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PCBprocess

The document describes the PCB manufacturing process using dry film positive photoresist. The key steps are: 1) Designing the PCB layout, 2) Applying photoresist to the copper-coated board, 3) Exposing the board to UV light through a photomask, 4) Developing the board to remove unexposed photoresist and reveal the circuit traces, 5) Etching away the exposed copper, 6) Drilling holes for components, and 7) Soldering the components onto the board. Quality control checks are performed after each step of the process.

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97 views5 pages

PCBprocess

The document describes the PCB manufacturing process using dry film positive photoresist. The key steps are: 1) Designing the PCB layout, 2) Applying photoresist to the copper-coated board, 3) Exposing the board to UV light through a photomask, 4) Developing the board to remove unexposed photoresist and reveal the circuit traces, 5) Etching away the exposed copper, 6) Drilling holes for components, and 7) Soldering the components onto the board. Quality control checks are performed after each step of the process.

Uploaded by

api-3755845
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
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PCB Manufacturing Process Using Dry Film Positive

Photo resist laminated to FR-4 Boards


K. Kamel and Hammam Elabd

Dry Film Positive Photoresist


The laminator Machine
1-Design of the layout artwork:
After the schematics generation, the next step is to place
the components on the PCB CAD program. The P-CAD /
ORCAD program is used to generate the PCB mask.

2-Apply photoresist to the board

Clean board
coated with
copper

The boards are coated with very thin film of photoresist.


3-Expose the photoresist

The board is exposed to the light of a UV lamp in a dark


environment. The exposed photoresist is ready to be
developed.
4- Resist Development

The exposed board is placed in a NaOH solution. The traces


which are similar to the mask will become visible on the
board.
Board wash / Rinse is applied to start the etch process
5-Etch Process:

The etchent is Fe2Cl3 solution. The hardened resist


protects the tracks, pads and via’s from the etch solution.
.

6-Drill

In this step the Pads are drilled with its appropriate bit
size / apertures. Now the components are ready to be
soldered.
8-soldering
Place the components and solder.

The automatic tester or the digital voltmeter is used to


check the tracks “short and open tracks”
In all of the above steps a Quality control inspection is
done after each process.

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