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Mpw2012 General v7

The document provides a schedule and pricing information for Multi-Project Wafer (MPW) runs from various semiconductor foundries and technology providers in 2012. It lists the available process technologies from companies like ON Semiconductor, Austriamicrosystems, IHP, LFoundry, TSMC, UMC, and others. For each process, it provides the standard and discounted pricing per square millimeter for academic users. It also specifies the number of prototypes provided and additional plot/packaging costs.

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0% found this document useful (0 votes)
112 views4 pages

Mpw2012 General v7

The document provides a schedule and pricing information for Multi-Project Wafer (MPW) runs from various semiconductor foundries and technology providers in 2012. It lists the available process technologies from companies like ON Semiconductor, Austriamicrosystems, IHP, LFoundry, TSMC, UMC, and others. For each process, it provides the standard and discounted pricing per square millimeter for academic users. It also specifies the number of prototypes provided and additional plot/packaging costs.

Uploaded by

mikeydavies24
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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2012GeneralEuropracticeMPWruns ScheduleandPrices

Accessible for universities, research institutes and companies Version 121001 v7 www.europractice-ic.com

ON Semiconductor (formerly AMIS)


AMIS 0.7 C07M-D 2M/1P & AMIS 0.7 C07M-A 2M/1P/PdiffC/HR AMIS 0.5 C05M-D 3M/1P & AMIS 0.5 C05M-A 3M/2P/HR AMIS 0.5 CMOS EEPROM C5F & C5N AMIS 0.35 C035M-D 5M/1P & AMIS 0.35 C035M-A 5M/2P/HR AMIS 0.35 C035U 4M (3M & 5M optional) only thick top metal AMIS 0.7 C07M-I2T100 100 V - 2M & 3M options AMIS 0.7 C07M-I2T30 & I2T30E 30 V - 2M & 3M options AMIS 0.35 C035 - I3T80U 80 V 4M - 3M optional (5M on special request) AMIS 0.35 C035 - I3T50 50 V 4M - 3M optional (5M on special request) AMIS 0.35 C035 - I3T25 3.3/25 V 4M (3M & 5M optional) only thick top metal

J
30

A
2

J
11

A
27

N
5

21 4 12 7 21 13 30 30 9 20 13 10 10 2 2 2 14 18 18 11 11 2 13 17 27 27 17 9 10

1 21 1 3 5 5 8 19 3

austriamicrosystems
austriamicrosystems 0.35 3M/2P/HR/5V IO austriamicrosystems 0.35 4M/2P/HR/5V IO austriamicrosystems 0.35 4M/2P/5V IO austriamicrosystems 0.35 & 4M austriamicrosystems 0.35 4M/4P austriamicrosystems 0.18 4M/1P/MIM/1.8V/5V austriamicrosystems 0.18 4M/50V/20V/5V/1.8V/MIM CMOS C35B3C3 CMOS C35B4C3 CMOS C35OPTO HV CMOS H35 50V 3M SiGe-BiCMOS S35 CMOS C18 6M or HV CMOS H18 6M or

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M
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M
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A
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D
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13 27

24 4 10 3 30

13 3 6 1 1

5 19 26 26

IHP

A
23 23 23 23 23 10 10

A
27 27 27 27 27

O
29 29 29 29 29

IHP SGB25V 0.25 SiGe:C Ft=75GHz@BVCEO 2 2.4V IHP SGB25VGD 0.25 SiGe:C Ft=75GHz@BVCEO 2 2.4V + RF HV-LDMOS GOD-Module 22V IHP SG25H1 0.25 SiGe:C 2 Ft/Fmax=190GHz/220GHz 5M/MIM IHP SG25H3P 0.25 Complementary SiGe:C Ft/Fmax (npn)110/180GHz / (pnp)90/120GHz 2 5M/MIM IHP SG25H3 0.25 SiGe:C Ft/Fmax= 110/180GHz 2 5M/MIM IHP SG13S SiGe:C Bipolar/Analog/CMOS Ft/Fmax= 250/300GHz 7M/MIM IHP SG13C SiGe:C CMOS 7M/MIM IHP SG13G2 SiGe:C Bipolar/Analog Ft/Fmax= 300/500GHz 7M/MIM BEOL SG25 (M1 and Metal Layers Above) 5 BEOL SG13 (M1 and Metal Layers Above) Bumping available for all IHP technologies with extra charge, limited to 200 bumps

23 23 23 5

3 3 3

LFoundry
Lfoundry LF150 0.15 CMOS MS Standard & Low Leakage 1P6M 1.8V/3.3V/5V Lfoundry LF150 0.15 CMOS RF Standard & Low Leakage 1P6M + Thick Metal 1.8V/3.3V MIM

A
2

J
9 9

S
28 28

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26 26

TSMC
TSMC 0.25 CMOS General LOGIC, MS OR MS RF TSMC 0.18 CMOS General LOGIC, MS or MS RF (MIM: 1.0 or 2.0 fFum2 / UTM: 20k) 0.18 CMOS High Voltage Mixed-Signal (CV018LD 1.8/3.3/32V) TSMC 0.13 CMOS General LOGIC, MS or MS RF (8-inch) TSMC 0.13 CMOS General LOGIC, MS or MS RF (12-inch) TSMC 90nm CMOS General or LP Logic , MS or MS/RF (12-inch) TSMC 65nm CMOS General or LP MS/RF TSMC 40nm CMOS General or LP MS/RF

J
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M
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2 30 2

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4 25

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1 29 1

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7 28 7

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5 19

2 8 2 25 18 1 18,29 22

14

9 9 13 6 13,27 20

11 8 4 11,25 18 1 8,29 22

12 10 5 12,26 19 3 10,31 24

14 12 7 14,28 21 5 12,19 12

7 14,28 19

4 11,25 18

2 9,30 23

UMC
UMC L180 Logic GII UMC L180 Mixed-Mode/RF UMC L180 Logic Low Leakage UMC CIS180 Image Sensor 1P4M CONV diode UMC CIS180 Image Sensor 2P4M ULTRA diode UMC L130 Logic UMC L130 Mixed-Mode/RF UMC L110AE Logic/Mixed-Mode/RF UMC L90N Logic/Mixed-Mode/RF UMC L65N Logic/Mixed-Mode/RF - LL UMC L65N Logic/Mixed-Mode/RF - SP Note : * = Not all options available. To options regular runs UMC L65N Logic/Mixed-Mode/RF - LL

J
23 23 23

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23 23 23

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30 30 30

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12 12 23 23 23 23 23 30 30 12 5* 5* 16 23* 23* 14

11 11 30 30 16 6 4 4 23* 23*

10 10 29 29 10 3* 3* 22 22 12 5 3* 3*

be confirmed before tapeout. IO 1.8V / 2.5V / 2.5V_OD3.3V / 3.3V 1.8V / 2.5V / 2.5V_UD1.8V / 2.5V_OD3.3V / 3.3V 1.8V / 2.5V / 2.5V_OD3.3V / 3.3V 3.3V 3.3V 3.3V(High Gain) 3.3V 3.3V 3.3V 3.3V MIM 2fF topmetal 8kA/32.5kA Max. 1P10M 8kA/32.5kA Max. 1P10M 8kA/32.5kA Max. 1P9M 8kA/12kA/20kA/40kA Max. 1P8M 8kA - Max. 1P8M 8kA/20kA Max. 1P8M 8kA - Max. 1P6M 8kA/20kA Max. 1P6M 8kA - Max. 1P6M 8kA special remarks Metallization recommendation on request. Redistribution to Al. Metallization recommendation on request. Redistribution to Al. SP and LL devices allowed. Redistribution to Al. Al metal - Three types (out of 3) of devices can be combined: HS,LL, SP Two types (out of 3) of devices can be combined: HS,LL, SP. Redistribution to Al. Two types (out of 3) of devices can be combined: HS,LL, SP. Redistribution to Al.

Core 1.2V 1.0V, 1.1V 1.0V, 1.2V 1.2V 1.2V 1.2V 1.8V 1.8V 1.8V 1.8V

UMC L65N Logic/Mixed-Mode/RF - SP

2fF

UMC L90N Logic/Mixed-Mode/RF UMC L110AE Logic/Mixed-Mode/RF UMC L130 Logic UMC L130 Mixed-Mode/RF UMC L180 Logic GII UMC L180 Mixed-Mode/RF UMC L180 Logic Low Leakage UMC CIS18 CONV & ULTRA Diode

1.5fF/2fF 1fF/1.5fF 1fF/1.5fF/2fF 1fF/1.5fF/2fF 1fF 1fF / 1fF

Cannot be combined with Logic GII

TRONICS Microsystems
MEMSOI

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MEMSCAP
METALMUMPS PolyMUMPS SOIMUMPS

ePIXfab-imec
ePIXfab-imec SiPhotonics ePIXfab-imec SiPhotonics with Heater ePIXfab-imec SiPhotonics modulators

A
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2012 General Europractice MPW runs Pricelist


Accessible for universities, research institutes and companies Prices and conditions may change at any time without prior notice STANDARD price : normal price DISCOUNTED price : only applies to EUROPRACTICE registered (who paid their annual full membership fee) Academic and Research Members from all 27 EU countries and Norway, Iceland, Liechtenstein, Israel, Croatia, Serbia, Macedonia, Albania, Montenegro, Bosnia&Herzegovina, Switzerland, Turkey who submit designs for educational or publicly funded research use only Prices are given for the delivery of unpackaged, untested prototypes. Encapsulation and testing will be charged separately. Number of prototypes OnSemi: 30 samples austriamicrosystems , IHP, LFoundry : 40 samples UMC : >45 samples TSMC : 8-inch : 40 samples, 12-inch : 100 samples SiPhotonics :25 samples MEMSCAP : 15 samples TRONICS : 20 samples If you need more prototype samples, please ask for a quotation Plots You can order plots/PDF of your designs first plot/PDF costs 50 euro next plots cost 20 euro each Packaging : see separate prices and available packages

PRICES IN EURO ON Semiconductor (formerly AMIS)


AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS AMIS 0.7 C07M-D 2M/1P 0.7 C07M-A 2M/1P/PdiffC/HR 0.5 C05M-D 3M/1P 0.5 C05M-A 3M/2P/HR 0.5 CMOS EEPROM C5F & C5N 0.35 C035M-D 5M/1P 0.35 C035M-A 5M/2P/HR 0.35 C035U 4M (default) including analog options 0.35 C035U 3M (optional) including analog options 0.35 C035U 5M (optional) including analog options 0.7 C07M-I2T100 100 V - 2M 0.7 C07M-I2T100 100 V - 3M 0.7 C07M-I2T30 30 V - 2M 0.7 C07M-I2T30 30 V - 3M 0.7 C07M-I2T30E 30 V - 2M 0.7 C07M-I2T30E 30 V - 3M 0.35 C035 - I3T80U 80 V 3M 0.35 C035 - I3T80U 80 V 4M 0.35 C035 - I3T80U 80 V 5M 0.35 C035 - I3T50 50 V 3M 0.35 C035 - I3T50 50 V 4M 0.35 C035 - I3T50 50 V 5M 0.35 C035 I3T25 3.3/25 V 3M (optional) 0.35 C035 I3T25 3.3/25 V 4M (default) 0.35 C035 I3T25 3.3/25 V 5M (optional)

STANDARD Price/mm2
360 2 400 2 420 3 480 3 1150 2 620 3 680 3 720 1 700 1 800 1 550 1 600 1 440 3 500 3 500 3 550 3 850 1 990 1 1145 1 850 1 990 1 1145 1 750 1 770 1 850 1

DISCOUNTED Price/mm2
320 2 360 2 370 3 430 3 1100 2 570 3 630 3 670 1 650 1 750 1 500 1 550 1 390 3 450 3 450 3 500 3 800 1 940 1 1075 1 800 1 940 1 1075 1 700 1 720 1 800 1

austriamicrosystems
austriamicrosystems austriamicrosystems austriamicrosystems austriamicrosystems austriamicrosystems austriamicrosystems austriamicrosystems 0.35 0.35 0.35 0.35 0.35 0.18 0.18 CMOS C35B3C3 3M/2P/HR/5V IO CMOS C35B4C3 4M/2P/HR/5V IO CMOS C35OPTO 4M/2P/5V IO HV CMOS H35 50V 3M & 4M SiGe-BiCMOS S35 4M/4P CMOS C18 6M or 4M/1P/MIM/1.8V/5V HV CMOS H18 6M or 4M/50V/20V/5V/1.8V/MIM

STANDARD Price/mm2
720 4 720 4 850 4 1000 4 1000 4 1200 1 1320 1

DISCOUNTED Price/mm2
580 4 580 4 700 4 900 4 900 4 1100 1 1200 1

IHP
IHP SGB25V 0.25 SiGe:C Ft=30GHz@BVCEO>7V 5M IHP SGB25VGD 0.25 SiGe:C Ft=75GHz@BVCEO 2.4V + RF HV-LDMOS GDModule 22V IHP SG25H1 0.25 SiGe:C Ft/Fmax=190GHz/220GHz 5M/MIM IHP SG25H3P 0.25 Complementary SiGe:C Ft/Fmax (npn)120/180GHz / (pnp)90/120GHz 5M/MIM IHP SG25H3 0.25 SiGe:C Ft/Fmax= 120/180GHz 5M/MIM IHP SG13G2 SiGe:C Bipolar/Analog Fmax= 400GHz 7M/MIM IHP SG13G2 SiGe:C Bipolar/Analog Fmax= 400GHz 7M/MIM IHP SG13S SiGe:C Bipolar/Analog/CMOS Ft/Fmax= 250/300GHz 7M/MIM IHP SG13S SiGe:C Bipolar/Analog/CMOS Ft/Fmax= 250/300GHz 7M/MIM IHP SG13C SiGe:C CMOS 7M/MIM BEOL SG25 (M1 and Metal Layers Above) BEOL SG13 (M1 and Metal Layers Above) bumping for all IHP technologies localized back side etching for all IHP technologies (per design) RF-MEMS switch for SG25H1 and SG25H3 (per design)

STANDARD Price/mm2
2500 2950 6800 5800
1 1 1 1

DISCOUNTED Price/mm2
1875 2212 5100 4200
1 1 1 1

3800 1 7500 2 7500 2 7200 8 7200 8 4500 8 800 1000 One-off fee of 3000 10 One-off fee of 5000 One-off fee of 10000

2850 1 5625 2, 14 4500 2, 13 5400 8, 14 4320 8, 13 3375 8 600 750 One-off fee of 2000 10 One-off fee of 2500 One-off fee of 2500

LFoundry
LFoundry LF150 0.15 CMOS all technologies

STANDARD Price/mm2
900
12

DISCOUNTED Price/mm2
850
12

TSMC
TSMC TSMC TSMC TSMC TSMC TSMC TSMC TSMC 0.25 0.18 0.13 0.13 90nm 90nm 65nm 40nm CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS General General General General General General General General LOGIC, MS OR MS RF LOGIC, MS OR MS RF LOGIC, MS or MS RF (8-inch) LOGIC, MS or MS RF (12-inch) or LP Logic (12-inch) or LP MS RF (12-inch) or LP MS RF (12-inch) or LP MS RF (12-inch)

STANDARD Price/mm2
Upon Upon Upon Upon Upon Upon Upon Upon request request request request request request request request
7 7 7 7 7 7 7 7

DISCOUNTED Price/mm2
Upon Upon Upon Upon Upon Upon Upon Upon request request request request request request request request
7 7 7 7 7 7 7 7

UMC
UMC UMC UMC UMC UMC UMC L180 Logic GII, Mixed-Mode/RF, Logic Low Leakage L180 CIS 1P4M CONV or 2P4M ULTRA L130 Logic, Mixed-Mode/RF L110AE Logic/Mixed-Mode/RF L90N Logic, Mixed-Mode/RF 65nm Logic, MM/technologies

STANDARD Price/block
16000 21600 30900 30900 47200 48100
5 5 5 5 6 6

DISCOUNTED Price/block
14800 20400 29100 29100 44700 45100
5 5 5 5 6 6

TRONICS Microsystems
MEMSOI 4x4 mm 11 MEMSOI 4x8 mm 11 MEMSOI 8x8 mm 11

STANDARD Price/block
2500 3500 5000

DISCOUNTED Price/block
2375 3225 4500

MEMSCAP
METALMUMPS 10x10mm 11 PolyMUMPS 10x10mm 11 SOIMUMPS 10x10mm 11 ePIXfab-imec SiPhotonics 1 block 2 blocks - vertical 2 blocks - horizontal 4 blocks Full wafer instead of 25 samples 25 extra samples Extra full wafer (Companies should contact the ePIXfab directly) ePIXfab-imec SiPhotonics modulators 1 block Larger sized blocks contact us Notes 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) 11) 12) 13) 14) Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 10 mm2 Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 5 mm2 Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 8 mm2 Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 7 mm2 Price = per block of 5x5mm needed to fit the design in Price = per block of 4x4mm needed to fit the design in 5.0 x 5.0 mm 6.3 x 3.1 mm 6.3 x 6.33 mm 12.73 x 3.1 mm 12.73 x 6.33 mm

STANDARD Price/block
3100 3100 3100

DISCOUNTED Price/block
3000 3000 3000

STANDARD Price
3750 6950 6950 13350 2430 900 900

DISCOUNTED Price
3560 6600 6600 12680 2430 900 900

STANDARD Price
17000

DISCOUNTED Price
16150

Price can be calculated through http://www.europractice-ic.com/TSMC_request_prices.php Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 3 mm2 Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 12 mm2 Price = per submitted design (no size limit, bumping limited to 200 bumps) Cost for extra services like structures release, subdicing, please refer to http://www.europractice-ic.com/mems_runschedule.php#MEMS_prices Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 6 mm2 Only European universities with Axxxx membership number Only European R&D institutes with Rxxxx membership number

Contacts imec, Belgium (C. Das, tel: +32 16 281248, fax: +32 16 281584, e-mail: [email protected]) Fraunhofer IIS, Germany (W. McKinley, tel : +49 9131 776 4413, fax: +49 9131 776 4499, e-mail: [email protected])

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