MTJ Cafm
MTJ Cafm
Magnetoresistive
Random Access
Memory (MRAM)
Everspin Technologies
Existing technology: 80
nm x 160 nm
Less than 65 nm
required to compete with
DRAM or Flash
Current
Field
N
Time
S
2
Field
CoFeB
MgO
M s2 K int
K eff K bulk
2 0 tCoFeB
Ikeda et. al. Nat. Mat. 9 721 (2010)
4
Voltage-Controlled Interface K
Thick, low Hc layer CoFeB
Hc
excess eMgO
e- deficit
d = 7 m
Hc
Thin, high Hc layer CoFeB
M(H) Top
M(H) Bottom
V(t)
Pt (30 nm)
Pt (30 nm)
Ru (10 nm)
CoFeB (1.6 nm)
MgO (~1.8 nm)
CoFeB (0.8 nm)
Ta (7 nm)
Ru (8 nm)
Ta (7 nm)
SiO2 (1 m)
SiO2 (1 m)
Si
Si
JHU, Co40Fe40B20
U Ariz., Co20Fe60B20
6
Topographic image
Current map
z
x
Heff,z = 0
time
APP switching nucleates at edge
M up
time
M down
11
22 nm
Co20Fe60B20/MgO/Co20Fe60B20
MTJs
Switching in 22 nm MTJs
Co20Fe60B20 (0.8 nm)/1.0 nm
MgO/ Co20Fe60B20 (1.6 nm)
14