Package de CI
Package de CI
Types of IC Packages (not shown in scale) CBGA - Ceramic Ball Grid Array CCGA - Ceramic Column Grid Array CerDIP - Ceramic Dualin-Line Package CerPack - Ceramic Package CLCC - Ceramic Leadless Chip Carrier CPGA - Ceramic Pin Grid Array CQFP - Ceramic Quad Flat Pack D2PAK or DDPAK - Double Decawatt Package D3PAK - Decawatt Package 3 DFN - Dual Flat No Leads Package DPAK - Decawatt Package FBGA - Fine-Pitch Ball Grid Array JLCC - J-Leaded Ceramic Chip Carrier LFBGA - Low Profile Fine-Pitch Ball Grid Array LGA - Land Grid Array PQFP - Plastic Quad Flat Pack PSOP - Power Small Outline Package QFN - Quad Flat No Leads Package QSOP - Quarter Size Outline Package SBDIP - Sidebraze Dualin-Line Package SC-70 - Small Outline Transistor SIP - Single-In-Line Package SOIC - Small Outline IC Package SOJ - Small Outline JLead Package SOT-23 - Small Outline Transistor SPDIP - Shrink Plastic Dual-in-Line Package SSOP - Shrink Small Outline Package TDFN - Thin Dual Flat No Leads Package TFBGA - Thin Fine-Pitch Ball Grid Array TQFN - Thin Quad Flat No Leads Package TQFP - Thin Quad Flat Pack
LQFP - Low-Profile Quad Flat Package MLP - Micro Leadframe Package MQFP - Metric Quad Flat Package MSOP - Micro Small Outline Package PBGA - Plastic Ball Grid Array PDIP - Plastic Dual-inLine Package PLCC - Plastic Leaded Chip Carrier PPGA - Plastic Pin Grid Array PQFN - Power Quad Flat No Leads Package
TSOP - Thin Small Outline Package TSSOP - Thin Shrink Small Outline Package UTDFN - Ultra Thin Dual Flat No Leads Package UTQFN - Ultra Thin Quad Flat No Leads Package VFBGA - Very Thin FinePitch Ball Grid Array VSOP - Very Small Outline Package XDFN - Extreme Thin Dual Flat No Leads Package XQFN - Extreme Thin Quad Flat No Leads Package