S330 Technical

ZXMP S330(V1.
10)
SDH-Based Multi-Service Node Equipment
Technical Specification
Document Version R3.1
ZTE CORPORATION ZTE Plaza, Keji Road South, Hi-Tech Industrial Park, Nanshan District, Shenzhen, P. R. China 518057 Tel: (86) 755 26773000 Fax: (86) (86) 755 0755-25737515, 0755-25732914 URL: http://www.zte.com.cn
LEGAL INFORMATION Copyright 2005 ZTE CORPORATION. The contents of this document are protected by copyright laws and international treaties. Any reproduction or distribution of this document or any portion of this document, in any form by any means, without the prior written consent of ZTE CORPORATION is prohibited. Additionally, the contents of this document are protected by contractual confidentiality obligations. All company, brand and product names are trade or service marks, or registered trade or service marks, of ZTE CORPORATION or of their respective owners. This document is provided as is, and all express, implied, or statutory warranties, representations or conditions are disclaimed, including without limitation any implied warranty of merchantability, fitness for a particular purpose, title or non-infringement. ZTE CORPORATION and its licensors shall not be liable for damages resulting from the use of or reliance on the information contained herein. ZTE CORPORATION or its licensors may have current or pending intellectual property rights or applications covering the subject matter of this document. Except as expressly provided in any written license between ZTE CORPORATION and its licensee, the user of this document shall not acquire any license to the subject matter herein. The contents of this document and all policies of ZTE CORPORATION, including without limitation policies related to support or training are subject to change without notice.
Revision History
Date 2005/10/18 Product version V1.10 Document Version R3.1 Serial No. TS001R31 Description Technical Specification of ZXMP S330
Target Readers
This document is intended for any one who needs a general command of the features, applications, structure and technical specifications of ZXMP S330.
Structure of This Specification

This specification describes the system functions, hardware structure and configuration, network application and technical indices of ZXMP S330.
Chapter 1 System Functions

This chapter introduces typical functions and features of ZXMP S330, including cross-connect, service access, protection functions, system control & communication, etc.
Chapter 2 System Mechanical Structure

This chapter introduces system hardware mechanical structure and the adaptable cabinet installation of ZXMP S330.
Chapter 3 Boards And Slots

This chapter introduces the slots and boards of ZXMP S330, including names (code), applying rule and unit power consumption, etc.
Chapter 4 Application Of MSTP

This part presents basic networking characteristics and applications of MSTP service.
Chapter 5 Networking And Protection

This chapter presents protection modes (including equipment level and network level) and characteristics of ZXMP S330.
Chapter 6 Performances And Indexes

This chapter details the technical parameters, physical and networking performance of the ZXMP S330.
Chapter 7 Environment Adaptability

This chapter lists the environmental indices which ZXMP S330 can operate normally for a long term.
Chapter 8 Appendix
This chapter lists international standards to which S330 conforms and the reference abbreviations terms used in this specification.
CONTENTS
CONTENTS ............................................................................................................................... 1 CHAPTER
........................................................................................................................... 4
SYSTEM FUNCTION ................................................................................................................ 4 1.1 SYSTEM OVERVIEW ....................................................................................... 4 1.2 CROSS-CONNECTION AND EXTENSION CAPABILITIES ....................................... 4 1.3 SERVICE ACCESS CAPABILITIES ..................................................................... 4 1.4 EQUIPMENT AND NETWORK PROTECTION CAPABILITIES ................................... 5 1.5 SYNCHRONOUS TIMING PROCESSING CAPABILITIES ......................................... 5 1.6 SYSTEM CONTROL AND COMMUNICATION ....................................................... 6 1.7 OVERHEAD PROCESSING .............................................................................. 7 1.8 NETWORK MANAGEMENT CAPABILITIES .......................................................... 7 1.9 ALARM INPUT/OUTPUT .................................................................................. 8 1.10 SYSTEM POWER SUPPLY .............................................................................. 8 1.11 MAINTENANCE AND UPGRADE ...................................................................... 8 1.12 PERFECT EMC AND OPERATION SAFETY ..................................................... 8
CHAPTER
........................................................................................................................... 9
SYSTEM MECHANICAL STRUCTURE ................................................................................... 9 2.1 APPEARANCE OF SUB-RACK ........................................................................... 9 2.2 CABINET STRUCTURE .................................................................................... 9 2.3 SUB-RACK STRUCTURE ............................................................................... 10 2.4 DIMENSIONS AND WEIGHTS OF COMPONENTS ............................................... 10
CHAPTER
......................................................................................................................... 12
BOARDS AND SLOTS ........................................................................................................... 12 3.1 INTRODUCTION TO THE BOARDS ................................................................... 12 3.2 SLOTS ........................................................................................................ 12 3.3 CONNECTOR-TYPE FOR ALL KINDS OF SERVICE INTERFACE ........................... 14
CHAPTER
......................................................................................................................... 15
APPLICATION OF MSTP........................................................................................................ 15
4.1 APPLICATION OF ETHERNET SERVICE ........................................................... 15 4.2 APPLICATION OF ATM SERVICE.................................................................... 17 4.3 APPLICATION OF RPR SERVICE ................................................................... 18
CHAPTER
......................................................................................................................... 20
NETWORKING AND PROTECTION ...................................................................................... 20 5.1 APPLICATION OF BASIC SERVICE.................................................................. 20 5.2 HARDWARE-LEVEL PROTECTION .................................................................. 20 5.3 NETWORK-LEVEL PROTECTION..................................................................... 22 5.4 PROTECTION SWITCH TIME .......................................................................... 23
CHAPTER
......................................................................................................................... 24
PERFORMANCES AND INDEXES......................................................................................... 24 6.1 STM-N OPTICAL INTERFACES PERFORMANCE ............................................... 24 6.2 PDH ELECTRICAL INTERFACES PERFORMANCE ............................................. 25 6.3 ERROR PERFORMANCE ............................................................................... 25 6.4 SFE6 PERFORMANCE ............................................................................... 25 6.5 AP14 PERFORMANCE ............................................................................... 28 6.6 OBA PERFORMANCE................................................................................... 29 6.7 OPA PERFORMANCE ................................................................................... 29 6.8 DCM PERFORMANCE .................................................................................. 30 6.9 OPTICAL INTERFACE INDEXES ...................................................................... 31 6.10 ELECTRICAL INTERFACE INDEXES ............................................................... 31 6.11 JITTER INDEX AT INTERFACES ..................................................................... 32 6.12 CLOCK TIMING AND SYNCHRONOUS CHARACTERISTICS ................................ 36
CHAPTER
......................................................................................................................... 38
ENVIRONMENT ADAPTABILITY ........................................................................................... 38 7.1 POWER SUPPLY REQUIREMENTS .................................................................. 38 7.2 GROUNDING REQUIREMENTS ....................................................................... 38 7.3 ENVIRONMENT REQUIREMENTS .................................................................... 38 7.4 EMC REQUIREMENTS.................................................................................. 41 7.5 SAFETY REQUIREMENTS .............................................................................. 43
CHAPTER
......................................................................................................................... 45
APPENDIX .............................................................................................................................. 45 8.1 FOLLOWED STANDARDS ............................................................................... 45 8.2 ABBREVIATIONS .......................................................................................... 48
Chapter
SYSTEM FUNCTION
1.1 System overview
ZXMP S330 equipment is a brand-new, multi-functional and compact 2.5G MSTP equipment launched by ZTE. Its a STM-16/STM-4/STM-1 integrated equipment, small in size, low in cost, and powerful in data service access capability. S330 is applicable to the construction of various transmission networks. Based on a modular design, ZXMP S330 can fulfill the functions of different systems such as TM, ADMMADM and REG without changing hardware. The TM and REG systems can be smoothly upgraded to ADM. The protection capabilities of hardware and network level greatly enhance the reliability and stability of the system.
1.2
Cross-connection and extension capabilities

The high-order cross-connection capability is 104104 VC4, and the low-order cross-connection capability is 4848TU-310081008 TU-12. The CS (cross-switch) board implements high-order and low-order cross-switching functions. CS supports matrix of AU-4, TU-3 or TU-12 level. The cross-connection is also used for protection switching. The CS board of S330 can implement functions of DXC equipment to fulfill the straight-through, broadcast, add/drop, and cross-connection of services. In the equipment, both the tributary electrical interface and the optical line interface enter the cross-connection network and have equivalent connections. 1. Containing an APS protocol processor, which implements the APS protect switching of the multiplex section. 2. Monitoring the alarm information of AUs in all directions and implementing channel protection switching. 3. Monitoring the state of all service boards and implementing the 1: N board protection. 4. Working in the 1+1 backup mode.
1.3
Service access capabilities

Optical Interfaces
ZXMP S330 provides three types of optical interfaces: STM-16, STM-4 and STM-1, as shown in Table 1-1.
Table 1-1 Optical Interfaces Provided by ZXMP S330 Interface Type Rate (Mbit/s) No. of Channel per Board Maximum Access Quantity
4
Confidential and Proprietary Information of ZTE CORPORATION
Chapter 1 - System Function
STM-16 STM-4 STM-1
2488.320 622.080 155.520
1 1/2 1/2
4 12 24
Electrical Interfaces
ZXMP S330 provides the STM-1 electronic interface and PDH electrical interfaces, as shown in Table 1-2.
Table 1-2 Electrical Interfaces Provided by ZXMP S330 Interface Type STM-1 E3 T3 E1 T1 Rate (Mbit/s) 155.520 34.368 44.736 2.048 1.544 No. of Channel per Board 1/2 3 3 21 21 Maximum Access Quantity 24 36 36 252 252
Data Interfaces
1. The SFE6 board provides 4 10M/100M adaptive Ethernet interfaces and the layer-2 switching function. The virtual cascading function of VC-12 is supported. 2. There are two types of Ethernet interface boards, namely, OIS14 board and EIFE board. Both can provide 4 ETH optical/electronic interfaces. ZXMP S330 fully supports data services and provides 155M POS optical interfaces and Ethernet interfaces shown in Table 1-3.
Table 1-3 Ethernet Interfaces Provided by ZXMP S330 Board Name OIS14 EIFE RSEB AP14 SFE6 Interface Type 100 M Ethernet optical interface 100 M Ethernet electrical interface 410/100M+2GE 155M ATM optical interface 100 M Ethernet optical interface 4 channels 4 channels No. of Channel per Board 4 channels 4 channels Maximum Access Capacity 48 48 1610/100M+8GE 48 48
1.4
Equipment and network protection capabilities

Clock boards (SC) and cross-switch boards (CS) are provided with 1+1 protection. The electrical interface boards are provided with 1: N redundancy protection. ZXMP S330 adopts the dual power supply system. Each functional board adopts the distributed power supply mode. This eliminates the power supply influence among the boards, and greatly reduces the impact during the hot plugging of the boards. ZXMP S330 can implement all networking features recommended by ITU-T. For details please refer to Chapter 5.
1.5
Synchronous timing processing capabilities

S330 supports synchronous priority switching based on the SSM algorithm, optimizes synchronous timing distribution of the network, prevents the
Confidential and Proprietary Information of ZTE CORPORATION 5
Technical Specification of ZXMP S330
occurrence of timing loops and keeps network synchronization the optimal status. The input clock references can be 4 external 2.048M clocks or 8 lines (or tributaries) 8k timing input references. Synchronization can select external clocks, line clocks or E1/T1 tributary clocks. S330 provides E1 tributary re-timing function. 1. The timing/synchronization function is carried out on SC (Synchronous Clock) board. SC board has three working modes: 1) 2) 3) Normal tracing mode Holdover mode Free-run mode
2. SC boards can run in a 1+1 hot backup mode. 3. SC board implements the following functions: 1). Selecting the clock source The NE extracts its timing reference from the following interface: 2.048MHz/2.048Mbps STM-N interface, tributary interface Internal SDH Equipment Clock. 2). Switching the clock source The system supports maximum 8 clock directions for any optical STM-N interface. The system clock supports synchronous priority switching and SSM algorithm-based automatic switching. 3). Clock output Four external reference clocks are provided. SCI board provides two 2.048Mbit/s and two 2.048MHz clock interfaces, which can be 75 or 120.
1.6
System control and communication

1. The system control and communication functions are mainly implemented by the NCP (Net Control Processor) board. 2. NMS information exchange between NEs via the ECC channel. 3. Orderwire interworks between NEs via the E1 and E2 bytes. It provides a 4-digit DIP switch to set different software states. 4. OW board provides two voice channels that are not mutually cross-switched. The system can support up to 16 orderwire directions. It achieves calls based on PTP, PMP, point-to-group (group calling), and broadcast. 5. The Qx interface is a communication interface between the NE and the Subnet Management Control Center (SMCC). 6. The f interface is the interface between NE and portable equipment. 7. The NCP board conducts the intelligent monitoring on the fan box of the current NE. 8. NCPI board provides one DB15 connector used as F1 interface or input interface of external alarms (smoke, flooding, opening door, fire alarm and temperature, etc.), and one DB9 connector used as output of alarms (warning, critical alarm and audio alarm) generated in the first cabinet of the row.
Chapter 1 - System Function
1.7
Overhead Processing
The CS board achieves the cross-connection dispatching of overheads and configures them to any port according to the configuration requirements of NMS. Following is the Overhead-Byte Usage List
Table 1-4 Overhead type Overhead-Byte Usage List S330 application Frame position indication for regeneration section, A1:11110110,A2:00101000 Used for regeneration section trace. It may be set. Not applied Transport the management information with D1~D3 The orderwire connection path for voice communication; E1 for regeneration section access, E2 for MS terminal access Used for special maintenance purpose supplying temporary data/audio path connection; and providing 64K co-directional data interface Used for the error code monitor of regeneration section Used for the error code monitor of MS Used for the auto-protection switchover (APS) command of MS b5~b8 used for synchronous status message Used for MS far-end difference indication The rate adjustment on AU level Used for high-order path trace, able to be set Used for path error code monitoring Used for expressing the composition or maintenance status of VC-3VC-4VC-4X, able to read and write Used for returning the status and performance of path terminal to the path origin of VC3/VC4/VC4XC Not applying Affording the general position indication to payload, as well as the special payload Position (i.e. H4 may be the multi-frame position indication of VC12 and VC2); and performing VC3/VC4 virtual concatenation Not applied Not applied Providing the functions of error code test, signal mark and channel status for VC1/VC2 VC1, VC2 path trace byte, able to be set Not supported Used for the virtual concatenation process of low-order path Overhead name A1, A2 J0 Z0 D1~D12 E1, E2 RSOH/MSOH F1 B1 B2 K1, K2 S1 M1 AU pointer AU PTR J1 B3 C2 G1 F2, F3 H4 K3 N1 V5 J2 N2 K4
POH
ECC uses the D1~D3 (DCCr) or D4~D12 (DCCm). It supports 24 DCC channels. DCCr are supported by any optical interface.
1.8
Network management capabilities

ZXMP S330 adopts ZXONM E300 network management system. E300 can manage all equipments of ZXMP series. E300 has perfect management functions, providing friendly GUI.
1.9
Alarm input/output
The equipment provides 4 external alarm input and 2 alarm output interfaces.
1.10
System power supply

ZXMP S330 equipment employs the dual-power system to access the -48V power and distributes it by the power distribution unit. Two independent external -48V DC power supplies, -48VGND and the system protection GND are connected to the sub-rack power distribution board. The power distribution (PD) unit provides following functions as power switch, distribution, isolation, EMI filtering, protection against lightening and surge, fan power supply and control. PD provides four lines of output power after filtering the EMI and ripples. Two lines of output power are provided for the sub-racks and the other two are provided for the fan plug-in box. The power distribution unit provides the processed -48V DC power to each board via the motherboard. A DC/DC power conversion module on each board converts -48V DC voltage into the required voltage of the board circuit.
The power distribution unit can achieve the 1+1 hot backup protection.
1.11
Maintenance and upgrade

With the following functions, the system becomes more reliable, featuring good maintainability and easy upgrade: 1. Supports the 155M, 622M, and 2.5G optical power monitoring function. 2. Supports online downloading and remote upgrade functions of the board software (including the FPGA logic). 3. Routine maintenance can quickly locate the fault to the board level. 4. Provides temperature monitoring for the boards.
1.12
Perfect EMC and Operation Safety

EMC, operation safety and fire/explosion protection of the equipment are fully considered in the circuit board design.
Chapter
SYSTEM MECHANICAL STRUCTURE

2.1 Appearance of sub-rack
Figure 2-1 Appearance of S330 Sub-rack
2.2
Cabinet structure
S330 equipment include sub-rack, cabinet, power plug-in box. S330 uses the uniform transmission cabinet.
Table 2-1 Configurations of S330 Rack Height 2.0m (Valid height 42U) 2.2m (Valid height 47U) 2.6m (Valid height 56U) Power Frame 4U 4U 4U Sub-rack 11U + 11U +11U (3 PCS) 11U + 11U +11U (3 PCS) 11U + 11U +11U + 11U (4 PCS)
The above configurations have already taken the number of E1 and cabling in case of full configurations into account. The structure and configurations of ZXMP S330 are shown in Fig. 2-2: Figure2-2 Structure and configurations of the cabinet.
Alarm LED Power distribution box
Back panel
Subrack Fan subrack Dust-proof unit
Front door
Telephone bracket Cabinet
2.3
Sub-rack structure
The S330 sub-rack includes board, fan plug-in box and dustproof unit. Structure of sub-rack is shown in Fig. 2-3. It contains two rows of boards, with 17 25.4mm-wide slots in each row. The sub-rack bottom contains a 1U fan plug-in box that contains three fans working independently. Its top is furnitured with a decorative door and has the functions such as decoration, ventilation and shielding.
Fig. 2-3 Sub-rack structure
Top wiring area
Deco door
Board area
Lower wiring area Fan shelf Dust-proof unit
2.4
Dimensions and weights of components

Table 2-2 Dimensions and weights of the equipment components Mechanical parts ZXMP S330 cabinet Dimensions 2,000mm(H) X 600mm(W) X 300mm(D) Weight (kg) 70
10
Chapter 2 - System Mechanical Structure
2,200mm(H) X 600mm(W) X 300mm(D) 2,600mm(H) X 600mm(W) X 300mm(D) ZXMP S330 sub-rack Power distribution box Fan plug-in box Dustproof unit Service interface board Service board 443.7mm(H) X 482.6mm(W) X 270mm(D) 177 mm(H) X 482.6mm(W) X 269.5mm(D) 43.6mm(H) X 436mm(W) X 245mm(D) 10.5mm(H) X 436mm(W) X 240mm(D) 160mm(H) X 2mm(W) X 70mm(D) 160mm(H) X 2mm(W) X 210mm(D)
80 90 15 5 -----
Note: The weight of the cabinet refers to the weight of an empty cabinet, and that of the power distribution box is the weight when it is installed with power distribution boards.
11
Chapter
BOARDS AND SLOTS

3.1
No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 Name Motherboard CS board SC board SCI board NCP board NCPI board PWR board OL16 board LP1 board LP4 board OIS1 board OIS4 board BIS1 board ESS1 board EPE1 board EPT1 board EIE1 board BIE1 board ESE1 board E3 board T3 board BIE3 board ESE3 board FAN board SFE6 board RSEB board AP14 Board
Introduction to the boards

Table 3-1 Boards/unit listwith Power consumption Type code MBA CSA SC SCI-75 NCP NCPI PWR OL16 LP1/LP1x2 LP4/LP4x2 OIS1 OIS4 BIS1 ESS1 EPE1 EPT1 EIE1 BIE1 ESE1 EPE3 EPT3 BIE3 ESE3 FAN SFE6 RSEB AP14 Code meaning Mother Board Cross-Switch type Synchronous Clock Synchronous Clock Interface Net Control Processor Net Control Processor Interface Power Optical Line STM-16 Line Process STM-1 Line Process STM-4 Optical Interface STM-1 Optical Interface STM-4 Tributary Protect STM-1 Tributary Switch Electric STM-1 Electrical Tributary Process E1 Electrical Tributary Process T1 Tributary Interface E1/T1 Tributary Protect E1/T1 Tributary Switch E1/T1 Electrical Tributary Process E3 Electrical Tributary Process T3 Tributary Protect E3/T3 Tributary Switch E3/T3 Fan board Smart Fast Ethernet Processing Board RPR board ATM Board Power consumption (w) 0 15 7 0.6 6 0.5 4 12 7/10 7/10 2.5/1.3 3/1.5 1 2 7 7 0 0.5 0.5 6 6 0.2 0.2 4.2 20 25 27 With the orderwire function Remarks
3.2
Slots
Fig. 3-1 Typical Board Configuration
12
Chapter 3 Boards And Slots
Board OL16 LP4 OIS4 LP1 OIS1 ESS1 BIS1 SFE6 RSEB OIS14 EIFE AP14 EPE33 EPT33 ESE33 BIE33 EPE121 EPT121 ESE121 75 ESE121 120 BIE121 CSA SC SCI75 SCI120 NCP NCPI PWR FAN OBA OPA
Service interface card

1

2

3

5

4

6
NCPI
SCI
7
PWR
8
PWR
9 10
11
12
13
14
15
16
17
Service card
1
Service card
2
Code meaning Optical Line STM-16 Line Process STM-4 Optical Interface STM-4 Line Process STM-1 Optical Interface STM-1 Tributary Switch Electric STM-1 Tributary Protect STM-1 Smart Fast Ethernet Processing Board RPR board Optical Interface STM-14 FE/ATM/SDH Electric Interface of Smart Fast Ethernet ATM Processor with 4 STM-1 port Electrical Tributary Process E33 Electrical Tributary Process T33 Tributary Switch E3/T3 Bridge Interface E3/T3 Electrical Tributary Process E121 Electrical Tributary Process T1 Electrical Switch E1(75) Electrical Switch E1/T1(120/100 Bridge Interface E1/T1 Cross-Switch type Synchronous Clock Synchronous Clock Interface(75) Synchronous Clock Interface(120) Net Control Processor Net Control Processor Interface Power Fan unit Optical Booster Amplifier Optical Preamplifier Amplifier
Service card
3
Table 3-2 Boards and relative slots Slot available SLOT 5~6/11~12 SLOT3~6/11~14 SLOT3~6/11~14 SLOT1~6/11~16 SLOT1~6/11~16 SLOT1~6/11~16 SLOT1/16 SLOT1~6/11~16 SLOT 5~6/11~12 SLOT1~6/11~16 SLOT1~6/11~16 SLOT1~6/11~16 SLOT1~6/11~16 SLOT1~6/11~16 SLOT1~6/11~16 SLOT1/16 SLOT1~6/11~16 SLOT1~6/11~16 SLOT1~6/11~16 SLOT1~6/11~16 SLOT1~6/11~16 SLOT 9/10 SLOT 7/8 SLOT 7 SLOT 7 SLOT 17 SLOT 17 SLOT 8/9 None 10BASE-T and 100BASE-TX STM-14 75 E3 electrical interface 75 T3 electrical interface 75 E3/T3 electrical interface None 120 and 75 E1 electrical interfaces 100 T1 electrical interfaces 75 E1 electrical interfaces 120 E1and 100 T1 electrical interfaces None None 75 E1 electrical interfaces 75 E1 electrical interfaces 120 E1and electrical interfaces f/Qx/6P4C 6P4C/DB9/DB15 a D-sub connector with 3 pins None SC/PC SC/PC Interface type S-16.1and L-16.2, LP4 and LP42 S-4.1, L-4.1, L-4.2 LP1 and LP12 S-1.1, L-1.1, L-1.2 ESS12 None 10BASE-T and 100BASE-TX and 100BASE-FX 10BASE-T and 100BASE-TX and 100BASE-FX1000BASE-FX
Service card Service card

4

5

6
Service card
Service card
Service card
NCP
SC
7
SC SC
8
CS CS
9
CS
10
11
12
13
14
15
16
17
13
3.3
Connector-type for All kinds of Service Interface

Table 3-3 Connector-type of interface Service Interface E1/T1(75 Ohm) E1/T1(120 Ohm) E3,T3,STM-1e(75 Ohm) External Clock(75 Ohm) External Clock(120 Ohm) FE(100Base-Tx) FE(100Base-Fx) ATM(o) STM-1/4/16 Alarm Connector Type SCI SCI CC4 CC4/DB9 DB9 RJ45 LC/PC SC/PC SC/PC DB15/DB9 Full-Duplex/Half-Duplex Full-Duplex Full-Duplex remark
14
Chapter
APPLICATION OF MSTP
4.1 Application of Ethernet Service
EPL: Ethernet Private Line
Fig 4-1 EPL
MSTP access node accesses data of important clients via FE interface, as shown in the above figure. After adapted with GFP encapsulation rate rather than L2 switching, user data is mapped into SDH VCG, then transmitted from end to end via SDH network to destination node. In the above process, link bandwidth depends on VCG. It is occupied only by a user just like a physical private line, so end-to-end QoS of services can be ensured. Different from conventional private line, MSTP can employ LCAS protocol or NM configuration to adjust link bandwidth flexibly and dynamically, and support traffic control. EPL can ensure transparent transmission of Ethernet service, e.g., Ethernet MAC frame and VLAN label. Ethernet service can be protected in SDH protection mode.
EVPL (Ethernet Virtual Private Line)

Fig 4-2 EVPL
In the above figure, user data are accessed via several user ports, and share the bandwidth of one network-side port (WAN port), i.e., one physical private line. The bandwidth at WAN port can also be configured. It is required to adopt
VLAN technique to ensure service intervals between different user ports. The advantage of the scheme is that all user ports can share bandwidth at WAN port, CIR and PIR should be configured to ensure QoS at user ports, and user Ethernet service adopts SDH physical-layer protection. EPVL is applied to virtual private line interconnection of different users (interconnected via VLAN) between two nodes. For example, VLAN1 and VLAN2 are two branches of industrial and commercial systems, and VLAN3 and VLAN4 are two branches of tax system.
EPLAN (Etherrnet Private LAN)

Fig 4-3 EPLAN
The services at 3 branches can be converged to headquarter via star network composed of SDH timeslot links. MSTP at central node is embedded with L2 switching function. For central converged services, link bandwidth from branches to headquarter is exclusive, so end-to-end QoS can be ensured. And the network is highly reliable. When a branch fails, services at other branches still work. User Ethernet service adopts SDH physical-layer protection.
Fig 4-4 EPLAN
The services between 3 branches and headquarter can form Ethernet shared ring through SDH virtual connections via VCAT. But it is required in the configuration that each MSTP node in the ring support L2 switching and STP. In this way, less fiber bandwidth is occupied when large quantities of nodes are available in the ring. In order to avoid unfair bandwidth allocation among the nodes, the supervision is required to control LAN port traffic at each node. The ring adopts SDH physical-layer protection. Because Ethernet ring crosses several SDH rings, STP protection can also be used. Fast STP can reduce protection time to less than 3 seconds.
16
Chapter 4 Application of MSTP
EVPLAN (Ethernet Virtual Private LAN)

Fig 4-5 EVPLAN
The services between branches and headquarters of company A and B can form virtual Ethernet shared ring through SDH virtual connections via VCAT. But it is required in the configuration that each MSTP node in the ring support L2 switching and STP. The services of two companies are isolated by VLAN. In this way, less fiber bandwidth is occupied when large quantities of nodes are available in the ring. In order to avoid unfair bandwidth allocation among the nodes, the supervision is required to control LAN port traffic at each node. The ring adopts SDH physical-layer protection. Because Ethernet ring crosses several SDH rings, STP protection can also be used. Fast STP can reduce protection time to less than 3 seconds. EPL is applied to private line interconnection between two users.
4.2
Application of ATM Service

VP-RING Networking
ATM service can be converged to one 155M channel in VP-RING. In the following figure, one 155M channel can carry ATM services of node B,C,D, all the converged services go to BAS via node A.
Fig 4-6 ATM VP-RING
155M VP-RING is based on SDH network. It can coexist with SDH ring
transmitting other services. In addition, ATM transparent transmission on SDH network can connect several VP-RINGs in serial to form a mixed ring.
4.3
Application of RPR Service

The deepened function of RPR by ZTE
1. The RPR board of S330 has integrated RPR MAC function following the IEEE 802.17 standard 2. RPR board (RSEB) can build up 1.25G RPR ringand its bandwidth towards Backplane is 2.5G. 3. The interface of MAC layer is 4FE2GEit can carry out the nFE to FE nFE to GE and nGE to GE converging. 4. Using powerful function of service classification the service can be differentiated based on the interface or VLAN. 5. Powerful function of flow control: The maximum number of data streams carried on the RPR ring is 1000, every data stream can be set as Class A0, A1, B, and C, also the flow control parameter of stream can be set and the granularity of flow control is 20Kbps. 6. The station supports plug and playand the configuration is very simple, RPR ring can find the incorrect fiber connection voluntarily. 7. The wrapping and steering protection is available on RPR layer, and the conflict of protections between SDH layer and RPR layer can be avoided by setting switching time delay. 8. The capability of MAC address is very large, every station can learn and store 64,000 MAC addresses it can avoid the unnecessary flood frame and reduce the waste of bandwidth when building up complex network. 9. The fairness arithmetic of autonomous intellectual property can share the bandwidth properly, make the bandwidth converge quickly and make the bandwidth fluctuation little. 10. CID (Customer Identifier Domain) in RPR. can carry out double isolation as CID plus VLAN ID, so it can isolate the data belonging to the same VLANs in different VPN domain and carry out EVPL and EVPLAN in network.
Networking of RPR over SDH :Point to Point

Fig 4-7 Point to Point
18
Chapter 4 Application of MSTP
Networking of RPR over SDH :Multi-points to Multi-point

Fig 4-8 Multi-points to Multi-point
19
Chapter
NETWORKING AND PROTECTION

5.1 Application of Basic Service
ZXMP S330 is mainly applied to the local, metropolitan and backbone transmission networks. ZXMP S330 can provide all the networking features recommended by ITU-T, such as TM, REG, ADM, and MADM.
Fig. 5-1 Basic Physical Topologies for ZSMP S330
1. Chain TM ADM ADM TM
2. Star
TM
DXC/ADM
TM
TM
TM
TM
3. Tree
DXC/ADM
ADM TM TM
ADM
TM TM
ADM 4. Ring ADM ADM ADM
5. Mesh
DXC/ADM
DXC/ADM
DXC/ADM
DXC/ADM
5.2
Hardware-level Protection
Power supply protection
Out-of-cabinet power protection
Chapter 5 Networking and Protection
For ZXMP S330 equipment, one or two 48V power cables are introduced to the cabinet via the air switch in the power distribution box. When two groups of equipment room power supplies are introduced to the device, the power supply works in 1+1 protection mode to make sure that the device works well in the case of either the power group failure. Inside-cabinet power protection The -48V power is filtered in the power distribution board in the power distribution box to provide power for the sub-rack and fan shelf. ZXMP S330 uses two power distribution boards for power distribution. The two power distribution boards can provide power jointly or separately. Board power protection The board adopts the distributed power supply mode to reduce the power affect between boards to zero. All boards have over-current and over-voltage protection. Power polarities inversely connected: Use fuse for protection.
Cross-switch protection
ZXMP S330 uses two CS boards. The 1+1 protection for the CS board is realized. Namely, two CS boards, i.e., active and standby, can be configured in the system. In case of failure, the NMS sends commands to control the switching of the CS board.
Clock protection
ZXMP S330 uses two SC boards to achieve the protection for the clock. To ensure reliable synchronization and timing, the SC board may work in the hot backup mode or independently, that is, two system clock boards, i.e. active and standby, may be configured in this system. When both boards are in position and work normally, only the clock of the main system clock board is output to the backplane. In case of failure in either of the boards, the clock is switched to the other SC board.
1:N protection for the tributary board

The system has totally twelve slots for the tributary board, which are divided into left and right groups. Each group provides the 1: N (N5) protection for the E1/T1 and FE tributary board and the protection board can be inserted in any service slot in the local group. It also provides the 1: N (N5) protection for the E3/T3 tributary board and EL1 board and the protection board must be inserted in the designated position. The 1: N protections for the service boards in the left and right groups are independent from each other, and different protection modes may be supported.
Automatic Laser Shutdown function

All STM-1/4/16 optical interfaces of S330 support the ALS function and satisfy G.664 standard. The course of ALS is illustrated in Fig.5-2. When the cable is broken at A point, the receive port detects the loss of continuity of optical transmission signal (LOC-OTS) at R2, which will cause T2 transmission port to shut down, and the LOC-OTS detected at R1 also causes the T1 transmission port to shut down. In such way, it guarantees the optical power, in the OTS section at A point where failure occurred, being in safety.
Fig.5-2 the ALS principle
21
After it is reconnected in the OTS section, resume the transmission within the OTS section by restarting automatically or manually. (Attention: when it disconnects or after an (unsuccessful) restart, do not enable the restart within 100s.)
5.3
Network-level protection
ZXMP S330 equipment can realize all the network protective modes specified by ITU-T: 1. MSP1:N, 2. 2F UPSR, 3. 2F BPSR, 4. 4F BPSR, 5. DNI protection, 6. SNCP, 7. Unique Logical Sub Network Protection scheme ZXMP S330 presents and implements a very new network protection concept on the basis of ITU-T recommendation: virtual logical subnet protection. This function can meet the requirements of more complex network structure, enhance the network security and increase the bandwidth utilization, such as Multi-ADM (M-ADM) and M-ADM with subtending rings. The logical subnet is the result of dividing a network according to the logic topology and logical capacity on the basis of the physical network. One physical network can be divided into several logical subnetsthe logical subnets can be further divided by service type, capacity, network topology and protection mode as shown in Fig. 5-3. The protection and management of each logical subnet is independent of one another.
Fig.5-3: Logical Sub network Protection
22
Chapter 5 Networking and Protection
A3 A3 A A B B STM -64 D D C C B3 47xVC-4 D3 D3 B3 C3 C3 B1 B1 A2 A2 B2 3xVC-4 B2 C2 C2 C2 D2 D2
C1
Sub-network
Circuit Low -order Path
A1 A1 8xVC-4 D1 D1 C1 C1 C3
Link
Path High-order Path MS RS Physical M edia Section Layered subnetwork M edia
Physica l ring
Logic sub-netw ork based on customer and capacity

A A B B D 40xVC-4 D B B C C Logic ring 1: M SP F F E E F 20xVC-4 F B B G G Logic ring 2: Path protection A E A E D F 4xVC-4 D F C G G C Logic ring 3: Path protection B B
Horizonta l partition
T DM , IP, ATM ... A B STM -N C D E B2 B1
Vertical partition
A1 TDM C1 D1 B3 A2 IP C2 E1 A3 ATM E3 C3 D3
D D
A E A E B1 B1 STM -64 STM -64 B2 B2 C G G C
Physical ring
Logic sub-netw ork based on topology and capacity
Logic sub-netw ork based on service type
Unique Logical Sub Netw ork Protection Schem e
5.4
Protection switch time

Table 5-1 SDH system protection switch time Protection scheme SC CS STM-1/e Unit protection Ethernet(e) 34M 45M 1.5M/2M Network level MS-ring SNCP Type Time <50ms <50ms <50ms <50ms <50ms <50ms <50ms <50ms <50ms
23
Chapter
PERFORMANCES AND INDEXES

6.1 STM-N optical interfaces performance
Performance of the STM-16 /4/1 optical interfaces is shown as follows.
Table 6-1 Performance of the STM-1 optical interface of ZXMP S330 Nominal bit rate Classification code Working wavelength (nm) Source type Min transmitting optical powerdB Max transmitting optical powerdB Minimum extinction ratiodB Poorest sensitivitydB Minimum overload pointdB Transmitter at reference point S Optical path between Point S and R Receiver at reference point R S-1.1 1310 MLM -15 -8 8.2 -28 -8 G.957-compliant 155520kbit/s L-1.1 1310 SLM -5 0 10 -34 -10 G.957-compliant L-1.2 1550 SLM -5 0 10 -34 -10 G.957-compliant
Table 6-2 Performance of the STM-4 optical interface of ZXMP S330 Nominal bit rate Classification code Working wavelength (nm) Source type Min transmitting optical powerdB Max transmitting optical powerdB Minimum extinction ratiodB Poorest sensitivitydB Minimum overload pointdB Transmitter at reference point S Optical path between Point S and R Receiver at reference point R S-4.1 1310 MLM -15 -8 8.2 -28 -8 G.957-compliant 622080kbit/s L-4.1 1310 SLM -3 2 10 -28 -8 G.957-compliant L-4.2 1550 SLM -3 2 10 -28 -8 G.957-compliant
Table 6-3 Performance of the STM-16 optical interface of ZXMP S330 Nominal bit rate Classification code Working wavelength (nm) Source type Min transmitting optical powerdBm Max transmitting optical powerdBm Minimum extinction ratiodBm Poorest sensitivitydBm Minimum overload pointdBm Transmitter at reference point S Optical path between Point S and R Receiver at reference point R 2488320kbit/s S-16.1 1310 SLM -5 0 8.2 -20 -3 G.957-compliant L-16.2 1550 SLM -2 3 8.2 -28 -9 G.957-compliant
24
Chapter 6 Performances and Indexes
6.2
Type Code pattern
PDH electrical interfaces performance

Table 6-4 Performance of the PDH electrical interface of ZXMP S330 1544kbit/s AMI or B8ZS 2048kbit/s HDB3 code 34368kbit/s HDB3 code 44736kbit/s B3ZS code 139264kbit/s CMI code 155520kbit/s CMI code
Bit rate of signals at output port Attenuation tolerance at input port Frequency deviation tolerance at input port Anti-interference capability of input port
G.703compliant
G.703compliant
G.703compliant
G.703compliant
G.703compliant
G.703compliant
6.3
Error Performance
For each circuit direction and for bi-directional section and path, the error performance is monitored separately, the SDH performance of ZXMP complies with ITU-T G.784, G.828 and G.826. The SDH performance includes performance items such as BBE, ES, SES, FBBE, FEES, FESES, PSC, PJC+, PJC-, UAS, etc. The long term and short-term error performances of ZXMP S330 are complied with ITU-T G.828 and M.2101 recommendation. According to ITU-T G.821 and G.826, in 420km HRDP (Hypothetical Reference Digital Path), SDH system error performance of ZTEs transmission product is as follows, these figures are tested in field and test duration is not less than 24 hour.
Table 6-5 SDH system error performance of ZTEs transmission product
Bit rate(kbit/s) ESR SESR BBER 2048 1.84810-6 9.2410-8 9.2410-9 44736 3.46610-6 9.2410-8 9.2410-9 139264/155520 7.39210-6 9.2410-8 9.2410-9 622080 1.84810-5 9.2410-8 9.2410-9 2488320 3.710-5 9.2410-8 9.2410-9
The performance of S330 is better than ITU-T recommendation.
6.4
SFE6 Performance
Performance of SFE6
Table 6-6 Performance of SFE6
Equipment name Characteristics of Ethernet Board Name of Board Interface type Connector Ethernet interface Interface number per board Settable working modes (Rate. Full Duplex. Half-Duplex Pluggable optical module Interface board type
ZXMP S330 Function and Specification of Board Smart Fast Ethernet Processing Board SFEx6interface Board OIS1x4. EIFEx4 10BASE-T /100BASE-TX /100BASE-FX RJ45/SFP-LC 4 Comply OIS1x4 OIS1x4 EIFEx4
25
1:N protection For SFEx6 Maximum port number at SDH side (VCGroup) Total mapping bandwidth of back board Virtual Concatenation (VC-12-Xv) Multidirectional convergence rate The dynamic addition/reduction of VCG bandwidth does not lead to the service loss. LCAS management function (Enable alarm LCAS Protocol and event report) VCG-level multi-path protection with the time of <300ms Support GFP encapsulation and comply with ITU-T G.7041 Recommendation Maximum frame is 1536 bytes and minimum frame is 64 bytes Bandwidth adjustment granule based on interface Support the trunk of the port Capability of Layer 2 Switch Layer 2 switching: Support dynamic learning and static configuration of MAC address. Comply with IEEE802.1D bridge function. The learning speed of MAC address is in compliance with the index: >1024 pieces/second. The aging time can be set. Support layer 2 switching/forwarding function, the switching is at local side and at SDH side. Support learning space of MAC address Support Stack Vlan (Q-in-Q) encapsulation and conversion. Support STP and RSTP Support STP, RSTP and multi-STP based on VLAN. VLAN number and scope supported QoS Layer VPN function (EVPL and EVPLAN service) Support port-level Ethernet performance supervision
N < =5 6 252VC12at most 63VC12 per VCG Comply 6:1 Comply Comply Comply Comply Comply 1M-rate restriction granule based on interface Comply. At most binded 4FE Bi-Directional capability: 1Gbps
Comply
Comply 64K Comply Comply Comply Support 255 VLANs with the scope of 1 4095. Support WFQ Support in Stack Vlan (Q-in-Q) mode. Comply
Ethernet interface types and followed standard

Table 6-7 Ethernet interface index Type 10BASE-T 100BASE-TX 100BASE-FX Rate (bps) 10M 100M 100M followed standard IEEE 802.3 IEEE 802.3u IEEE 802.3u Interface type Electronic interface Electronic interface M-1.1 S-1.1 L-1.1 interface RJ45, category 3 UTP RJ45, category 3 UTP SFP-LC
All optical interface indices are described as following:
FE MMF optical interfaceM-1.1

Table 6-8 transmission index of FE MMF optical interface
Item Transmission unit type
62.5/125m MMF MMF LD 2 SFP-LC 1270~1380 3 63 -14 -20 -45 10
Unit KM nm ns nm dBm dBm dBm dB
Transmission distance
Interface Wavelength range Trise/Tfall (maximum;10%~90%) RMS spectrum width maximum Output optical powermaximum Output optical powerminimum Output optical power when the LD is shut downmaximum Extinction ratiominimum
Table 6-9 receiver index of FE MMF optical interface Item wavelength range 62.5/125m MMF 1270~1380 nm dBm dBm Unit
input optical powermaximum -14 Receiver sensitivity -30
FE short distance SMF optical interfaceS-1.1

Table 6-10 transmission index of FE short distance SMF optical interface Item Transmission unit type 10/125m SMF SMF LD 15 SFP-LC 1261~1360 2.5 7.7 -8 -11.5 -45 9 nm ns nm dBm dBm dBm dB KM Unit
Interface type Wavelength range Trise/Tfall (maximum;20%~80%) RMS spectrum widthmaximum output optical powermaximum output optical powerminimum Output optical power when the LD is shut downmaximum Extinction ratiominimum
Table 6-11 receiver index of FE short distance optical interface Item Wavelength ( range) Input optical power (maximum) Receiver sensitivity 10/125m SMF 1261~1360 -8 -31 unit nm dBm dBm
FE long distance SMF optical interfaceL-1.1

Table 6-12 transmission index of FE long distance SMF optical interface Item 10/125m SMF Unit
27
Transmission unit type
SMF LD 40 SFP-LC 1261~1360 2.5 3 0 -5 -45 10 nm ns nm dBm dBm dBm dB KM
Interface type Wavelength ( range Trise/Tfall (maximum;20%~80%) RMS spectrum width (maximum output optical powermaximum output optical powerminimum Output optical power when the LD is shut downmaximum Extinction ratiominimum
Table 6-13 receiver index of FE long distance optical interface Item Wavelength range Input optical power maximum Receiver sensitivity 10/125m SMF 1261~1360 -9 -34 Unit nm dBm dBm
6.5
AP14 Performance
Performance of the AP14
Table 6-14 Performance of the AP14 of ZXMP S330
Equipment name Features of ATM Board Name of Board Features of Interface Interface Connector Interface number per board Pluggable optical module Interface type Upgraded and loaded on-line Total mapping bandwidth of back board ATM interface Support UNI/NNI ATM Switching Element Capability VP/VC Switching Function VPI scope VCI scope PVC scope CAC Continuous cell detection OAM Loop-back Service Type Supported CBR
ZXMP S330 Functions and Specifications of Board Processing Board AP1x4Interface Board OIS1x4 STM-1 LC 4 Comply Interface Board OIS1x4 Comply 4 (VC4) Comply 622M Bi-Directional Support Switching between VP and VC and the Capability is 16K UNI0255 116383 Bi-Directional 8K Comply Comply Comply Comply NNI04095
28
rt VBR nrt VBR UBR The function of transmission PRI Space Multicast Logic Multicast VP-Ring ATM Automatic Protection Switching ATM forced protection Switching SDH side Consumer side
Comply Comply Comply Comply Comply Comply Comply Comply Comply Comply Comply
Loop-Back of Port Alarm of ATM layer
6.6
OBA Performance
Performance of the OBA Module
Table 6-15 Performance of the OBA Module
Performance Operating wavelength Input power Output power(maximum) Dynamic range of output power (dB) Gain Small Signal Gain Noise Index Input return loss output return loss Output pump leakage Input pump leakage PDG PMD Operating temperature Operating humidity Storage temperature Operating voltage
Unit nm dBm dBm dB dB dB dB dB dB dBm dBm dB ps
OBA12 1530~1565 -12~4 12 3 5~24 >25 5 45 45 -30 -30 0.5 1 <25 -15~65 5~95 -40~75 +55%
OBA14 1530~1565 -12~410G -6~42.5G 14 3 7~26(10G) 7~20(2.5G) >25 5 45 45 -30 -30 0.5 1 <25 -15~65 5~95 -40~75 +55%
OBA17 1530~1565 -6~4 17 3 10~23 >23 5 45 45 -30 -30 0.5 1 <25 -15~65 5~95 -40~75 +55%
OBA19 1530~1565 -6~4 19 3 12~25 >25 5 45 45 -30 -30 0.5 1 <25 -15~65 5~95 -40~75 +55%
Remark
Life origination value Only decrease Output power lock mode
powerfull temperature range W V
NoteOBA19 Only operating at 155M and 622M bit rate; the Connector type is SC/PC.
6.7
OPA Performance
Table 6-16 Performance of the OPA Box
Performance Operating wavelength Tunable wavelength range filter-3dB bandwidth Filter -20dB bandwidth Input power Output power(maximum) Dynamic range of output power (dB) Gain Small Signal Gain Noise Index Input return loss output return loss Output pump leakage Input pump leakage Forward ASE level Backward ASE power level Pump wavelength PDG PMD Power Power supply Operating temperature Operating humidity Storage temperature Optical Connector
unit nm nm nm nm dBm dBm dB dB dB dB dB dB dBm dBm dBm dBm nm dB ps W V
OPA(2.5G) 1530~1561 31 0.45 1.2 -38 -9 3 26~32 30 4.5 45 45 -30 -50 -30 -30 980 0.2 1 15 -4810% -15~65 5~95 -40~75 SC/PC
OPA(10G) 1530~1561 31 0.45 1.2 -32 -4 3 25~31 30 4.5 45 45 -30 -50 -30 -30 980 0.2 1 15 -4810% -15~65 5~95 -40~75 SC/PC
remark
6.8
DCM Performance
The Dispersion Compensating Modules compensates the dispersion of conventional single mode fiber (G.652/G.655) Performance of the DCM
Table 6-17 Performance of the DCM Type Dispersion compensated range ps/nm Insert loss(dB) typical value PMD(2-step) PMDTypical(ps) PMD cost(dB) DCM-20 -32915 4.1 -3.2 0.5 -0.4 DCM-40 -68021 5.1 -4.4 1.0 -0.4 0.1 DCM-60 -102031 7.0 -6 1.2 -0.5 0.1 DCM-80 -136041 8.9 -7.7 1.3 -0.6 0.1 DCM-100 -164041 12.1 -11.5
Note 1. Each DCM needs a 1U-high DCM-Box. 2. Generally Only 10G system need to consider dispersion problem 3. DCM80 can only be located in front of OBA and cannot be located after OPA
30
6.9
Optical interface indexes

Eye Pattern of the optical sending signals
Fig. 6-1 the eye diagram pattern for sending optical signals
The eye pattern of ZXMP S330 equipment conforms to the template in Fig. 6-1. Permitted frequency deviation of optical input interface The allowable frequency deviation of ZXMP S330 optical input port is greater than 20ppm. AIS Rate of optical output port The AIS rate at ZXMP S330 optical output port is within 20ppm.
6.10
Electrical interface indexes

Permitted input port attenuation, permitted frequency deviation and output port signal bit rate tolerance
Table 6-18 Input port permitted attenuation, frequency deviation and output port signal bit rate tolerance
Interface rate 1544kbit/s 2048 kbit/s 34368 kbit/s 44736 kbit/s 139264 kbit/s 155520 kbit/s
Permitted input port frequency deviation(regular squared attenuation) -0dB~6dB, 1024kHz 0dB~12dB, 17,184kHz -0dB~12dB, 70MHz 0dB~12.7dB, 78MHz
Permitted input port frequency deviation Greater than 32ppm Greater than 50ppm Greater than 20ppm Greater than 20ppm Greater than 15ppm Greater than 20ppm
Output port rate tolerance Less than 32ppm Less than 50ppm Less than 20ppm Less than 20ppm Less than 15ppm Less than 20ppm
Reflection attenuation at the input/output ports For input/output port reflection attenuation index of various electronic ports of ZXMP S330, please refer to Table 6-19.
Table 6-19 Requirements for the input/output port reflection attenuation Interface bit rate 2048Kbit/s input port Test frequency range 51.2kHz~102.4kHz 102.4kHz~2048kHz 2048kHz~3072kHz 860kHz~1720kHz 34368Kbit/s input port 139264Kbit/s input/output port 1720kHz~34368kHz 34368kHz~51550kHz 7MHz-210MHz Reflection attenuation (dB) 12 18 14 12 18 14 15
31
155520Kbit/s input/output port
8MHz~240MHz
15
Anti-interference capability of the input port The ratio of main signals to interference signals is 18dB. ZXMP S330 can satisfy the above requirement. Output port waveform The output port waveform complies with template specified in G.703 Recommendation. Over-voltage protection of the input and output interfaces The input and output interfaces must bear 10 continuous standard pulses (5 positive and 5 negative) without being damaged. The rising time of a standard pulse is 1.2s, the width is 50s and the voltage amplitude is 20V.
6.11
Jitter index at interfaces

For ZXMP S330, the jitter and wander tolerance for G.703 PDH and SDH interface conform to ITU-T G.823, G.824 (45Mbps) and G.825 respectively. Jitter and wander tolerance of PDH input interface The jitter and wander tolerance at the ZXMP S330 PDH input interface meets the requirements shown in Fig. 6-2a, 6-2b and Table 6-20.
Fig. 6-2a the jitter and wander tolerance at PDH input interface (E1 HIERARCHY)
Peak-peak jitter and wander (logarithm)
A0 A3 A1 A2
Slope: -20dB/10 octave
f0
f10 f9
f8 f1
f2
f3
f4
Jitter frequency (logarithm)
Fig. 6-2b The jitter and wander tolerance at PDH input interface (1.5M HIERARCHY)
Table 6-20 The input jitter and wander tolerance of the PDH interface Interface rate UIp-p Frequency (Hz) Pseudo-random
32
(kbit/s)
1544 2048 34368 44736 139264
A0
18 36.9 618.6 18 2506.6
A1
5.0 UI 18 1.5 5.0 UI 1.5
A2
0.1UI 0.2 0.15 0.1UI 0.075
A3
f10(T1/T3 is f0)
1.210
5
f9
f8
f1
10
f2
120 2.4k 1k 600 500
f3
6k 18k 10k 30k 10k
f4
40K 100k 800k 400k 3500k
signal
2 1 2 -1 2 -1 2 1 2 -1
23 20 23 15 20
18 ffs
4.8810 ffs 1.2 10
-3
0.01 ffs
1.667 ffs
20 100 10
30.511
8.1110
-3
0.08
10.267
200
Jitter and wander tolerance of PDH output interface

Table 6-21 The output jitter and wander tolerance of the PDH interface Parameter value Network limit B1 unit interval Digit rate (kbit/s) peak-to-peak B2 unit interval peak-to-peak Measurement filter bandwidth Band-pass filter having a lower cut-off frequency f1 or f3 and an upper cut-off frequency f4 f1 1 544 2 048 34 368 44736 139 264 NOTES: 5 1.5 1.5 5 1.5 0.1 0.2 0.15 0.1 0.075 10Hz 20 Hz 100 Hz 10Hz 200 Hz f3 8kHz 18 kHz (700 Hz) 10 kHz 30kHz 10 kHz f4 40KHz 100 kHz 800 kHz 400kHz 3500 kHz
1 For the codirectional interface only. 2 The frequency values shown in parenthesis only apply to certain national interfaces. 3 UI Unit Interval: for 2048 Kbit/s 1 UI = for 34 368 Kbit/s 1 UI = for 139 264 Kbit/s 1 UI = 488 ns 29.1 ns 7.18 ns
Jitter and wander tolerance of SDH input interface The capability of STM-N input interface to stand jitter and wander is specified and tested with the digital test signal of sine modulated phase. The input jitter and wander tolerance of ZXMP S330 SDH terminal multiplexer satisfies the requirements in Fig. 6-3 and Tables 6-22 and 6-23. The input jitter and wander tolerance of ZXMP S330 SDH regenerator satisfies the requirements shown in Fig. 6-4 and Table 6-24.
Fig. 6-3 The jitter tolerance of STM-N terminal multiplexer input interface
33
Peak-peak jitter and wander (logarithm)

A0 A1

A2 A3 A4
f0
f12
f11
f10
f9
f8
f1
f2
f3
f4
Frequency
Table 6-22 Input jitter and wander tolerance (UIP-P) of the SDH terminal multiplexer A0 (18s) STM-1 STM-4 STM-16 2800 11200 44790 A1 (2s) 311 1244 4977 A2 (0.25s) 39 156 622 A3 1.5 1.5 1.5 A4 0.15 0.15 0.15
Table 6-23 Input jitter and wander tolerance (frequency: Hz) of the SDH terminal multiplexer f0 STM-1 STM-4 STM-16 1.210 1.210
-5 -5 -5
f12 1.7810 1.7810

-4 -4 -4
f11 1.610 1.610

-3 -3 -3
f10 1.5610 1.5610

-2 -2 -2
f9 0.125 0.125
f8 19.3 9.65
f1 500 1000
f2 6.5k 25k 100k
f3 65k 250k 1M
f4 1.3M 5M 20M
1.210 1.7810 1.610 1.5610 0.125 12.1 5000 Fig. 6-4 The input jitter tolerance of STM-N SDH regenerator
Input jitter amplitude
UIP-P A2
A1
f2
f1
Frequency
Table 6-24 Input jitter tolerances of STM-1, STM-4 and STM-16 regenerators f1 (kHz) STM-1 STM-4 STM-16 A B A B A B 65 12 250 12 1000 12 f2 (kHz) 6.5 1.2 25 1.2 100 1.2 A1 (UIP-P) 0.15 0.15 0.15 0.15 0.15 0.15 A2 (UIP-P) 1.5 1.5 1.5 1.5 1.5 1.5
Inherent output jitter of STM-N interface of SDH equipment and the output jitter of network interface For the ADM, TM and DXC equipment of ZXMP S330, the STM-N output
jittering indexes meet the requirements in Tables 6-25 and 6-26. Because of the randomness of jitter, the test value might exceed, and it is acceptable when over 99% test values satisfy the indexes during the test (for 1 to 2 minutes).
Table 6-25 STM-N interface inherent output jitter indexes of SDH equipment STM interface STM-1 STM-4 STM-16 Test filter 500Hz~1.3MHz 65kHz~1.3MHz 1000Hz~5MHz 250kHz~5MHz 5000Hz~20MHz 1MHz~20MHz Peak value of jitter 0.50 UI 0.10 UI 0.50 UI 0.10 UI 0.50 UI 0.10 UI
Table 6-26 STM-N network interface output jitter indexes of SDH equipment STM interface STM-1 optical interface STM-1 electrical interface STM-4 optical interface STM-16 optical interface f1 (Hz) 500 500 1000 5000 f3 (kHz) 65 65 250 1M f4 (MHz) 1.3 1.3 5 20 B1 (UIp-p) 1.5 1.5 1.5 1.5 B2 (UIp-p) 0.15 0.075 0.15 0.15
For the REG equipment, when the test filter adopts 12kHz high-pass filter, its root mean square value (RMS) created from jitter should not be greater than 0.01UIrms. Mapping jitter of PDH tributary
The mapping jitter at the ZXMP S330 PDH tributary can satisfy the requirements listed in Table 6-27.
Table 6-27 Mapping jitter specifications G.703 interface (kbit/s) 2048 34368 44736 139264 50 20 20 15 Tolerance (ppm) High-pass filter 20dB/10 multiplication f1 (Hz) 20 100 100 200 f3 (Hz) 18k 10k 10k 10k f4 (Hz) 100k 800k 800k 3.5M Maximum peak value of mapping jitter f1~f4 Undetermined Undetermined Undetermined Undetermined f3~f4 0.08 0.08 0.08 0.08
Combined Jitter In the SDH system, generally, there are both mapping jitter and pointer adjusting jitter. The combined jitter of both is called the combined jitter. Under various test sequences, the value detected by ZXMP S330 should meet the ones listed in Table 6-28.
Table 6-28 Combined jitter PDH interface (kbit/s) 2048 34368 44736 139264 Bit rate tolerance (ppm) 50 30 30 15 High pass filter 20dB/10 octave f1 f3 f4 (Hz) (Hz) (Hz) 20 18k 100k 100 100 200 10k 10k 10k 800k 800k 3.5M Maximum peak-peak value combined jitter UIP-P f1~f4 (UIp-p) 0.4 0.4 0.4 0.4 a 0.4 0.4 0.4 0.4 b 0.4 0.4 0.4 0.4 c 0.75 0.75 0.75 d 0.075 0.075 0.075 0.075 a f3~f4 (UIp-p) 0.075 0.075 0.075 0.075 b 0.075 0.075 0.075 0.075 c 0.075 0.075 0.075 d
Test sequence
35
Jitter transfer function of the regeneration relay The jitter transfer function of the regeneration relay is defined the ratio of output STM-N signal jitter to the input STM-N signal jitter versus frequency. The jitter transmission characteristic of ZXMP S330 SDH regeneration relay is shown in Fig. 6-5.
Fig. 6-5 The jitter transfer characteristics of a regeneration relay
Input jitter amplitude
(UI P-P ) A2
A1
f2
f1
Frequency
The jitter transmission parameters of regeneration relay are shown in Table 6-29.
Table 6-29 Jitter transmission parameters of a regeneration relay STM-N STM-1 STM-4 STM-16 A B A B A B fc (kHz) 130 30 500 30 2000 30 P (dB) 0.1 0.1 0.1 0.1 0.1 0.1
6.12
Clock timing and synchronous characteristics

The SEC Index list
Table 6-30 The SEC Index list Vendor Type Standard Central Frequency Day aging rate Year aging rate Central frequency precision Short time stability Temperature characteristic ISOTEMP OCXO 77.76MHz 110-8 510-7 110-7(0V) 110-10/s
-8 510 (050C)
Output jitter When there is no input jitter, the inhered jitter of ZXMP S330 2M clock output interface should not be over 0,05 UIP-P. The test is conducted at an interval of every 60 seconds with a single-pole band-pass filter in 20Hz and 100kHz turnover frequencies. Permitted input/output attenuation and others For ZXMP S330 the bit rate tolerance of clock output signal is 4.6ppm. Long-term phase variation in clock locking mode
The long-term phase variation in the clock locking mode refers to the phase noise generated at the SEC output terminal when there is an ideal input reference signal. Usually, they are expressed by the Maximum Time Interval Error (MTIE) and time deviation error (MTIE). ZXMP S330 can satisfy the requirements shown in Tables 6-31, 6-32 and 6-33.
Table 6-31 The wander limit value under constant temperature (MTIE) MTIE limits 40 ns 40
0.1
Observation interval 0.1s<1s 1s<100s
ns
0.2
25.25
ns
100s< <1000s
Table 6-32 The wander limit value under temperature impact (MTIE) Additional MTIE permitted value 0.5ns 50ns Observation interval 0.1s<100s >118s
Table 6-33The wander limit value under constant temperature (TDEV) MTIE limits 3.2 ns 0.64
0.5
Observation interval 0.1s<25s 25s<100s 100s<1000s
ns
6.4 ns
Clock accuracy in the hold mode Once all the timing references are lost, SEC will enter the hold mode after instantaneous phase variation. Now, SEC will use the last frequency information saved before the timing reference signal loss as its timing reference. Meanwhile, the oscillation frequency of the oscillator will slowly wander, but can still ensure that SEC frequency only has very small frequency deviation from the reference frequency in a long time base; therefore, the sliding loss will be within the allowed index requirement. This mode can be used to deal with an external clock failure lasting several days. When SEC loses its reference source and enters the hold mode, the phase error T of the SEC output signal to the input signal should not be over the following limits when observation time S is greater than 15s from the moment that the reference source loses. T (S) = [(a1+a2)S+0.5bS2+c] ns a1= 50ns/s corresponds to the initial frequency deviation of 5 10-8. a2=2000ns/s refers to the frequency deviation caused by the temperature change after the clock enters the hold mode. If there is no temperature change in 2 10-6, there will be no a2S in the phase error. b = 1.16 10-4ns/s. It is caused by aging, corresponding to 110-8/day frequency wander. c = 120ns, includes any additional phase deviation that might be generated after entering the transition stage of hold mode. ZXMP S330 meets the above requirements. Frequency Accuracy of Internal Oscillator in the Free-run Mode When the internal oscillator of SEC works in the free-run mode if SEC loses all of the clock references, and their memories or SEC has no hold mode at all, it is required that its output frequency accuracy be within a certain range. For a reference that can follow the G.811 clock, the SEC output frequency accuracy in the free-run mode should not be greater than 4.6ppm for SDH terminal equipment and 20ppm for REG equipment. ZXMP S330 can satisfy the above requirements.
37
Chapter
ENVIRONMENT ADAPTABILITY
7.1 Power supply requirements
Working voltage and current: Rated working voltage: -48V Rated working current: 6A Nominal voltage: -48VDC Range: -57VDC~-40VDC
7.2
Grounding requirements
If separate grounding is adopted in the equipment room, the grounding resistance should meet the following requirements: 1. The grounding resistance in case of 48V DC is less than or equal to 4. 2. The grounding resistance for the system working ground is less than or equal to 4. 3. The grounding resistance for the lightning protection ground is less than or equal to 4. If the combined grounding is adopted in the user equipment room, the grounding resistance should be less than or equal to 1. The voltage difference among lightning protection ground, system working ground and -48V GND should be less than 1V. The tandem requirements between all groundings are as follows: 1. The -48V ground of the board is isolated from the -48V GND. 2. The board shielding plate is connected to the cabinet via the front panel, and there is an electrical connection with the co-module filter capacitor inside a board. The lightening protection GND only connects to the protection component, and converges with the system working GND at the grounding terminal on the bus bar of the rack. The -48V GND can converge with the PGND, or the combined GND on the bus bar of the rack, or be grounded outside.
7.3
Environment requirements
Operation Environment
1) Climate
Table 7-1 Climate requirement Item Range
38
Chapter 7 - Environment Adaptability
Altitude Air pressure Temperature Temperature change rate Relative humidity Heat radiation
4000m 70 ~ 106kPa -5 ~ +45 0.5/min 5% ~ 90% 300W/s
2) Biological environment Avoid multiplication of microbe, such as eumycete and mycete. Avoid the rodent, e.g., mice. 3) Air cleanliness
Table 7-2 Density requirements for chemical active substances Chemical active substance SO2 H2S NH3 Cl2 HCl HF O3 NO2 Content mean (mg/m) 0.3 0.1 1 0.1 0.1 0.01 0.05 0.5 Max( mg/m) 1 0.5 3 0.3 0.5 0.03 0.1 1
Table 7-3 Density requirements for mechanical active substances Mechanical active substance Precipitable dust/ Content = 15 mg/mh
4) Mechanical stress
Table 7-4 Requirements for mechanical stress Item Acceleration Frequency range direction duration Unit m/S2 Hz XYZ Min 90 Value 0.1 5100, 1005
5) Condition of earthquake According with NEBS GR63 IEC721-2-6 Environmental conditions appearing in nature - Earthquake vibration IEC68-3-3 Environmental testing - Part 3: Background information - Subpart 3: Guidance. Seismic test methods for equipment
39
Environment for Storage

The following international standards are taken as the reference for framing the environment requirements IEC721-3-1 Classes 1K4/1Z2/1Z3/1Z5/1B2/1C2/1S3/1M2 1) Climate
Table 7-5 Climate requirement Item Altitude Air pressure Temperature Temperature change rate Relative humidity Solar radiation Air speed Range 4000m 70 ~ 106kPa -40 ~ +70 0.5/min 10% ~ 100% 600W/s = 30m/s
2) Mechanical stress
Table 7-6 Requirements for mechanical stress Item Acceleration Frequency range direction duration unit m/S2 Hz Min value 0.1 5100, 1005 90
XYZ
The earthquake-proof performance of the whole equipment complies with Earthquake-proof Performance Detection for SDH Optical Communications Equipment (Provisional) and Earthquake-proof Performance Detection for SDH Optical Communications Equipment (Provisional). The earthquake-proof performance detection reaches the eight-level intensity
Cleanness requirements
Cleanness involves dust and harmful gases in the air. The equipment should be operated in the equipment room that meets the cleanness requirements described below: 1).In the transmission equipment room, there is no explosive, electrically conductive, magnetically conductive or corrosive dust. 2).The density of dust particles with the diameter greater than 5m should be no more than 3X104 particles/m3. 3).No corrosive metal or gases that is detrimental to the insulation exist in the equipment room, such as SO2 and NH3. 4).The equipment room should be always kept clean, with doors and windows being closed.
Bearing Requirements of the Equipment Room

The bearing capability of the equipment room should be over 450kg/m2 to hold ZXMP S330 equipment.
40
7.4
EMC requirements
Before introducing the EMC (Electromagnetic Compatibility) requirements, firstly specifies 3 criteria for test results: Performance A: Continuous phenomenon. Neither error nor alarm is allowed. After the electromagnetic interference, the number of errors shall not exceed the maximum of the normal requirement. Performance B: Transient phenomenon. During the electromagnetic interference, the degradation of function is allowed, the equipment can work as expected without the operators interference, the loss of frame and synchronization is not allowed, and neither pattern out-of-sync, nor AIS alarm is generated. The equipment shall work normally after the electromagnetic interference. Performance R: Resistive phenomenon. The fuse or other special devices can be replaced or restarted.
Electronic Static Discharge (ESD)

1). Anti-interference for static discharging The static discharge anti-interference index of ZXMP S330 equipment is shown in Table 7-7. During the operation in the interface area, be sure to wear an antistatic wrist strap.
Table 7-7 Static discharge anti-interference Contact discharge 6kV 8kV Air discharge 8kV 15kV Criterion for test results Performance B Performance R
2). RF electromagnetic radiated susceptibility The RF electromagnetic radiated susceptibility of ZXMP S330 equipment is shown in Table 7-8.
Table 7-8 RF electromagnetic radiated susceptibility Test frequency (80MHz~1000MHz) Electric field intensity 10V/m Amplitude modulation 80%AM (1kHz) Criterion for test results Performance A
3). Electrical fast transient burst susceptibility The electrical fast transient burst susceptibility of ZXMP S330 equipment is shown in Tables 7-9 and 7-10.
Table 7-9 Electrical fast transient burst susceptibility at the DC power port Generator waveform 5/50ns Test voltage 1kV Repeated frequency 5kHz Criterion for test results Performance B
Table 7-10 Electrical fast transient burst susceptibilities at the signal cable and control cable ports Generator waveform 5/50ns Test voltage 1kV Repeated frequency 5kHz Criterion for test results Performance B
41
4). Surge susceptibility The surge susceptibility of ZXMP S330 equipment is shown in Tables 7-11, 7-12, and 7-13.
Table 7-11 Surge susceptibility of DC power The waveform of generators 1.2/50us (8/20s), internal resistance 12 Test mode Line to ground Line to ground Test voltage 1kV 2kV Criterion for test results Performance B Performance R
Table 7-12 Surge susceptibility of the outdoor signal cable The waveform of generators 10/700s, internal resistance 40 Test mode Line to line Line to ground Line to line Line to ground Test voltage 2kV 4kV Criterion for test results Performance B Performance R
Table 7-13 Surge susceptibility of the indoor signal cable Generator waveform 1.2/50s (8/20s), internal resistance 42 Test mode Line to ground Line to ground Test voltage 1kV 2kV Criterion for test results Performance B Performance R
5). Conductivity susceptibility of RF field The conductivity susceptibility of RF field of ZXMP S330 equipment is shown in Table 7-14.
Table 7-14 Conductivity susceptibility of RF field Test frequency 0.15MHz ~ 80MHz Test intensity 3V Amplitude modulation 80%AM (1kHz) Criterion for test results Performance A
Electromagnetic Interference (EMI)

1). Conductive emission electromagnetic interference The conductive emission electromagnetic interference of ZXMP S330 equipment is shown in Table 7-15.
Table 7-15 Conductive emission electromagnetic interference at the direct current port Testing frequency (MHz) 0.02~0.15 0.15~0.5 0.5~30 Limits (dBuV) Quasi-peak 79 79 73 Mean value -66 60
2). Radioactive emission electromagnetic interference
42
The radioactive emission electromagnetic interference of ZXMP S330 equipment is shown in Table 7-16.
Table 7-16 Radio active emission electromagnetic interference Testing frequency (MHz) 30~230 230~1000 Quasi-peak demodulating limit (dBV/m) 10m 40 47 3m 50 57
7.5
Safety requirements
This product adopts the technical requirements specified in the following standard: IEC/EN 60950:2000 Safety of information technology equipment 1. Working voltage and current Rated working voltage: -48V Max. working voltage: -57V Min. working voltage: -40V Rated working current: 6A 2. Insulation classification of the equipment The power supply of the equipment provides the SELV circuit with safe and excessively low voltage, without self-generating dangerous voltage. It belongs to the equipment of the class III insulation (Class III equipment). 3. Optical interface The optical module of the maximum power belongs to (Class 3A). All the optical modules shall be under strict control and certified by authorities (such as UL, TUV and NEMKO), and comply with EN60825. 4. Fuse All the fuses and power modules, including recoverable fuses, shall be certified by authorities such as CE, UL and TUV. 5. Safety mark On the package of the equipment, there are striking labels about antistatic, fragile, waterproof, and damp-proof. The maximum optical power satisfies the 3A safety standard. An obvious label warning against the laser shall be pasted at the optical interface. Cables of different colors shall be used for the power input, shielding GND and lightening protection GND to avoid incorrect connection. Different power connectors shall use coding keys. There shall be a power label at the power inlet. Both the equipment and each board shall have an antistatic label. Grounding symbol switch-off. 6. Mechanical structure In installation, four bolts are designed at the rack bottom (may also be used to adjust balance) to fix the rack to the ground. At the rack top, the corresponding screws are designed to fix the rack to the cabling rack. When installed in the . indicates switch-on, and indicates
43
equipment room, the rack shall be fixed both at the top and bottom to ensure the stability and safety of the equipment. The corners of both the rack and sub-rack are processed to avoid hurting people. 7. Fire protection The materials of the circuit boards in the equipment use the fireproof materials of the V-2 level to prevent the circuits from burning in case of failure. The structural parts use unburnable materials with a good fireproof performance, including surface processing materials. With the effective heat dissipation design, it ensures that the temperature does not exceed 70C to prevent heat aggregation and reduce the possibility of burning. Safe parts passing the safety authentication (CE, UL, etc.) are used. 8. High temperature protection In abnormal conditions, the temperature does not exceed 70C. The plastic parts, components, wires and cables, and safety labels shall all comply with the requirements specified in the safety standard-GB4943/EN60950. 9. Lightening protection In this system, good grounding and isolation and protection of electrical interfaces are used to prevent the dangerous voltage of lightening.
44
Chapter
APPENDIX
8.1 Followed standards
International standards of ITU
1. Overall concept recommendations G.707 and G.780 Network Node Interface for the Synchronous Digital Hierarchy. Vocabulary of Terms for Synchronous Digital Hierarchy (SDH) Networks and Equipment G.707(03/1996) G.780(11/1994) 2.
Recommendations G.783, G.784, G.785 and G.813 for SDH equipment Characteristics of Synchronous Digital Hierarchy (SDH) Equipment Functional Blocks. Synchronous Digital Hierarchy (SDH) Management. It involves SDH management, including the control and supervision functions related to SDH network elements (NE). Characteristics of a Flexible Multiplexer in a Synchronous Digital Environment. J.132, Transport of MPEG-2 Signal in SHD Networks. .
G.783(04/1997) G.784 (01/1994) G.785 (11/1996) G.813 3.
Recommendations G.957, G.958, G.681, G.691, G.692 and F.751 for the
physical layer transmission They include G.652~G.958, G.681, G.691, G.692, and F.751 recommendations. G.957 (07/1995) G.958 (11/1994) G.691(original G.scs) G.652 (04/1997) G.653 (04/1997) G.654 (04/1997) G.655 (10/1996) G.661 (10/98) G.662 (07/1995) G.663 (10/1996) G.671(02/1998) G.681 (10/1996) G.861 (08/1996) Optical Interfaces for Equipment and Systems Relating to Synchronous Digital Hierarchy. Digital Line Systems based on the Synchronous Digital Hierarchy for use on Optical Fiber Cables Optical Interfaces for Single-Channel SDH Systems with Optical Amplifiers, and STM-64 Systems. Characteristics of a Single-Mode Optical Fiber Cable. The optical fiber specified in G.652 has been widely used; namely, it is called as a normal single-mode optical fiber. Characteristics of Dispersion-Shifted Single-mode Optical Fiber Cable. Characteristics of a Cut-off Shifted Single-mode Optical Fiber Cable. Characteristics of a Non-zero Dispersion Shifted Single-mode Optical Fiber Cable Definition and test methods for the relevant generic parameters of optical amplifier devices and subsystems Generic Characteristics of Optical Fiber Amplifier Devices and Sub-Systems. Application Related Aspects of Optical Fiber Amplifier Devices and Sub-Systems Transmission Characteristics of Passive Optical Components Functional Characteristics of Interoffice and Long-haul Line Systems Using Optical Amplifiers, Including Optical Multiplexing Principles and Guidelines for the Integration of Satellite and Radio
Systems in SDH Transport Networks G.703(04/1991) F.751-2(09/1997) Physical/Electrical Characteristics of Hierarchical Digital Interfaces. Transmission Characteristics and Performance Requirements of Radio-relay Systems for SDH Based Networks.
4. Recommendation G.803 (G.805, F.750-3) for network structure G.803 (06/1997) G.805 (11/1995) F.750-3 (09/1997) Architecture of transport Networks based on the Synchronous Digital Hierarchy (SDH). Generic Functional Architecture of Transport Networks. Architectures and Functional Aspects of Radio-Relay Systems for SDH-Base Networks
5. Recommendations G.810~G.813 and G.synce (G.781) for synchronization and timing G.810 (08/1996) G.811 (02/1997) G.812 (02/1997) G.813 (08/1996) G.synce (G.781) Definitions and Terminology for Synchronization Networks Timing Requirements at the Outputs of Primary Reference Clock Suitable for Plesiochronous Operation of International Digital Links. Timing Requirements at the Outputs of Slave Clocks Suitable for Plesiochronous Operation of International digital Links Timing Characteristics of SHD Equipment Slave Clocks. Synchronization Layer Functions.
6. Protection and interworking recommendations G.841 and G. 842 G.841(07/1995) G.842 (04/1997) Types and Characteristics of SHD Network Protection Architecture Interworking of SDH Network Protection Architecture.
7. Performance and measure recommendations G.825, G.826, O.172, O.181, M.1201, M.2110 and M.2120 G.825 (03/1993) G.826 (08/1996) O.181 (05/1996) O.172 M.2101.1 (04/1997) M.2110 (04/1997) M2120 (04/1997) The Control of Jitter and Wander within Digital Networks which are based on the Synchronous Digital Hierarchy (SDH). Error Performance Parameters and Objectives for International, constant Bit Rate Digital Paths at or Above the Primary Rate. Equipment to Assess Error Performance on STM-N Interfaces. Timing Jitter and Wander Measuring Equipment for Digital Systems Which are Based on the Synchronous Digital Hierarchy (SDH) Performance Limits for Bringing-into-service and Maintenance of International SDH Paths and Multiplex Sections. Bringing-into-service of International PDH Paths, Sections and Transmission Systems and SDH Paths and Multiplex Sections. PDH Path, Section and Transmission System and SDH Path and Multiplex Section Fault Detection and Localization Procedures.
8. Network management recommendations G.784, G.831, G.774, G.774.01~G774.09 and G.773 (G.851~G.854, M.3010, M.3100, Q.811, Q.812) G.784 (01/1994) G.831 (08/1996) G.774 (11/1996) G.774.02 (11/1996) SDH management Management Capabilities of Transport Networks Based on the Synchronous Digital Hierarchy (SDH). Synchronous Digital Hierarchy (SDH) Performance Monitoring for the Network-Element View. Synchronous Digital Hierarchy (SDH) configuration of the Payload Structure for the Network Element View. This
46
Chapter 8 - Appendix
G.774.03 (11/1996) G.774.04 (11/1996) G.774.05 (11/1996) G.774.06 (04/1997) G.774.07 (11/1996) G.774.08 (04/1997) G.774.09 (02/1998) ITU-T/M.3010(02/00) ITU-T/M.3010 (2000) ITU-T M.3400
recommendation offers an information model for the payload management of SDH network. Synchronous Digital Hierarchy (SDH) Protection Management for the Network Element View. Synchronous Digital Hierarchy (SDH) management of Sub-network Connection Protection for the Network Element View. Synchronous Digital Hierarchy (SDH) management of Sub-network Connection Supervision Functionality (HCS/LCS) for the Network Element View. Synchronous Digital Hierarchy (SDH) Unidirectional Performance Monitoring for the Network Element View Synchronous Digital Hierarchy (SDH) - G.774 Implementers Guide. Synchronous Digital Hierarchy (SDH) Management of Radio-Relay Systems for the Network Element View. Synchronous Digital Hierarchy (SDH) Configuration of Linear Multiplex Section Protection for the Network Element View. Principles for a Telecommunications management network Amendment 1 (12/03) TMN conformance and TMN compliance TMN management functions
9. EMC, Safety and Environmental Standard For EMC Standard: 1. EMI Standard---CISPR22(EN55022) 2. EN50082-1:1992 or EN55024:1998 EN61000-4-2, 3, 4, 5, 6 series (Mandatory by 1 July 2001)
FOR TNE (Telecommunication network equipment) 3. ETSI EN 300 386 V1.2.1 (2000-03) Electromagnetic compatibility and Radio spectrum Matters (ERM); Telecommunication network equipment; Electromagnetic Compatibility (EMC) requirements Safety Standard---IEC950(EN60950) Environmental standard--ETS 300 019 (T/TR02-12) Storage: Environmental class 1.1 Transport: Environmental class 2.3 Operation: Environmental class 3.4 The relevant recommendations are as follows:
G.773 (03/1993) G.851.1 (11/1996) G.852.1 (11/1996) Protocol Suites for Management of Transmission Systems. Management of the Transport Network-Application of the RM-ODP Framework. Management of the Transport Network-Enterprise Viewpoint for Simple Sub-network Connection Management.
47
G.853.1 (11/1996) G.853.2 (11/1996) G.854.1 (11/1996) M.3030 (05/1996) M.3100 (07/1995) G.664(03/2003) ITU-T G.7041 ITU-T G.7042 G.828 (03/00) G.823 (03/00) G.824 (03/00) ITU-T/V.11/V.11(10/96) ITU-T/V.24/V.24(02/00) ITU-T V.28(03/93) ETSI EN 300 119-3 ETSI EN 300 119-4 IEEE 802.1d IEEE 802.1q IEEE 802.1s IEEE 802.3
Common Element of the Information Viewpoint for the Management of a Transport Network. Sub-network connection Management Information Viewpoint. Management of the Transport Network-Computational Interfaces for Basic Transport Network Model. Principles for a Telecommunications Management Network. Generic Network Information Model. Optical safety procedures and requirements for optical transport systems. Generic frame procedureGFP Link capacity alignment schemeLCASfor virtual concatenated signals Error performance parameters and objectives for international, constant bit rate synchronous digital paths The control of jitter and wander within digital networks which are based on the 2048 Kbit/s hierarchy. The control of jitter and wander within digital networks which are based on the 1544 Kbit/s hierarchy. Electrical characteristics for balanced double-current interchange circuits operating at data signaling rates up to 10 Mbit/s. List of definitions for interchange circuits between data terminal equipment (DTE) and data circuit-terminating equipment (DCE) Electrical characteristics for unbalanced double-current interchange circuits Environmental Engineering (EE) European telecommunication standard for equipment practice; Part 3: Engineering requirements for miscellaneous racks and cabinets "Environmental Engineering (EE); European telecommunication standard for equipment practice; Part 4: Engineering requirements for sub-racks in miscellaneous racks and cabinets" Information Technology- Telecommunications and information exchange between systems--Local and metropolitan area networksCommon Specific requirements--Part 3: MAC Bridge IEEE Standards for Local and metropolitan area networksVirtual Bridged Local Area Networks Multiple spanning tree
IEEE Standard for Information technology --Telecommunications and information exchange between systems--Local and metropolitan area networks--Specific requirements--Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical Layer Specifications Ethernet standard is ISO/IEC 8802-3 (ANSI/IEEE Std 802.3) Fast Ethernet standard is IEEE Std 802.3u-1995
Corporate standards and other standards

Q/ZX04 001-1997 Q/ZX 23.011.04-2001 Q/ZX 04.0141998 Q/ZX04.030999A Component Derating Principles Guide to Electromagnetic Compatibility Test of Electronic Communication Equipment---Transmission Equipment Regulations regarding Product Testability Design Technological Requirement for PCB Design
8.2
ADM
Abbreviations
Full Name Add-Drop Multiplexer
Abbreviations
Abbreviations AIS ANSI APS ASIC ATM AU AUG AU-n AU-PTR BBE BBER BER BITS BML CBR CDM CLP CMI C-n CORBA CV DB DBMS DCC DCE DCF DCN DDN DLL DNA DNI DQDB DTE DWDM DXC ECC EDFA EM EMC EMI EML EMS EOS ES ESD Alarm Indication Signal
Full Name American National Standards Institute Automatic Protection Switching Application Specific Integrated Circuit Asynchronous Transfer Mode Administrative Unit Administration Unit Group Administration Unit, level n Administration Unit Pointer Background Block Error Background Block Error Ratio Bit Error Ratio Building Integrated Timing Supply Business Management Layer Constant Bit Rate Code Division Multiplexing Cell Loss Priority Coded Mark Inversion Container- n Common Object Request Broker Architecture Code Violation Data Base Data Base Management System Data Communications Channel Data Circuit-terminating Equipment Data Communications Function Data Communications Network Digital Data Network Dynamic Link Libraries Distributed Network Architecture Dual Node Interconnection Distributed Queue Double Bus Data Terminal Equipment Dense Wavelength-division Multiplexing Digital Cross Connect Embedded Control Channel Erbium Doped Fiber Amplifier Element Management ElectroMagnetic Compatibility ElectroMagnetic Interference Element Management Layer Element Management System Ethernet Over SDH Error Second Electronic Static Discharge
Abbreviations ESR ETSI FDDI FDM FE FEBBE FEES FESES GUI HDLC HPC HW IEC IEEE IP ITU-T L2 LAN LAPD LAPS LCD LCT LOF LOP LOS LPC MAC MAN MCF MCU MD MF MII MM MS MS-AIS MSOH MSP MS-PSC MS-PSD MS-SPRing MST MTIE NE Error Second Ratio
Full Name European Telecommunication Standards Institute Fiber Distributed Data Interface Frequency Division Multiplexing Fast Ethernet Far End Background Block Error Far End Errored Second Far End Severely Errored Second Graphical User Interface High Digital Link Control Higher order Path Connection High-Way International Electrotechnical Commission Institute of Electrical & Electronic Engineers Internet Protocol International Telecommunication Union-Telecommunication Standardization Sector Layer 2 Local Area Network Link Access Procedure On D-channel Link Access Procedure for SDH Loss of ATM Cell Delineation Local Craft Terminal Loss Of Frame Loss Of Pointer Loss Of Signal Lower order Path Connection Medium Access Control Metropolitan Area Network Message Communication Function Micro Control Unit Mediation Device Mediation Function Medium Independent Interface Multi Mode Multiplex Section Multiplex Sections - Alarm Indication Signal Multiplex Section OverHead Multiplex Section Protection Multiplex Sections - Protection Switching Count Multiplex Sections - Protection Switching Duration Multiplexer Section Shared Protection Ring Multiplex Section Terminal Maximum Time Interval Error Network Element
Abbreviations NEF NEL NML NMS NRZ OAM OFS OOF OS OSF OSI PCB PCM PDH PGND PHY PJEPJE+ POH PPP PRC QA QAF QoS RAM RDI REG REI RFI RIP RMII RS RSOH SAR SDH SEC SEMF SES SESR SETS SM SMCC SML SMN SMS Network Element Function Network Element Layer Network Manager Layer Network Management System Non-Return-to-Zero
Full Name
Operation, Administration and Maintenance Out of Frame Second Out of Frame Operation System Operation System Function Open System Interconnect Printed Circuit Board Pulse Code Modulation Plesiochronous Digital Hierarchy Protection GND physical Layer Device Pointer Justification Event Pointer Justification Event + Path OverHead Point to Point Protocol Primary Reference Clock Q Adaptor Q Adaptor Function Quality of Service Random Access Memory Remote Defect Indication Regenerator Remote Error Indication Remote Failure Indication Router Information Protocol Reduced Medium Independent Interface Regenerator Section Regenerator Section OverHead Segmentation and Reassembly Synchronous Digital Hierarchy SDH Equipment Clock Synchronous Equipment Manage Function Severely Errored Second Severely Errored Second Ratio Synchronous Equipment Timing Source Single Mode Sub-network management control center Service Management Layer SDH Management Network SDH Management Sub-Network
Abbreviations SMT SNC SNCP SOH SPRING SSF SSM SSM STM-N TCP TDEV TDM TM TMN TTL TU TUG-m TU-m UART UAS UBR UNI UPC VBR VC VC VCI VC-n VDN VLAN VP VPI VPG WAN WDM WS WSF ZXMP Surface Mount Technology Sub-network Connection
Full Name
Sub-network Connection Protection Section Overhead Shared Protection Ring Service Signal Fail Synchronization status messaging Synchronous State Message Synchronous Transport Module Level-N Transport Control Protocol Time Deviation Time Division Multiplex Terminal Multiplexer Telecommunications Management Network Transistor-Transistor Logic Tributary Unit Tributary Unit Group, level m Tributary Unit, level m Universal Asynchronous Receiver Transmitter Unavailable Second Unspecified Bit Rate User-Network Interface Usage Parameter Control Variable Bit Rate Virtual Channel Virtual Container Virtual channel Indicator Virtual Container, level n Virtual Data Network Virtual Local Area Network Virtual Path Virtual Path Indicator VP Group Wide Area Network Wavelength Division Multiplexing Work Station Work Station Function Zhong Xing MSTP
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ZXMP S330(V1.

Structure of This Specification

Chapter 1 System Functions

Chapter 2 System Mechanical Structure

Chapter 3 Boards And Slots

Chapter 4 Application Of MSTP

Chapter 5 Networking And Protection

Chapter 6 Performances And Indexes

Chapter 7 Environment Adaptability

Cross-connection and extension capabilities

Service access capabilities

Confidential and Proprietary Information of ZTE CORPORATION

Chapter 1 - System Function

STM-16 STM-4 STM-1

2488.320 622.080 155.520

Equipment and network protection capabilities

Synchronous timing processing capabilities

Technical Specification of ZXMP S330

System control and communication

Confidential and Proprietary Information of ZTE CORPORATION

Chapter 1 - System Function

Network management capabilities

Technical Specification of ZXMP S330

System power supply

Maintenance and upgrade

Perfect EMC and Operation Safety

Confidential and Proprietary Information of ZTE CORPORATION

SYSTEM MECHANICAL STRUCTURE

Confidential and Proprietary Information of ZTE CORPORATION

Technical Specification of ZXMP S330

Alarm LED Power distribution box

Subrack Fan subrack Dust-proof unit

Telephone bracket Cabinet

Lower wiring area Fan shelf Dust-proof unit

Dimensions and weights of components

Confidential and Proprietary Information of ZTE CORPORATION

Chapter 2 - System Mechanical Structure

Confidential and Proprietary Information of ZTE CORPORATION

BOARDS AND SLOTS

Introduction to the boards

Confidential and Proprietary Information of ZTE CORPORATION

Chapter 3 Boards And Slots

Service interface card

Service interface card

Service interface card

Service interface card

Service interface card

Service interface card

Service interface card

Service interface card

Service interface card

Service interface card

Service interface card

Service interface card

Service card Service card

Service card Service card

Service card Service card

Service card Service card

Service card Service card

Service card Service card