User profiles for Joseph B. Bernstein
![]() | Joseph BernsteinAriel University Verified email at ariel.ac.il Cited by 4341 |
Compact modeling of MOSFET wearout mechanisms for circuit-reliability simulation
X Li, J Qin, JB Bernstein - IEEE Transactions on device and …, 2008 - ieeexplore.ieee.org
The integration density of state-of-the-art electronic systems is limited by the reliability of the
manufactured integrated circuits at a desired circuit density. Design rules, operating voltages…
manufactured integrated circuits at a desired circuit density. Design rules, operating voltages…
Electronic circuit reliability modeling
JB Bernstein, M Gurfinkel, X Li, J Walters… - Microelectronics …, 2006 - Elsevier
The intrinsic failure mechanisms and reliability models of state-of-the-art MOSFETs are
reviewed. The simulation tools and failure equivalent circuits are described. The review includes …
reviewed. The simulation tools and failure equivalent circuits are described. The review includes …
Characterization of Transient Gate Oxide Trapping in SiC MOSFETs Using Fast – Techniques
…, KP Cheung, JS Suehle, JB Bernstein… - … on Electron Devices, 2008 - ieeexplore.ieee.org
Threshold voltage and drain current instabilities in state-of-the-art 4H-SiC MOSFETs with
thermal as-grown SiO 2 and NO-annealed gate oxides have been studied using fast IV …
thermal as-grown SiO 2 and NO-annealed gate oxides have been studied using fast IV …
Time-Dependent Dielectric Breakdown of 4H-SiC/ MOS Capacitors
…, JC Horst, JS Suehle, JB Bernstein… - IEEE transactions on …, 2008 - ieeexplore.ieee.org
Time-dependent dielectric breakdown (TDDB) is one of the major issues concerning long-range
reliability of dielectric layers in SiC-based high-power devices. Despite the extensive …
reliability of dielectric layers in SiC-based high-power devices. Despite the extensive …
[HTML][HTML] Modern trends in microelectronics packaging reliability testing
In this review, recent trends in microelectronics packaging reliability are summarized. We
review the technology from early packaging concepts, including wire bond and BGA, to …
review the technology from early packaging concepts, including wire bond and BGA, to …
Spatial distributions of trapping centers in HfO2∕ SiO2 gate stacks
A methodology to analyze charge pumping (CP) data, which allows positions of probing traps
in the dielectric to be identified, was applied to extract the spatial profile of traps in SiO 2∕ …
in the dielectric to be identified, was applied to extract the spatial profile of traps in SiO 2∕ …
Reliability simulation and circuit-failure analysis in analog and mixed-signal applications
…, J Qin, J Dai, Q Fan, JB Bernstein - IEEE Transactions on …, 2009 - ieeexplore.ieee.org
In this paper, an effective and efficient methodology for reliability simulation is developed to
bridge the gap between device-level reliability and that at product level. For the first time, …
bridge the gap between device-level reliability and that at product level. For the first time, …
Failure dynamics of the IGBT during turn-off for unclamped inductive loading conditions
…, AR Hefner, DW Berning, JB Bernstein - IEEE Transactions on …, 2000 - ieeexplore.ieee.org
The internal failure dynamics of the insulated gate bipolar transistor (IGBT) for unclamped
inductive switching (UIS) conditions are studied using simulations and measurements. The …
inductive switching (UIS) conditions are studied using simulations and measurements. The …
[BOOK][B] Thomas Jefferson
RB Bernstein - 2005 - books.google.com
… It is in this simple epitaph that RB Bernstein finds the key to this … , Bernstein offers the
definitive short biography of this revered American--the first concise life in six decades. Bernstein …
definitive short biography of this revered American--the first concise life in six decades. Bernstein …
A new SPICE reliability simulation method for deep submicrometer CMOS VLSI circuits
…, B Huang, X Zhang, JB Bernstein - IEEE Transactions on …, 2006 - ieeexplore.ieee.org
CMOS very large scale integration (VLSI) circuit reliability modeling and simulation have
attracted an intense research interest in the last two decades, and as a result, almost all IC …
attracted an intense research interest in the last two decades, and as a result, almost all IC …