… solders, the European Union Parliament issued a directive to ban the use of Pb-based solders
… effect of external forces on solder joint reliability is critical and is emphasized in this book. …

In 3D IC technology, the vertical interconnection consists of through-Si-vias (TSV) and micro
solder bumps. The size of the micro-bump is approaching 10μm, which is the diameter of …

… the preheating and soldering subsystems in the sense that the solder temperature defines
the … Reducing the peak temperature changes solder viscosity. Even though lowering solder …

… study of solder reaction. In this review, we shall discuss why we use solder in chip-to-board
packaging, and why after hundreds of years of solder usage, the study of solder reaction is …

… solder whenever it is available. Specifically, we reviewed: (1) interfacial reactions between
Pb-free solder … side, (2) interfacial reactions between Pb-free solder and thin-film under-bump …

… The solder joint reliability has been observed to be highly dependent on solder joint geometry
as well as solder material properties, such that predicting solder reflow shape became a …

… The mechanical stability of Pb-free SnAgCu solder connections is studied in comparison to
… with solders of different near-eutectic compositions. In addition, the hardness of bulk solder …

… solder are reviewed in this paper. … solders; so that one can utilize these solders with
confidence, a national project on the development and standardization of low temperature soldering …

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder
joint reliability assessment. Each chapter is written to be used as a stand-alone resource for …

… the solder can be observed.0ften the soldering … solder, brittle phase formation, concentration
gradients of elemental or metallurgical composition when the joint is formed).Smaller solder …