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Ball Grid Array

This document discusses ball grid array (BGA) technology as a replacement for through-hole technology in printed circuit boards. It notes that BGA uses solder balls instead of leads, allowing for smaller footprints and greater reliability. BGA packages are classified based on whether the die is up or down, and come in different ball array configurations. The manufacturing process involves applying solder paste to the board, placing the BGA component, and reflow soldering to join the balls to pads. BGA components are more easily replaced if defective since they do not use leads. The document provides illustrations of BGA components and the mounting/rework process.

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yogeshleostar
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398 views29 pages

Ball Grid Array

This document discusses ball grid array (BGA) technology as a replacement for through-hole technology in printed circuit boards. It notes that BGA uses solder balls instead of leads, allowing for smaller footprints and greater reliability. BGA packages are classified based on whether the die is up or down, and come in different ball array configurations. The manufacturing process involves applying solder paste to the board, placing the BGA component, and reflow soldering to join the balls to pads. BGA components are more easily replaced if defective since they do not use leads. The document provides illustrations of BGA components and the mounting/rework process.

Uploaded by

yogeshleostar
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
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BALL GRID ARRAY

Made by – Yogesh Singh


Btech final year
College of engg. Technology , moradabad
Today’s PCB

 PCB’s getting smaller


 Increased population and
I/O density
 Thermally sensitive
materials
THROUGH HOLE TECHNOLOGY
( THT )
Leaded Components Getting Replaced
By BGA

Leaded IC replaced by BGA IC


Today’s PCB Concerns

 Maximum I/O density


 Smallest footprint
 Component Manufacturers
slowly replacing leaded
devices with BGA’s
Why BGA ???
 Smaller footprints
 Fragile leads absent
 Better thermal stability
 More reliable
 Easily replaced
 Less damage to logic network ckt
What is BGA ???
 Consist of wire bonded die on
substrate
 Substrate made of Copper Clad
Bismalemide Triazine
 2 to 4 metal layers
LEADED IC vs BGA IC

LEADED IC

BGA IC
BGA Classification
 PBGA - die up cross section
BGA Classification
 H-PBGA – die up cross section
BGA Classification
 HL–PBGA – die down cross section
Package Dimension
PBGA ball array configurations
HL-PBGA & H-PBGA ball array
Configuration
Manufacturing Of BGA

REFLOW

Solder balls Balls Pass


picked Balls through
placed on
through dipped in oven &
ICs
vacuum flux inspection
nozzles is done
BGA Board Design
BGA Mounting Process
 Pads are present on PCB
 Solder paste used as flux is applied
on pads
 BGA component are placed
 Plate move for Reflow process
Advantage of Using Paste
 It act as Flux
 Paste is sticky so hold component
during reflow
 Paste contribute to final volume of
solder in joints
BGA component mounting

BEFORE REFLOW AFTER REFLOW


Self Centering Of BGA
Pick n Place Machines
Ball To Pad Placement

Alignment of solder balls with solder pads on PCB using


Pick n Place machine
BGA Routing
If BGA ICs fail Then ???
 When BGA IC get fail then it can
be easily removed from PCB
 Steps involved
1) Heating surface of Ic Using Hot Air
2) Sucking the component using
vacuum pipe
3) New BGA placed
What Happen If BGA solder balls have
some defects ???

 Defects like Crack In solder ball,


Ball alignment get disturbed
REWORK With BGA
Lets see this clip to understand
Rework process
Advantages
 BGA packages are smaller
 No fragile leads
 Board assembly improved
 Board inspection reduce
 Better thermal properties
Thank You
QUERIES

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