R3.0 Product Overview Student Handout 6-12-2007
R3.0 Product Overview Student Handout 6-12-2007
R3.0 Product Overview Student Handout 6-12-2007
PRODUCT OVERVIEW
Revision June 2007 Revision A Software Release: 3.0
Infinera Corporation 169 Java Drive Sunnyvale, CA. 94089 www.infinera.com + 1-408-572-5200
Copyright
2007 Infinera Corporation. All rights reserved. This Manual is the property of Infinera Corporation and is confidential. No part of this Manual may be reproduced for any purposes or transmitted in any form to any third party without the express written consent of Infinera. Infinera makes no warranties or representations, expressed or implied, of any kind relative to the information or any portion thereof contained in this Manual or its adaptation or use, and assumes no responsibility or liability of any kind, including, but not limited to, indirect, special, consequential or incidental damages, (1) for any errors or inaccuracies contained in the information or (2) arising from the adaptation or use of the information or any portion thereof including any application of software referenced or utilized in the Manual. The information in this Manual is subject to change without notice.
Trademarks
Infinera and Infinera Digital Optical Network are trademarks of Infinera Corporation. GoAhead is a trademark of GoAhead Software, Inc. All other trademarks in this Manual are the property of their respective owners.
DOC Class A
This digital apparatus does not exceed the Class A limits for radio noise emissions from digital apparatus as set out in the interference-causing equipment standard titled "Digital Apparatus," ICES-003 of the Department of Communications. Cet appareil numrique respecte les limites de bruits radiolectriques applicables aux appareils numriques de Classe A prescrites dans la norme sur le matriel brouilleur: "Appareils Numriques," NMB-003 dicte par le Ministre des Communications.
Warning
This is a class A product. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures.
FDA
This product complies with the DHHS Rules 21 CFR Subchapter J, Section 1040.10, Applicable at date of manufacture.
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COURSE OUTLINE
June 2007 Revision A Software Release: 3.0 COURSE DESCRIPTION
This training course is designed for the student who needs an introduction into the capabilities of the Infinera Digital Optical Network. Students are provided detailed information on the following topics: System Architecture Chassis Capabilities Hardware functions and features Theory of Operations Software functions and features
LEARNING OBJECTIVES
Upon successful completion of this course, the student should be able to: Describe the functions of Infineras PIC List the capabilities of the DTN and the Optical Line Amplifier Describe the network applications and topologies supported by the DTN/Optical Line Amplifier List the capabilities of the DTC/OTC Describe the functions and features of the hardware modules for the DTC/OTC Describe the power feeds for the DTC Describe the vertical cooling method used in the DTC Describe the functions of the DTC/OTC control plane
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List the components of the control plane for the DTC and the OTC List the components of the data plane for the DTC Describe the system architecture for the DTN and the Optical Line Amplifier List the functions and features of the software available for the DTN/Optical Line Amplifier
COURSE CONDITIONS
There are a maximum of 12 students Students are issued training texts Lectures are presented with projector displays This course is 100% lecture
PREREQUISITES
To be successful in this course, students should have the following skills and knowledge: An understanding of fiber optics and digital communications technology Experience with telecommunications systems Experience with a graphical user interface such as a browser Knowledge of Dense Wavelength Division Multiplexing (DWDM), Synchronous Optical Network (SONET), Synchronous Digital Hierarchy (SDH), and Gigabit Ethernet (GbE)
TIME
The average time for this training course is 1 day.
COURSE OUTLINE
1. Introduction and Administration
a. b. c. a. b. c.
Class Introductions Safety Administrative paperwork Functions of the PIC Infinera Digital Optical Network DTN Capabilities 800Gbps capacity GMPLS G.709 Digital Wrapper
2. System Architecture
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Client signal transport transparency Multiple client signal support O-E-O regeneration Multiple configuration support Add/Drop capabilities Multi-chassis capabilities Digital link reach Topology support Protection capabilities Restoration capabilities Enhanced troubleshooting capabilities Redundant control plane Optical Line Amplifier Capabilities Chapter Review DTN chassis overview Components of the DTC
d. e. a. b.
3. Hardware Overview
Rack mount ears Grounding Power Entry Module(s) (PEM) Input Output (I/O) Panel Timing and Alarm Panel (TAP) Fan Trays Air Filter Card cage DTC Modules Management Control Modules (MCM) Tributary Optical Modules (TOMs) Tributary Adapter Modules (TAMs) Digital Line Module (DLM) TAM Extender Module (TEM) Bandwidth Multiplexing Modules (BMM) Optical Line Amplifier chassis overview Components of the OTC
c.
d. e.
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Input/Alarm Panel Fan Trays Air Filter Card cage OTC Modules Optical Management Module (OMM) Optical Amplifier Modules (OAM) Dispersion Management Chassis Dispersion Compensation Module Chapter Review DTN Power and Cooling Control Plane
f.
g.
h. a. b.
4. Theory of Operations
Network Level DTN Control Plane Components DTN Control Plane DTN Redundant Control Plane NCT cable configurations Optical Line Amplifier Control Plane Components Optical Line Amplifier Control Plane Optical Line Amplifier Redundant Control Plane Data Plane System data plane architecture Digital Terminal Configuration Digital Repeater Configuration Digital Add/Drop Configuration Multi-Chassis Configuration Optical Line Amplifier Signal Flow Chapter Review
c.
d. e. f.
5. Software Overview
a. b. c. d.
Infinera Graphical Node Manager (GNM) Infinera Digital Network Administrator (DNA) TL-1 Chapter Review
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6. Course Review
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System Architecture
CHAPTER LEARNING OBJECTIVES
Upon successful completion of this chapter, the student should be able to: Describe the functions of Infineras Photonic Integrated Circuit (PIC) List the capabilities of the DTN and the Optical Line Amplifier. Describe the network topologies that the DTN and the Optical Line Amplifier can be deployed in.
NOTES:
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EACH PIC CHIP SET FEATURES A TRANSMIT (TX) AND RECEIVE (RCV) PIC PIC CHIP SET FEATURES - TRANSMIT PIC
Infinera currently produces eight different TX PICs. Each TX PIC creates 10 separate 10G wavelengths, then multiplexes the 10 wavelengths into one 100Gbps signal. With just 8 chips, Infinera provides the user 80 individual 10G channels! Each Transmit PIC chip features: 10 x DWDM lasers 10 x 10G DWDM modulators 10 x lambda DWDM multiplexer
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System Architecture
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System Architecture
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GMPLS
Multi-protocol Label Switching (MPLS) is utilized to speed up packet forwarding and provide for traffic engineering in Internet Protocol (IP) networks. Generalized MPLS (GMPLS) extends MPLS to provide the control plane (signaling and routing) for devices that switch in any of these domains: packet; time; wavelength; fiber. This common control plane promises to simplify network operation and management by automating end-to-end provisioning of connections, managing network resources, and providing the level of Quality of Service (QoS) that is expected in the new, sophisticated applications.
NOTES:
Line DTF
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O-E-O REGENERATION
Full Optical-Electrical-Optical (O-E-O) 4R regeneration of every channel at every DTN 4R Re-amplify Reshape Retime Re-FEC
NOTES:
DTN CONFIGURATIONS
Supported configurations include: Digital Terminal (DT) Add-Drop (AD) Digital repeater (DR) Note: The default configuration for a newly commissioned DTN will be Digital Optical Node (DON). Configuration support is based on equipment installed in the DTN, not software Equipment can be added in-service to change functionality and capability All configurations are supported using the same software load.
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ADD/DROP CAPABILITIES
The DTN provides a means for direct access to client data at wavelength (10Gbps, 2.5Gbps, and 1Gbps) granularity at any site, allowing flexible selection of whether to multiplex, add/drop, amplify, groom, or wavelength interchange individual channels. The Infinera DTN is the first Digital Optical Networking System which provides 0 to 100 percent digital add/drop and bandwidth management capabilities at every DTN.
NOTES:
MULTI-CHASSIS CAPABILITIES
No matter the number of individual chassis interconnected, the DTN functions, reports, and is managed as a single Network Element (NE). The DTN supports numerous multi-chassis configurations 2 to 10 chassis configurations are supported
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System Architecture
Optical Line Amplifiers used to extend the Digital Link Up to 7 Optical Line Amplifiers between DTNs Infineras Digital Optical Network components can recover an average of approximately (~) 26db per span for up to 8 spans
Up to 7 Optical Line Amplifiers per Digital Link maximum
8 x 26 Digital Link
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TOPOLOGY SUPPORT
Point-to-Point Single Span Multiple Span Linear Add/Drop Hub and Spoke Ring Mesh
NOTES:
POINT-TO-POINT
The basic deployment is an un-protected point-to-point network. The point-to-point network consists of two DTNs, each configured as a Digital Terminal (DT), connecting two sites in the network. Depending on the distance of the route, the fiber loss and the potential for customer access at intermediate sites along the route, an optimal selection of Optical Line Amplifiers and DTNs can be included in the route.
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LINEAR ADD-DROP
A linear add/drop network is an extension of the point-to-point network configuration. Multiple point-to-point segments are concatenated and traffic is added, dropped, or passed through at the intermediate sites. A point-to-point network can be upgraded in-service to a linear add/drop network by populating the appropriate interfaces at the Digital Repeater (DR) site or at the Digital Terminal (DT) site.
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RING
A ring network is a special case of a linear add/drop network where two Digital Terminal nodes are replaced by a single Digital Add/Drop node. So, a digital optical ring network consists of DTNs configured to perform add/drop function and interconnected in a ring topology. As with all other network configurations, a linear add/drop network is in-service upgradeable to a ring network. Infineras digital optical ring network eliminates the distance limitations on ring circumference. This allows the digital optical ring to be used in metro applications and core network applications
NOTES:
MESH
A mesh network is a special case where there are multiple paths to every destination. As with all other network configurations, a linear add/drop network is in-service upgradeable to a mesh network.
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System Architecture
Chapter Review
Photonic Integrated Circuit (PIC): 1. Integration of ___________ discrete optical components on ONE chip set. Dramatic CapEx reductions __________________ service anywhere Simplify Network Architecture Simplify Engineering and Operations
2. __________________ Dense Wavelength Division Multiplexer on one chip set. 3. Enables ultra low cost ___________________________________ conversion 4. Two PIC chip set features: Transmit PIC _______ x DWDM lasers 10 x 10G DWDM modulators 10 x lambda DWDM multiplexer Receive PIC 10 x 10G receivers _______ lambda DWDM de-multiplexer DTN capabilities: 1. _______ Gbps capacity. 2. _______ Gbps capacity per chassis deployed in 100Gbps ___________ ____________ _________ (OCG) increments. 3. Generalized ___________________ ________________ _________________. 4. G.709 __________ ___________. 5. Client signal transport _________________________. 6. Signal support for:
a. b. c. d. e. f. g. h. i.
__________________________________________ Synchronous Digital Hierarchy (SDH) STM-64 10Gigabit Ethernet (GbE) _______ 10Gigabit Ethernet (GbE) _______ 10 Gigabit ___________ _______________ ______ (2.488) Gigabit Clear Channel SONET __________ SDH STM ________ ________ OC-12
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j. k. l. m.
7. 8. 9. 10. 11.
Optical-________________-Optical (O-_-O) regeneration on every channel. ______ channels at 10Gbps capacity per channel. __________________ capability at each DTN. Enhanced performance monitoring (PM) and troubleshooting capabilities Configurations include: Digital Terminal (DT). ______________ (AD). Digital Repeater (____). ____________ Chassis ____________ Chassis
a. b. c. d. e.
Point-to-Point _______________ Span Point-to-Point _______________ Span Linear __________________ ________________________ ________________________
Optical Line Amplifier capabilities 1. Amplifies the combined optical signal (______________) 2. Extend the ______________________between the DTNs 3. Optical Line Amplifiers are deployed where client access is ______________________________.
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Slide-2 DTN
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CHAPTER LEARNING OBJECTIVES
Upon successful completion of this chapter, the student should be able to: Describe the functions and features of the hardware modules for the DTC. Describe the functions and features of the hardware modules for the OTC.
NOTES:
a. b. c.
Digital Transport Chassis (DTC) Deployed as a Main Chassis or an Expansion Chassis Functions as a: Digital Terminal (DT) Add-Drop (AD) Digital Repeater (DR)
d. e. f. g.
800Gbps bidirectional line side capacity 400Gbps tributary add/drop capacity Installed in a 23 rack or a 600mmx600mm European Telecommunication Standards Institute (ETSI) rack Seven slot card cage
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Slide-4 Chassis
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NOTES:
CHASSIS
The DTC Chassis is: ANSI certified ETSI certified Weight - 78lbs (empty) Fans removed Door removed Top Cover removed 2 person lift 2 DTCs can be installed in standard 7 rack
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NOTES:
GROUNDING POINTS
There are 4 grounding points Two on the rear of the chassis One on each side of the chassis
Note: Although there are multiple grounding points, only one should be connected to achieve proper grounding of the DTC.
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Slide-7 PEM
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a. b.
The LEDs indicate whether the power levels are within specified limits.
TECHNICAL SPECIFICATIONS Each PEM is dual-lugged and shielded around the faceplate permitter. Electrical Power Consumption 50 W Circuit Breaker Rating 70 A Operating Temperature range Normal 5C to 40 C Short Term -5C to 55c (134f)
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NOTES:
The I/O panel Bay level LEDs reflect the status of all chassis in a bay. Table 2: I/O Panel Bay Level LEDs
The I/O panel Chassis level LEDs reflect the severities of the current outstanding alarms within that chassis.
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Slide-9 TAP
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FAN TRAY
The DTC contains two removable fan trays - 11lbs each Each fan tray consists of 3 individually controlled fans The top fan tray is Fan Shelf A The bottom fan tray is Fan Shelf B Both fan trays are required for normal operations and are not redundant Each fan tray is marked with This Side Up to ensure proper installation Power Fault Table 4: Fan Tray LEDs
NOTES:
AIR FILTER
A replacable air filter is located below the bottom fan tray to filter out dust particles at the air intake of the DTC. Air is filtered at 80% dust arrestance. Depending upon the operational environment, the air filters should be replaced at regular intervals, preferably once every 6 months.
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CARD CAGE
The DTC contains a single card cage with seven slots that house up to eight modules.
NOTES:
DTC COMPONENTS
Chassis Rack Mount Ears PEMs IO Panel TAP Fan Tray Air Filter Card Cage
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Slide-15 MCM-B
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DTC MODULES
Management Control Module (MCM) Tributary Optical Module (TOM) Tributary Adapter Module (TAM) Digital Line Module (DLM) TAM Extender Module (TEM) Bandwidth Multiplexer Module (BMM)
NOTES:
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Slide-16 MCM-B
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Note: In a Multi-Chassis configuration, the DCN and AUX ports on the I/O panel of the Main Chassis are active. The DCN and AUX ports on the I/O panel of an Expansion Chassis are disabled. The MCM has the circuit pack status LED indicators and Craft Ethernet/ Serial port connectors on the front panel The MCM-B parameters are: 466Mhz processor 1G NVS 512 SDRAM Single Chassis Multi-Chassis Non-redundant Single MCM An MCM will be installed in both 7A and 7B Redundant
NOTES:
The MCM-B has four circuit pack level LEDs Power (PWR) Node Controller (NC) Active (ACT) Fault (FLT)
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Note: On the ACT MCM in the Main Chassis, the PWR, NC and ACT LEDs will be solid green. On the STBY MCM the PWR LED will be solid green and the ACT LED will be solid amber. On the ACT MCM in an Expansion Chassis, the PWR and ACT LEDs will be solid green. On the STBY MCM in an Expansion Chassis, the PWR LED will be green and the ACT LED will be amber.
NOTES:
The MCM has Craft Ethernet and Serial Ports for management purposes. Table 2-2: MCM Craft Connectors
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TOM-10G-SR1 TOM-10G-IR2 TOM-10G-LR2 1550nm TOM-2.5G-SR1 TOM-2.5G-IR1 TOM-2.5G-IR2 TOM-2.5G-LR2 1550nm TOM-2.5GMR-IR1 TOM-1G-ZX 1550nm TOM-1G-LX TOM-1G-SX 850nm (multimode)
All TOMs have LC connectors Provide client signal interface Client signals are fully transparent TOMs operate at 1310nm except where otherwise noted
Slide-20 TOM-10G-x
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TOM-10G-X
Has signal support for: OC-192 STM64 10G Clear channel 10G LAN 10G WAN
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Slide-21 TOM-2.5G-x
Slide-22 TOM-2.5GMR-x
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TOM-2.5G-X
Has signal support for: OC-48 STM16 2.488G Clear Channel
NOTES:
TOM-2.5GMR-X
Has signal support for: OC-48 STM16 2.488G Clear Channel OC-12 STM4 OC-3 STM1
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Slide-23 TOM-1G-x
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TOM-1G-X
Has signal support for: 1G Ethernet
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Slide-25 TAM-4-2.5G
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NOTES:
All TAMs:
TAM-4-2.5G
The 2.5G Tributary Adapter Module, referred to as the TAM-4-2.5G, maps the client optical signals into digital signals for subsequent transmission through the DLM. Installed in any of the sub-slots in the DLM or TEM Each TAM-4-2.5G has four sub-slots for Tributary Optical Modules 2.5G (TOM-2.5G) Maps client signals into electrical signals Maximum capacity of 10Gbps per TAM-4-2.5G 2.5Gbps per TOM Four TOM-2.5Gs per TAM-4-2.5G The TAM-4-2.5G has three circuit pack level LEDs
a. b. c.
Power (PWR) Active (ACT) Fault (FLT) Table 3: TAM-4-2.5G Circuit Pack Level LEDs
In addition to TAM circuit pack status indicators, it houses the TOM-2.5G circuit pack LEDs: Table 4: TOM-2.5G Port Level LEDs
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Slide-26 TAM-4-1G
An y sub -slot any D L M /TE M 4 ports S upports TO M -1G -LX TO M -1G -S X TO M -1G -ZX C ircuit pack LE D s TO M port LE D s -- O nly the faceplate labeling differentiate the T AM -4-1G from the T AM -4-2.5G .
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TAM-4-1G
The Tributary Adapter Module 1G, referred to as TAM-4-1G, maps the customer client ethernet signals into internal electrical signals for subsequent transmission through the DLM. The TAM-4-1G circuit packs can be arbitrarily equipped in any of the sub-slots located on the DLM or TEM. TAM-4-1Gs provide further sub-slots to enable the insertion of TOMs. TAM-4-1G supports 1GbE client interfaces. It does not support 1GbE multiplexing, rather each 1GbE client signal is mapped into a 2.5G subchannel. The TAM-4-1G has 3 LEDs to indicate the circuit pack status. Table 5: TAM-4-1G status LED indicators
LED Indicator PWR (Power) ACT (Active) FLT (Fault) Color Green Green / Yellow Red Meaning Indicates the presence (lit) or absence (dimmed) of power supply to the TAM-4-1G circuit pack Indicates the TAM-4-1G circuit pack status: Active or Standby Indicates the presence (lit) or absence (dimmed) of an alarm on the TAM-4-1G circuit pack: Critical, Major or Minor
NOTES:
In addition to TAM circuit pack status indicators, the TAM-4-1G houses the TOM-1G circuit pack LEDs: ACT (Active), FLT (Fault) and LOS, one set for each TOM. The significance of an illuminated LED is described in the table below. Table 6: TOM-1G-LX status indicators
LED ACT (Active) FLT (Fault) LOS Color Green / Yellow Red Red Description Indicates the TOM status: Active, Standby or Not provisioned Indicates the presence (lit) or absence (dimmed) of a fault on the TOM Indicates the detection of LOS signal on the TOM
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Slide-27 TAM-8-1G
Any sub-slot any DLM/TEM 8 ports 4 independent port pairs 1a, 1b 2a, 2b 3a, 3b 4a, 4b Supports TOM-1G-LX TOM-1G-SX TOM-1G-ZX Circuit pack LEDs TOM port LEDs
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NOTES:
In addition to TAM circuit pack status indicators, the TAM-8-1G houses the TOM-1G circuit pack LEDs: ACT (Active), FLT (Fault) and LOS, one set for each TOM. The significance of an illuminated LED is described in the table below. Table 8: TOM-1G-LX status indicators
LED ACT (Active) FLT (Fault) LOS Color Green / Yellow Red Red Description Indicates the TOM status: Active, Standby or Not provisioned Indicates the presence (lit) or absence (dimmed) of a fault on the TOM Indicates the detection of LOS signal on the TOM
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Slide-28 TAM-2-10G
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NOTES:
a. b. c.
Power (PWR) Active (ACT) Fault (FLT) Table 9: TAM-2-10G Circuit Pack Level LEDs
a. b. c.
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Slide-29 DLM
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Slide-30
DLM Versions
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Codes and decodes the Forward Error Correction (FEC) signal for each wavelength of the OCG transmitted through the Tx and Rx Photonic Integrated Circuits (PICs) Multiplexes the 10 individual wavelengths into an OCG through the Tx PIC De-multiplexes the OCG into 10 individual wavelengths through the RX PIC Optically connects to the appropriate BMM for transmission over the facility line side Wider dispersion in order to increase distance between regeneration
NOTES:
DLM VERSIONS
Any version of the DLM can be equipped in slots 3 through 6. Note: DLM versions must be mirrored on opposite ends of the digital link. There are sixteen versions of the DLM supporting eight OCGs. Table 11: DLM product details
Product Number DLM-1-C1-A DLM-1-C1-B DLM-1-C2-A DLM-2-C2-A DLM-3-C1-A DLM-3-C1-B DLM-3-C2-A DLM-4-C2-A DLM-5-C1-A DLM-5-C1-B DLM-5-C2-A DLM-6-C2-A DLM-7-C1-A DLM-7-C1-B DLM-7-C2-A DLM-8-C2-A Product Description DLM, OCG 1, C-Band DLM, OCG 1, C-Band DLM, OCG 1, C-Band DLM, OCG 2, C-Band DLM, OCG 3, C-Band DLM, OCG 3, C-Band DLM, OCG 3, C-Band DLM, OCG 4, C-Band DLM, OCG 5, C-Band DLM, OCG 5, C-Band DLM, OCG 5, C-Band DLM, OCG 6, C-Band DLM, OCG 7, C-Band DLM, OCG 7, C-Band DLM, OCG 7, C-Band DLM, OCG 8, C-Band
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The DLM has two fiber connectors. The fiber connections are SC connectors.
NOTES:
a. a. b. c.
The DLM has Line IN and Line OUT connectors to the BMM Power (PWR) Active (ACT) Fault (FLT)
a. b.
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Optical Specifications for the DLM Table 14: DLM Optical Specifications
NOTES:
Parameter Frequency range OCG1 Output power level Frequency range OCG2 Output power level Frequency range OCG3 Output power level Frequency range OCG4 Output power level Frequency range OCG5 Output power level Frequency range OCG6 Output power level Frequency range OCG7 Output power level Frequency range OCG8 Output power level
Specification 1548.915nm - 1563.455nm -13.8dBm to -12.5dBm 1548.515nm - 1563.047nm -13.8dBm to -12.5dBm 1548.115nm - 1562.640nm -13.8dBm to -12.5dBm 1547.715nm - 1562.233nm -13.8dBm to -12.5dBm 1531.507nm - 1545.720nm -13.8dBm to -12.5dBm 1531.116nm - 1545.322nm -13.8dBm to -12.5dBm 1530.334nm - 1544.526nm -13.8dBm to -12.5dBm 1530.725nm - 1544.924nm -13.8dBm to -12.5dBm
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Slide-33 TEM
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NOTES:
a. TEM slots in bold are indirect slot configurations where a cross-connect takes two hops between DLM and TEM.
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Circuit Pack Level LEDs The TEM has 3 LEDs to indicate the circuit pack status. The significance of an illuminated LED is described in the table below.
NOTES:
ACT (Active)
Green / Amber
FLT (Fault)
Red
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Slide-35 BMM
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NOTES:
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BMM-4-CX1-A
BMM-8-CXH1-A
BMM-4-C2-MS-B
BMM-4-CX2-MS-A
BMM-8-CXH2-MS-A
BMM-4-C3-MS-B
BMM-4-CX3-MS-A
BMM-8-CXH3-MS-A
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:The gain ranges for the different BMM types are listed below
BMM Type C1 CX1 CXH1 C2 CX2 CXH2 C3 CX3 CXH3 0-20 0-21 0-20 19-26 20-27.5 19-26.5 25-34 26-34 25-34 BMM Span Loss Range (dB)
NOTES:
BMM LEDS
The BMM has three circuit pack level LEDs to indicate the circuit pack status Power (PWR) Active (ACT) Fault (FLT)
The BMM has two port level LEDs to indicate the status of the combined optical signal Active (ACT) Loss of Signal (LOS) Table 19: BMM Line Connector LEDs
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BMM CONNECTORS
The BMM has many fiber connectors. All the fiber connections are SC connectors. Line connectors Optical Spectrum Analyzer (OSA) monitor connector for line input and output OSA monitor port for facility output L-Band connectors (not present on all BMMs) Dispersion Compensation Module (DCM) connectors (not present on all BMMs) OCG 1 connectors OCG 2 connectors OCG 3 connectors OCG 4 connectors OCG 5 connectors OCG 6 connectors OCG 7 connectors OCG 8 connectors
NOTES:
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NOTES:
Wavelength frequency range 80 Channel BMM (Cn and CXn versions) Line Side Optics Wavelength spacing 50GHZ
1530.334-1563.455nm ITU grid
Wavelength frequency range OSC (all versions) Optical Supervisory Channel Wavelength Format OC-3 100Mbps. Throughput 1510 nm
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NOTES:
OTC COMPONENTS
Rack Mount Grounding PEM IAP Fan Tray Air Filter Card Cage
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OTC CHASSIS
Weight ~ 50lbs - empty Front Cover removed Fans removed ANSI compliant ETSI compliant
NOTES:
Rack Mount
Each OTC includes front rack mounting ears as an integral part of the chassis. They are utilized to front mount the chassis in a 23 rack or 600mmx600mm ETSI rack. Separate mid-mount ears are provided to allow the chassis to mount 1, 2, 5, and 6 forward from the front of the 23 rack.
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Although there are multiple grounding points, only one should be connected to achieve proper grounding of the OTC
Slide-47 OTC PEM
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GROUNDING POINTS
There are 4 grounding points Two on the rear of the chassis One on each side of the chassis
NOTES:
Note: Although there are multiple grounding points, only one should be connected to achieve proper grounding of the OTC.
Technical Specifications Each PEM is dual-lugged and shielded around the faceplate permitter. Electrical Power Consumption 20 W Input voltage range -40 to -60 VDC Operating Temperature Range Normal 5C to 40 C Short Term -5C to 55c
PEM LEDS
The PEM has two status LEDs Power Input Power Fault
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NOTES:
Note: The OTC does not support multi-chassis configuration(s). The Nodal Control and Timing RJ-45 ports are disabled on all OTCs. The I/O Alarm panel Chassis level LEDs reflect the severities of the current outstanding alarms within the chassis.
ALARM INPUT CONTACTS There are 20 alarm input contacts. One Alarm contact is pre-defined and the nineteen other are user configurable alarm contacts. The user configurable alarm contacts are useful for generation of customized alarms which can be triggered remotely through the network management system. ALARM OUTPUT CONTACTS There are 20 alarm output contacts. Ten alarm contacts are pre-defined in the system and the ten other contacts user configurable. The ten user configurable contacts can be used to monitor the environmental alarms.
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Fan Tray
The OTC contains two removable fan trays, one on the left and one on the right. Each fan tray consists of an individually controlled fan. The left fan tray is Fan Shelf A The right fan tray is Fan Shelf B. Both fan trays are required for normal operations and are not redundant. Each Fan Tray has two LEDs
NOTES:
a. b.
Power Fault
Air Filter
An air filter is located beside the right fan tray (Fan B) to filter out dust particles at the air intake of the OTC. Air is filtered at 80% dust arrestance. Depending upon the operational environment, the air filter should be replaced at regular intervals, preferably once every 6 months.
Card Cage
The OTC contains a single card cage that has three slots.
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OTC Components
Rack Mounting Ears IAP PEMs Fan Trays Air Filter Card Cage
NOTES:
OTC Modules
1. Optical Management Module (OMM) 2. Optical Amplifier Module (OAM)
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NOTES:
a. b. c. d.
Note: The OTC does not support multi-chassis configuration(s). Thus, the Node Controller LED should be green (lit).
The OMM has Craft Ethernet and Craft Serial Ports for management purposes.
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OMM Faceplate
Ejector RS232 Serial port Ethernet port LEDs
NOTES:
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The gain ranges for the different OAM types are listed below:
OAM Type C1 C2 CX2, CXH2 C3 CX3, CXH3 OAM Module Gain Range (dB) 0-20 19-26 19-26.5 25-30 25-30.5
NOTES:
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NOTES:
Port Indicators
There are two LEDs: ACTIVE and LOS to indicate the line port status LOS to indicate the OSC port status
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OAM Connectors
Line DCM (some versions) -L-Band (Cn versions only) OSC OSA monitor ports
NOTES:
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NOTES:
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DTC Review
DTC HARDWARE
Rack Mounting Ears PEMs I/O panel Fan Trays Air Filter Card cage
NOTES:
DTC MODULES
MCM TOM TAM DLM TEM BMM
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Chapter Review
DTN CHASSIS
1. Functional description
a. b. c.
Digital Transport Chassis (DTC) Deployed as a _____________ Chassis or an __________________ chassis Functions as a: Digital ____________(___) __________________(___) Digital ________________(DR)
d. e. f. g.
____________ bidirectional line side capacity _________________________ drop capacity Installed in a 23 rack or a 600mmx600mm European Telecommunication Standards Institute (ETSI) rack _____________slot card cage
COMPONENTS OF THE DTC 1. Rack Mounting Ears 2. _____________ grounding points 3. Two ____________________________(___) 4. Input Output (I/O) Panel The I/O panel contains the ____________________________and operations interfaces _______ 10/100Mb auto-negotiating Data Communication Network (DCN) RJ-45 interfaces Two 10Mb Administrative Inter-LAN RJ-45 interfaces, labeled as ________ interface. Chassis level alarm LEDs (_____________________________________________) Bay level alarm LEDs (Critical, Major, Minor) Four inter-chassis interconnect RJ-45 interfaces referred to as Nodal Control and Timing Lamp Test button ACO button ACO LED Craft RS232 Modem port
5. Timing Alarm Panel (TAP) The TAP provides interfaces for __________________________synchronization and __________________________________________ alarm contacts. The TAP provides ___________________________________ timing interfaces. ___________________________________ is not supported in Release 1.0.LT
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6. Fan Tray The DTC contains ____________ removable fan trays. Each fan tray consists of ________________ individually controlled fans. The top fan tray is Fan Shelf A The bottom tray is Fan Shelf B. Both fan trays are ______________________for normal operations and are not redundant. Each Fan Tray has two LEDs
NOTES:
a. b.
7. Air Filter
Power _________________________
8. Card Cage The DTC contains a single card cage that has ______________________slots.
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d. e. f. g. h. i.
Optically _________________________ the ____________into 10x10Gb DWDM channels. Provides optical insertion and extraction of the 1510nm ________________________________________ Provides optical access points for power monitors or optical spectrum analyzers. Accommodates mid-stage access_________________________________ in 9 versions of BMM Provides sub-slot access for the Order Wire Module (OWM) circuit pack There are _____ different BMM types providing different ______ gain and with/without _________________________________________ (for DCM)
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TAM-4-2.5G
a. b. c. d.
Installed in any of the sub-slots in the DLM/_____ Each TAM has __________sub-slots for TOM-2.5G FRU Maximum capacity of _______________________ _______________ per TOM _____________ TOMs per TAM
NOTES:
TAM-4-1G
a. b. c. d.
Installed in any of the sub-slots in the _____/______ Each TAM has __________sub-slots for TOM-1G-LX FRU Maximum capacity of _______________________ _______________ per TOM _____________ TOMs per TAM
TOM-10G
a.
List two versions of the TOM-10G ________________ ________________
b. c. d. e.
Hot-pluggable into any TAM_______ sub-slot _____________ connectors Converts client signals to and from a _________________________ signal FRU
a. b. c. d. e.
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TOM-2.5G
a.
List two versions of the TOM-2.5G ________________ ________________
b. c. d. e.
Hot-pluggable into any TAM_______ sub-slot _____________ connectors Converts client signals to and from a _________________________ signal FRU
a. b.
TOM-1G-X
a. b. c. d.
Hot-pluggable into any TAM_______ sub-slot _____________ connectors Converts client signals to and from a _________________________ signal FRU
a.
______
a. b. c. d.
Optical Transport Chassis (OTC) Bidirectional in-line amplifier used to _______________________________of the DTN Deployed where client access is _________________________________ Installed in a 23 rack or a 600mmx600mm European Telecommunication Standards Institute (ETSI) rack
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3. Two ____________________________(___) 4. I/O Alarm Panel The I/O Alarm panel contains the ________________________ and operations interfaces and _______________________________ alarm input and output contacts ________ 10/100Mb auto-negotiating Data Communication Network (DCN) RJ-45 interfaces Two 10Mb Administrative Inter-LAN RJ-45 interfaces, labeled as _____ interface. Chassis level alarm LEDs (Critical, Major, Minor, Power) Bay level alarm LEDs (Critical, Major, Minor) _________ inter-chassis interconnect RJ-45 interfaces referred to as Nodal Control and Timing Lamp Test button ACO button ACO LED Craft RS232 Modem port
NOTES:
5. Fan Tray The OTC contains ______ removable fan trays, one on the left and one on the right. Each fan tray consists of an __________________________________ controlled fan. The __________________________ fan tray is Fan Shelf A The ______________________________________ tray is Fan Shelf B. Both fan trays are _______________________ for normal operations and are not redundant. Each Fan Tray has two LEDs
a. b.
6. Air Filter
Power Fault
7. Card Cage The OTC contains a single card cage that has three slots.
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It houses Dispersion Compensation Fiber. Supports ________ types of negative DCMs, ranging from 100 ps/nm to 1900 ps/nm in 100 ps/nm increments Supports ________ types of positive DCMs, ranging from 100 ps/nm to 300 ps/nm.
NOTES:
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Theory Of Operations
CHAPTER LEARNING OBJECTIVES
Upon successful completion of this chapter, the student should be able to: Describe the power feeds for the Infinera DTN Describe the vertical cooling method used in the Infinera DTN Describe the functions of the control plane List the components of the control plane for the DTC and the OTC List the components of the data plane for the DTC. Describe the system architectures for the DTC and the OTC
NOTES:
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Power
-48V dual feeds Automated power shutdown for under voltage condition The DTN will attempt an automatic restart when voltage goes above -40V The DTN breakers will trip when the applied power exceeds 72V or 70A requiring a manual reset of the breakers
NOTES:
Cooling
The DTN implements a vertical push pull cooling method
Control Plane
The Control Plane is a logical partition of the DTN system at both the network and node level. At a very broad level, the control plane provides: The ability to locally or remotely provision (configure) the network element in accordance with a specific customer application Performance and fault monitoring, the ability to accumulate performance statistics, and the ability to locally or remotely access the collected information
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NOTES:
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Theory Of Operations
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DLM Mapper
The DLM Mapper codes, decodes, and applies the Forward Error Correction algorithm at the DTF level The DTF is then forwarded to the PIC or Crosspoint DTF and FEC performance monitoring statistics are collected
NOTES:
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NOTES:
BMM Transmit
The BMM combines the eight OCGs onto a common optical path creating a 800G C Band signal. The C Band signal is amplified by an Erbium Doped Fiber Amplifier (EDFA), the OC3 Optical Supervisory Channel (OSC) is added creating the Optical Transport Signal (OTS), performance monitoring statistics are collected, and the signal is sent to the Line Out. Both optical and digital OSC performance monitoring statistics are collected.
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NOTES:
BMM Receive
The 800G OTS is received at the Line In, the OC3 Optical Supervisory Channel (OSC) is removed, dispersion compensation may be applied, and the C Band signal is amplified by an Erbium Doped Fiber Amplifier (EDFA). The BMM then demultiplexes the C Band signal into eight 100G OCGs and each is sent to the appropriate OCG connector.Both optical and digital OSC performance monitoring statistics are collected.
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Express Connection
The 800G OTS is received at the Line In, the C Band is amplified by EDFA, the BMM then demultiplexes the eight 100G OCGs and each is sent to the appropriate OCG connector. On the DLM, the PIC converts the signal from optical to electrical, the Mapper decodes and applies FEC, and then the signal is routed by the Crosspoint to the outbound DLM On the outbound DLM the signal comes in from the Crosspoint to the Mapper, new FEC is coded and read into the DTF, then the PIC converts the signal from electrical to optical and multiplexes the OChs into the OCG The BMM combines the eight OCGs onto a common optical path creating the 800G C Band signal The C Band signal is amplified by the EDFA, the OSC is added, and the OTS is sent to the Line Out
NOTES:
Hairpin Connection
On the TOM the signal from the client is converted from optical to electrical and sent to the TAM On the TAM the client signal is wrapped in the DTF and sent to the DLM/TEM On the DLM/TEM, the signal is routed by the Crosspoint to the provisioned outbound DLM/TEM where the signal from the Crosspoint is sent to the provisioned TAM On the TAM the DTF is stripped and the signal is routed to the appropriate TOM On the TOM the signal is converted from electrical to optical and sent to the client
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Theory Of Operations
Slide-132
Channelized SNC
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Channelized SNC
Channelized cross-connects, and channelized SNCs, associations, and sub-SNCs supported by the TAM-8-1G, which maps two 1GbE circuits to a single 2.5G DTF
NOTES:
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Digital Repeater
Digital Repeater function deployed in OCG increments Up to 200Gbps in each fiber direction per chassis Paired DLMs with expressed backplane capacity Per-channel PM & fault monitoring There is no Add/Drop traffic at a Repeater configuration
NOTES:
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NOTES:
Multi-Chassis Configurations
Combining up to 24 DLMs and 6 BMMs across 10 chassis provides the user with virtually limitless possible configuration variations and directional support.
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NOTES:
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Theory Of Operations
Slide-140 Review
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Chapter Review
Theory of Operations Power and Cooling Control Plane Data Plane Architecture System Configurations
NOTES:
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Theory Of Operations
Chapter Review
1. Power: ______________ redundant feeds 2. Cooling: Vertical ____________ _________________ cooling 3. Control Plane
a.
Functions: The ability to locally or remotely ________________ (configure) the NE in accordance with a specific customer application _____________________ and ________________ monitoring, the ability to accumulate _________________________ statistics, and the ability to locally or remotely access the collected information DTC: _________, BMM, __________ OTC: _____________, ______________
b.
Components
a. a. b. c. d.
DTC: ___________, TAM, __________, ________________, ______________________ Digital _______________________ Digital Repeater Digital ______________________________ Optical Line Amplifier
5. System Configuration
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Software Overview
Chapter Learning Objectives
Upon successful completion of this chapter, the student should be able to: List the functions and features of the software available for the DTN/Optical Line Amplifier
NOTES:
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Software Overview
G ra p h ic a l N o d e M a n a g e r
B ro w s e r la u n c h e d J a va a p p lic a tio n (c a c h e m a n a g e r)
F a u lt M a n a g e m e n t C o n fig u ra tio n M a n a g e m e n t S e rv ic e P ro v is io n in g P e rfo rm a n c e M o n ito rin g S e c u rity M a n a g e m e n t
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NOTES:
Type the target network element DCN or craft IP address in the address bar Note: The craft port may require the use of a crossover cable. The Java applet initiates and JAR files are downloaded The following Java 2 Runtime Environments are supported JRE 1.4.2_04 JRE 1.4.2_06 JRE 1.4.2_09 JRE 1.4.2_10 JRE 1.5.0_04 JRE 1.5.0_05 JRE 1.5.0_06
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Initial Login Default Username - secadmin Default password - Infinera1 Click Login
NOTES:
Note: Usernames and passwords are case sensitive. Security message is displayed Click OK to continue
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Changing Passwords
Change password on initial login or if password expires: Type current password Type new password Confirm new password Click Apply
NOTES:
a. b. c. d.
Equipment Facilities Tools used to control and monitor the target network element Graphical representation of the network element
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Software Overview
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Infinera Corporation
Software Overview
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NOTES:
a.
Exit
Fault management
Contains the drop-down menus.
a. b. c. d. e. f. g.
Alarm Manager Event Log Export all Alarms to file Export all Events to file Export Current View of Alarms to File Export Current View of Events to File Alarm Severity Profile Settings
Configuration
Contains the drop-down menus.
a. b. c. d. e. f. g. h. i. j.
Network Element Create Chassis Create Protection group Equipment Manager Facility Manager Protection Group Manager Link Manager Back Plane Link Manager Static Route Manager Default Templates
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Slide-150 Security
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Provisioning
Contains the drop-down menus.
NOTES:
a. b. c. d.
Security
Contains the drop-down menus.
a. b. c. d.
Change Password NE Security Administration Active User Sessions NE-Wide Security Settings
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Product Overview
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Software Overview
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Tools
Contains the following drop down menus
NOTES:
a. b. c. d. e. f.
SW-DB Manager SW-DB Upload Download Manager PM Upload Scheduler Connectivity Verification Tools TL-1 Session View
Window
Contains the following drop down menus
a. b.
Cascade Node
Help
Contains the following drop down menus
a. b. c.
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The user can right click on any module to access associated drop down menus BMM Menu
a. b. c. d. e. f. g. h. i. j. k. l.
Properties Show Alarms Show Facilities Admin State Alarm Reporting Delete Reset GMPLS Link OSC Span Optical Carrier Group Connectivity Verification Tools
NOTES:
DLM Menu
a. b. c. d. e. f. g. h. i. j. k. l.
Properties Show Alarms Show Facilities Protection Group Manager Admin State Alarm Reporting Delete Reset Provisioning Optical Carrier Group Optical Channels Line DTF Path
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Product Overview
Release 3.0
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MCM Menu
a. b. c. d. e. f. g. h.
Properties Show Alarms Admin State Alarm Reporting Delete Reset Switch over Make Standby
NOTES:
TOM Menu
a. b. c. d. e. f. g. h. i. j. k. l.
Properties Show Alarms Show Facilities Protection Group Manager Admin State Alarm Reporting Delete Provisioning Trib DTF Path Trib Port Client trib termination point Create Protection group
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Product Overview
Release 3.0
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Software Overview
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NOTES:
Equipment Tree
The Equipment Tree provides a hierarchical view of all the equipment contained within the target network element. The Equipment Tree also lists all other nodes in the same signaling domain through the Network Neighborhood. The Equipment Tree displays a tree structure of the following:
a.
Current Network Element View The Current Network Element View displays the target network element and its subequipment. It lists the network elements chassis and other contained equipment in hierarchical format. The Network Neighborhood View lists the network elements within the same signaling domain of the target network element.
b.
When the user selects an item in the Equipment Tree, it is highlighted in the Equipment View by a black outline. Right-clicking an item displays a shortcut menu.
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Product Overview
Release 3.0
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Software Overview
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GNM Help
Context sensitive Search Capable Print capable GNM User Guide and Maintenance and Troubleshooting Guide Access from any screen
NOTES:
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Release 3.0
Page 4-22
Software Overview
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Infinera DNA
Product Overview
Release 3.0
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NOTES:
a. b. c. d. e. a. b. c. d. e.
Fault Management Configuration Management Service Provisioning Performance Management Security Management Network wide real-time fault management and monitoring, including current alarm summary, historical event logs, and threshold crossing alerts Physical and Provisioning topological views, topology updates, auto-discovery and network synchronization Network equipment inventory reporting with comprehensive manufacturing information Scheduling network element configuration backup and manual restoration Historical performance monitoring collection, archiving and viewing
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NOTES:
a. b. c. d. e. f.
Main Menu Equipment Tree Workspace Area Quick View Browser Alarm Manager Status Bar
DNA Views
Topographical View Provisioning View Physical View Quick View Browser Equipment Tree
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NOTES:
TL1 Interface
Transaction Language 1 (TL1) is an industry-recognized common language protocol for messages exchanged between network elements and an Operating System (OS). The TL1 Interface uses the common language protocol to eliminate the need to support vendor-specific interfaces. The TL1 Interface on the network element allows an operations system to perform the following functions:
a. b. c. d. e.
Fault Management Equipment Configuration Service Provisioning Performance Monitoring Security Administration
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Software Overview
Chapter Review
INFINERA GRAPHICAL NODE MANAGER (GNM) OVERVIEW
Infinera GNM is a ____________________element management application that provides users with onsite access and control of Infinera DTN Digital Nodes (DTN) and Infinera Optical Line Amplifiers (Optical Line Amplifier).
TL1 INTERFACE
The TL1 Interface on the network element allows operations system to perform the following functions:
a. b. c. d. e.
Fault Management ________________________ Configuration Service Provisioning ____________________________ Monitoring Security Administration
Product Overview
Release 3.0
Infinera Corporation
Appendix A
Acronyms
Table A-1 List of Acronyms
Abbreviation Description
A
ACLI ACO ACT AD ADM ADPCM AGC AID AINS AIS ALS AMP ANSI AO APD API APS ARC ARP application command line interface alarm cutoff active add/drop add/drop multiplexer adaptive differential pulse code modulation automatic gain control access identifier administrative inservice alarm indication signal automatic laser shutdown amplifier American National Standards Institute autonomous output avalanche photo diode application programming interface automatic protection switching alarm reporting control address resolution protocol
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B
BDFB BDI BDI BEI BER BERT BGA BIP-8 BITS BLSR BMM-C BNC BOL BOM BOOTP bps BPV battery distribution fuse bay backward defect indication backward defect indication backward error indication bit error rate bit error rate testing ball grid array bit interleaved parity building-integrated timing supply bi-directional line switched ring Band Mux Module - C band Bayonet Niell-Concelman; British Naval Connector beginning of life bill of material bootstrap protocol bits per second bipolar violations
C
C CCITT CCLI CDE CDR CDRH Celsius Consultative Committee on International Telegraph and Telephone commissioning command line interface chromatic dispersion equalizer clock and data recovery Center for Devices and Radiological Health
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D
DA DAWN dB DB DCC DCE DCF DCM digital amplifier Digital Amplified Wavelength Network decibel database data communications channel data communications equipment dispersion compensation fiber dispersion compensation module
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E
EDFA EEPROM EMC EMI EMS EOL ESD ES-L ES-P ES-S ETS ETSI erbium doped fiber amplifier electrically-erasable programmable read only memory electromagnetic compatibility electro-magnetic interference element management system end-of-life electrostatic discharge; electrostatic-sensitive device line-errored seconds path-errored seconds section-errored seconds IEEE european test symposium European Telecommunications Standards Institute
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F
F FA FAS FC FCAPS FCC FDA FDI FEC FIFO FIT FLT FPGA FRU FTP fahrenheit frame alignment frame alignment signal fiber channel; failure count fault management, configuration management, accounting, performance monitoring, and security administration Federal Communications Commission (USA) Food and Drug Administration forward defect indication forward error correction first-in-first-out failure in time fault field programmable gate array field replaceable unit file transfer protocol
G
GbE Gbps GCC GFP GHz GMPLS GNE GNM GUI gigabit ethernet gigabits per second general communication channel general framing protocol gigahertz generalized multi protocol label switching gateway network element graphical node manager graphical user interface
H/I
HTML HTTP IAP ICG ID hypertext markup language hypertext transfer protocol input, output and alarm panel invalid code group identification
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J/K/L
Jabber JDK JRE JS LAN LBC LC LCK LED Linear ADM LOF LOL LOP LOS LR LSB LTE LVDS Jabber is the transmission of a packet on a computer network that is larger than the network's MTU Java Development Kit Java Runtime Environment jabber seconds local area network laser bias current fiber optic cable connector type locked light-emitting diode linear add/drop multiplexer loss of frame loss of light loss of pointer loss of signal long reach least significant bit line-terminating equipment low voltage differential signaling
M
MA MAC MB monitoring access media access control megabyte
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N
NA NAND NC NCC NCT NDSF NE NEBS NECG NEPA NJO nm NML NMS NNI NO NSA NTP NVRAM network administrator flash type normally closed; node controller node controller chassis nodal control and timing non zero dispersion shifted fiber network engineer network equipment building system net electrical coding gain national fire protection association negative justification opportunity nanometer network management layer network management system network-to-network interface normally open non-service affecting network time protocol nonvolatile random access memory
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O
OAM OAM&P OC-12 OC-192 OC-3 OC-48 OCG Och OCI ODU OEO OFC OH OIF OLA OMM OMS OOS OOS-MT OPR OPT OPU ORL OS OSA OSC OSNR OSPF OSS OTC OTDR OTN OTS optical amplification module operation, administration, maintenance and provisioning optical carrier signal at 622.08 mb/s optical carrier signal at 9.95328 gb/s optical carrier signal at 155.52 mb/s optical carrier signal at 2.48832 gb/s optical carrier group Optical channel open connection indication optical channel data unit optical-electrical-optical conversion open fiber control overhead optical internetworking forum optical line amplifier optical management module optical multiplex section out-of-service out-of-service maintenance optical power received optical power transmitted optical channel payload unit optical return loss operating system optical spectrum analyzer optical supervisory channel optical signal-to-noise ratio open shortest path first operations support system optical transport chassis optical time domain reflectometer optical transport network optical transport section
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P/Q
PC PCPM PDU PEM PF PG PHY PIC PID PIN PJO PLD PLL PM PMD POH POP PPM PPP PR PRBS ps PSC PSD PSTN PT PTP PWR QOS personal computer per channel power monitoring protocol data unit; power distribution unit power entry module partial failure protection group physical photonic integrated circuit protocol identifier positive-intrinsic negative positive justification opportunity programmable logic device phase locked loop performance monitoring polarization mode dispersion path overhead point-of-presence part per million point-to-point protocol provisioning pseudo random binary sequence pico second (unit of measure for dispersion) protection switch completion; protection switch count protection switch duration public switched telephone network parallel telemetry physical termination point; point-to-point power quality of service
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R
RAM RDI REI-L REI-P RFI ROM RS RSOH RTC RTN RTS RU Rx Rx Q random access memory remote defect indication remote error indication-line remote error indication-path remote failure indication read-only memory regenerator section; reed solomon regenerator section overhead real time clock return lead ready to send rack unit receiver; receive receiver quality
S
SA SAPI SC SD SDH SDRAM SEF SEFS SELV SERDES SES SF SFP SID SMF SML SNC service affecting; security administrator source access point identifier square shaped fiber optic cable connector signal degrade synchronous digital hierarchy synchronized dynamic random access memory severely errored frame severely errored frame second safety extra low voltage serializer and deserializer severely errored seconds signal fail small form factor plug source identifier; system identifier single-mode fiber service management layer subnetwork connection
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T/U/V
TAM TAP TCA TCP TE TEC TEM TERM TFTP TID tributary adapter module timing and alarm panel Threshold Crossing Alert transmission control protocol traffic engineering thermo-electric cooler TAM Extender Module terminal trivial file transfer protocol target identifier
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W/X/Y/Z
WAN WDM XC XFP XML wide area network wavelength division multiplexing cross-connect name of a small form factor 10 Gbps optical transceiver extensible markup language
MISC
1R 2R re-amplification re-amplification, re-shape
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Infinera Corporation