Vlsi Technology
Vlsi Technology
Circuits
Jan M. Rabaey
AAnantha
Design
Perspective
Chandrakasan
Borivoje Nikolic
Design
Methodologies
December 10, 2002
Digital Integrated Circuits2nd
Design Methodologies
100,000,000
.10 1,000,000
.35
Transistor/Staf Month
10,000,000
1,000,000
100,000
1,000
10,000
X
10
2009
2007
2005
2003
2001
1991
1989
1987
1985
1983
100
21%/Yr. compound
Productivity growth rate
1
1981
1999
10
1,000
1997
X x
X X
1995
100
2.5
Productivity (Trans./Staf-Month)
10,000,000
1993
Design Methodologies
A Simple Processor
INPUT/OUTPUT
MEMORY
CONTROL
DATAPATH
Design Methodologies
A System-on-a-Chip: Example
Courtesy: Philips
Design Methodologies
None
1-10
Embedded microprocessor
Configurable/Parameterizable
10-100
Hardwired custom
100-1000
Domain-specific processor
(e.g. DSP)
0.1-1
Somewhat
flexible
Fully
flexible
Flexibility
(or application scope)
Design Methodologies
Design Methodology
Design Methodologies
Implementation Choices
Digital Circuit Implementation Approaches
Custom
Semicustom
Cell-based
Standard Cells
Compiled Cells
Macro Cells
Array-based
Pre-diffused
(Gate Arrays)
Pre-wired
(FPGA's)
Design Methodologies
Courtesy Intel
Design Methodologies
Intel 8080
Intel 8286
Digital Integrated Circuits2nd
Intel 8085
Intel 8486
Courtesy Intel
Design Methodologies
Rows of cells
Feedthrough cell
Logic cell
Routing
channel
Functional
module
(RAM,
multiplier,)
Routing channel
requirements are
reduced by presence
of more interconnect
layers
Design Methodologies
[Brodersen92]
Design Methodologies
Design Methodologies
Design Methodologies
Initial transistor
geometries
Placed
transistors
Routed
cell
Compacted
cell
Courtesy Acadabra
Finished
cell
Design Methodologies
AND
plane
OR
plane
f0
x0
x1
f1
x2
Design Methodologies
Two-Level Logic
Every logic function can be
expressed in sum-of-products
format (AND-OR)
minterm
Design Methodologies
V DD
x0 x0 x1 x1 x2 x2
Pullupdevices
Digital Integrated Circuits2nd
Or-Plane
GND
f0 f1
Pullupdevices
Design Methodologies
BUFFER
PRE-CHARGE
P R E -C H A R G E
BUFFER
PRECHARGE
BUFFER
P R E -C H A R G E
BUFFER
PRE-CHARGE
BU FFER
P R E -C H A R G E
BUFFER
PRECHARGE
BU FFER
BUFFER
P R E -C H A R G E
Courtesy B. Brayton
Design Methodologies
Area:
RPLAs (2 layers)
1.23
SCs (3 layers) 1.00,
NPLAs (4 layers)
1.31
Delay
RPLAs
1.04
SCs
1.00
NPLAs
1.09
Synthesis time: for RPLA , synthesis time equals design time;
SCs and NPLAs still need P&R.
delay
Experimental Results
1.4
0.6
0.2
0
Layout of C2670
Standard cell,
2 layers channel routing
2
SC
Standard cell,
3 layers OTC
Network of PLAs,
4 layers OTC
4
NPLA
area
RPLA
River PLA,
2 layers no additional routing
Design Methodologies
MacroModules
Design Methodologies
Soft MacroModules
Synopsys DesignCompiler
Design Methodologies
Intellectual Property
Design Methodologies
Design Iteration
Pre-Layout
Pre-Layout
Simulation
Simulation
Post-Layout
Post-Layout
Simulation
Simulation
Circuit
CircuitExtraction
Extraction
Behavioral
HDL
HDL
Logic
LogicSynthesis
Synthesis
Structural
Floorplanning
Floorplanning
Placement
Placement
Physical
Routing
Routing
Tape-out
Design Methodologies
Courtesy Synopsys
Design Methodologies
Netlist with
Place-and-Route Info
Place-and-Route
Place-and-Route
Optimization
Optimization
Digital Integrated Circuits2nd
Artwork
Design Methodologies
Late-Binding Implementation
Array-based
Pre-diffused
(Gate Arrays)
Pre-wired
(FPGA's)
Design Methodologies
rowsof
uncommitted
cells
metal
possible
contact
GND
In 1 In2
Uncommited
Cell
In 3 In4
routing
channel
Committed
Cell
(4-input NOR)
Out
Design Methodologies
NM OS
NM OS
Using oxide-isolation
Using gate-isolation
Design Methodologies
continuous
p-dif strip
continuous
n-dif strip
contact for
isolator
GND
From Smith97
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
n-well
p-well
n-dif
p-dif
poly
m1
m2
contact
Design Methodologies
CLR
Q
CLK
Q
D
GND
From Smith97
Design Methodologies
Sea-of-gates
Random Logic
Memory
Subsystem
LSI Logic LEA300K
(0.6 m CMOS)
Digital Integrated Circuits2nd
Design Methodologies
Via-programmable cross-point
metal-5
metal-6
programmable via
[Pileggi02]
Design Methodologies
Prewired Arrays
Classification of prewired arrays (or field-programmable devices):
Design Methodologies
Fuse-Based FPGA
antifuse polysilicon
ONO dielectric
n+ antifuse diffusion
2l
From Smith97
Design Methodologies
I4
I3
I2
I1
I0
Programmable
OR array
I3
I2
I1
I0
Programmable
OR array
PLA
I5
I4
I3
I2
I1
I0
Fixed OR array
PROM
O 3O 2O 1 O 0
PAL
Design Methodologies
Programming a PROM
1
X2
X1
X0
: programmed node
NA NA f 1 f 0
Design Methodologies
k macrocells
product
terms
j -wide OR array
D
OUT
j
macrocell
CLK
A
i inputs
From Smith97
Design Methodologies
2-input mux
as programmable logic block
Configuration
0
F
F=
0
0
0
0
X
Y
Y
1
1
1
0
X
Y
Y
0
0
1
0
0
1
0
1
1
X
Y
X
X
X
Y
1
0
X
Y
XY
XY
XY
X1 Y
X
Y
1
Design Methodologies
SA
Y
1
C
D
SB
S0
S1
Design Methodologies
Memory
Out
In
Out
00
00
01
10
11
ln1 ln2
Design Methodologies
C1....C4
xx
D4
D3
D2
Logic
function
of
xxx
D1
F2
F1
Logic
function
of
xxx
x
xxxxx
xxxx
xxxx
xxxx
Bits
control
xx
xx
xx
xx
Logic
functionx
of
xxx
F4
F3
Figure must be
updated
xxxx
xx
x xx x
xx xx
x
x
x
Bits
control
xx
xx
xx
xx
xxxx
x xx x
xx
xx xx
H
P
Multiplexer Controlled
by Configuration Program
Courtesy Xilinx
Design Methodologies
Interconnect
Point
Programmed interconnection
Input/output pin
Cell
Horizontal
tracks
Vertical tracks
Design Methodologies
Connect Box
Interconnect
Point
Design Methodologies
Design Methodologies
Design Methodologies
Primary inputs
Courtesy Altera
Design Methodologies
Altera MAX
From Smith97
Design Methodologies
row channel
t PIA
LAB1
LAB2
LAB
PIA
t PIA
LAB6
Array-based
(MAX 3000-7000)
Digital Integrated Circuits2nd
Mesh-based
(MAX 9000)
Courtesy Altera
Design Methodologies
I/O B u ffe rs
I/O B u ffe r s
Standard-cell like
floorplan
R o w s o f lo g i c m o d u le s
R o u ti n g c h a n n e ls
I / O B u ff e r s
Design Methodologies
CLB
12
Quad
Single
Double
Long
2
3
12
Quad
Long
Global
Long
Clock
Direct
Connect
Long
2
Carry
Direct
Courtesy Xilinx
Design Methodologies
RAM-based FPGA
Xilinx XC4000ex
Digital Integrated Circuits2nd
Courtesy Xilinx
Design Methodologies
Design Methodologies
1-mm 2-metal
CMOS tech
600k transistors
208-pin PGA
fclock = 50 MHz
av
= 3.6 W @ 5V
Design Methodologies
Design at a crossroad
Analog
System-on-a-Chip
C
system
+2 Gbit
DRAM
Recognition
Design Methodologies
Reuse element
Status
1st
Standard cells
Well established
2nd
IP blocks
Being introduced
3rd
Architecture
Emerging
4th
IC
Early research
Design Methodologies
Architecture ReUse
Design Methodologies
Platform-Based Design
Only the consumer gets freedom of choice;
designers need freedom from choice
(Orfali, et al, 1996, p.522)
Source:R.Newton
Design Methodologies
5.2mm x 6.7mm
1.2 Million transistors
Reconfigurable
Data-path
Interface
ARM8 Core
40 MHz at 1V
2 extra supplies: 0.4V, 1.5V
1.5~2 mW power dissipation
Design Methodologies
Embedded memories
Embedded PowerPc
Hardwired multipliers
Courtesy Xilinx
Design Methodologies
Summary
Digital CMOS Design is kicking and healthy
Some major challenges down the road caused
by Deep Sub-micron
Design Methodologies