IC PACKAGE

FUJITSU MICROELECTRONICS LIMITED

Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/

For further information please contact: North and South America FUJITSU MICROELECTRONICS AMERICA, INC.
1250 E. Arques Avenue, M/S 333 Sunnyvale, CA 94085-5401, U.S.A. Tel: +1-408-737-5600 Fax: +1-408-737-5999 http://www.fma.fujitsu.com/

Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE LTD.

151 Lorong Chuan, #05-08 New Tech Park Singapore 556741 Tel : +65-6281-0770 Fax : +65-6281-0220 http://www.fujitsu.com/sg/services/micro/semiconductor/

Europe FUJITSU MICROELECTRONICS EUROPE GmbH

Pittlerstrasse 47, 63225 Langen, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 http://emea.fujitsu.com/microelectronics/

FUJITSU MICROELECTRONICS SHANGHAI CO., LTD.

Rm. 3102, Bund Center, No.222 Yan An Road (E), Shanghai 200002, China Tel : +86-21-6335-1560 Fax : +86-21-6335-1605 http://cn.fujitsu.com/fmc

Korea FUJITSU MICROELECTRONICS KOREA LTD.

206 KOSMO TOWER, 1002 Daechi-Dong, Kangnam-Gu,Seoul 135-280 Korea Tel: +82-2-3484-7100 Fax: +82-2-3484-7111 http://www.fmk.fujitsu.com/

FUJITSU MICROELECTRONICS PACIFIC ASIA LTD.

10/F., World Commerce Centre, 11 Canton Road Tsimshatsui, Kowloon Hong Kong Tel : +852-2377-0226 Fax : +852-2376-3269 http://cn.fujitsu.com/fmc/tw

Specifications are subject to change without notice. For further information please contact each office. All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws. The company names and brand names herein are the trademarks or registered trademarks of their respective owners. 2002-2008 FUJITSU MICROELECTRONICS LIMITED Printed in Japan AD81-00001-12Ea April, 2004 Edited: Strategic Business Development Dept.

FUJITSU MICROELECTRONICS

Technologies of the Future Available Now

Supported by LSI technologies, the markets for personal computers, cellular telephones, mobile information terminals and other electronic equipment continue to experience sharp demand growth. Continuing into the future, electronic equipment is expected to become thinner and more compact. LSI packages allowing high-density mounting, such as chip size packages or chip scale packages (CSPs) and ball grid arrays (BGAs), have been developed and become common throughout the market. As packages grow ever more compact, Fujitsu continues to lead the industry in CSPs by beginning mass-production of SON packages that incorporate 16Mbit flash memories. Further efforts to achieve more compact, highdensity mounting include the mass production of FBGAs, CSOPs, MCPs and various stacked MCPs. Fujitsu also mass-produces multipin packages, chiefly PBGAs, EBGAs and LGAs. We continue to break new ground in the field of electronics, devoting tireless efforts to the development of packages for a wide variety of applications, including next-generation and custom packages. s Multipin packages QFP, PBGA, EBGA, E-BGA, TAB-BGA, FC-BGA, LGA s Thin, compact packages SSOP, TQFP, BCC, FBGA, CSOP, S-MCP, Super CSP s Packages for card modules TSOP, TQFP s Packages featuring high power dissipation or for large chips HQFP, PBGA, EBGA, TAB-BGA, FC-BGA, LGA

Package Overview and Cross -section Structure

INTEGRATED CIRCUIT PACKAGES

Stacked Multi Chip Package

Features q Stacked MCP (Multi Chip Package) stacks 2 chips in one package to correspond to increased capacities of memory. q One package can have the functions of two chips because chips are stacked. Corresponds to high performance systems and smaller mounting area.
Bottom View

S-MCP

Resin

LSI Chip-2 LSI Chip-1

Au Wire

Top View Polyimide Tape

Adhesive

Solder Ball

Package Overview and Cross -section Structure

A typical package is introduced with package overview and a crosssectional structure figure. S-MCP TAB-BGA BCC PBGA FBGA HQFP EBGA FC-BGA CSOP SOP SSOP Dual lead TSOP CSOP Flat type QFP LQFP Quad lead TQFP HQFP C-lead type Dual lead MCP CSOP S-MCP Super CSP PBGA

CONTENTS

3 4 5 7 8 8
Bottom View

Plastic Ball Grid Array

Features q High cost performance by the sealing of plastic resin q Excellent application to high pin count LSIs

PBGA

Package Lineup

9 10 11 11 19 9 12 12 13 13 14 14 15 15 16 16 17 17
Top View Au wire Potting Resin Solder Ball Bottom View Top View LSI Chip Solder Ball Au Wire Resin PC Board

Enhanced Ball Grid Array

Features q High density mounting available q Superior electrical characteristics from multilayre structure q Low thermal resistance, and superior cost performance to ceramic PGA

Package

Surface mounted type BGA

EBGA Matrix type TAB-BGA FDH-BGA FBGA FC-BGA LGA LGA FLGA Bumped type Tape carrier Quad lead Dual lead BCC DTP

EBGA

LSI Chip

Heat Spreader

PC Board

Package Overview and Cross -section Structure

TAB-Ball Grid Array
TAB-BGA
Features Excellent mulit-pin as signment applicability Excellent thiickness-reduction applicability High thermal dissipation Excellent narrow-pitch and size-reduction applicability Chip size reduction using narrow PAD

INTEGRATED CIRCUIT PACKAGES

Bump chip carrier

BCC
Features With the same packaging capabilities as those of SSOP, this very small package provides space for COB 16-pin Bump chip carrier is about 40% smaller in packaging area and about 70% smaller in packaging capacity than conventional SSOP This plated resin bump package introduces selective etching technology to enable reductions in both size and cost

Bottom View

Bottom View

LSI Chip Heat Spreader LSI Chip Stiffener

Au Wire

Resin Polyimide Tape Top View Encapsulation Solder Ball Top View Resin Bump Die attach material

Fine pitch Ball Grid Array

FBGA
Features Low-cost assembly using existing facilities Fan-in and fan-out types Fine pitch using Polymide (PI) tape

QFP with Heat Sink

HQFP-HS (current)
Features Excellent thermal dissipation The same size as current packages (adopting high standoff configuration)

Bottom View

Resin

Au Wire Top View

Au Wire

LSI Chip

Adhesive Tape

PCB (2Layer) Top View

Adhesive

LSI Chip

Solder Ball

Lead Frame

Heat Spreader Resin

Flip chip-Ball Grid Array

FC-BGA
Features Excellent ultra-multi-pin assignment and high-packaging density applicability Superior electrical characteristics from multilayer structure of board with low dielectric constand and Low-resistivity wiring Low thermal resistance due to heat dissipation from back of chip
Bottom View Thermal Compound Area Bump Encapsulation Chip Capacitor LSI Chip Lid

C-lead Small Outline Package

CSOP
Features Chip-size package High price -performance using TSOP packaging technology Packaging strength and reliability equal to or better than TOSP Same packaging technology as TSOP 40% packaging density max. as compared to TOSP
Bottom View

Au Wire

Die Pad

LSI Chip

Top View

Top View Glass Ceramic (thick-film)

Outer Lead

Resin

Surface mount device package

SOP
(Small Outline L-leaded Package)

Lead Pitch

Nominal Dimensions EIAJ TYPE 600mil/VI 450mil/IV

Pin Count

44 28 16 8 8 14 16 20 24 24 28

1.27mm(50mil) 375mil/III 300mil/II 0.80mm : 30-PIN 1.00mm : 38-PIN 1.27mm : 8-PIN

Surface mount device package

CSOP
(C-lead Small Outline Package)

Body Size (mm) Pin Count

1010 48 0.4

SSOP/TSSOP
(Shrink Small Outline L-leaded Package) /(Thin Shrink Small Outline L-leaded Package)

Lead Pitch (mm)

Pin Count Lead Pitch (mm) Mounting Height (mm)

8 0.8 1.45

16 0.65 1.45

20 0.65 1.45

24 0.65 1.45

30 0.65 1.45

34 0.65 1.45

Pin Count Lead Pitch (mm) Mounting Height (mm)

16 0.65 1.10

20 0.65 1.10 1.20

24 0.65 1.10

TSOP TYPE I
(Thin Small Outline L-leaded Package)

Body Size (mm) Pin Count Lead Pitch (mm) Mounting Height (mm)

818.4 32 0.50 1.20

1018.4 40 0.50 1.20

1218.4 48 0.50 1.20

1212.4 48 0.50 1.20

1418.4 56 0.50 1.20

1212.4 56 0.40 1.20

LQFP
(Low-profile Quad Flat L-leaded Package)

Body Size (mm) Pin Count Lead Pitch (mm)

1414 120

1616 144

2020 176 0.40

2424 216

2828 256

77 48

1010 64

1212 80

1414 100

1616 120 0.50

2020 144

2424 176

2828 208

1212 64

1414 80

77 32 0.80

0.65

TQFP
(Thin Quad Flat L-leaded Package)

QFP
(Quad Flat-leaded Package)

Body Size (mm) Pin Count Lead Pitch (mm)

2828 256

3232 296

2020 120 144

2424 176

2828 208

3232 240

4040 304

1420 100 144

2828 160 44

1010 48

1212 48 0.80

1420 80

2828 120

1420 64 1.00

0.40

0.50

0.65

Body Size (mm) Pin Count Lead Pitch (mm) Mounting Height (mm)

1010 64 0.50

1212 80 0.50

1212 100 0.40 1.20

1414 100 0.50

1414 120 0.40

10

11

Stacked MCP
(Stacked Multi Chip Package)

PBGA (Over mold Type)

(Plastic Ball Grid Array)

Body Size (mm) Ball Count Stack Ball Pitch (mm)

77.21.2 56 2

791.2 59 2

991.4 61 2

991.34 65 2

8111.4 69 2

7121.2 71 2

7111.2 71 2

811.61.4 811.61.34 10.410.81.3 11121.34 1091.4 73 2 73 2 85 3 101 2 103 4

9101.4 107 3 4

9121.4 115 3 4

Body Size (mm) Ball Count Ball Pitch (mm)

2727 256 1.27

3535 352 1.27

3535 420 1.27

0.80

Super CSP
(Super Chip Size Package)

EBGA (Enhanced BGA)

(Plastic Ball Grid Array)

Body Size (mm) Ball Count Package Type Ball Pitch (mm)

3.517.05 48 BGA 0.5

3.517.05 48 LGA 0.5

3.514.70 48 BGA 0.5

3.514.70 48 LGA 0.5

Body Size (mm) Ball Count Ball Pitch (mm)

35353.1 352 1.27

40403.1 416 1.27

35353.1 40403.1 420 1.27 576 1.27

40402.9 660 1.0

45453.1 40402.9 40402.9 672 1.27 792 1.0 896 1.0

12

13

TAB-BGA
(Tape Automated Bonding Ball Grid Array)

Body Size (mm) Ball Count Ball Pitch (mm)

21211.4 304 0.8

23231.4 352 0.8

27271.3 31311.3 400 1.0 480 1.0

35351.3 560 1.0

40401.4 40401.3 40401.3 576 1.27 660 1.0 720 1.0

FBGA/PFBGA
(Fine-Pitch Ball Grid Array)/(Plastic Fine-Pitch Ball Grid Array)

Body Size (mm) Ball Count Package Type Ball Pitch (mm)

681.2 48 FBGA

681.2 48 PFBGA

691.2 48 FBGA

891.2 48 FBGA

714.51.2 52 FBGA

891.2 60 PFBGA

7111.2 63 FBGA

10111.2 63 FBGA

991.2 64 PFBGA

7111.2 80 PFBGA

8111.2 80 PFBGA

9121.2 80 PFBGA

8111.2 84 PFBGA

9.514.51.2 96 FBGA

0.80

Body Size (mm) Ball Count Package Type Ball Pitch (mm) 112 PFBGA 144 PFBGA 0.80 224 PFBGA 272 PFBGA 144 FBGA

881.13 10101.33 12121.3 176 FBGA 240 FBGA 304 FBGA 0.50 360 FBGA

14141.33 368 FBGA 480 FBGA

FC-BGA
(Flip Chip Ball Grid Array)

FDH-BGA
(Face Down Heat spreader BGA)

Body Size (mm) Body Size (mm) Ball Count Ball Pitch (mm) Ball Count 2727 256* 1.27 2727 264* 1.0 3535 352 1.27 3535 436 1.0 4040 576* 1.27 Body Size (mm) Ball Count Ball Pitch (mm) Ball Pitch (mm)

42.542.54.7 45.045.54.7 47.547.54.7 1089 1.27 1225 1.27 1369 1.27

*: Under planning

42.542.54.6 45.045.04.6 47.547.54.6 1681 1.00 1849 1.00 2116 1.00

14

15

LGA
(Land Grid Array)

Body Size (mm) Land Count Land Pitch (mm)

42.50 889 1.27

BCC
(Bump Chip Carrier)

Body Size (mm) Pin Count Lead Pitch (mm)

3.44.550.8 4.24.550.8 3.43.60.8 3.43.60.6 4.04.00.8 5.05.00.8 7.07.00.8 9.09.00.8 7.07.00.5 7.07.00.8 8.08.00.5 9.09.00.8 10.010.00.8 16 0.65 16 0.65 20 0.5 20 0.5 24 0.5 32 0.5 48 0.5 64 0.5 64 0.65 64 0.65 80 0.65 92 0.65 100 0.65

SLIM DTP
(Slim Dual Tape-carrier Package)

FLGA
(Fine pitch Land Grid Array)

Body Size (mm) Land Count Land Pitch (mm)

9.09.0 80 0.8

4.05.5 20 0.65

7.07.0 64 0.65

5.05.0 64 0.5

7.07.0 80 0.5

7.07.0 11.011.0 11.011.0 12.012.0 14.314.3 16.016.0 120 0.5 144 0.65 176 0.65 208 0.65 224 0.65 288 0.65

Pin count Lead Pitch (mm)

44 0.8

233 0.1

255 0.16

463 0.06

16

17

Low thermal resistance package

HQFP
(QFP with Heat Sink)

Pin count Heat spreader Lead Pitch (mm)

160 Heat Spreader 0.65

208 Heat Spreader 0.50

240 Heat Spreader 0.50

256 Heat Spreader 0.40

304 Heat Spreader 0.50

18

Low thermal resistance package

24

19