28]# D[29]# D[30]# D[31]# D[32]# D[33]# D[34]# D[35]# D[36]# D[37]# D[38]# D[39]# D[40]# D[41]# D[42]# D[43]# D[44]# D[45]# D[46]# D[47]# D[48]# D[49]# D[50]# D[51]# D[52]# D[53]# D[54]# D[55]# Ball Number R41 W41 N43 U41 AA41 AB40 AD40 AC41 AA43 Y40 Y44 T44 AP44 AR43 AH40 AF40 AJ43 AG41 AF44 AH44 AM44 AN43 AM40 AK40 AG43 AP40 AN41 AL41 AV38 AT44 AV40 AU41 AW41 AR41 BA37 BB38

84

Datasheet

Package Mechanical Specifications and Pin Information

Table 18.Intel Core 2 Duo Mobile Processor in SFF Package Listing by Ball Name
Signal Name D[56]# D[57]# D[58]# D[59]# D[60]# D[61]# D[62]# D[63]# DBR# DBSY# DEFER# DINV[0]# DINV[1]# DINV[2]# DINV[3]# DPRSTP# DPSLP# DPWR# DRDY# DSTBN[0]# DSTBN[1]# DSTBN[2]# DSTBN[3]# DSTBP[0]# DSTBP[1]# DSTBP[2]# DSTBP[3]# FERR# GTLREF HIT# HITM# IERR# IGNNE# INIT# LINT0 LINT1 LOCK# Ball Number AY36 AT40 BC35 BC39 BA41 BB40 BA35 AU43 J7 J1 N5 P40 R43 AJ41 BC37 G7 B8 C41 F38 K40 U43 AK44 AY40 J41 W43 AL43 AY38 D4 AW43 H2 F2 B40 F10 D8 C9 C5 N1 Signal Name PRDY# PREQ# PROCHOT# PSI# PWRGOOD REQ[0]# REQ[1]# REQ[2]# REQ[3]# REQ[4]# RESET# RS[0]# RS[1]# RS[2]# RSVD01 RSVD02 RSVD03 RSVD04 RSVD05 RSVD06 RSVD07 SLP# SMI# STPCLK# TCK TDI TDO TEST1 TEST2 TEST3 TEST4 TEST5 TEST6 THERMTRIP# THRMDA THRMDC THERMTRIP# Ball Number AV10 AV2 D38 BD10 E7 R1 R5 U1 P4 W5 G5 K2 H4 K4 V2 Y2 AG5 AL5 J9 F4 H8 D10 E5 F8 AV4 AW7 AU1 E37 D40 C43 AE41 AY10 AC43 B10 BB34 BD34 B10 Signal Name TMS TRDY# TRST# VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC Ball Number AW5 L1 AV8 AA33 AB16 AB18 AB20 AB22 AB24 AB26 AB28 AB30 AB32 AC33 AD16 AD18 AD20 AD22 AD24 AD26 AD28 AD30 AD32 AE33 AF16 AF18 AF20 AF22 AF24 AF26 AF28 AF30 AF32 AG33 AH16 AH18 AH20

Datasheet

85

Package Mechanical Specifications and Pin Information

Table 18.Intel Core 2 Duo Mobile Processor in SFF Package Listing by Ball Name
Signal Name VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC Ball Number AH22 AH24 AH26 AH28 AH30 AH32 AJ33 AK16 AK18 AK20 AK22 AK24 AK26 AK28 AK30 AK32 AL33 AM14 AM16 AM18 AM20 AM22 AM24 AM26 AM28 AM30 AM32 AN33 AP14 AP16 AP18 AP20 AP22 AP24 AP26 AP28 AP30 Signal Name VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC Ball Number AP32 AR33 AT14 AT16 AT18 AT20 AT22 AT24 AT26 AT28 AT30 AT32 AT34 AU33 AV14 AV16 AV18 AV20 AV22 AV24 AV26 AV28 AV30 AV32 AY14 AY16 AY18 AY20 AY22 AY24 AY26 AY28 AY30 AY32 B16 B18 B20 Signal Name VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC Ball Number B22 B24 B26 B28 B30 BB14 BB16 BB18 BB20 BB22 BB24 BB26 BB28 BB30 BB32 BD14 BD16 BD18 BD20 BD22 BD24 BD26 BD28 BD30 BD32 D16 D18 D20 D22 D24 D26 D28 D30 F16 F18 F20 F22

86

Datasheet

Package Mechanical Specifications and Pin Information

Table 18.Intel Core 2 Duo Mobile Processor in SFF Package Listing by Ball Name
Signal Name VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC Ball Number F24 F26 F28 F30 F32 G33 H16 H18 H20 H22 H24 H26 H28 H30 H32 J33 K16 K18 K20 K22 K24 K26 K28 K30 K32 L33 M16 M18 M20 M22 M24 M26 M28 M30 M32 N33 P16 Signal Name VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC Ball Number P18 P20 P22 P24 P26 P28 P30 P32 R33 T16 T18 T20 T22 T24 T26 T28 T30 T32 U33 V16 V18 V20 V22 V24 V26 V28 V30 V32 W33 Y16 Y18 Y20 Y22 Y24 Y26 Y28 Y30 Signal Name VCC VCCA VCCA VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP Ball Number Y32 B34 D34 A13 A33 AA7 AA9 AA11 AA13 AA35 AA37 AB10 AB12 AB14 AB36 AB38 AC7 AC9 AC11 AC13 AC35 AC37 AD14 AE7 AE9 AE11 AE13 AE35 AE37 AF10 AF12 AF14 AF36 AF38 AG7 AG9 AG11

Datasheet

87

Package Mechanical Specifications and Pin Information

Table 18.Intel Core 2 Duo Mobile Processor in SFF Package Listing by Ball Name
Signal Name VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP Ball Number AG13 AG35 AG37 AH14 AJ7 AJ9 AJ11 AJ13 AJ35 AJ37 AK10 AK12 AK14 AK36 AK38 AL7 AL9 AL11 AL13 AL35 AL37 AN7 AN9 AN11 AN13 AN35 AN37 AP10 AP12 AP36 AP38 AR7 AR9 AR11 AR13 AU11 AU13 Signal Name VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP Ball Number B12 B14 B32 C13 C33 D12 D14 D32 E11 E13 E33 E35 F12 F14 F34 F36 G11 G13 G35 H12 H14 H36 J11 J13 J35 J37 K10 K12 K14 K36 K38 L7 L9 L11 L13 L35 L37 Signal Name VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP Ball Number M14 N7 N9 N11 N13 N35 N37 P10 P12 P14 P36 P38 R7 R9 R11 R13 R35 R37 T14 U7 U9 U11 U13 U35 U37 V10 V12 V14 V36 V38 W7 W9 W11 W13 W35 W37 Y14

88

Datasheet

Package Mechanical Specifications and Pin Information

Table 18.Intel Core 2 Duo Mobile Processor in SFF Package Listing by Ball Name
Signal Name VCCSENSE VID[0] VID[1] VID[2] VID[3] VID[4] VID[5] VID[6] VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Ball Number BD12 BD8 BC7 BB10 BB8 BC5 BB4 AY4 A5 A7 A9 A11 A15 A17 A19 A21 A23 A25 A27 A29 A31 A39 A41 AA3 AA15 AA17 AA19 AA21 AA23 AA25 AA27 AA29 AA31 AA39 AB6 AB8 AB34 Signal Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Ball Number AB42 AC3 AC15 AC17 AC19 AC21 AC23 AC25 AC27 AC29 AC31 AC39 AD6 AD8 AD10 AD12 AD34 AD36 AD38 AD42 AE3 AE15 AE17 AE19 AE21 AE23 AE25 AE27 AE29 AE31 AE39 AF6 AF8 AF34 AF42 AG3 AG15 Signal Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Ball Number AG17 AG19 AG21 AG23 AG25 AG27 AG29 AG31 AG39 AH6 AH8 AH10 AH12 AH34 AH36 AH38 AH42 AJ3 AJ15 AJ17 AJ19 AJ21 AJ23 AJ25 AJ27 AJ29 AJ31 AJ39 AK6 AK8 AK34 AK42 AL3 AL15 AL17 AL19 AL21

Datasheet

89

Package Mechanical Specifications and Pin Information

Table 18.Intel Core 2 Duo Mobile Processor in SFF Package Listing by Ball Name
Signal Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Ball Number AL23 AL25 AL27 AL29 AL31 AL39 AM6 AM8 AM10 AM12 AM34 AM36 AM38 AM42 AN3 AN15 AN17 AN19 AN21 AN23 AN25 AN27 AN29 AN31 AN39 AP6 AP8 AP34 AP42 AR3 AR15 AR17 AR19 AR21 AR23 AR25 AR27 Signal Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Ball Number AR29 AR31 AR35 AR37 AR39 AT6 AT8 AT10 AT12 AT36 AT38 AT42 AU3 AU7 AU9 AU15 AU17 AU19 AU21 AU23 AU25 AU27 AU29 AU31 AU35 AU37 AU39 AV6 AV12 AV34 AV36 AV42 AV44 AW1 AW3 AW9 AW11 Signal Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Ball Number AW13 AW15 AW17 AW19 AW21 AW23 AW25 AW27 AW29 AW31 AW33 AW35 AW37 AW39 AY6 AY12 AY34 AY42 AY44 B4 B6 B36 B42 BA1 BA3 BA9 BA11 BA13 BA15 BA17 BA19 BA21 BA23 BA25 BA27 BA29 BA31

90

Datasheet

Package Mechanical Specifications and Pin Information

Table 18.Intel Core 2 Duo Mobile Processor in SFF Package Listing by Ball Name
Signal Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Ball Number BA33 BA39 BA43 BB2 BB6 BB12 BB36 BB42 BC3 BC9 BC11 BC15 BC17 BC19 BC21 BC23 BC25 BC27 BC29 BC31 BC33 BC41 BD4 BD6 BD36 BD38 BD40 C3 C11 C15 C17 C19 C21 C23 C25 C27 C29 Signal Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Ball Number C31 C39 D2 D6 D36 D42 D44 E1 E3 E9 E15 E17 E19 E21 E23 E25 E27 E29 E31 E39 F6 F42 F44 G1 G3 G9 G15 G17 G19 G21 G23 G25 G27 G29 G31 G37 H6 Signal Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Ball Number H10 H34 H38 H42 J3 J15 J17 J19 J21 J23 J25 J27 J29 J31 J39 K6 K8 K34 K42 L3 L15 L17 L19 L21 L23 L25 L27 L29 L31 L39 M6 M8 M10 M12 M34 M36 M38

Datasheet

91

Package Mechanical Specifications and Pin Information

Table 18.Intel Core 2 Duo Mobile Processor in SFF Package Listing by Ball Name
Signal Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Ball Number M42 N3 N15 N17 N19 N21 N23 N25 N27 N29 N31 N39 P6 P8 P34 P42 R3 R15 R17 R19 R21 R23 R25 R27 R29 R31 R39 T6 T8 T10 T12 T34 T36 T38 T42 U3 U5 Signal Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSSSENSE Ball Number U15 U17 U19 U21 U23 U25 U27 U29 U31 U39 V6 V8 V34 V42 W3 W15 W17 W19 W21 W23 W25 W27 W29 W31 W39 Y6 Y8 Y10 Y12 Y34 Y36 Y38 Y42 BC13 Signal Name Ball Number

92

Datasheet

Package Mechanical Specifications and Pin Information

4.3
Table 19.

Alphabetical Signals Reference

Signal Description (Sheet 1 of 8)
Name Type Description A[35:3]# (Address) define a 236-byte physical memory address space. In sub-phase 1 of the address phase, these pins transmit the address of a transaction. In sub-phase 2, these pins transmit transaction type information. These signals must connect the appropriate pins of both agents on the processor FSB. A[35:3]# are source-synchronous signals and are latched into the receiving buffers by ADSTB[1:0]#. Address signals are used as straps, which are sampled before RESET# is deasserted. If A20M# (Address-20 Mask) is asserted, the processor masks physical address bit 20 (A20#) before looking up a line in any internal cache and before driving a read/write transaction on the bus. Asserting A20M# emulates the 8086 processor's address wrap-around at the 1-MB boundary. Assertion of A20M# is only supported in real mode. A20M# is an asynchronous signal. However, to ensure recognition of this signal following an input/output write instruction, it must be valid along with the TRDY# assertion of the corresponding input/ output Write bus transaction. ADS# (Address Strobe) is asserted to indicate the validity of the transaction address on the A[35:3]# and REQ[4:0]# pins. All bus agents observe the ADS# activation to begin parity checking, protocol checking, address decode, internal snoop, or deferred reply ID match operations associated with the new transaction. Address strobes are used to latch A[35:3]# and REQ[4:0]# on their rising and falling edges. Strobes are associated with signals as shown below. ADSTB[1:0]# Input/ Output Signals REQ[4:0]#, A[16:3]# A[35:17]# Associated Strobe ADSTB[0]# ADSTB[1]#

A[35:3]#

Input/ Output

A20M#

Input

ADS#

Input/ Output

BCLK[1:0]

Input

The differential pair BCLK (Bus Clock) determines the FSB frequency. All FSB agents must receive these signals to drive their outputs and latch their inputs. All external timing parameters are specified with respect to the rising edge of BCLK0 crossing VCROSS.

BNR#

Input/ Output Output Input/ Output

BNR# (Block Next Request) is used to assert a bus stall by any bus agent who is unable to accept new bus transactions. During a bus stall, the current bus owner cannot issue any new transactions. BPM[3:0]# (Breakpoint Monitor) are breakpoint and performance monitor signals. They are outputs from the processor that indicate the status of breakpoints and programmable counters used for monitoring processor performance. BPM[3:0]# should connect the appropriate pins of all processor FSB agents.This includes debug or performance monitoring tools.

BPM[2:1]# BPM[3,0]#

Datasheet

93

Package Mechanical Specifications and Pin Information

Table 19.

Signal Description (Sheet 2 of 8)

Name Type Description BPRI# (Bus Priority Request) is used to arbitrate for ownership of the FSB. It must connect the appropriate pins of both FSB agents. Observing BPRI# active (as asserted by the priority agent) causes the other agent to stop issuing new requests, unless such requests are part of an ongoing locked operation. The priority agent keeps BPRI# asserted until all of its requests are completed, then releases the bus by deasserting BPRI#. BR0# is used by the processor to request the bus. The arbitration is done between the processor (Symmetric Agent) and GMCH (High Priority Agent). BSEL[2:0] (Bus Select) are used to select the processor input clock frequency. Table 3 defines the possible combinations of the signals and the frequency associated with each combination. The required frequency is determined by the processor, chipset and clock synthesizer. All agents must operate at the same frequency. COMP[3:0] must be terminated on the system board using precision (1% tolerance) resistors. D[63:0]# (Data) are the data signals. These signals provide a 64-bit data path between the FSB agents, and must connect the appropriate pins on both agents. The data driver asserts DRDY# to indicate a valid data transfer. D[63:0]# are quad-pumped signals and will thus be driven four times in a common clock period. D[63:0]# are latched off the falling edge of both DSTBP[3:0]# and DSTBN[3:0]#. Each group of 16 data signals correspond to a pair of one DSTBP# and one DSTBN#. The following table shows the grouping of data signals to data strobes and DINV#. Quad-Pumped Signal Groups D[63:0]# Input/ Output Data Group D[15:0]# D[31:16]# D[47:32]# D[63:48]# DSTBN#/ DSTBP# 0 1 2 3 DINV# 0 1 2 3

BPRI#

Input

BR0#

Input/ Output

BSEL[2:0]

Output

COMP[3:0]

Analog

Furthermore, the DINV# pins determine the polarity of the data signals. Each group of 16 data signals corresponds to one DINV# signal. When the DINV# signal is active, the corresponding data group is inverted and therefore sampled active high. DBR# (Data Bus Reset) is used only in processor systems where no debug port is implemented on the system board. DBR# is used by a debug port interposer so that an in-target probe can drive system reset. If a debug port is implemented in the system, DBR# is a no connect in the system. DBR# is not a processor signal. DBSY# (Data Bus Busy) is asserted by the agent responsible for driving data on the FSB to indicate that the data bus is in use. The data bus is released after DBSY# is deasserted. This signal must connect the appropriate pins on both FSB agents.

DBR#

Output

DBSY#

Input/ Output

94

Datasheet

Package Mechanical Specifications and Pin Information

Table 19.

Signal Description (Sheet 3 of 8)

Name Type Description DEFER# is asserted by an agent to indicate that a transaction cannot be ensured in-order completion. Assertion of DEFER# is normally the responsibility of the addressed memory or input/ output agent. This signal must connect the appropriate pins of both FSB agents. DINV[3:0]# (Data Bus Inversion) are source synchronous and indicate the polarity of the D[63:0]# signals. The DINV[3:0]# signals are activated when the data on the data bus is inverted. The bus agent will invert the data bus signals if more than half the bits, within the covered group, would change level in the next cycle. DINV[3:0]# Assignment To Data Bus DINV[3:0]# Input/ Output Bus Signal DINV[3]# DINV[2]# DINV[1]# DINV[0]# Data Bus Signals D[63:48]# D[47:32]# D[31:16]# D[15:0]#

DEFER#

Input

DPRSTP#

Input

DPRSTP#, when asserted on the platform, causes the processor to transition from the Deep Sleep State to the Deeper Sleep state or Deep Power Down Technology (C6) state. To return to the Deep Sleep State, DPRSTP# must be deasserted. DPRSTP# is driven by the ICH9M. DPSLP# when asserted on the platform causes the processor to transition from the Sleep State to the Deep Sleep state. To return to the Sleep State, DPSLP# must be deasserted. DPSLP# is driven by the ICH9M. DPWR# is a control signal used by the chipset to reduce power on the processor data bus input buffers. The processor drives this pin during dynamic FSB frequency switching. DRDY# (Data Ready) is asserted by the data driver on each data transfer, indicating valid data on the data bus. In a multi-common clock data transfer, DRDY# may be deasserted to insert idle clocks. This signal must connect the appropriate pins of both FSB agents. Data strobe used to latch in D[63:0]#. Signals Associated Strobe DSTBN[0]# DSTBN[1]# DSTBN[2]# DSTBN[3]#

DPSLP#

Input

DPWR#

Input/ Output

DRDY#

Input/ Output

DSTBN[3:0]#

Input/ Output

D[15:0]#, DINV[0]# D[31:16]#, DINV[1]# D[47:32]#, DINV[2]# D[63:48]#, DINV[3]#

Datasheet

95

Package Mechanical Specifications and Pin Information

Table 19.

Signal Description (Sheet 4 of 8)

Name Type Description Data strobe used to latch in D[63:0]#. Signals DSTBP[3:0]# Input/ Output D[15:0]#, DINV[0]# D[31:16]#, DINV[1]# D[47:32]#, DINV[2]# D[63:48]#, DINV[3]# Associated Strobe DSTBP[0]# DSTBP[1]# DSTBP[2]# DSTBP[3]#

FERR#/PBE#

Output

FERR# (Floating-point Error)/PBE# (Pending Break Event) is a multiplexed signal and its meaning is qualified with STPCLK#. When STPCLK# is not asserted, FERR#/PBE# indicates a floating point when the processor detects an unmasked floating-point error. FERR# is similar to the ERROR# signal on the Intel 387 coprocessor, and is included for compatibility with systems using Microsoft MS-DOS*-type floating-point error reporting. When STPCLK# is asserted, an assertion of FERR#/PBE# indicates that the processor has a pending break event waiting for service. The assertion of FERR#/PBE# indicates that the processor should be returned to the Normal state. When FERR#/PBE# is asserted, indicating a break event, it will remain asserted until STPCLK# is deasserted. Assertion of PREQ# when STPCLK# is active will also cause an FERR# break event. For additional information on the pending break event functionality, including identification of support of the feature and enable/disable information, refer to Volumes 3A and 3B of the Intel 64 and IA-32 Architectures Software Developer's Manuals and the Intel Processor Identification and CPUID Instruction application note.

GTLREF HIT# HITM#

Input Input/ Output Input/ Output

GTLREF determines the signal reference level for AGTL+ input pins. GTLREF should be set at 2/3 VCCP. GTLREF is used by the AGTL+ receivers to determine if a signal is a logical 0 or logical 1. HIT# (Snoop Hit) and HITM# (Hit Modified) convey transaction snoop operation results. Either FSB agent may assert both HIT# and HITM# together to indicate that it requires a snoop stall that can be continued by reasserting HIT# and HITM# together. IERR# (Internal Error) is asserted by the processor as the result of an internal error. Assertion of IERR# is usually accompanied by a SHUTDOWN transaction on the FSB. This transaction may optionally be converted to an external error signal (e.g., NMI) by system core logic. The processor will keep IERR# asserted until the assertion of RESET#, BINIT#, or INIT#. IGNNE# (Ignore Numeric Error) is asserted to force the processor to ignore a numeric error and continue to execute non-control floating-point instructions. If IGNNE# is deasserted, the processor generates an exception on a non-control floating-point instruction if a previous floating-point instruction caused an error. IGNNE# has no effect when the NE bit in control register 0 (CR0) is set. IGNNE# is an asynchronous signal. However, to ensure recognition of this signal following an input/output write instruction, it must be valid along with the TRDY# assertion of the corresponding input/ output Write bus transaction.

IERR#

Output

IGNNE#

Input

96

Datasheet

Package Mechanical Specifications and Pin Information

Table 19.

Signal Description (Sheet 5 of 8)

Name Type Description INIT# (Initialization), when asserted, resets integer registers inside the processor without affecting its internal caches or floating-point registers. The processor then begins execution at the power-on Reset vector configured during power-on configuration. The processor continues to handle snoop requests during INIT# assertion. INIT# is an asynchronous signal. However, to ensure recognition of this signal following an input/output write instruction, it must be valid along with the TRDY# assertion of the corresponding input/output write bus transaction. INIT# must connect the appropriate pins of both FSB agents. If INIT# is sampled active on the active-to-inactive transition of RESET#, then the processor executes its Built-in Self-Test (BIST) LINT[1:0] (Local APIC Interrupt) must connect the appropriate pins of all APIC Bus agents. When the APIC is disabled, the LINT0 signal becomes INTR, a maskable interrupt request signal, and LINT1 becomes NMI, a nonmaskable interrupt. INTR and NMI are backward-compatible with the signals of those names on the Pentium processor. Both signals are asynchronous. Both of these signals must be software configured via BIOS programming of the APIC register space to be used either as NMI/ INTR or LINT[1:0]. Because the APIC is enabled by default after Reset, operation of these pins as LINT[1:0] is the default configuration. LOCK# indicates to the system that a transaction must occur atomically. This signal must connect the appropriate pins of both FSB agents. For a locked sequence of transactions, LOCK# is asserted from the beginning of the first transaction to the end of the last transaction. When the priority agent asserts BPRI# to arbitrate for ownership of the FSB, it will wait until it observes LOCK# deasserted. This enables symmetric agents to retain ownership of the FSB throughout the bus locked operation and ensure the atomicity of lock. Probe Ready signal used by debug tools to determine processor debug readiness. Probe Request signal used by debug tools to request debug operation of the processor. As an output, PROCHOT# (Processor Hot) will go active when the processor temperature monitoring sensor detects that the processor has reached its maximum safe operating temperature. This indicates that the processor Thermal Control Circuit (TCC) has been activated, if enabled. As an input, assertion of PROCHOT# by the system will activate the TCC, if enabled. The TCC will remain active until the system deasserts PROCHOT#. By default PROCHOT# is configured as an output. The processor must be enabled via the BIOS for PROCHOT# to be configured as bidirectional. This signal may require voltage translation on the motherboard. PSI# Output Processor Power Status Indicator signal. This signal is asserted when the processor is both in the normal state (HFM to LFM) and in lower power states (Deep Sleep and Deeper Sleep).

INIT#

Input

LINT[1:0]

Input

LOCK#

Input/ Output

PRDY# PREQ#

Output Input

PROCHOT#

Input/ Output

Datasheet

97

Package Mechanical Specifications and Pin Information

Table 19.

Signal Description (Sheet 6 of 8)

Name Type Description PWRGOOD (Power Good) is a processor input. The processor requires this signal to be a clean indication that the clocks and power supplies are stable and within their specifications. Clean implies that the signal remains low (capable of sinking leakage current), without glitches, from the time that the power supplies are turned on until they come within specification. The signal must then transition monotonically to a high state. The PWRGOOD signal must be supplied to the processor; it is used to protect internal circuits against voltage sequencing issues. It should be driven high throughout boundary scan operation. Input/ Output REQ[4:0]# (Request Command) must connect the appropriate pins of both FSB agents. They are asserted by the current bus owner to define the currently active transaction type. These signals are source synchronous to ADSTB[0]#. Asserting the RESET# signal resets the processor to a known state and invalidates its internal caches without writing back any of their contents. For a power-on Reset, RESET# must stay active for at least two milliseconds after VCC and BCLK have reached their proper specifications. On observing active RESET#, both FSB agents will deassert their outputs within two clocks. All processor straps must be valid within the specified setup time before RESET# is deasserted. There is a 55 (nominal) on die pull-up resistor on this signal. RS[2:0]# Input Reserved/ No Connect RS[2:0]# (Response Status) are driven by the response agent (the agent responsible for completion of the current transaction), and must connect the appropriate pins of both FSB agents. These pins are RESERVED and must be left unconnected on the board. However, it is recommended that routing channels to these pins on the board be kept open for possible future use. SLP# (Sleep), when asserted in Stop-Grant state, causes the processor to enter the Sleep state. During Sleep state, the processor stops providing internal clock signals to all units, leaving only the Phase-Locked Loop (PLL) still operating. Processors in this state will not recognize snoops or interrupts. The processor will recognize only assertion of the RESET# signal, deassertion of SLP#, and removal of the BCLK input while in Sleep state. If SLP# is deasserted, the processor exits Sleep state and returns to StopGrant state, restarting its internal clock signals to the bus and processor core units. If DPSLP# is asserted while in the Sleep state, the processor will exit the Sleep state and transition to the Deep Sleep state. SMI# (System Management Interrupt) is asserted asynchronously by system logic. On accepting a System Management Interrupt, the processor saves the current state and enters System Management Mode (SMM). An SMI Acknowledge transaction is issued and the processor begins program execution from the SMM handler. If an SMI# is asserted during the deassertion of RESET#, then the processor will tristate its outputs.

PWRGOOD

Input

REQ[4:0]#

RESET#

Input

RSVD

SLP#

Input

SMI#

Input

98

Datasheet

Package Mechanical Specifications and Pin Information

Table 19.

Signal Description (Sheet 7 of 8)

Name Type Description STPCLK# (Stop Clock), when asserted, causes the processor to enter a low power Stop-Grant state. The processor issues a StopGrant Acknowledge transaction, and stops providing internal clock signals to all processor core units except the FSB and APIC units. The processor continues to snoop bus transactions and service interrupts while in Stop-Grant state. When STPCLK# is deasserted, the processor restarts its internal clock to all units and resumes execution. The assertion of STPCLK# has no effect on the bus clock; STPCLK# is an asynchronous input. TCK (Test Clock) provides the clock input for the processor Test Bus (also known as the Test Access Port). TDI (Test Data In) transfers serial test data into the processor. TDI provides the serial input needed for JTAG specification support. TDO (Test Data Out) transfers serial test data out of the processor. TDO provides the serial output needed for JTAG specification support.

STPCLK#

Input

TCK TDI

Input Input

TDO TEST1, TEST2, TEST3, TEST4, TEST5, TEST6 TEST7 THRMDA THRMDC

Output

Input

Refer to the appropriate platform design guide for further TEST1, TEST2, TEST3, TEST4, TEST5, TEST6 and TEST7 termination requirements and implementation details.

Other Other

Thermal Diode Anode. Thermal Diode Cathode. The processor protects itself from catastrophic overheating by use of an internal thermal sensor. This sensor is set well above the normal operating temperature to ensure that there are no false trips. The processor will stop all execution when the junction temperature exceeds approximately 125 C. This is signalled to the system by the THERMTRIP# (Thermal Trip) pin. TMS (Test Mode Select) is a JTAG specification support signal used by debug tools. TRDY# (Target Ready) is asserted by the target to indicate that it is ready to receive a write or implicit writeback data transfer. TRDY# must connect the appropriate pins of both FSB agents. TRST# (Test Reset) resets the Test Access Port (TAP) logic. TRST# must be driven low during power on Reset. Processor core power supply. Processor core ground node. VCCA provides isolated power for the internal processor core PLLs. Processor I/O Power Supply.

THERMTRIP#

Output

TMS

Input

TRDY# TRST# VCC VSS VCCA VCCP

Input Input Input Input Input Input

Datasheet

99

Package Mechanical Specifications and Pin Information

Table 19.

Signal Description (Sheet 8 of 8)

Name VCCSENSE Type Output Description VCCSENSE together with VSSSENSE are voltage feedback signals that control the 2.1 m loadline at the processor die. It should be used to sense voltage near the silicon with little noise. VID[6:0] (Voltage ID) pins are used to support automatic selection of power supply voltages (VCC). Unlike some previous generations of processors, these are CMOS signals that are driven by the processor. The voltage supply for these pins must be valid before the VR can supply VCC to the processor. Conversely, the VR output must be disabled until the voltage supply for the VID pins becomes valid. The VID pins are needed to support the processor voltage specification variations. See Table 2 for definitions of these pins. The VR must supply the voltage that is requested by the pins, or disable itself. VSSSENSE together with VCCSENSE are voltage feedback signals that control the 2.1-m loadline at the processor die. It should be used to sense ground near the silicon with little noise.

VID[6:0]

Output

VSSSENSE

Output

100

Datasheet

Thermal Specifications and Design Considerations

Thermal Specifications and Design Considerations

A complete thermal solution includes both component and system-level thermal management features. To allow for the optimal operation and long-term reliability of Intel processor-based systems, the system/processor thermal solution should be designed so the processor remains within the minimum and maximum junction temperature (TJ) specifications at the corresponding thermal design power (TDP) value listed in the tables below

Caution: Table 20.

Operating the processor outside these operating limits may result in permanent damage to the processor and potentially other components in the system. Power Specifications for the Dual-Core Extreme Edition Processor
Symbol Processor Number X9100 Core Frequency & Voltage 3.06 GHz & VCCHFM 1.6 GHz & VCCLFM 0.8 GHz & VCCSLFM Symbol PAH, PSGNT at VCCHFM at VCCSLFM Sleep Power PSLP at VCCHFM at VCCSLFM Deep Sleep Power PDSLP PDPRSLP PDC4 PC6 TJ at VCCHFM at VCCSLFM Deeper Sleep Power Intel Enhanced Deeper Sleep state Power Intel Deep Power Down Power Junction Temperature 0 8.2 3.8 1.9 1.7 1.3 105 W W W C 2, 8 2, 8 2, 8 3, 4 W 2, 5, 8 17.8 6.4 W 2, 5, 7 Parameter Auto Halt, Stop Grant Power 18.8 6.7 W 2, 5, 7 Min Thermal Design Power 44 29 20 Typ Max Unit W Unit Notes 1, 4, 5, 6 Notes

TDP

NOTES: 1. The TDP specification should be used to design the processor thermal solution. The TDP is not the maximum theoretical power the processor can generate. 2. Not 100% tested. These power specifications are determined by characterization of the processor currents at higher temperatures and extrapolating the values for the temperature indicated. 3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitors automatic mode is used to indicate that the maximum TJ has been reached. 4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within specifications. 5. Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser than TDP in HFM. 6. At Tj of 105 oC 7. At Tj of 50 oC 8. At Tj of 35 oC

Datasheet 101

Thermal Specifications and Design Considerations

Table 21.

Power Specifications for the Dual-Core Standard Voltage Processor

Symbol Processor Number T9900 T9800 T9600 T9550 T9400 Core Frequency & Voltage 3.06 GHz & VCCHFM 2.93 GHz & VCCHFM 2.80 GHz & VCCHFM 2.66 GHz & VCCHFM 2.53 GHz & VCCHFM 1.6 GHz & VCCLFM 0.8 GHz & VCCSLFM Symbol PAH, PSGNT at VCCHFM at VCCSLFM Sleep Power PSLP at VCCHFM at VCCSLFM Deep Sleep Power PDSLP PDPRSLP PDC4 PC6 TJ at VCCHFM at VCCSLFM Deeper Sleep Power Intel Enhanced Deeper Sleep state Power Intel Deep Power Down Power Junction Temperature 0 5.5 2.2 1.7 1.3 0.3 105 W W W C 2, 8 2, 8 2, 8 3, 4 W 2, 5, 8 13.1 4.8 W 2, 5, 7 Parameter Auto Halt, Stop Grant Power 13.9 5.0 W 2, 5, 7 Min Thermal Design Power 35 35 35 35 35 22 12 Typ Max Unit Notes W 1, 4, 5, 6 Unit Notes

TDP

NOTES: 1. The TDP specification should be used to design the processor thermal solution. The TDP is not the maximum theoretical power the processor can generate. 2. Not 100% tested. These power specifications are determined by characterization of the processor currents at higher temperatures and extrapolating the values for the temperature indicated. 3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitors automatic mode is used to indicate that the maximum TJ has been reached. 4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within specifications. 5. Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser than TDP in HFM. 6. At Tj of 105 oC 7. At Tj of 50 oC 8. At Tj of 35 oC

102

Datasheet

Thermal Specifications and Design Considerations

Table 22.

Power Specifications for the Dual-Core Low Power Standard Voltage Processors (25W) in Standard Package
Symbol Processor Number P9700 P9600 P8800 P9500 P8700 P8600 P8400 Core Frequency & Voltage 2.8 GHz & VCCHFM 2.667 GHz & VCCHFM 2.667 GHz & VCCHFM 2.53 GHz & VCCHFM 2.53 GHz & VCCHFM 2.4 GHz & VCCHFM 2.267 GHz & VCCHFM 1.6 GHz & VCCLFM 0.8 GHz & VCCSLFM Parameter Auto Halt, Stop Grant Power at VCCHFM at VCCSLFM Sleep Power PSLP at VCCHFM at VCCSLFM Deep Sleep Power PDSLP PDPRSLP PDC4 PC6 TJ at VCCHFM at VCCSLFM Deeper Sleep Power Intel Enhanced Deeper Sleep State Power Intel Deep Power Down Power Junction Temperature 0 2.9 2.1 1.0 0.9 0.3 105 W W W C 2, 8 2, 8 2, 8 3, 4 W 2, 5, 8 7.3 3.5 W 2, 5, 7 8.1 3.7 W 2, 5, 7 Min Thermal Design Power 25 25 25 25 25 25 25 20 11 Typ Max Unit Notes W 1, 4, 5, 6 Unit Notes

TDP

Symbol PAH, PSGNT

NOTES: 1. The TDP specification should be used to design the processor thermal solution. The TDP is not the maximum theoretical power the processor can generate. 2. Not 100% tested. These power specifications are determined by characterization of the processor currents at higher temperatures and extrapolating the values for the temperature indicated. 3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitors automatic mode is used to indicate that the maximum TJ has been reached. Refer to Section 6.1 for more details. 4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within specifications. 5. Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser than TDP in HFM. 6. At Tj of 105 oC 7. At Tj of 50 oC 8. At Tj of 35 oC

Datasheet 103

Thermal Specifications and Design Considerations

Table 23.
Symbol

Power Specifications for the Dual-Core Power Optimized Performance (25 W) SFF Processors
Processor Number SP9600 SP9400 Core Frequency & Voltage 2.53 GHz & HFM VCC 2.4 GHz & HFM VCC 2.26 GHz & HFM VCC 1.6 GHz & Super LFM VCC 0.8 GHz & Super LFM VCC Thermal Design Power 25 25 25 20 11 Min Typ Max 8.3 3.3 7.5 3.1 0 2.9 1.8 1.0 0.9 0.3 105 W W W C 2, 8 2, 8 2, 8 3, 4 W 2, 5, 8 W 2, 5, 7 Unit W Notes 2, 5, 7 W 1, 4, 5, 6 Unit Notes

TDP

SP9300

Symbol PAH, PSGNT at VCCHFM at VCCSLFM Sleep Power PSLP at VCCHFM at VCCSLFM Deep Sleep Power PDSLP PDPRSLP PDC4 PC6 TJ at VCCHFM at VCCSLFM Deeper Sleep Power

Parameter Auto Halt, Stop Grant Power

Intel Enhanced Deeper Sleep State Power Intel Deep Power Down Power Junction Temperature

NOTES: 1. The TDP specification should be used to design the processor thermal solution. The TDP is not the maximum theoretical power the processor can generate. 2. Not 100% tested. These power specifications are determined by characterization of the processor currents at higher temperatures and extrapolating the values for the temperature indicated. 3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitors automatic mode is used to indicate that the maximum TJ has been reached. 4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within specifications. 5. Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser than TDP in HFM. 6. At Tj of 105 oC 7. At Tj of 50 C 8. At Tj of 35 oC

104

Datasheet

Thermal Specifications and Design Considerations

Table 24.
Symbol

Power Specifications fro the Dual-Core Low Voltage (LV) SFF Processors
Processor Number SL9600 SL9400 Core Frequency & Voltage 2.13 GHz & HFM VCC 1.86 GHz & HFM VCC 1.6 GHz & HFM VCC 1.6 GHz & Super LFM VCC 0.8 GHz & Super LFM VCC Thermal Design Power 17 17 17 16.7 10 Min Typ Max Unit W 1, 4, 5, 6 Unit Notes

TDP

SL9300

Symbol PAH, PSGNT

Parameter Auto Halt, Stop Grant Power at VCCHFM at VCCSLFM Sleep Power at VCCHFM at VCCSLFM Deep Sleep Power

Notes

6.3 3.0

2, 5, 7

PSLP

5.7 2.8

2, 5, 7

PDSLP PDPRSLP PDC4 PC6 TJ

at VCCHFM at VCCSLFM Deeper Sleep Power Intel Enhanced Deeper Sleep State Power Intel Deep Power Down Power Junction Temperature

2.6 1.3 0.9 0.8 0.3 105

W W W W C

2, 5, 8 2, 8 2, 8 2, 8 3, 4

NOTES: 1. The TDP specification should be used to design the processor thermal solution. The TDP is not the maximum theoretical power the processor can generate. 2. Not 100% tested. These power specifications are determined by characterization of the processor currents at higher temperatures and extrapolating the values for the temperature indicated. 3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitors automatic mode is used to indicate that the maximum TJ has been reached. 4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within specifications. 5. Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser than TDP in HFM. 6. At Tj of 105 oC 7. At Tj of 50 C 8. At Tj of 35 oC

Datasheet 105

Thermal Specifications and Design Considerations

Table 25.
Symbol

Power Specifications for the Dual-Core Ultra-Low-Voltage (ULV) Processors

Processor Number SU9600 SU9400 SU9300 Core Frequency & Voltage 1.4 GHz & HFM VCC 1.4 GHz & HFM VCC 1.2GHz & HFM VCC 1.2 GHz & Super LFM VCC 0.8 GHz & Super LFM VCC Thermal Design Power 10 10 10 10 8 Min Typ Max 2.9 1.6 2.5 1.4 W 2, 5, 7 Unit W Notes 2, 5, 7 W 1, 4, 5, 6 Unit Notes

TDP

Symbol PAH, PSGNT at VCCHFM at VCCSLFM Sleep Power PSLP at VCCHFM at VCCSLFM Deep Sleep Power PDSLP PDPRSLP PDC4 PC6 TJ at VCCHFM at VCCSLFM Deeper Sleep Power

Parameter Auto Halt, Stop Grant Power

1.3 0.9 0.6 0.4 0.25 105

W W W W C

2, 5, 8 2, 8 2, 8 2, 8 3, 4

Intel Enhanced Deeper Sleep state Power Intel Deep Power Down Power Junction Temperature

NOTES: 1. The TDP specification should be used to design the processor thermal solution. The TDP is not the maximum theoretical power the processor can generate. 2. Not 100% tested. These power specifications are determined by characterization of the processor currents at higher temperatures and extrapolating the values for the temperature indicated. 3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitors automatic mode is used to indicate that the maximum TJ has been reached. 4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within specifications. 5. Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser than TDP in HFM. 6. At Tj of 105 oC 7. At Tj of 50 C 8. At Tj of 35 oC

106

Datasheet

Thermal Specifications and Design Considerations

Table 26.
Symbol

Power Specifications for the Single-Core Ultra-Low-Voltage (5.5 W) SFF Processors

Processor Number SU3500 SU3300 Core Frequency & Voltage 1.4 GHz & HFM VCC 1.2 GHz & HFM VCC 1.2 GHz & Super LFM VCC 0.8 GHz & Super LFM VCC Parameter Auto Halt, Stop Grant Power at VCCHFM at VCCSLFM Sleep Power at VCCHFM at VCCSLFM Deep Sleep Power 2.1 1.4 1.8 1.2 0 0.7 0.6 0.4 0.3 0.2 100 W W W C 2, 8 2, 8 2, 8 3, 4 W 2, 5, 8 W 2, 5, 7 W 2, 5, 7 Min Thermal Design Power 5.5 5.5 5.5 5 Typ Max Unit Notes W 1, 4, 5, 6 Unit Notes

TDP

Symbol PAH, PSGNT

PSLP

PDSLP PDPRSLP PDC4 PC6 TJ

at VCCHFM at VCCSLFM Deeper Sleep Power Intel Enhanced Deeper Sleep state Power Intel Deep Power Down Power Junction Temperature

NOTES: 1. The TDP specification should be used to design the processor thermal solution. The TDP is not the maximum theoretical power the processor can generate. 2. Not 100% tested. These power specifications are determined by characterization of the processor currents at higher temperatures and extrapolating the values for the temperature indicated. 3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitors automatic mode is used to indicate that the maximum TJ has been reached. 4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within specifications. 5. Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser than TDP in HFM. 6. At Tj of 100 oC 7. At Tj of 50 C 8. At Tj of 35 C

Datasheet 107

Thermal Specifications and Design Considerations

5.1

Monitoring Die Temperature

The processor incorporates three methods of monitoring die temperature: Thermal Diode Intel Thermal Monitor Digital Thermal Sensor

5.1.1

Thermal Diode
Intels processors utilize an SMBus thermal sensor to read back the voltage/current characteristics of a substrate PNP transistor. Since these characteristics are a function of temperature, these parameters can be used to calculate silicon temperature values. For older silicon process technologies, it is possible to simplify the voltage/current and temperature relationships by treating the substrate transistor as though it were a simple diffusion diode. In this case, the assumption is that the beta of the transistor does not impact the calculated temperature values. The resultant diode model essentially predicts a quasi linear relationship between the base/emitter voltage differential of the PNP transistor and the applied temperature (one of the proportionality constants in this relationship is processor specific, and is known as the diode ideality factor). Realization of this relationship is accomplished with the SMBus thermal sensor that is connected to the transistor. The processor, however, is built on Intels advanced 45-nm processor technology. Due to this new processor technology, it is no longer possible to model the substrate transistor as a simple diode. To accurately calculate silicon temperature use a full bipolar junction transistor-type model. In this model, the voltage/current and temperature characteristics include an additional process dependant parameter which is known as the transistor beta. System designers should be aware that the current thermal sensors may not be configured to account for beta and should work with their SMB thermal sensor vendors to ensure they have a part capable of reading the thermal diode in BJT model. Offset between the thermal diode-based temperature reading and the Intel Thermal Monitor reading may be characterized using the Intel Thermal Monitors Automatic mode activation of the thermal control circuit. This temperature offset must be considered when using the processor thermal diode to implement power management events. This offset is different than the diode Toffset value programmed into the processor Model-Specific Register (MSR). Table 27 and Table 28 provide the diode interface and transistor model specifications.

Table 27.

Thermal Diode Interface

Signal Name THERMDA THERMDC Pin/Ball Number A24 A25 Signal Description Thermal diode anode Thermal diode cathode

108

Datasheet

Thermal Specifications and Design Considerations

Table 28.

Thermal Diode Parameters Using Transistor Model

Symbol IFW IE nQ Beta RT Series Resistance Parameter Forward Bias Current Emitter Current Transistor Ideality Min 5 5 0.997 0.1 3.0 Typ 1.001 0.4 4.5 Max 200 200 1.008 0.5 7.0 Unit A A 1 1 2, 3, 4 2, 3 2 Notes

NOTES: 1. Intel does not support or recommend operation of the thermal diode under reverse bias. 2. Characterized across a temperature range of 50-105C. 3. Not 100% tested. Specified by design characterization. 4. The ideality factor, nQ, represents the deviation from ideal transistor model behavior as exemplified by the equation for the collector current: IC = IS * (e qVBE/nQkT 1) where IS = saturation current, q = electronic charge, VBE = voltage across the transistor base emitter junction (same nodes as VD), k = Boltzmann Constant, and T = absolute temperature (Kelvin).

5.1.2

Intel Thermal Monitor

The Intel Thermal Monitor helps control the processor temperature by activating the TCC (Thermal Control Circuit) when the processor silicon reaches its maximum operating temperature. The temperature at which the Intel Thermal Monitor activates the TCC is not user configurable. Bus traffic is snooped in the normal manner and interrupt requests are latched (and serviced during the time that the clocks are on) while the TCC is active. With a properly designed and characterized thermal solution, the TCC would only be activated for very short periods of time when running the most power-intensive applications. The processor performance impact due to these brief periods of TCC activation is expected to be minor and hence not detectable. An under-designed thermal solution that is not able to prevent excessive activation of the TCC in the anticipated ambient environment may cause a noticeable performance loss and may affect the long-term reliability of the processor. In addition, a thermal solution that is significantly under designed may not be capable of cooling the processor even when the TCC is active continuously. The Intel Thermal Monitor controls the processor temperature by modulating (starting and stopping) the processor core clocks or by initiating an Enhanced Intel SpeedStep Technology transition when the processor silicon reaches its maximum operating temperature. The Intel Thermal Monitor uses two modes to activate the TCC: automatic mode and on-demand mode. If both modes are activated, automatic mode takes precedence. There are two automatic modes called Intel Thermal Monitor 1 (TM1) and Intel Thermal Monitor 2 (TM2). These modes are selected by writing values to the MSRs of the processor. After automatic mode is enabled, the TCC will activate only when the internal die temperature reaches the maximum allowed value for operation. When TM1 is enabled and a high temperature situation exists, the clocks will be modulated by alternately turning the clocks off and on at a 50% duty cycle. Cycle times are processor speed-dependent and will decrease linearly as processor core frequencies increase. Once the temperature has returned to a non-critical level, modulation ceases and TCC goes inactive. A small amount of hysteresis has been included to prevent rapid

Datasheet 109

Thermal Specifications and Design Considerations

active/inactive transitions of the TCC when the processor temperature is near the trip point. The duty cycle is factory configured and cannot be modified. Also, automatic mode does not require any additional hardware, software drivers, or interrupt handling routines. Processor performance will be decreased by the same amount as the duty cycle when the TCC is active. When TM2 is enabled and a high temperature situation exists, the processor will perform an Enhanced Intel SpeedStep Technology transition to the LFM. When the processor temperature drops below the critical level, the processor will make an Enhanced Intel SpeedStep Technology transition to the last requested operating point. The processor also supports Enhanced Multi-Threaded Thermal Monitoring (EMTTM). EMTTM is a processor feature that enhances TM2 with a processor throttling algorithm known as Adaptive TM2. Adaptive TM2 transitions to intermediate operating points, rather than directly to the LFM, once the processor has reached its thermal limit and subsequently searches for the highest possible operating point. Please ensure this feature is enabled and supported in the BIOS. Also with EMTTM enabled, the operating system can request the processor to throttling to any point between Intel Dynamic Acceleration Technology frequency and SuperLFM frequency as long as these features are enabled in the BIOS and supported by the processor. The Intel Thermal Monitor automatic mode and Enhanced Multi-Threaded Thermal Monitoring must be enabled through BIOS for the processor to be operating within specifications. Intel recommends TM1 and TM2 be enabled on the processors. TM1, TM2 and EMTTM features are collectively referred to as Adaptive Thermal Monitoring features. TM1 and TM2 can co-exist within the processor. If both TM1 and TM2 bits are enabled in the auto-throttle MSR, TM2 takes precedence over TM1. However, if Force TM1 over TM2 is enabled in MSRs via BIOS and TM2 is not sufficient to cool the processor below the maximum operating temperature, then TM1 will also activate to help cool down the processor. If a processor load-based Enhanced Intel SpeedStep Technology transition (through MSR write) is initiated when a TM2 period is active, there are two possible results: 1. If the processor load-based Enhanced Intel SpeedStep Technology transition target frequency is higher than the TM2 transition-based target frequency, the processor load-based transition will be deferred until the TM2 event has been completed. 2. If the processor load-based Enhanced Intel SpeedStep Technology transition target frequency is lower than the TM2 transition-based target frequency, the processor will transition to the processor load-based Enhanced Intel SpeedStep Technology target frequency point. The TCC may also be activated via on-demand mode. If bit 4 of the ACPI Intel Thermal Monitor control register is written to a 1, the TCC will be activated immediately independent of the processor temperature. When using on-demand mode to activate the TCC, the duty cycle of the clock modulation is programmable via bits 3:1 of the same ACPI Intel Thermal Monitor control register. In automatic mode, the duty cycle is fixed at 50% on, 50% off, however in on-demand mode, the duty cycle can be programmed from 12.5% on/ 87.5% off, to 87.5% on/12.5% off in 12.5% increments. On-demand mode may be used at the same time automatic mode is enabled, however, if the system tries to enable the TCC via on-demand mode at the same time automatic mode is enabled and a high temperature condition exists, automatic mode will take precedence. An external signal, PROCHOT# (processor hot) is asserted when the processor detects that its temperature is above the thermal trip point. Bus snooping and interrupt latching are also active while the TCC is active.

110

Datasheet

Thermal Specifications and Design Considerations

Besides the thermal sensor and thermal control circuit, the Intel Thermal Monitor also includes one ACPI register, one performance counter register, three MSR, and one I/O pin (PROCHOT#). All are available to monitor and control the state of the Intel Thermal Monitor feature. The Intel Thermal Monitor can be configured to generate an interrupt upon the assertion or deassertion of PROCHOT#. PROCHOT# will not be asserted when the processor is in the Stop Grant, Sleep, Deep Sleep, and Deeper Sleep low-power states, hence the thermal diode reading must be used as a safeguard to maintain the processor junction temperature within maximum specification. If the platform thermal solution is not able to maintain the processor junction temperature within the maximum specification, the system must initiate an orderly shutdown to prevent damage. If the processor enters one of the above low-power states with PROCHOT# already asserted, PROCHOT# will remain asserted until the processor exits the low-power state and the processor junction temperature drops below the thermal trip point. However, PROCHOT# will de-assert for the duration of Deep Power Down Technology state (C6) residency. If Thermal Monitor automatic mode is disabled, the processor will be operating out of specification. Regardless of enabling the automatic or on-demand modes, in the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached a temperature of approximately 125 C. At this point the THERMTRIP# signal will go active. THERMTRIP# activation is independent of processor activity and does not generate any bus cycles. When THERMTRIP# is asserted, the processor core voltage must be shut down within the time specified in Chapter 3. In all cases the Intel Thermal Monitor feature must be enabled for the processor to remain within specification.

5.1.3

Digital Thermal Sensor

The processor also contains an on-die Digital Thermal Sensor (DTS) that can be read via an MSR (no I/O interface). Each core of the processor will have a unique digital thermal sensor whose temperature is accessible via the processor MSRs. The DTS is the preferred method of reading the processor die temperature since it can be located much closer to the hottest portions of the die and can thus more accurately track the die temperature and potential activation of processor core clock modulation via the Thermal Monitor. The DTS is only valid while the processor is in the normal operating state (the Normal package level low-power state). Unlike traditional thermal devices, the DTS outputs a temperature relative to the maximum supported operating temperature of the processor (TJ,max). It is the responsibility of software to convert the relative temperature to an absolute temperature. The temperature returned by the DTS will always be at or below TJ,max. Catastrophic temperature conditions are detectable via an Out Of Specification status bit. This bit is also part of the DTS MSR. When this bit is set, the processor is operating out of specification and immediate shutdown of the system should occur. The processor operation and code execution is not ensured once the activation of the Out of Specification status bit is set. The DTS-relative temperature readout corresponds to the Thermal Monitor (TM1/TM2) trigger point. When the DTS indicates maximum processor core temperature has been reached, the TM1 or TM2 hardware thermal control mechanism will activate. The DTS and TM1/TM2 temperature may not correspond to the thermal diode reading since the thermal diode is located in a separate portion of the die and thermal gradient between the individual core DTS. Additionally, the thermal gradient from DTS to thermal diode can vary substantially due to changes in processor power, mechanical and thermal attach, and software application. The system designer is required to use the DTS to ensure proper operation of the processor within its temperature operating specifications.

Datasheet 111

Thermal Specifications and Design Considerations

Changes to the temperature can be detected via two programmable thresholds located in the processor MSRs. These thresholds have the capability of generating interrupts via the core's local APIC. Refer to the Intel 64 and IA-32 Architectures Software Developer's Manuals for specific register and programming details.

5.2

Out of Specification Detection

Overheat detection is performed by monitoring the processor temperature and temperature gradient. This feature is intended for graceful shutdown before the THERMTRIP# is activated. If the processors TM1 or TM2 are triggered and the temperature remains high, an Out Of Spec status and sticky bit are latched in the status MSR register and generates a thermal interrupt.

5.3

PROCHOT# Signal Pin

An external signal, PROCHOT# (processor hot), is asserted when the processor die temperature has reached its maximum operating temperature. If TM1 or TM2 is enabled, then the TCC will be active when PROCHOT# is asserted. The processor can be configured to generate an interrupt upon the assertion or deassertion of PROCHOT#. Refer to the an interrupt upon the assertion or deassertion of PROCHOT#. Refer to the Intel 64 and IA-32 Architectures Software Developer's Manuals for specific register and programming details. The processor implements a bi-directional PROCHOT# capability to allow system designs to protect various components from overheating situations. The PROCHOT# signal is bi-directional in that it can either signal when the processor has reached its maximum operating temperature or be driven from an external source to activate the TCC. The ability to activate the TCC via PROCHOT# can provide a means for thermal protection of system components. Only a single PROCHOT# pin exists at a package level of the processor. When either core's thermal sensor trips, PROCHOT# signal will be driven by the processor package. If only TM1 is enabled, PROCHOT# will be asserted regardless of which core is above its TCC temperature trip point, and both cores will have their core clocks modulated. If TM2 is enabled then, regardless of which core(s) are above the TCC temperature trip point, both cores will enter the lowest programmed TM2 performance state. It is important to note that Intel recommends both TM1 and TM2 to be enabled. When PROCHOT# is driven by an external agent, if only TM1 is enabled on both cores, then both processor cores will have their core clocks modulated. If TM2 is enabled on both cores, then both processor cores will enter the lowest programmed TM2 performance state. It should be noted that Force TM1 on TM2, enabled via BIOS, does not have any effect on external PROCHOT#. If PROCHOT# is driven by an external agent when TM1, TM2, and Force TM1 on TM2 are all enabled, then the processor will still apply only TM2. PROCHOT# may be used for thermal protection of voltage regulators (VR). System designers can create a circuit to monitor the VR temperature and activate the TCC when the temperature limit of the VR is reached. By asserting PROCHOT# (pulled-low) and activating the TCC, the VR will cool down as a result of reduced processor power consumption. Bi-directional PROCHOT# can allow VR thermal designs to target maximum sustained current instead of maximum current. Systems should still provide proper cooling for the VR and rely on bi-directional PROCHOT# only as a backup in case of system cooling failure. The system thermal design should allow the power delivery circuitry to operate within its temperature specification even while the processor is operating at its TDP. With a properly designed and characterized thermal solution, it is anticipated that bi-directional PROCHOT# would only be asserted for very short periods

112

Datasheet

Thermal Specifications and Design Considerations

of time when running the most power-intensive applications. An under-designed thermal solution that is not able to prevent excessive assertion of PROCHOT# in the anticipated ambient environment may cause a noticeable performance loss.

Datasheet 113