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Basic Soldering Procedure-1

The document outlines the basic steps for soldering components to a printed circuit board. The steps include: 1) preparing the soldering iron tip by cleaning and tinning it; 2) setting the soldering station temperature to 350°C; 3) ensuring the solder sponge is damp for cleaning the tip; 4) inserting the component leads into the circuit board and bending them; 5) heating both the lead and pad with the soldering iron and applying solder; 6) allowing the joint to cool naturally without blowing on it; and 7) inspecting the joint for a smooth, shiny connection when complete.

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vgmanjunatha
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57 views

Basic Soldering Procedure-1

The document outlines the basic steps for soldering components to a printed circuit board. The steps include: 1) preparing the soldering iron tip by cleaning and tinning it; 2) setting the soldering station temperature to 350°C; 3) ensuring the solder sponge is damp for cleaning the tip; 4) inserting the component leads into the circuit board and bending them; 5) heating both the lead and pad with the soldering iron and applying solder; 6) allowing the joint to cool naturally without blowing on it; and 7) inspecting the joint for a smooth, shiny connection when complete.

Uploaded by

vgmanjunatha
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as DOC, PDF, TXT or read online on Scribd
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BASIC SOLDERING PROCEDURE

Step 1

Check that your soldering iron tip is suitable for the Project. (no larger than the
diameter of the pad).
Check the tip is clean and shiny. If not, tin it by adding a small amount of solder
to the tip.

Step 2

Adjust the temperature of the soldering station to 3500 C (degrees Celsius )

Step 3

Ensure the solder sponge is damp. A dry sponge will not clean the tip
effectively, and one that is too wet will lower the temperature of the tip making
for an ineffective solder joint.

Step 4

Carefully wipe the tip on the damp sponge until clean. Continually wipe the tip
while soldering a circuit board.

Step 5

Bend the lead of the component


using fine pliers so that it easily
slides into the holes of the printed
circuit pad.

Step 5

Insert the component to be soldered into the circuit board and bend the leads
protruding from the bottom of the circuit board at an angle of approx 450.

Step 6

Cut the leads of the component close to the outer edge of the solder pad.

Step 7

When ready, hold the soldering iron at a 45 angle, and heat both the lead and
the pad simultaneously. Touch the solder wire in the space between the iron tip
and the lead.

Step 7

Keep the soldering iron tip still while moving the solder around the joint as it
melts.

Step 8
Step 9

Remove the solder tip first and the solder wire next, (prevents spiking).
Allow to the joint to cool naturally and undisturbed, do not blow on the solder
joint to cool it.

Step 10

When you have completed all solder joints thoroughly clean your board, using
Isopropyl Alcohol, and a bristle brush, to remove the flux residue and other
contaminants.

Step 11

Wipe or pat dry with a lint free tissue to remove traces of residue.

Step 12

Inspect for a good solder connection. The solder joint should be clean, smooth
and shiny.
The solder fillet should be concave in shape, feathering out smoothly to the
edge of the pad. In the diagram below figure b) is the ideal solder joint.
Figure a) the amount of solder applied is minimal and may result in a poor
electrical connection over time.

Figure c) indicates an excessive amount of solder has been applied to the


connection. This may damage the solder pad due to excessive heat applied.

Step 13

Leave a large blob of solder on the tip when switching the iron off as this will
protect the tip from oxidation and contamination.

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