Free Video Lectures For MBA
Free Video Lectures For MBA
Free Video Lectures For MBA
By:
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INTRODUCTION TO
CMOS VLSI
DESIGN
LECTURE 15:
NONIDEAL TRANSISTORS
David Harris
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OUTLINE
Transistor I-V Review
Nonideal Transistor Behavior
Velocity Saturation
Channel Length Modulation
Body Effect
Leakage
Temperature Sensitivity
Process Corners
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Slide
3
CMOS VLSI Design
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Vgs Vt
V V V
ds
ds
dsat
Vds Vdsat
V
I ds Vgs Vt ds
2
Vgs Vt
cutoff
linear
saturation
Slide
4
Ideal Models
= 155(W/L)
Vt = 0.4 V
VDD = 1.8 V
Ids (mA)
mA/V2
400
Vgs = 1.8
300
Vgs = 1.5
200
Vgs = 1.2
100
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Vgs = 0.9
Vgs = 0.6
0
0.3
0.6
0.9
1.2
1.5
1.8
Vds
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5
CMOS VLSI Design
250
Vgs = 1.8
200
Vgs = 1.5
150
Vgs = 1.2
Ids (mA)
100
Vgs = 0.9
50
Vgs = 0.6
0
0
0.3
0.6
0.9
1.2
1.5
Vds
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6
CMOS VLSI Design
250
Vgs = 1.8
200
Vgs = 1.5
150
Vgs = 1.2
Less ON current
No square law
Current increases
in saturation
Ids (mA)
100
Vgs = 0.9
50
Vgs = 0.6
0
0
0.3
0.6
0.9
1.2
1.5
Vds
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7
CMOS VLSI Design
VELOCITY SATURATION
v = mElat = mVds/L
nsat
nsat / 2
Better model
Elat
v
vsat Esat
Elat
1
Esat
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slope = m
0
0
Esat
2Esat
3Esat
Elat
Slide
8
I ds mCox
Vgs Vt
L
2
2
2
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9
CMOS VLSI Design
A-POWER
MODEL
Vgs Vt
cutoff
Vds Vdsat
linear
Vds Vdsat
saturation
I dsat Pc
400
Vt
gs
Vdsat Pv Vgs Vt
a /2
Simulated
a-law
Shockley
Ids (mA)
I ds I dsat ds
Vdsat
I dsat
300
Vgs = 1.8
200
Vgs = 1.5
100
Vgs = 1.2
Vgs = 0.9
Vgs = 0.6
0
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0.3
0.6
0.9
1.2
1.5
1.8 V
ds
Slide
10
DD
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Depletion Region
Width: Ld
n+
L
Leff
n+
p GND
bulk Si
DD
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11
CMOS VLSI Design
gs
Vt 1 lVds
2
400
Vgs = 1.8
300
Vgs = 1.5
200
Vgs = 1.2
100
0
0
I ds
Ids (mA)
Vgs = 0.9
Vgs = 0.6
0.3
0.6
0.9
1.2
1.5
1.8 Vds
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Slide
12
BODY EFFECT
Vt: gate voltage necessary to invert channel
Increases if source voltage increases because
source is connected to the channel
Increase in Vt with Vs is called the body effect
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Slide
13
CMOS VLSI Design
fs Vsb fs
NA
ni
tox
ox
2q si N A
2q si N A
Cox
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Slide
14
CMOS VLSI Design
Current doesnt go
to 0 in cutoff
10 mA
Saturation
Region
Subthreshold
Region
Vds = 1.8
1 mA
100 nA
10 nA
ds
Subthreshold
Slope
1 nA
100 pA
10 pA
Vt
0
0.3
0.6
0.9
1.2
1.5
1.8
Vgs
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Slide
15
CMOS VLSI Design
LEAKAGE SOURCES
Subthreshold conduction
Junction leakage
Gate leakage
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16
CMOS VLSI Design
SUBTHRESHOLD LEAKAGE
I ds 0 vT2 e1.8
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I ds I ds 0e
nvT
Vds
v
1 e T
Slide
17
CMOS VLSI Design
DIBL
Vt Vt hVds
ttds
VVVh
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18
CMOS VLSI Design
DIBL
Vt Vt hVds
ttds
VVVh
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19
CMOS VLSI Design
JUNCTION LEAKAGE
Is depends
And area
VvD
T
I D I S e 1
on doping levels
p+
n+
n+
p+
p+
n+
n well
p substrate
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20
GATE LEAKAGE
Carriers may tunnel thorough very thin gate oxides
Predicted tunneling current (from [Song01])
tox
VDD trend
0.6 nm
0.8 nm
JG (A/cm )
106
103
1.0 nm
1.2 nm
100
1.5 nm
109
1.9 nm
10-3
10-6
10-9
0
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0.3
0.6
0.9
1.2
1.5
1.8
VDD
Slide
21
TEMPERATURE SENSITIVITY
Increasing temperature
ION
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Reduces mobility
Reduces Vt
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22
CMOS VLSI Design
TEMPERATURE SENSITIVITY
Increasing temperature
Reduces mobility
Reduces Vt
ION
Vgs
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Slide
23
CMOS VLSI Design
SO WHAT?
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Slide
24
CMOS VLSI Design
PARAMETER VARIATION
Transistors have uncertainty in parameters
Fast (F)
fast
FF
SF
Leff: ______
Vt: ______
tox: ______
pMOS
TT
FS
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SS
slow
slow
nMOS
fast
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25
CMOS VLSI Design
PARAMETER VARIATION
Transistors have uncertainty in parameters
Fast (F)
fast
FF
SF
Leff: short
Vt: low
tox: thin
pMOS
TT
FS
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SS
slow
slow
nMOS
fast
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26
CMOS VLSI Design
ENVIRONMENTAL VARIATION
VDD and T also vary in time and space
Fast:
Corner
Voltage
Temperature
1.8
70 C
VDD: ____
T: ____
F
T
S
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27
CMOS VLSI Design
ENVIRONMENTAL VARIATION
VDD and T also vary in time and space
Fast:
Corner
Voltage
Temperature
1.98
0C
1.8
70 C
1.62
125 C
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VDD: high
T:
low
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28
CMOS VLSI Design
PROCESS CORNERS
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29
CMOS VLSI Design
IMPORTANT CORNERS
nMOS
pMOS
VDD
Cycle time
Temp
Purpose
Power
Subthrehold
leakage
Pseudo-nMOS
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30
CMOS VLSI Design
IMPORTANT CORNERS
nMOS
pMOS
VDD
Temp
Cycle time
Power
Subthrehold
leakage
Pseudo-nMOS S
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Purpose
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31
CMOS VLSI Design