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CD 4520

CD4518B and CD4520B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix) TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

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100% found this document useful (1 vote)
178 views11 pages

CD 4520

CD4518B and CD4520B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix) TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

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Ljupco Mitev
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CD4520

Data sheet acquired from Harris Semiconductor SCHS076D Revised March 2004

The CD4518B and CD4520B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

Copyright 2004, Texas Instruments Incorporated

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PACKAGE OPTION ADDENDUM


28-Feb-2005

PACKAGING INFORMATION
Orderable Device 7702301EA CD4518BE CD4518BF CD4518BF3A CD4518BM CD4518BM96 CD4518BNSR CD4518BPW CD4518BPWR CD4520BE CD4520BF CD4520BF3A CD4520BM CD4520BM96 CD4520BNSR CD4520BPW CD4520BPWR
(1)

Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Package Type CDIP PDIP CDIP CDIP SOIC SOIC SO TSSOP TSSOP PDIP CDIP CDIP SOIC SOIC SO TSSOP TSSOP

Package Drawing J N J J D D NS PW PW N J J D D NS PW PW

Pins 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16

Eco Plan (2) None Pb-Free (RoHS) None None Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) None None Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS)

Lead/Ball Finish Call TI CU NIPDAU Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU

MSL Peak Temp (3) Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-1-250C-UNLIM Level-1-250C-UNLIM Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-1-250C-UNLIM Level-1-250C-UNLIM

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

Addendum-Page 1

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MECHANICAL DATA
MTSS001C JANUARY 1995 REVISED FEBRUARY 1999

PW (R-PDSO-G**)
14 PINS SHOWN

PLASTIC SMALL-OUTLINE PACKAGE

0,65 14 8

0,30 0,19

0,10 M

0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 A 7 0 8 0,75 0,50

Seating Plane 1,20 MAX 0,15 0,05 0,10

PINS ** DIM A MAX

14

16

20

24

28

3,10

5,10

5,10

6,60

7,90

9,80

A MIN

2,90

4,90

4,90

6,40

7,70

9,60

4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153

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