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Authors: power dissipation by chip must be balanced by convection and radiation. To provide acceptable cooling, attach the chip to a highly conducting substrate. Any other reproduction beyond that permitted by Sections 107 or 108 of the 1976 u.s. Copyright act is prohibited.

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51 views1 page

sm1 31

Authors: power dissipation by chip must be balanced by convection and radiation. To provide acceptable cooling, attach the chip to a highly conducting substrate. Any other reproduction beyond that permitted by Sections 107 or 108 of the 1976 u.s. Copyright act is prohibited.

Uploaded by

awoods12835
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
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PROBLEM 1.

31
KNOWN: Width, surface emissivity and maximum allowable temperature of an electronic chip. Temperature of air and surroundings. Convection coefficient.
2 1/4 FIND: (a) Maximum power dissipation for free convection with h(W/m K) = 4.2(T - T) , (b) 2 Maximum power dissipation for forced convection with h = 250 W/m K.

SCHEMATIC:

ASSUMPTIONS: (1) Steady-state conditions, (2) Radiation exchange between a small surface and a large enclosure, (3) Negligible heat transfer from sides of chip or from back of chip by conduction through the substrate. ANALYSIS: Subject to the foregoing assumptions, electric power dissipation by the chip must be balanced by convection and radiation heat transfer from the chip. Hence, from Eq. (1.10),

4 4 Pelec = q conv + q rad = hA ( Ts T ) + A Ts Tsur where A = L2 = ( 0.015m )2 = 2.25 104 m 2 .


(a) If heat transfer is by natural convection,

5/ 4 5/ 4 qconv = C A ( Ts T ) = 4.2 W/m 2 K5/4 2.25 104 m 2 ( 60K ) = 0.158 W q rad = 0.60 2.25 104 m 2 5.67 108 W/m 2 K 4 3584 2984 K 4 = 0.065 W Pelec = 0.158 W + 0.065 W = 0.223 W
(b) If heat transfer is by forced convection,

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qconv = hA ( Ts T ) = 250 W/m 2 K 2.25 104 m 2 ( 60K ) = 3.375 W Pelec = 3.375 W + 0.065 W = 3.44 W

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COMMENTS: Clearly, radiation and natural convection are inefficient mechanisms for transferring 2 heat from the chip. For Ts = 85C and T = 25C, the natural convection coefficient is 11.7 W/m K. 2 Even for forced convection with h = 250 W/m K, the power dissipation is well below that associated with many of todays processors. To provide acceptable cooling, it is often necessary to attach the chip to a highly conducting substrate and to thereby provide an additional heat transfer mechanism due to conduction from the back surface.

Excerpts from this work may be reproduced by instructors for distribution on a not-for-profit basis for testing or instructional purposes only to students enrolled in courses for which the textbook has been adopted. Any other reproduction or translation of this work beyond that permitted by Sections 107 or 108 of the 1976 United States Copyright Act without the permission of the copyright owner is unlawful.

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