Dică

Dică may refer to:

Nicolae Dică, a Romanian football player, playing for Viitorul Constanța;

Emil Dică, another Romanian football player playing for CFR Cluj.

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DIC

DIC may refer to:

Science

Differential interference contrast microscopy, an illumination technique in optical microscopy

Diisopropylcarbodiimide, a reagent in organic chemistry

Digital Integrating Computer, a digital implementation of a Differential Analyzer

Digital image correlation for ultra accurate measurements of deformations, displacement and strain from digital images

Dissolved inorganic carbon, the sum of inorganic carbon species in a solution

Deviance information criterion, a diagnostic statistic used in Bayesian model selection

Dicyclic group

Medicine

Disseminated intravascular coagulation, a pathological activation of coagulation (blood clotting) mechanisms that happens in response to a variety of diseases

Entertainment

DIC Entertainment, a multinational film and television production company that was folded into Cookie Jar Group in 2008

Drive-In Classics, a Canadian television station

Other uses

Democratic Indira Congress (Karunakaran), an Indian political party

Diploma of Imperial College

Three-dimensional integrated circuit

In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers and/or dies and interconnecting them vertically using through-silicon vias (TSVs) so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. 3D IC is just one of a host of 3D integration schemes that exploit the z-direction to achieve electrical performance benefits. They can be classified by their level of interconnect hierarchy at the global (package), intermediate (bond pad) and local (transistor) level In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs), monolithic 3D ICs; 3D heterogeneous integration; and 3D systems integration. International organizations such as the Jisso Technology Roadmap Committee (JIC) and the International Technology Roadmap for Semiconductors (ITRS) have worked to classify the various 3D integration technologies to further the establishment of standards and roadmaps of 3D integration.