Quad Flat Package

A QFP or Quad Flat Package is a surface mount integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low profile QFP and thin QFP.

The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japanese consumer electronics since the seventies. It is often mixed with hole mounted, and sometimes socketed, components on the same printed circuit board.

A package related to QFP is PLCC which is similar but has pins with larger pitch, 1.27 mm (or 1/20 inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). It is commonly used for NOR Flash memories and other programmable components.

Limitations

The quad flat-pack has connections only around the periphery of the package. To increase the number of pins, the spacing was decreased from 50 mil (thousandths of an inch) (as found on small outline packages) to 20 and later 12 mil (1.27 mm, 0.51mm and 0.30mm respectively). However, this close lead spacing made solder bridges more likely and put higher demands on the soldering process and alignment of parts during assembly. The later pin grid array and ball grid array packages, by allowing connections to be made over the area of the package and not just around the edges, allowed for higher pin counts with similar package sizes, and reduced the problems with close lead spacing.