‘H’ Part number Last Updated: Nov.

2008

H 5 T Q XX X X X X X - XX X
1 2 3 4 56 7 8 9 10 11 12 13 14

HYNIX MEMORY
OPERATING TEMPERATURE &
PRODUCT FAMILY POWER CONSUMPTION
5 : DRAM C : Commercial Temp1) & Normal Power
L : Commercial Temp1) & Low Power
E : Extended Temp2) & Normal Power
I : Industrial Temp3) & Normal Power
PRODUCT MODE
A : Commercial Temp1) & 1.35 VDD Power
T : DDR3 SDRAM

SPEED(tCL-tRCD-tRP)
P9 : DDR3-1600 9-9-9
POWER SUPPLY PA : DDR3-1600 10-10-10
PB : DDR3-1600 11-11-11
Q : VDD=1.5V & VDDQ=1.5V
H8 : DDR3-1333 8-8-8
C : VDD=1.35V & VDDQ=1.35V
H9 : DDR3-1333 9-9-9
HA : DDR3-1333 10-10-10
G6 : DDR3-1066 6-6-6
DENSITY & REFRESH
G7 : DDR3-1066 7-7-7
51 : 512Mb, 8K/64ms Refresh G8 : DDR3-1066 8-8-8
1G : 1Gb, 8K/64ms Refresh S5 : DDR3-800 5-5-5
2G : 2Gb, 8K/64ms Refresh S6 : DDR3-800 6-6-6
4G : 4Gb, 8K/64ms Refresh
8G : 8Gb, 8K/64ms Refresh

PACKAGE MATERIAL

ORGANIZATION L : Leaded
P : Lead Free (ROHS4) compliant)
4 : x4
R : Lead Free & Halogen Free
8 : x8
6 : x16 (ROHS4) compliant)

PACKAGE TYPE
NUMBER OF BANKS
F : FBGA SDP
3 : 8 Banks
(Single Die Package)
4 : 16 Banks
M : FBGA DDP
(Dual Die Package)
H : FBGA QDP
DIE GENERATION (Quad Die Package)
M : 1st D : 5th
A : 2nd E : 6th
B : 3rd F : 7th
C : 4th G : 8th

Note:
1) Commercial Temperature: 0°C ~ 85°C
2) Extended Temperature: -25°C ~ 85°C
3) Industrial Temperature: -40°C ~ 85°C
4) ROHS : Restriction Of Hazardous Substances
‘HY’ Part number Last Updated: Apr. 2007

HY XX X XX X X X X X X X - XX X

HYNIX MEMORY
TEMPERATURE

PRODUCT FAMILY Blank : Commercial (0℃~85℃)

I : Industrial (-40℃~85℃)
5T : DDR3 SDRAM E : Extended (-25℃~85℃)

SPEED(tCL-tRCD-tRP)
PROCESS & POWER SUPPLY H7 : DDR3-1333 7-7-7
H8 : DDR3-1333 8-8-8
Q : VDD=1.5V & VDDQ=1.5V
H9 : DDR3-1333 9-9-9
G6 : DDR3-1066 6-6-6
G7 : DDR3-1066 7-7-7
G8 : DDR3-1066 8-8-8
DENSITY & REFRESH S5 : DDR3-800 5-5-5
12 : 512Mb, 8K/64ms Refresh S6 : DDR3-800 6-6-6
1G : 1Gb, 8K/64ms Refresh
2G : 2Gb, 8K/64ms Refresh
PACKAGE MATERIAL

P : All Lead Free 1)

(RoHS compliant)
ORGANIZATION
4 : x4
PACKAGE TYPE
8 : x8
16 : x16 F : FBGA Single Die
M : FBGA DDP2)
S : FBGA Stack

NUMBER of BANK POWER CONSUMPTION

3 : 8 Banks N : Normal
4 : 16 Banks L : Low Self Refresh Power
K : Reduced Power

DIE GENERATION
INTERFACE
1 Z : 1st Gen. D : 5th Gen.
: SSTL_15
A : 2nd Gen. E : 6th Gen.
B : 3rd Gen. F : 7th Gen.
C : 4th Gen. G : 8th Gen.

Notes)
1. All Lead-free and RoHS compliant ~ RoHS: Restriction of Hazardous Substance
2. DDP (Dual Die Package)
3. All DDR3 partnumber may also be changed by the result of nomenclature revision in progress