XC8102 Series

Load Switch with Low On-Resistance (Current Limit 400mA)

ETR2502-008

GENERAL DESCRIPTION
The XC8102 series is a low ON resistance load switch IC with ON/OFF control and output current protection which integrates a P-channel MOSFET. By connecting the XC8102 to the output pin of a step-down DC/DC converter, the CE pin controls ON/OFF for each distribution switch to deliver power per requirements and maximize total power efficiency. As a result, the XC8102 helps to extend battery life and product operation time. The series contains a current limit and protection circuit so these are not required externally unlike discrete circuit solutions where MOSFETs and resistors are used. When a low signal is input to the CE pin, the series enters stand-by mode. Even where a load capacitor is connected to the output pin during stand-by, the electric charge stored at the load capacitor is discharged through the internal switch. As a result, the VOUT pin voltage falls quickly to the VSS level. The series contains over current protection with fold-back current circuitry which operates as over current protection and short circuit protection for the output pin.

APPLICATIONS
Mobile phones, Smart phones Digital still cameras, Digital video cameras Portable game consoles Portable equipment

FEATURES
On Resistance : 0.28@ VIN=6.0V (TYP.) 0.31@ VIN=4.0V (TYP.) 0.35@ VIN=2.9V (TYP.) 0.52@ VIN=1.8V (TYP.) 0.60@ VIN=1.5V (TYP.) 0.80@ VIN=1.2V (TYP.) Input Voltage Range : 1.2V6.0V Power Consumption : 3.0A@ VIN=1.2V 3.6A@ VIN=2.9V 4.0A@ VIN=6.0V Stand-by Current : 0.1A Protection Circuit : Current limit(Output Current) 400mA (1.8VIN6.0V) Short-circuit Protection, Short current= 30mA (TYP.) ON/OFF Function : Active High Enable High-Speed Discharge Function Operating Ambient Temperature : -40+85 Packages : USP-4,SSOT-24, SOT-25 USPN-4 Environmentally Friendly : EU RoHS Compliant, Pb Free

TYPICAL APPLICATION CIRCUIT

VIN VOUT
DC/DC OUT 2.1V

TYPICAL PERFORMANCE CHARACTERISTICS

On Resistance vs. Input Voltage
XC8102AA01M/XC8102AA01G VIN=CE IOUT=50mA CIN=None,CL=None 1.0

VIN CE
CIN ON/OFF Control

VOUT

IN

Step Down
Li-ion 3.6V

XC8102
VSS
CL

CPU

DC/DC XC9235

XC8102
CE
CIN ON/OFF Control

CPU

ON Resistance : RON (

VIN

VOUT VSS
CL

IN

0.8 0.6 0.4 0.2 0.0

Ta=85 25 -40

VIN CE
CIN ON/OFF Control

VOUT

IN

XC8102
VSS
CL

CPU

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

Input Voltage : VIN (V)

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XC8102 Series
PIN CONFIGURATION

*The heat dissipation pad of the USP-4 package is recommended to solder as shown in the recommended mount pattern and metal mask pattern for mounting strength. The heat dissipation pad should be electrically opened or connected to the VSS (No. 2) pin.

PIN ASSIGNMENT
PIN NUMBER USP-4 4 1 2 3 SOT-25 1 5 2 3 4 SSOT-24 4 3 2 1 USPN-4 4 1 2 3 PIN NAME VIN VOUT VSS CE NC FUNCTIONS Power Input Output Ground ON/OFF Control No Connection

PRODUCT CLASSIFICATION
Ordering Information

XC8102-(*1)
DESIGNATOR ITEM CE pin logic CL Discharge Function Internal Standard Number SYMBOL A A 01 GR-G -(
*1)

DESCRIPTION CE High active Output capacitor (CL) auto-discharge function integrated Fixed USP-4 (3,000/Reel) SOT-25 (3,000/Reel) SSOT-24 (3,000/Reel) USPN-4 (5,000/Reel)

Packages (Order Unit)

MR-G NR-G 7R-G

(*1)

The -G suffix denotes Halogen and Antimony free as well as being fully RoHS compliant.

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XC8102
Series

FUNCTION CHART
SERIES CE H L OPEN IC OPERATIONAL STATUS ON/OFF ON OFF Undefined state H = High Level L = Low Level

XC8102AA01

* CE pin should not be left open.

BLOCK DIAGRAM
VIN VOUT

GATE CONTROL

Current Limit Rdischg

CE

ON/OFF Control

each circuit

CE/

VSS

XC8102AA Series XC8102AA

* Diodes inside the circuit are an ESD protection diode and a parasitic diode.

ABSOLUTE MAXIMUM RATINGS

PARAMETER Input Voltage Output Current Output Voltage CE Input Voltage USP-4 SSOT-24 Power Dissipation SOT-25 USPN-4 Operating Ambient Temperature Storage Temperature
(*1)

SYMBOL VIN IOUT VOUT VCE Pd

Topr Tstg

RATINGS -0.3+6.5 850(*1) 750(USPN-4)(*1) -0.3VIN -0.3+6.5 120 150 250 100 -40+85 -55+125

UNITS V mA V V mW
o o

C C

Please make sure that IOUT is less than Pd/ (VIN-VOUT)

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XC8102 Series
ELECTRICAL CHARACTERISTICS
XC8102 Series
PARAMETER Input Voltage SYMBOL VIN VIN =6.0V, VCE=VIN VIN =4.0V, VCE=VIN On Resistance (SSOT-24/USPN-4) RON VIN =2.9V, VCE=VIN VIN =1.8V, VCE=VIN VIN =1.5V, VCE=VIN VIN =1.2V, VCE=VIN VIN =6.0V, VCE=VIN VIN =4.0V, VCE=VIN On Resistance (SOT-25/USP-4) RON VIN =2.9V, VCE=VIN VIN =1.8V, VCE=VIN VIN =1.5V, VCE=VIN VIN =1.2V, VCE=VIN VIN =6.0V, VCE=VIN, VOUT=OPEN VIN =4.0V, VCE=VIN, VOUT=OPEN Supply Current IDD VIN =2.9V, VCE=VIN, VOUT=OPEN VIN =1.8V, VCE=VIN, VOUT=OPEN VIN =1.5V, VCE=VIN, VOUT=OPEN VIN =1.2V, VCE=VIN, VOUT=OPEN Stand-by Current Switch Leakage Current ISTBY ILEAK VIN =6.0V, VCE=VSS, VOUT=OPEN VIN =6.0V, VCE=VSS, VOUT=0V VIN2.9V, VOUT = VIN -0.8V Current Limit ILIM 1.8VVIN2.9V, VOUT = VIN -0.6V 1.5VVIN1.8V, VOUT =1.2V 1.2VVIN1.5V, VOUT =1.0V Short Circuit Current CE High Level Voltage CE Low Level Voltage CE High Level Current CE Low Level Current CL Auto-Discharge Resistance Turn On Time Turn Off Time NOTE: *1: Time to reach 90% of VOUT after VCE entering the VCEH threshold. *2: Time to fall to 10% of VOUT after VCE entering the VCEL threshold.
(*1) (*2)

Ta=25 CONDITIONS MIN. 1.2 400 400 200 90 1.1 VCE=VIN VCE=VSS VIN=4.0V, VOUT=4.0V, VCE=VSS VIN =4.0V, VCE=0.3V1.2V, RL=80, without CIN, CL VIN =4.0V, VCE=1.2V0.3V, RL=80, without CIN, CL -0.1 -0.1 380 TYP. 0.28 0.31 0.35 0.52 0.60 0.80 0.35 0.38 0.43 0.59 0.67 0.87 4.0 3.8 3.6 3.4 3.2 3.0 0.01 0.01 480 480 30 480 8.5 3.0 MAX. 6.0 0.425 0.475 0.475 0.625 0.80 1.60 0.475 0.525 0.525 0.675 0.85 1.65 7.0 6.5 6.3 5.7 5.5 4.9 0.10 0.10 75 6.0 0.3 0.1 0.1 570 18 7.5 mA V V A A s s mA A A A UNITS V CIRCUITS -

ISHORT VCEH VCEL ICEH ICEL RDCHG tDLY(ON) tDLY(OFF)

VCE=VIN, VOUT=0V

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XC8102
Series

TEST CIRCUITS
Circuit

VIN

VOUT

A IOUT Ishort

CE VSS

Circuit

Circuit

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XC8102 Series
TEST CIRCUITS (Continued)
Circuit

Circuit
The measurement point of wave form The measurement point of wave form

RL

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XC8102
Series

OPERATIONAL EXPLANATION
<CE Pin> The XC8102 enables an output P-channel MOSFET switch and the IC internal circuitry to turn off by the signal to the CE pin. In the shutdown mode, the VOUT pin will be pulled down to the VSS by the CL auto-discharge function. The output voltage becomes unstable when the CE pin is opened. If the input voltage to the CE pin is within the specified threshold voltages, the logic is fixed and the XC8102 will operate normally. However, supply current may increase as a result of the shoot-through current of internal circuitry when the medium level voltage is input to the CE pin.

Input/Output Capacitor The XC8102 works well without an input and output capacitors. Also, an output capacitor of the power source can be used as an input capacitor of the XC8102 and a bypass capacitor of the driving IC can be used as an output capacitor of the XC8102.

<CL Auto-Discharge Function> The XC8102AA contains a CL auto-discharge resistor and an N-channel transistor between the VOUT pin and the VSS pin. The device quickly discharge the electric charge in the output capacitor (CL) when a low signal to the CE pin is input to turn off a whole IC circuit. The CL auto-discharge resistance is set at 480 (VOUT=4.0V TYP. @ VIN=4.0). Discharge time of the output capacitor (CL) is determined by a CL auto-discharge resistor value (Rdischg) and an output capacitor value. Time constant is defined as ( = C x Rdischg). Output voltage after starting discharge can be calculated by the following formula. V = VOUT x e t/, or t=In (VOUT / V)

V: Output voltage after starting discharge, VOUT: Output voltage, t : Discharge time, : Output discharge resistor value RdischgOutput capacitor (CL) value C

<Current Limiter, Short-Circuit Protection> The XC8102 series contains a constant current limiter and fold-back current circuitry. The constant current limiter operates to limit output current and the fold-back current circuitry operates as short circuit protection for the output pin. When the load current reaches the limit current, the constant current limiter operates and the output voltage drops. The output voltage further, then the fold-back current circuitry operates to decrease the output current. When the output pin is short-circuited to the ground, the output current drops and maintains a flow about 30mA.

NOTES ON USE
1. 2. 3. 4. 5. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. The X8102 goes into an undefined operation when the CE pin is left open. The CE pin shall be tied to low or high level. VOUT pin voltage should not be applied beyond the VIN pin voltage. The IC may get damage due to the reverse current toward the VIN pin. The XC8102 has constant current start-up. Please keep the start-up sequence to draw load current after raising the output voltage. Current limit function is integrated. However, power dissipation may be beyond the limit before starting a fold-back current protection when used in high temperature. For the power dissipation of each package, please refer to the graphs of Package Power vs. Operating Temperature in page 15 to 18. Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems.

6.

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XC8102 Series
TYPICAL PERFORMANCE CHARACTERISTICS
(1) ON Resistance vs. Input Voltage
XC8102AA01N/XC8102AA017 VIN=CE IOUT=50mA CIN=None,CL=None 1.0 ON Resistance : RON ( 0.8 0.6 0.4 0.2 0.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Input Voltage : VIN (V) ON Resistance : RON ( Ta=85 25 -40 1.0 0.8 0.6 0.4 0.2 0.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Input Voltage : VIN (V) Ta=85 25 -40 XC8102AA01M/XC8102AA01G VIN=CE IOUT=50mA CIN=None,CL=None

(2) ON Resistance vs. Ambient Temperature

XC8102AA01M/XC8102AA01G VIN=CE IOUT=50mA CIN=None,CL=None 1.0 ON Resistance : RON ( 0.8 0.6 0.4 0.2 6.0V 0.0 -50 -25 0 25 50 75 100 Ambient Temp : Ta ( ) 4.0V 2.9V ON Resistance : RON ( VIN=1.2V 1.5V 1.0 VIN=1.2V 0.8 0.6 0.4 0.2 6.0V 0.0 -50 -25 0 25 50 75 100 Ambient Temp : Ta () 4.0V 1.5V 1.8V XC8102AA01N/XC8102AA017 VIN=CE IOUT=50mA CIN=None,CL=None

1.8V

2.9V

(3) Supply Current vs. Input Voltage

(4) Supply Current vs. Ambient Temperature

XC8102AA01 VIN=CE CIN=None,CL=None 5.0 Supply Current : IDD (uA) 4.0 3.0 2.0 1.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Input Voltage : VIN (V) Ta=85 25 -40
Supply Current : IDD (uA) 5.0 4.0 3.0 2.0 1.0 0.0 -50 -25 0

XC8102AA01 VIN=CE CIN=None,CL=None

VIN=1.2V 1.5V 1.8V 2.9V 4.0V 6.0V 25 50 75 100

Ambient Temp : Ta ( )

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XC8102
Series

TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(5) Output Voltage vs. Output Current
XC8102AA01M/XC8102AA01G VIN=CE=1.2V CIN=None,CL=None 5.0 Output Voltage : VOUT (V) Output Voltage : VOUT (V) 4.0 3.0 2.0 1.0 0.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Ta=85 25 -40 5.0 4.0 3.0 2.0 1.0 0.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Ta=85 25 -40 XC8102AA01M/XC8102AA01G VIN=CE=1.5V CIN=None,CL=None

XC8102AA01M/XC8102AA01G VIN=CE=1.8V CIN=None,CL=None 5.0 Output Voltage : VOUT (V) 4.0 3.0 2.0 1.0 0.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) Ta=85 25 -40 5.0 4.0 3.0 2.0 1.0 0.0 0 100

XC8102AA01M/XC8102AA01G VIN=CE=2.9V CIN=None,CL=None

Ta=85 25 -40

200

300

400

500

600

Output Current : IOUT (mA)

XC8102AA01M/XC8102AA01G VIN=CE=4.0V CIN=None,CL=None 10.0 8.0 6.0 4.0 2.0 0.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) Output Voltage : VOUT (V) Ta=85 25 -40 10.0 8.0 6.0 4.0 2.0 0.0 0 100

XC8102AA01M/XC8102AA01G VIN=CE=6.0V CIN=None,CL=None

Ta=85 25 -40

200

300

400

500

600

Output Current : IOUT (mA)

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XC8102 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(5) Output Voltage vs. Output Current
XC8102AA01N/XC8102AA017 VIN=CE=1.2V CIN=None,CL=None 5.0 Output Voltage : VOUT (V) Output Voltage : VOUT (V) 4.0 3.0 2.0 1.0 0.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Ta=85 25 -40 5.0 4.0 3.0 2.0 1.0 0.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Ta=85 25 -40 XC8102AA01N/XC8102AA017 VIN=CE=1.5V CIN=None,CL=None

XC8102AA01N/XC8102AA017 VIN=CE=1.8V CIN=None,CL=None 5.0 Output Voltage : VOUT (V) 4.0 3.0 2.0 1.0 0.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) Ta=85 25 -40 5.0 4.0 3.0 2.0 1.0 0.0 0 100

XC8102AA01N/XC8102AA017 VIN=CE=2.9V CIN=None,CL=None

Ta=85 25 -40

200

300

400

500

600

Output Current : IOUT (mA)

XC8102AA01N/XC8102AA017 VIN=CE=4.0V CIN=None,CL=None 10.0 8.0 6.0 4.0 2.0 0.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) Output Voltage : VOUT (V) Ta=85 25 -40 10.0 8.0 6.0 4.0 2.0 0.0 0 100

XC8102AA01N/XC8102AA017 VIN=CE=6.0V CIN=None,CL=None

Ta=85 25 -40

200

300

400

500

600

Output Current : IOUT (mA)

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XC8102
Series

TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(6) CE Threshold Voltage vs. Ambient Temperature (7) CL Discharge Resistance vs. Ambient Temperature
XC8102AA01 VIN=6.0V CIN=None,CL=None 1.0 CE High Level Voltage : VCEH (V) 0.9 VCEH 0.8 0.7 0.6 0.5 0.4 -50 -25 0 25 50 75 100 Ambient Temp : Ta () VCEL Discharge Resistance : Rdischg () 3000 2500 2000 1500 1000 500 VIN=4.0V 0 -50 -25 0 25 50 75 100 Ambient Temp : Ta () VIN=6.0V VIN=1.5V VIN=1.2V VIN=2.9V XC8102AA01 VIN=VOUT CE=VSS CIN=None,CL=None

VIN=1.8V

(8) Output Turn-on Time with CE

XC8102AA01 VIN=1.2V CE=0.3V 1.2V tr=tf=5s , IOUT=50mA CIN=None , CL=None

XC8102AA01 VIN=1.5V CE=0.3V 1.2V tr=tf=5s , IOUT=50mA CIN=None , CL=None

1.5 CE Input Voltage: VCE (V) 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10s/div

6.0 Output Voltage :VOUT (V) CE Input Voltage: VCE (V) 5.0

1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10s/div

6.0 Output Voltage :VOUT (V) Output Voltage :VOUT (V) 5.0

CE Input Voltage

4.0 3.0

CE Input Voltage

4.0 3.0

Output Voltage

2.0 1.0 0.0 -1.0

Output Voltage

2.0 1.0 0.0 -1.0

XC8102AA01 VIN=1.8V CE=0.3V 1.2V tr=tf=5s , IOUT=50mA CIN=None , CL=None

XC8102AA01 VIN=2.9V CE=0.3V 1.2V tr=tf=5s , IOUT=50mA CIN=None , CL=None

1.5 CE Input Voltage: VCE (V) 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10s/div

6.0 Output Voltage :VOUT (V) CE Input Voltage: VCE (V) 5.0

1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10s/div

6.0 5.0

CE Input Voltage

4.0 3.0 2.0 1.0

CE Input Voltage

4.0 3.0 2.0 1.0

Output Voltage

0.0 -1.0

Output Voltage

0.0 -1.0

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XC8102 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) Output Turn-on Time with CE (Continued)
XC8102AA01 VIN=4.0V CE=0.3V 1.2V tr=tf=5s , IOUT=50mA CIN=None , CL=None XC8102AA01 VIN=6.0V CE=0.3V 1.2V tr=tf=5s , IOUT=50mA CIN=None , CL=None

1.5 CE Input Voltage: VCE (V) 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10s/div

12.0 Output Voltage :VOUT (V) CE Input Voltage: VCE (V) 10.0

1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10s/div

12.0 Output Voltage :VOUT (V) Output Voltage :VOUT (V) Output Voltage :VOUT (V) 10.0

CE Input Voltage

8.0 6.0 4.0 2.0

CE Input Voltage

8.0 6.0 4.0

Output Voltage

2.0 0.0 -2.0

Output Voltage

0.0 -2.0

(9) Output Turn-off Time with CE

XC8102AA01 VIN=1.2V CE=1.2V 0.3V tr=tf=5s , IOUT=50mA CIN=None , CL=None

XC8102AA01 VIN=1.5V CE=1.2V 0.3V tr=tf=5s , IOUT=50mA CIN=None , CL=None

1.5 CE Input Voltage: VCE (V) 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10s/div

6.0 Output Voltage :VOUT (V) CE Input Voltage: VCE (V) 5.0

1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10s/div

6.0 5.0

CE Input Voltage

4.0 3.0

CE Input Voltage

4.0 3.0

Output Voltage

2.0 1.0 0.0 -1.0

Output Voltage

2.0 1.0 0.0 -1.0

XC8102AA01 VIN=1.8V CE=1.2V 0.3V tr=tf=5s , IOUT=50mA CIN=None , CL=None

XC8102AA01 VIN=2.9V CE=1.2V 0.3V tr=tf=5s , IOUT=50mA CIN=None , CL=None CE Input Voltage

1.5 CE Input Voltage: VCE (V) 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10s/div

6.0 Output Voltage :VOUT (V) CE Input Voltage: VCE (V) 5.0

1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 5s/div

6.0 5.0 4.0 3.0 2.0

CE Input Voltage

4.0 3.0

Output Voltage

2.0 1.0 0.0 -1.0

Output Voltage

1.0 0.0 -1.0

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XC8102
Series

TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(9) Output Turn-off Time with CE (Continued)
XC8102AA01 VIN=4.0V CE=1.2V 0.3V tr=tf=5s , IOUT=50mA CIN=None , CL=None CE Input Voltage XC8102AA01 VIN=6.0V CE=1.2V 0.3V tr=tf=5s , IOUT=50mA CIN=None , CL=None CE Input Voltage

1.5 CE Input Voltage: VCE (V) 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 5s/div

12.0 Output Voltage :VOUT (V) CE Input Voltage: VCE (V) 10.0 8.0 6.0 4.0

1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 5s/div

12.0 Output Voltage :VOUT (V) 10.0 8.0 6.0 4.0

Output Voltage

2.0 0.0 -2.0

Output Voltage

2.0 0.0 -2.0

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XC8102 Series
PACKAGING INFORMATION
SOT-25 SSOT-24

Unit : mm

Unit : mm

USP-4

USPN-4

Unit : mm

Unit : mm

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XC8102
Series

PACKAGING INFORMATION (Continued)

SOT-25 Power Dissipation Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition.

1.

Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used) Material:Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter

2. Power Dissipation vs. Ambient Temperature

Evaluation Board (Unit: mm) mm

Board Mount (Tj max = 125)

Ambient Temperature 25 85

Power Dissipation PdmW 600 240

Thermal Resistance (/W) 166.67

Pd-Ta Pd vs. Ta 700 600 500 400 300 200 100 0 25 45 65 85 105 125
Ambient Temperature Ta () Ta Power Dissipation Pd (mW)

PdmW

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XC8102 Series
PACKAGING INFORMATION (Continued)
SSOT-24 Power Dissipation Power dissipation data for the SSOT-24 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition.

40.0
1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter

28.9

28.9

2.54

1.4

Evaluation Board (Unit: mm)

2. Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125)

Ambient Temperature 25 85

Power Dissipation PdmW 500 200

Thermal Resistance (/W) 200.00

Pd-Ta Ta Pd vs. 600

Power Dissipation Pd (mW) PdmW

500 400 300 200 100 0 25 45 65 85 AmbientTa Temperature Ta () 105 125

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2.5

40.0

XC8102
Series

PACKAGING INFORMATION (Continued)

USP-4 Power Dissipation Power dissipation data for the USP-4 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition.

1.

Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter

28.9

2. Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125)

Evaluation Board (Unit: mm)

Ambient Temperature 25 85

Power Dissipation PdmW 1000 400

Thermal Resistance (/W) 100.00

Pd vs Ta 1200
Power Dissipation Pd (mW)

1000 800 600 400 200 0 25 45 65 85 Ambient Temperature Ta 105 125

2.5

40.0

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XC8102 Series
PACKAGING INFORMATION (Continued)
USPN-4 Power Dissipation Power dissipation data for the USPN-4 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition.

40.0 2.5
1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter

28.9

2. Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125)

Evaluation Board (Unit: mm)

Ambient Temperature 25 85

Power Dissipation PdmW 640 240

Thermal Resistance (/W) 166.67

Pd-Ta Pd vs Ta 700 600 500 400 300 200 100 0 25 45 65 85 Ta Ambient Temperature Ta() 105 125

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Power Dissipation Pd (mW) PdmW

XC8102
Series

MARKING RULE
SOT-25USP-4 represents product series MARK C PRODUCT SERIES XC8102******
USP-4 (TOP VIEW)

represents CE pin logic MARK F PRODUCT SERIES XC8102A*****

SOT-25 (TOP VIEW)

represents CL Discharge Function MARK C PRODUCT SERIES XC8102*A****

represents production lot number 01, ,09, 0A, ,0Z, 11,,9Z, A1, , A9, AA, , Z9, ZA,,ZZ repeated. (G, I, J, O, Q, W excluded) *No character inversion used.

SSOT-24USPN-4 represents product series MARK C PRODUCT SERIES XC8102******

represents CE pin logic and CL Discharge Function MARK 5 PRODUCT SERIES XC8102AA****
SSOT-24 (TOP VIEW)

USPN-4 (TOP VIEW)

represents production lot number 01, ,09, 0A, ,0Z, 11,,9Z, A1, , A9, AA, , Z9, ZA,,ZZ repeated. (G, I, J, O, Q, W excluded) *No character inversion used.

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XC8102 Series

1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD.

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