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OSP Reaction Mechanism

The document summarizes the reaction mechanism of organic solderability preservatives (OSP). It states that: 1) Azole compounds like benz-imidazole, imidazole, and triazole in OSP materials adsorb onto exposed copper surfaces. 2) This leads to hydrogen elimination, dehydration, and chelate formation between the azole nitrogen and copper ions. 3) An organic film then forms on the copper land through further chelation of additional azole compounds and copper ions.

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409 views2 pages

OSP Reaction Mechanism

The document summarizes the reaction mechanism of organic solderability preservatives (OSP). It states that: 1) Azole compounds like benz-imidazole, imidazole, and triazole in OSP materials adsorb onto exposed copper surfaces. 2) This leads to hydrogen elimination, dehydration, and chelate formation between the azole nitrogen and copper ions. 3) An organic film then forms on the copper land through further chelation of additional azole compounds and copper ions.

Uploaded by

smtdrkd
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
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OSP reaction mechanism

Organic film is formed by azole compound in OSP material.


WPF106A and WPF15 have benz-imidazole ,KESTER has imidazole and triazole

N N N

R R N

NH NH
NH
benz-imidazole imidazole triazole
*note: R means branched chain, and is different between each OSP materials

Reaction mechanism»
azole compounds adsorption (2) Hydrogen(proton) elimination
on exposed copper surface and dehydration
N N N
N N N
R R R + H2
R R R
N- N- N-
NH NH NH Cu+ Cu+ Cu+

copper land copper land


OSP reaction mechanism
chelate formation (4) Organic film formation

N: N: N: N: N: N:

R R R R R R
N- N- N- N
N N
Cu+ Cu+ Cu+ Cu++ Cu++ Cu++

copper land N: N:
N:

R R R
N N N
Cu+ Cu+ Cu+

copper land

Copper chelate is formed by Cu2+ in OSP mater


or Copper surface on PWB
KESTER has no Cu2+

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