SN54279, SN54LS279A, SN74279, SN74LS279A

QUADRUPLE S-R LATCHES

SDLS093 DECEMBER 1983 REVISED MARCH 1988
1 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 1988, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SN54279, SN54LS279A, SN74279, SN74LS279A
QUADRUPLE S-R LATCHES


SDLS093 DECEMBER 1983 REVISED MARCH 1988
2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
SN54279, SN54LS279A, SN74279, SN74LS279A
QUADRUPLE S-R LATCHES


SDLS093 DECEMBER 1983 REVISED MARCH 1988
3 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
SN54279, SN54LS279A, SN74279, SN74LS279A
QUADRUPLE S-R LATCHES


SDLS093 DECEMBER 1983 REVISED MARCH 1988
4 POST OFFICE BOX 655303 DALLAS, TEXAS 75265



















































































































































































































































































































































































PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
76018012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
7601801EA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
7601801EA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
7601801FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
7601801FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SN54279J OBSOLETE CDIP J 16 TBD Call TI Call TI
SN54279J OBSOLETE CDIP J 16 TBD Call TI Call TI
SN54LS279AJ ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
SN54LS279AJ ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
SN74279N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74279N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74279N3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74279N3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS279AD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279AD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279ADE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279ADE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279ADG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279ADG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279ADR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279ADR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279AN ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS279AN ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS279AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS279AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS279ANE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS279ANE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
SN74LS279ANSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279ANSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS279ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SNJ54279J OBSOLETE CDIP J 16 TBD Call TI Call TI
SNJ54279J OBSOLETE CDIP J 16 TBD Call TI Call TI
SNJ54279W OBSOLETE CFP W 16 TBD Call TI Call TI
SNJ54279W OBSOLETE CFP W 16 TBD Call TI Call TI
SNJ54LS279AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS279AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS279AJ ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS279AJ ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS279AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SNJ54LS279AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 3
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)
W
(mm)
Pin1
Quadrant
SN74LS279ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74LS279ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS279ADR SOIC D 16 2500 333.2 345.9 28.6
SN74LS279ANSR SO NS 16 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA


MLCC006B OCTOBER 1996
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/ D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A NO. OF
MIN MAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32) (18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12 13 14 15 16 18 17
11
10
8
9
7
5
4 3 2
0.020 (0,51)
0.010 (0,25)
6
1 28 26 27
19
21
B SQ
A SQ
22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004