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Assembly and Test Flow:: Wafer/Die

The document outlines the assembly and test flow for semiconductor manufacturing. It involves wafer preparation, die bonding individual dies to a leadframe via soldering, wire bonding connections between the die and leadframe, molding the assembly for protection using compound, plating for corrosion protection, inspection and testing at various stages, marking or vision inspection, and final packaging and shipping after quality assurance approval.

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Freddy R
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33 views5 pages

Assembly and Test Flow:: Wafer/Die

The document outlines the assembly and test flow for semiconductor manufacturing. It involves wafer preparation, die bonding individual dies to a leadframe via soldering, wire bonding connections between the die and leadframe, molding the assembly for protection using compound, plating for corrosion protection, inspection and testing at various stages, marking or vision inspection, and final packaging and shipping after quality assurance approval.

Uploaded by

Freddy R
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Assembly and Test Flow :

WAFER/DIE

WAFER

DIE PREPARATION

WAFER MOUNT

WAFER SAW

WAFER WASH

LEADFRAME &
SOLDER WIRE

DIE BOND
DIE BOND

WIRE

WIRE BOND
WIRE BOND

MOLD

MOLD COMPOUND

MOLD
PRODUCTION MONITOR

PLATING
PLATING
PRODUCTION MONITOR

ASSEMBLY
INSPECTION

ASSEMBLY INSPECTION

TRIM & FORM

TRIM & FORM

TEST
FINAL TEST

-----------------------------------------------------------------------------------------------------------------------------MARK/ VISION
MARK

Visual
Mechanical
Inspection

V/M INSPECTION

-----------------------------------------------------------------------------------------------------------------------------QA GATE
Out Going GATE

PACK & SHIP

a. X-Ray Photo

b. For Wire Bonding Process

c. Top side and Bottom side view

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