chiplet

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chiplet

(1) A bare chip that is used in a multichip module. See MCM.

(2) A future semiconductor technology from Palo Alto Research Center (PARC), a subsidiary of Xerox, that ties together minuscule circuits no larger than a grain of sand to make microprocessors, memory and other electronic components. Introduced in 2013, PARC's "Xerographic micro-assembly" cuts a wafer into tens of thousands of chiplets rather than hundreds of chips as in the traditional semiconductor process. The chiplets can be wrapped around flexible surfaces and may even become the "ink" in 3D printing.

More than a decade ago, Alien Technologies developed a similar technology. The tiny chips in Alien's Fluid Self Assembly (FSA) were named "Nanoblocks." The patented Fluid Self Assembly is waiting in the wings for the time it becomes commercially viable. See 3D printing, chip, wafer and PARC.

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The new technology involves etching a pit of the correct depth and size in the surface of a silicon wafer, then inserting a tiny patterned chip (sometimes called a "chiplet") into the pit.

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Bill Chappell, director of DARPA's Microsystems Technology Office, when introducing the CHIPS program, said, 'By bringing the best design capabilities, reconfigurable circuit fabrics, and accelerators from the commercial domain, we should be able to create defence systems just by adding smaller specialised chiplets.'

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An interesting tidbit in Foveros is the introduction of "chiplets," which basically is the fragmentation of CPU into its individual parts.

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The missile gathers information and returns data packets in 30 to 50 kb chiplets that are 'high-confident' viewable 3D images.

Size does matter: the annual autumn gathering of the Association of the United States Army (AUSA) in October 2005 proved that the US military remains flexible in the rather fluid birth and demise of defence programmes. Many larger projects draw the obvious observers and 'wish list' crowds, but it is the smaller innovations that are beginning to catch more attention

The base die, compute chiplets, and DRAM layers are all stacked one on top of the other.

CES 2019: Intel demos Ice Lake 10nm CPUs, Lakefield architecture

A number of companies have proposed a strategy of chiplets to achieve the economics of scaling previously achieved with silicon scaling.

Heterogeneous Integration a Recurring Theme at ECTC

It has a base clock of 3.8 GHz and a boost clock of 4.6 GHz and uses two chiplets to achieve the high core count.

COMPUTEX 2019: AMD unveils 3rd Gen Ryzen 3000 7nm CPUs with 12-cores, Radeon RX 5700 7nm graphics cards

Netronome is collaborating with six silicon companies, Achronix, GLOBALFOUNDRIES, Kandou, NXP, Sarcina and SiFive, to develop an open architecture and related specifications for developing chiplets that promise to reduce silicon development and manufacturing costs.