Lecture8 Memory Sys
Lecture8 Memory Sys
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Memory Classes
Main Memory
Invariably comprises solid state semiconductor devices Interfaces directly with the three bus architecture of the computer system. Operates at speeds consistent with the speed of the processor. Characterised by relatively high cost per bit of storage. Many types of semiconductor memory loses stored data when the power is removed from the device. (volatile)
Secondary Memory
Invariably electromechanical devices - CDs, discs, tapes etc Interfaces to the system busses via I/O devices such as disc controllers. For the processor to use data stored in secondary memory it must first be transferred to main memory. Characterised by very low cost per bit of storage and is non-volatile.
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RAM Architecture
8k x 8 RAM Chip
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Memory Architecture
Total number of memory cells per chip
number of locations x number of bits per location
(8192 x 8 = 65536 in the example)
A row of the matrix is selected by one output of the row decoder. The row decoder accepts n address bits and decodes them into 2n outputs.
( n = 8 selects 1 of 256 rows in the example )
Memory Architecture
The column decoder selects a location in a row of the matrix. A column of the matrix is selected by one output of the column decoder. The column decoder accepts m address bits and decodes them into 2m outputs.
( m = 5 selects 1 of 32 columns in the example )
The total number of address bits required to specify a location within the memory device is m + n
( m + n = 13 in the example Note: 213 = 8192 )
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Memory Operation
Once the memory device receives address information ( 13 binary digits on inputs A0 - A13 in the example ) the decoding logic selects the addressed location. The addressed location is interfaced to the external data bus via back-to-back tri-state buffers. The memory devices data bus input buffers are enabled when the device receives an asserted WR/ signal and data on the external bus gets written to the addressed memory location. The memory devices data bus output buffers are enabled when the device receives an asserted RD/ signal and data at the addressed memory location is placed on the external bus for an external device to read.
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The chip enable inputs, CE1* and CE2 permit memory systems to comprise more than a single memory device. To provide the required memory system for a computer application may require tens or even hundreds of memory devices.
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Draw the memory map Develop the decoding logic Draw a schematic diagram of the complete system
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The preceding example uses exhaustive decoding for all memory devices. Partial Decoding
If one or more of the processors address lines are not used by either the external memory decoders or internal device decoders to specify an address then partial decoding is said to be used.
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If three address line are not used to specify a memory location then the location will respond to 8 different processor addresses. Etc, etc
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tACS
max
This represents the maximum time it takes the memory device from CS/ being asserted to valid data appearing on the data bus. (assuming all other constraints are met)
tAA
address access
max
This represents the maximum time it takes the memory device from it receiving valid address to valid data appearing on the data bus. (assuming all other constraints are met)
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tRDHC
min
This represents the minimum time the memory device will keep valid data on the data bus after being deselected. (assuming valid address and oe/ remain asserted)
tOE
max
This represents the maximum time it takes the memory device to place valid data on the data bus after oe/ is asserted. (assuming other constraints are met)
tOHZ
max
This represents the maximum time it takes the memory device to tristate its output buffers after oe/ is de-asserted.
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The processor asserts the wr/ control input of the memory device. This enables its tri-state input buffers.
The processor places the data to be stored onto the data input lines of the memory device. The processor de-asserts the wr/ control line. The rising edge of wr/ latches the data into the specified location and also tri-states the devices input buffers.
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tCW
min
This represents the minimum time that the chip select signal must remain asserted. (assuming all other constraints are met)
tAS
min
This represents the minimum time valid address must be present on the memory devices address lines before wr/ is asserted.
tMWE
write enable
min
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tWDS
min
This represents the minimum time data must be valid before the rising edge of wr/.
tWDHE
min
This represents the minimum time data must remain valid after the rising edge of wr/.
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