DRAM Component Part Numbering System

The part numbering system is available at www.micron.com/numbering

DDR4/DDR3/DDR2/DDR/SDRAM, Mobile LPDDR4/LPDDR3/LPDDR2/LPDDR/LPSDR, RLDRAM &

GDDR5 Memory
MT 42 A 128M16 D1 KL - 25 IT ES :A
Micron Technology Die Revision Designator
Product Family Production Status
40 = DDR4 SDRAM ES = Engineering sample
41 = DDR3 SDRAM MS = Mechanical sample
42 = Mobile LPDDR2 Blank = Production
44 = RLDRAM 3
46 = DDR SDRAM/Mobile LPDDR Operating Temperatures
47 = DDR2 SDRAM Blank = Commercial temperature
48 = SDRAM/Mobile LPSDR IT** = Industrial temperature
49 = RLDRAM (1 & 2)
51 = GDDR5
52 = Mobile LPDDR3
53 = Mobile LPDDR4 (2x16 ch/die)
Voltage Special Options
A = 1.2V VDD CMOS
B = 1.1V VDD CMOS A = Automotive
C = 5.0V VCC CMOS G = Graphics
G = 3.0V VDD CMOS L = Low power
H = 1.8V VDD CMOS M = Reduced standby
HC = 1.8V VDD CMOS, 1.2V I/O X = Product Longevity Program (Automotive & Industrial only)
J = 1.5V VDD CMOS
K = 1.35V VDD CMOS Access/Cycle Time
L = 1.2V VDD CMOS DRAM Speed Grade
t
RAC Access
LC = 3.3V VDD CMOS Technology Mark Time
N = 1.0V VDD CMOS All DRAM -0 Untested
R = 1.55V VDD CMOS -A Untested
V = 2.5V VDD CMOS
DRAM Speed Grade MAX Clock PC Targets
Component Configuration Technology Mark Frequency CL-
t
RCD-
t
RP
Depth, Width DDR4 -107E 933 MHz 13-13-13
Blank = Bits SDRAM -107H 933 MHz 14-13-13
K = Kilobits -093E 1067 MHz 15-15-15
M = Megabits -093H 1067 MHz 16-15-15
G = Gigabits -083E 1200 MHz 16-16-16
-075 1333 MHz 19-19-19
Device Versions DDR3 -15E 667 MHz 9-9-9
Alphanumeric character(s) specified by individual data sheet SDRAM -125 800 MHz 11-11-11
-125E 800 MHz 10-10-10
Mobile devices -107 933 MHz 13-13-13
D1 = Single die (LPDDR2, LPDDR3, LPDDR4) -093 1067 MHz 14-14-14
LF = Single die (LPDDR) DDR2 -3 333 MHz 5-5-5
LG = Single die, reduced page-size addressing (LPDDR) SDRAM -25 400 MHz 6-6-6
D2 = 2-die stack (LPDDR2, LPDDR3, LPDDR4) -25E 400 MHz 5-5-5
L2 = 2-die stack (LPDDR) -187E 533 MHz 7-7-7
D4 = 4-die stack (LPDDR2, LPDDR3, LPDDR4) DDR -75 133 MHz 2.5-3-3
L4 = 4-die stack (LPDDR) SDRAM -6T 167 MHz 2.5-3-3
D6 = 6-die stack (LPDDR3) -5B 200 MHz 3-3-3
SDRAM -75 133 MHz 3-3-3
RLDRAM only -7E 133 MHz 2-2-2
Blank = Common I/O -6A 167 MHz 3-3-3
C = Separate I/O -5 200 MHz 3-3-3
Mobile -046 2133MHz
LPDDR4 -053 1866MHz
DRAM Package Codes* -062 1600MHz
-075 1333MHz
Lead Pb-Free/RoHS-Compliant -093 1066MHz
Plating Plating -125 800MHz
DDR4 SDRAM -125 800MHz
Package Description***
AT = Automotive temperature
WT= Wireless temperature
**The number one (1) and the capital letter I utilize the same laser markI
(Multiple processing codes are separated by a space and are listed in hierarchical order)
XT= Wide temperature
DDR4 SDRAM -125 800MHz
HA FBGA (96-ball, 9 x 14) -18 533MHz
HX FBGA (78-ball, 9 x 11.5) -375 266MHz
TRF FBGA (TwinDie, 78-ball, 9.5 x 11.5) Mobile -15 667 MHz 10-10-10
DDR3 SDRAM LPDDR3 -125 800 MHz 12-12-12
DA FBGA (78-ball, 8 x 10.5) Mobile -18 533 MHz
RG FBGA (78-ball, 7.5 x 10.6) LPDDR2 -25 400 MHz
HX FBGA (78-ball, 9 x 11.5) -3 333 MHz
JP FBGA (78-ball, 8 x 11.5) -37 266 MHz
RH FBGA (78-ball, 9 x 10.5) -5 200 MHz
RA FBGA (78-ball, 10.5 x 12) Mobile -75 133 MHz
JT FBGA (96-ball, 8 x 14) LPDDR -6 167 MHz
TW FBGA (96-ball, 8 x 14) (30nm) -54 185 MHz
HA FBGA (96-ball, 9 x 14) -5 200 MHz
LY FBGA (96-ball, 7.5 x 13.5) -48 208 MHz
SMA FBGA (QuadDie, 78-ball, 9.5 x 11.5) Mobile -8 125 MHz
SLD FBGA (TwinDie, 136-ball, 10 x 14) LPSDR -75 133 MHz
TNA FBGA (TwinDie, 96-ball, 10 x 14 X8 + X8) -6 167 MHz
TRF FBGA (TwinDie, 78-ball, 9.5 x 11.5) RLDRAM -5 200 MHz
DDR2 SDRAM 1 & 2 -33 300 MHz
SH FBGA (60-ball, 8 x 10) (30nm) -25 400 MHz with
t
RC 20ns
JN CF FBGA (60-ball, 8 x 10) -25E 400 MHz with
t
RC 15ns
NF FBGA (84-ball, 8 x 12.5) (30nm) -18 533 MHz
HW HR FBGA (84-ball, 8 x 12.5) RLDRAM 3 -125 800 MHz with
t
RC (MIN) 12ns
PK RT FBGA (84-ball, 9 x 12.5) -125E 800 MHz with
t
RC (MIN) 10ns
EB FBGA (60-ball, 9 x 11.5) -107 933 MHz with
t
RC (MIN) 10ns
WTR FBGA (TwinDie, 63-ball, 9 x 11.5) -107E 933 MHz with
t
RC (MIN) 8ns
THN FBGA (TwinDie, 63-ball, 8 x 10 [1Gb-50nm only]) -093 1067 MHz with
t
RC (MIN) 10ns
WTR FBGA (TwinDie, 63-ball, 9 x 11.5) -093E 1067 MHz with
t
RC (MIN) 8ns
DDR SDRAM GDDR5 Data Rate
CV CY FBGA (84-ball, 60-ball, 8 x 12.5) -50 1.25 GHz 5Gbps
TG P TSOP (Type II) -60 1.5 GHz 6Gbps
SDRAM -70 1.75 GHz 7Gbps
BB FBGA (60-ball, 8 x 16) -80 2.0 GHz 8Gbps
F4 B4 VFBGA (54-ball, 8 x 8)
F5 B5 VFBGA (90-ball, 8 x 13) Mobile Package Codes* Pb-Free/RoHS-Compliant Plating
TG P TSOP (Type II) Mobile LPDDR2 Mobile LPDDR3
xTG xP Stacked TSOP, "x" = internal stacking code AB VFBGA (121-ball SDP, 6.5 x8 x.8) EN VFBGA (253-ball DDP, 11.5 x11.5 x.9)
RLDRAM 1 & 2 AC VFBGA (134-ball DDP ICE, 10 x11.5 x.65) ER TFBGA (253-ball QDP, 11.5 x11.5 x1.2)
FM BM BGA (144-ball, 11 x 18.5) EU VFBGA (253-ball DDP, 11 x11 x.9) LH PoP (216-ball SDP, 12 x12 x.65)
RLDRAM 3 EV VFBGA (253-ball DDP, 11 x11 x1.2) LP PoP (216-ball 3DP 12 x12 x.82)
RB FBGA (168/169-ball, 13.5 x 13.5 x 1.2) SDP GU WFBGA (134-ball SDP, 10 x11.5 x.7) LR PoP (216-ball DDP/QDP 15 x15 x.8)
RCT FBGA (168/169-ball, 13.5 x 13.5 x 1.45) DDP GV VFBGA (134-ball DDP, 10 x11 x.85) LS PoP (256-ball DDP 14 x14 x.75)
GDDR5 KH PoP (216-ball DDP, 12 x12 x.8) LT PoP (216-ball QDP 15 x15 x1)
HF FBGA (170-ball, 12 x 14) KJ PoP (216-ball QDP, 12 x12 x1) LU PoP (256-ball QDP 14 x14 x1)
KL PoP (168-ball SDP &DDP, 12x12x.8) LV PoP (216-ball DDP 12 x12 x.75)
*Due to space limitations, FBGA- and BGA-packaged components and flip chips in KP PoP (168-ball QDP, 12 x12 x1) LW PoP (256-ball QDP 14 x14 x.8)
packages have an abbreviated part mark that is different from the part number. KQ PoP (168-ball J D32, 12 x12 x.75) Mobile LPDDR4
See our Web site for more information on abbreviated component marks. KU PoP (216-ball 3DP, 12 x12 x.9) NH PoP (272-ball DDP/QDP 15 x15 x0.7)
***Dimensions in millimeters KV PoP (216-ball SDP, 12 x12 x.65) NJ PoP (272-ball QDP 15 x15 x0.8)
Some device offerings are available in a VFBGA rather than an FBGA package; LC PoP (240-ball QDP, 14 x14 x1) NK PoP (366-ball DDP/QDP 15 x15 x0.7)
this is noted on the data sheet. LD PoP (220-ball QDP, 14 x14 x1) SG PoP (572-ball DDP 15 x15 x1.1)
LE PoP (168-ball 3DP, 12x12x1) .35mmball Mobile LPDDR
LF PoP (168-ball SDP , 12 x12 x.75) BF VFBGA (60-ball SDP, 8 x9 x1)
LG PoP (168-ball DDP, 12 x12 x.8) B5 VFBGA (90-ball SDP, 8 x13 x1)
LH PoP (216-ball SDP, 12 x12 x.65) BQ Same as B5 pkg except w/SAC305
LK PoP (216-ball DDP, 12 x12 x.8) B7 VFBGA (60-ball SDP, 10 x10 x1)
LL PoP (216-ball DDP, 12 x12 x.8) CK VFBGA (60-ball SDP, 10 x11.5 x1)
LM PoP (216-ball QDP, 12 x12 x1) CM VFBGA (90-ball SDP, 10 x13 x1)
LP PoP (216-ball 3DP, 12 x12 x.82) CX VFBGA (90-ball SDP, 9 x13 x1)
MA PoP (168-ball SDP, 12 x12 x.7) DD Same as BF pkg except w/SAC305
Rev. 11-Jun-2014 MC PoP (240-ball DDP, 14 x14 x.8) J V PoP (168-ball QDP, 12 x12 x1)
MG TFBGA (134-ball QPD, 11.5 x11.5 x1.2) KQ PoP (168-ball DDP, 12 x12 x.75)
MH VFBGA (134-ball QPD, 11 x11.5 x1) MA PoP (168-ball SDP, 12 x12 x.7)
MP PoP (220-ball DDP, 14 x14 x. 8) MC PoP (240-ball DDP, 14 x14 x.8)
TK Same as GU pkg except w/SAC305 Mobile LPSDR
B4 VFBGA (54-ball SDP, 8 x8)
B5 VFBGA (90-ball SDP, 8 x13 x1)
BF VFBGA (60-ball SDP, 8 x9 x1)
2014 Micron Technology, Inc.
Micron, the Micron logo, and RLDRAM are trademarks of Micron Technology, Inc.
Products and specifications are subject to change without notice. Dates are estimates only.
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