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Computer Science > Graphics

arXiv:2205.13727 (cs)
[Submitted on 27 May 2022 (v1), last revised 26 May 2023 (this version, v3)]

Title:High-Order Incremental Potential Contact for Elastodynamic Simulation on Curved Meshes

Authors:Zachary Ferguson, Pranav Jain, Denis Zorin, Teseo Schneider, Daniele Panozzo
View a PDF of the paper titled High-Order Incremental Potential Contact for Elastodynamic Simulation on Curved Meshes, by Zachary Ferguson and 4 other authors
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Abstract:High-order bases provide major advantages over linear ones in terms of efficiency, as they provide (for the same physical model) higher accuracy for the same running time, and reliability, as they are less affected by locking artifacts and mesh quality. Thus, we introduce a high-order finite element (FE) formulation (high-order bases) for elastodynamic simulation on high-order (curved) meshes with contact handling based on the recently proposed Incremental Potential Contact (IPC) model.
Our approach is based on the observation that each IPC optimization step used to minimize the elasticity, contact, and friction potentials leads to linear trajectories even in the presence of nonlinear meshes or nonlinear FE bases. It is thus possible to retain the strong non-penetration guarantees and large time steps of the original formulation while benefiting from the high-order bases and high-order geometry. We accomplish this by mapping displacements and resulting contact forces between a linear collision proxy and the underlying high-order representation.
We demonstrate the effectiveness of our approach in a selection of problems from graphics, computational fabrication, and scientific computing.
Subjects: Graphics (cs.GR)
Cite as: arXiv:2205.13727 [cs.GR]
  (or arXiv:2205.13727v3 [cs.GR] for this version)
  https://doi.org/10.48550/arXiv.2205.13727
arXiv-issued DOI via DataCite
Journal reference: In Special Interest Group on Computer Graphics and Interactive Techniques Conference Conference Proceedings (SIGGRAPH '23 Conference Proceedings), August 06--10, 2023, Los Angeles, CA, USA. ACM, New York, NY, USA, 11 pages
Related DOI: https://doi.org/10.1145/3588432.3591488
DOI(s) linking to related resources

Submission history

From: Zachary Ferguson [view email]
[v1] Fri, 27 May 2022 02:44:55 UTC (14,593 KB)
[v2] Mon, 12 Sep 2022 20:56:26 UTC (22,513 KB)
[v3] Fri, 26 May 2023 21:57:32 UTC (42,343 KB)
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