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Recitation 1: IC Technology: How Are Integrated Circuits Being Designed and Fabricated?

This document provides an overview of integrated circuit technology. It discusses how ICs are designed through tools like layout and simulation, and then fabricated using semiconductors like silicon. The fabrication process involves growing silicon wafers, defining areas through lithography, etching, doping to control conductivity, and adding insulation and metallic interconnects through deposition and polishing. At the heart of it all is the transistor.

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Gopi Krishna
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27 views2 pages

Recitation 1: IC Technology: How Are Integrated Circuits Being Designed and Fabricated?

This document provides an overview of integrated circuit technology. It discusses how ICs are designed through tools like layout and simulation, and then fabricated using semiconductors like silicon. The fabrication process involves growing silicon wafers, defining areas through lithography, etching, doping to control conductivity, and adding insulation and metallic interconnects through deposition and polishing. At the heart of it all is the transistor.

Uploaded by

Gopi Krishna
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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Recitation 1

Review of IC Technology

6.012 Spring 2009

Recitation 1: IC Technology
How are integrated circuits being designed and fabricated?
1. IC Design: application circuits design: design tools include layout, place and route, circuit simulation, etc 2. Fabrication and Integration: (a) What material that allows the development of microelectronics? a class of materials called semiconductors two types of carriers - electron and hole (the missing of an electron) carrier concentrations can be controlled over many orders of magnitude by doping and electric eld eects. Examples of semiconductors: GaAs, GaN, Si, Ge. This class will focus on Si. (b) How to make Si wafers (from sand, crystal growth . . . ?) (c) Fabrication Dening area: Lithography (mostly in industry - photolithography) Cutting out material = etching (wet vs. dry) Insulation= SiO 2 (oxide) or Si 3N 4 (nitride), oxidation or nitride deposition Tuning conductivity (carrier concentration) = doping (ion implantation) Metallic wiring (interconnect): Al now Cu Chemical-mechanical polishing (CMP) (d) The heart of microelectronics

Figure 1: The Transistor

MIT OpenCourseWare http://ocw.mit.edu

6.012 Microelectronic Devices and Circuits


Spring 2009

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